LQH31HZR88K03L

Reference Only Spec No.JELF243A-9122D-01 P.1/8 CHIP COIL（CHIP INDUCTORS）LQH31HZ□□□□03L Murata Standard Reference Specification【AEC-Q200】 1. Scope This reference specification applies to Chip coil (Chip Inductors) LQH31HZ series for automotive Electronics based on AEC-Q200 except for Power train and Safety. 2. Part Numbering (ex) LQ H 31 H Z 54N K 0 3 L Product ID Structure Dimension Applications Category Inductance Tolerance Features Electrode Packaging (L×W) and L:Taping Characteristics 3. Rating ・Operating Temperature Range. ・Storage Temperature Range. Customer Part Number -40 to + 85°C -40 to + 85°C Q (min) DC Resistance (Ω) Self Resonant Frequency (MHz min) Rated Current (mA) 50 0.035±30% 800 920 0.047±30% 650 790 145 0.061±30% 500 700 215 0.11±30% 430 520 290 0.17±30% 360 420 0.26±30% 300 330 0.44±30% 270 260 610 0.48±30% 240 250 750 0.79±30% 220 190 880 0.86±30% 200 180 Inductance MURATA Part Number (nH) LQH31HZ54NK03L 54 LQH31HZ95NK03L 95 LQH31HZR14J03L LQH31HZR14K03L LQH31HZR21J03L LQH31HZR21K03L LQH31HZR29J03L LQH31HZR29K03L LQH31HZR39J03L K:±10% 390 LQH31HZR39K03L LQH31HZR50J03L 500 LQH31HZR50K03L LQH31HZR61J03L LQH31HZR61K03L LQH31HZR75J03L LQH31HZR75K03L LQH31HZR88J03L LQH31HZR88K03L Tolerance J:±5% K:±10% 60 ESD Rank 1C: 2kV 1C 4. Testing Conditions 《Unless otherwise specified》 Temperature : Ordinary Temperature / 15°C to 35°C Humidity : Ordinary Humidity / 25%(RH) to 85%(RH) 《In case of doubt》 Temperature : 20°C± 2°C Humidity : 60%(RH) to 70%(RH) Atmospheric Pressure : 86kPa to 106 kPa 5. Appearance and Dimensions 2.3±0.2 1.8±0.2 1.6±0.2 3.2±0.3 1.6±0.2 ■Unit Mass (Typical value) 0.029g ∗ No Marking. 0.7 0.7 0.7 min min min (in mm) MURATA MFG.CO., LTD Reference Only Spec No.JELF243A-9122D-01 P.2/8 6. Electrical Performance No. 6.1 Item Inductance Specification Inductance shall meet item 3. Test Method Measuring Equipment : KEYSIGHT E4991A or equivalent Measuring Frequency : 1MHz Measuring Method:See P.8 6.2 Q Q shall meet item 3. Measuring Equipment : KEYSIGHT 4191A or equivalent Measuring Frequency : 100MHz 6.3 DC Resistance DC Resistance shall meet item 3. Measuring Equipment : Digital multi meter 6.4 Self Resonant Frequency(S.R.F) S.R.F shall meet item 3. Measuring Equipment : KEYSIGHT E4991A or equivalent 6.5 Rated Current Self temperature rise shall be limited to 20 °C max. Inductance Change : within ± 10 % The rated Current is applied. 7. AEC-Q200 Requirement 7.1 Performance (based on Table 5 for Magnetics(Inductors / Transformer) AEC-Q200 Rev.D issued June. 1 2010 AEC-Q200 No Stress 3 High Temperature Exposure Test Method 1000hours at 85 deg C Set for 24hours at room temperature, then measured. Murata Specification / Deviation Meet Table A after testing. Table A Appearance No damage Inductance change (at 100MHz) Within ±5% Q change Within ±20% Meet Table A after testing. 4 Temperature Cycling 1000cycles -40 deg C to + 85deg C Set for 24hours at room temperature,then measured. 7 Biased Humidity 1000hours at 85 deg C, 85%RH Meet Table A after testing. unpowered.. 8 Operational Life Apply 85 deg C 1000 hours Set for 24hours at room temperature, then measured Meet Table A after testing. 9 External Visual Visual inspection No abnormalities 10 Physical Dimension Meet ITEM 5 （Style and Dimensions） No defects 12 Resistance to Solvents Per MIL-STD-202 Method 215 Not Applicable 13 Mechanical Shock Per MIL-STD-202 Method 213 Condition C 100g’s/6ms/Half sine Meet Table A after testing. MURATA MFG.CO., LTD Reference Only Spec No.JELF243A-9122D-01 AEC-Q200 Murata Specification / Deviation No Stress 14 Vibration Test Method 5g's for 20 minutes, 12cycles eah of 3 orientations Test from 10-2000Hz. 12cycles each of 3 orientations 15 Resistance to Soldering Heat No-heating Solder temperature 260C+/-5 deg C Immersion time 10s Meet Table A after testing. 17 ESD Per AEC-Q200-002 ESD Rank: Refer to Item 3. Rating. No defects 18 Solderbility Per J-STD-002 Method b : Not Applicable 95% of the terminations is to be soldered. (Except exposed wire) 19 Electrical Characterization Measured : Inductance No defects 20 Flammability Per UL-94 Not Applicable 21 Board Flex Epoxy-PCB(1.6mm) Deflection 2mm(min) 60s minimum holding time Murata deviation request: 30s Meet Table B after testing. Table B 22 Terminal Strength P.3/8 Meet Table A after testing. Appearance No damage DC resistance change Within ±10％ No defect Murata deviation request: 10N for 5s Per AEC-Q200-006 A force of 17.7N for 60s 8. Specification of Packaging 8.1 Appearance and Dimensions of plastic tape +0.1 ※Lead-in / out wire φ 1.5 -0 1.75±0.1 ( 0.2 ) positions of the lead wire. 4.0±0.1 4.0±0.1 1.9±0.1 in taping are unified with the in/out 8.0±0.2 3.6±0.1 3.5±0.05 ※The packing directions of the chip coil 2.0±0.05 Direction of feed 2.0±0.1 (in mm) Dimension of the Cavity is measured at the bottom side. 8.2 Specification of Taping (1) Packing quantity (standard quantity) 2,000 pcs / reel (2) Packing Method Products shall be packed in the each embossed cavity of plastic tape and sealed by cover tape. (3) Sprocket hole The sprocket holes are to the right as the tape is pulled toward the user. (4) Spliced point Plastic tape and Cover tape has no spliced point. (5) Missing components number Missing components number within 0.1 % of the number per reel or 1 pc., whichever is greater, and are not continuous. The specified quantity per reel is kept. MURATA MFG.CO., LTD Reference Only Spec No.JELF243A-9122D-01 P.4/8 8.3 Pull Strength Plastic tape 10N min. Cover tape 8.4 Peeling off force of cover tape Speed of Peeling off 165 to 180 degree 300mm / min 0.2N to 0.7N (minimum value is typical) Peeling off force F Cover tape Plastic tape 8.5 Dimensions of Leader-tape, Trailer and Reel There shall be leader-tape (cover tape) and trailer-tape (empty tape) as follows. Leader Trailer 2.0±0.5 160 min. 190 min. Label Empty tape 210 min. Cover tape φ 13.0±0.2 1 φ 60± 0 φ 21.0±0.8 9± 10 Direction of feed 13±1.4 0 φ 180± 3 8.6 Marking for reel Customer part number, MURATA part number, Inspection number(∗1), RoHS marking(∗2), Quantity etc ･･･ ∗1) (1) Factory Code (2) Date □□ OOOO ××× (1) (2) (3) First digit : Year / Last digit of year Second digit : Month / Jan. to Sep. → 1 to 9, Oct. to Dec. → O, N, D Third, Fourth digit : Day (3) Serial No. ∗2) « Expression of RoHS marking » ROHS – Y (△) (1) (2) (1) RoHS regulation conformity (2) MURATA classification number 8.7 Marking for Outside package (corrugated paper box) Customer name, Purchasing order number, Customer part number, MURATA part number, RoHS marking (∗2) , Quantity, etc ･･･ 8.8. Specification of Outer Case Outer Case Dimensions (mm) Label H D W D H Standard Reel Quantity in Outer Case (Reel) 186 186 93 5 ∗ Above Outer Case size is typical. It depends on a quantity of an order W 9. Caution Limitation of Applications Please contact us before using our products for the applications listed below which require especially high reliability for the prevention of defects which might directly cause damage to the third party's life, body or property. (1)Aircraft equipment (2)Aerospace equipment (3)Undersea equipment (4)Power plant control equipment (5)Medical equipment (6)Transportation equipment (trains, ships, etc.) (7)Traffic signal equipment (8)Disaster prevention / crime prevention equipment (9)Data-processing equipment (10)Applications of similar complexity and /or reliability requirements to the applications listed in the above MURATA MFG.CO., LTD Reference Only Spec No.JELF243A-9122D-01 P.5/8 10. Notice This product is designed for solder mounting. Please consult us in advance for applying other mounting method such as conductive adhesive. 10.1 Land pattern designing Recommended land patterns for flow and reflow soldering are as follows: It has been designed for Electric characteristics and solderability. Please follow the recommended pattern. Otherwise, their performance which includes electrical performance or solderability may be affected, or result to "position shift" in soldering process. Chip Coil c Land Solder resist a 1.0 b 4.5 c 1.5 a (in mm) b 10.2 Flux, Solder Flux Solder ・Use rosin-based flux. ・Don’t use highly acidic flux with halide content exceeding 0.2(wt)% (chlorine conversion value). ・Don’t use water-soluble flux. ・Use Sn-3.0Ag-0.5Cu solder ・Standard thickness of solder paste : 200μm to 300μm Other flux (except above) Please contact us for details, then use. 10.3 Flow soldering / Reflow soldering conditions ・Pre-heating should be in such a way that the temperature difference between solder and product surface is limited to 150°C max. Cooling into solvent after soldering also should be in such a way that the temperature difference is limited to 100°C max. Insufficient pre-heating may cause cracks on the product, resulting in the deterioration of products quality. ・Standard soldering profile and the limit soldering profile is as follows. The excessive limit soldering conditions may cause leaching of the electrode and / or resulting in the deterioration of product quality. Soldering profile (1)Flow soldering profile Temp. (℃) 265℃±3℃ 250℃ Limit Profile 150 Heating Time 60s min. Time. (s) Standard Profile Pre-heating Heating Cycle of flow Standard Profile Limit Profile 150℃、60s min. 250℃、4s～6s 265℃±3℃、5s 2 times 2 times MURATA MFG.CO., LTD Reference Only Spec No.JELF243A-9122D-01 P.6/8 (2)Reflow soldering profile Temp. (℃) 260℃ 245℃±3℃ 230℃ 220℃ Limit Profile 180 150 Standard Profile 30s～60s 60s max. 90s±30s Time. (s) Standard Profile Pre-heating Heating Limit Profile 150～180°C 、90s±30s above 220°C、30s～60s above 230°C、60s max. 245±3°C 260°C,10s 2 times 2 times Peak temperature Cycle of reflow 10.4 Reworking with soldering iron. The following conditions must be strictly followed when using a soldering iron. Pre-heating 150°C,1 min Tip temperature 350°C max. Soldering iron output 80W max. Tip diameter φ3mm max. Soldering time 3(+1,-0)s Times 2 times Note : Do not directly touch the products with the tip of the soldering iron in order to prevent the crack on the products due to the thermal shock. 10.5 Solder Volume ・Solder shall be used not to be exceeded the upper limits as shown below. ・Accordingly increasing the solder volume, the mechanical stress to Chip is also increased. Exceeding solder volume may cause the failure of mechanical or electrical performance. Upper Limit Recommendable T t 1/3T≦t≦T T: Lower flange thickness 10.6 Product’s location The following shall be considered when designing and laying out P.C.B.'s. (1) P.C.B. shall be designed so that products are not subject to the mechanical stress due to warping the board. ［Products direction］ a b 〈 Poor example〉 Products shall be located in the sideways direction (Length:a B (3) Keep the mounting position of the component away from the board separation surface. A > C b A C B Seam D Slit > D ∗1 ∗1 A > D is valid when stress is added vertically to the perforation as with Hand Separation. If a Cutting Disc is used, stress will be diagonal to the PCB, therefore A > D is invalid. Length:a< b a (3) Mounting Components Near Screw Holes When a component is mounted near a screw hole, it may be affected by the board deflection that occurs during the tightening of the screw. Mount the component in a position as far away from the screw holes as possible. Screw Hole Recommended 10.7 Cleaning Conditions Products shall be cleaned on the following conditions. (1) Cleaning temperature shall be limited to 60°C max.(40°C max for alcohol type cleaner.) (2) Ultrasonic cleaning shall comply with the following conditions with avoiding the resonance phenomenon at the mounted products and P.C.B. Power : 20 W / l max. Frequency : 28kHz to 40kHz Time : 5 min max. (3) Cleaner 1. Alternative cleaner ・Isopropyl alcohol (IPA) 2. Aqueous agent ・PINE ALPHA ST-100S (4) There shall be no residual flux and residual cleaner after cleaning. In the case of using aqueous agent, products shall be dried completely after rinse with de-ionized water in order to remove the cleaner. (5) Other cleaning Please contact us. 10.8 Resin coating The inductance value may change due to high cure-stress of resin to be used for coating/molding products. An open circuit issue may occur by mechanical stress caused by the resin, amount/cured shape of resin, or operating condition etc. Some resin contains some impurities or chloride possible to generate chlorine by hydrolysis under some operating condition may cause corrosion of wire of coil, leading to open circuit. So, please pay your careful attention when you select resin in case of coating/molding the products with the resin. Prior to use the coating resin, please make sure no reliability issue is observed by evaluating products mounted on your board. 10.9 Caution for use ・Sharp material such as a pair of tweezers or other material such as bristles of cleaning brush, shall not be touched to the winding portion to prevent the breaking of wire. ・Mechanical shock should not be applied to the products mounted on the board to prevent the breaking of the core 10.10 Handling of a substrate After mounting products on a substrate, do not apply any stress to the product caused by bending or twisting to the substrate when cropping the substrate, inserting and removing a connector from the substrate or tightening screw to the substrate. Excessive mechanical stress may cause cracking in the product. Bending Twisting MURATA MFG.CO., LTD Reference Only Spec No.JELF243A-9122D-01 P.8/8 10.11 Storage and Handing Requirements (1) Storage period Use the products within 12 months after delivered. Solderability should be checked if this period is exceeded. (2) Storage conditions ・Products should be stored in the warehouse on the following conditions. Temperature : -10 °C to 40 °C Humidity : 15 % to 85 % relative humidity No rapid change on temperature and humidity The electrode of the products is coated with solder. Don't keep products in corrosive gases such as sulfur,chlorine gas or acid, or it may cause oxidization of electrode, resulting in poor solderability. ・Products should not be stored on bulk packaging condition to prevent the chipping of the core and the breaking of winding wire caused by the collision between the products. ・Products should be stored on the palette for the prevention of the influence from humidity, dust and so on. ・Products should be stored in the warehouse without heat shock, vibration, direct sunlight and so on. (3) Handling Condition Care should be taken when transporting or handling product to avoid excessive vibration or mechanical shock. 11. Note (1) Please make sure that your product has been evaluated in view of your specifications with our product being mounted to your product. (2) You are requested not to use our product deviating from the reference specifications. (3) The contents of this reference specification are subject to change without advance notice. Please approve our product specifications or transact the approval sheet for product specifications before ordering. (1) Residual elements and stray elements of test fixture can be described by F-parameter shown in following. I2 I1 A Zm V1 B D C Test Head Test fixture V2 Zx V1 I1 = A B C D V2 I2 Product (2) The impedance of chip coil Zx and measured value Zm can be described by input/output current/voltage. Zm= V1 I1 ， Zx= V2 I2 (3) Thus,the relation between Zx and Zm is following; Zx=  Zm-β 1-ZmΓ where, α= D / A =1 β= B / D =Zsm-(1-Yom Zsm)Zss Γ= C / A =Yom Zsm : measured impedance of short chip Zssa: residual impedance of short chip (0.771nH) Yom: measured admittance when opening the fixture (4) Lx and Qx shall be calculated with the following equation. Lx= Im(Zx) , 2πf Qx = Im(Zx) Re(Zx) Lx : Inductance of chip coil Qx : Q of chip coil f : Measuring frequency MURATA MFG.CO., LTD