LQH31MN101J03L

Reference Only Spec No. JELF243A-0032R-01 P.1/10 CHIP COIL(CHIP INDUCTORS) LQH31MN□□□□03L REFERENCE SPECIFICATION 1. Scope This reference specification applies to LQH31MN series, Chip coil (Chip Inductors). 2. Part Numbering (ex) LQ H 31 M N R15 M 0 3 L Product ID Structure Dimension Applications Category Inductance Tolerance Features Electrode Packaging (L×W) and L:Taping Characteristics 3. Rating ・Operating Temperature Range. ・Storage Temperature Range. Customer Part Number – 40 °C – 40 °C to + 85 °C to + 85 °C DC Resistance (Ω) Self Resonant Frequency (MHz min.) ∗Rated Current (mA) 0.39±40% 250 250 0.22 0.43±40% 250 240 0.33 0.45±40% 250 230 0.83±40% 200 215 0.61±40% 180 200 0.68 0.67±40% 160 190 0.82 0.73±40% 120 185 1.0 0.49±30% 100 175 90 165 1.0±30% 75 155 1.6±30% 60 150 2.2 0.7±30% 50 140 2.7 0.55±30% 43 135 3.3 0.61±30% 38 130 Inductance MURATA Part Number (μH) LQH31MNR15M03L LQH31MNR15K03L LQH31MNR22M03L LQH31MNR22K03L LQH31MNR33M03L LQH31MNR33K03L LQH31MNR47M03L LQH31MNR47K03L LQH31MNR56M03L LQH31MNR56K03L LQH31MNR68M03L LQH31MNR68K03L LQH31MNR82M03L LQH31MNR82K03L LQH31MN1R0M03L LQH31MN1R0K03L Tolerance Q (min.) 0.15 20 0.47 0.56 M:±20% K :±10% 30 LQH31MN1R2M03L LQH31MN1R2K03L 0.9±30% 1.2 LQH31MN1R2J03L 0.37±30% LQH31MN1R5M03L LQH31MN1R5K03L 1.5 LQH31MN1R5J03L LQH31MN1R8M03L LQH31MN1R8K03L 1.8 M:±20% K :±10% J :± 5% LQH31MN1R8J03L LQH31MN2R2M03L LQH31MN2R2K03L 35 LQH31MN2R2J03L LQH31MN2R7M03L LQH31MN2R7K03L LQH31MN2R7J03L LQH31MN3R3M03L LQH31MN3R3K03L LQH31MN3R3J03L MURATA MFG.CO., LTD Spec No. JELF243A-0032R-01 Customer Part Number Reference Only DC Resistance (Ω) Self Resonant Frequency (MHz min.) ∗Rated Current (mA) 3.9 1.5±30% 35 125 4.7 1.7±30% 31 120 1.8±30% 28 115 2.0±30% 25 110 8.2 2.2±30% 23 105 10 2.5±30% 20 100 12 2.7±30% 18 95 15 3.0±30% 16 90 18 3.4±30% 15 85 22 3.1±30% 14 85 27 3.4±30% 13 85 3.8±30% 12 80 7.2±30% 11 55 8.0±30% 10 55 56 8.9±30% 9.0 50 68 9.9±30% 8.5 50 82 11.0±30% 7.5 45 100 12.0±30% 7.0 45 Inductance MURATA Part Number P.2/10 (μH) Tolerance Q (min.) LQH31MN3R9M03L LQH31MN3R9K03L LQH31MN3R9J03L LQH31MN4R7M03L LQH31MN4R7K03L LQH31MN4R7J03L LQH31MN5R6M03L LQH31MN5R6K03L 5.6 LQH31MN5R6J03L M:±20% K :±10% J :± 5% LQH31MN6R8M03L LQH31MN6R8K03L 6.8 LQH31MN6R8J03L 35 LQH31MN8R2M03L LQH31MN8R2K03L LQH31MN8R2J03L LQH31MN100K03L LQH31MN100J03L LQH31MN120K03L LQH31MN120J03L LQH31MN150K03L LQH31MN150J03L LQH31MN180K03L LQH31MN180J03L LQH31MN220K03L LQH31MN220J03L LQH31MN270K03L LQH31MN270J03L LQH31MN330K03L LQH31MN330J03L LQH31MN390K03L LQH31MN390J03L LQH31MN470K03L LQH31MN470J03L LQH31MN560K03L LQH31MN560J03L LQH31MN680K03L LQH31MN680J03L LQH31MN820K03L LQH31MN820J03L LQH31MN101K03L LQH31MN101J03L 33 K:±10% J :± 5% 39 47 40 ∗When applied Rated current to the Products, self temperature rise shall be limited to 20°C max and Inductance will be within ±10% of initial Inductance value. MURATA MFG.CO., LTD Reference Only Spec No. JELF243A-0032R-01 P.3/10 4. Testing Conditions 《Unless otherwise specified》 Temperature : Ordinary Temperature / 15°C to 35°C Humidity : Ordinary Humidity / 25%(RH) to 85%(RH) 《In case of doubt》 Temperature : 20 ± 2°C Humidity : 60%(RH) to 70%(RH) Atmospheric Pressure : 86kPa to 106 kPa 5. Appearance and Dimensions 1.6±0.2 1.8±0.2 2.3±0.2 ■Unit Mass (Typical value) 0.029g 3.2±0.3 1.6±0.2 ∗ No polarity. 0.7 min. 0.7 min. 0.7 (in mm) min. 6. Electrical Performance No. 6.1 Item Inductance Specification Inductance shall meet item 3. Test Method Measuring Equipment : KEYSIGHT 4192A or equivalent Measuring Frequency : 1MHz Measuring Fixture : Measuring Fixture Fig.1 6.2 Q Q shall meet item 3. Measuring Equipment : KEYSIGHT 4192A or equivalent Measuring Frequency : 25.2MHz / 0.15μH ~ 0.82μH 10MHz / 1.0μH ~ 2.7μH 8MHz / 3.3μH ~ 8.2μH 5MHz / 10μH ~ 18μH 2.5MHz / 22μH ~ 100μH Measuring Fixture : See Fig.1. 6.3 DC Resistance DC Resistance shall meet item 3. Measuring Equipment : Digital multi meter 6.4 Self Resonant Frequency(S.R.F) S.R.F shall meet item 3. Measuring Equipment : KEYSIGHT E4991A or equivalent 6.5 Temperature Characteristics Temperature Coefficient Inductance / 0.15μH ~ 18μH : 150 PPM/ °C±150 PPM / °C 22μH ~ 100μH : 650 PPM/ °C±450 PPM / °C Temperature coefficient on the basis of step 3 shall meet specification after tested as follows.It shall be subjected to the condition of Table 1,and its inductance shall be measured at each step after reaching the thermal equilibrium and be calculated. Table 1 Step1/+20°C ±2°C Step2/ -25°C ±2°C Step3/+20°C ±2°C MURATA MFG.CO., LTD Step4/+85°C ±2°C Step5/+20°C ±2°C Spec No. JELF243A-0032R-01 Reference Only P.4/10 7. Mechanical Performance No. 7.1 Item Shear Test Specification Chip coil shall not be damaged after tested as test method. Test Method Substrate : Glass-epoxy substrate 4.5 Chip Coil Pattern Solder resist Substrate 1.5 Applied Direction : (in mm) 1 Chip Coil F Substrate Force : 10N Hold Duration : 5s ± 1s 7.2 Bending Test Chip coil shall not be damaged after tested as test method. Substrate : Glass-epoxy substrate (100mm40mm1.6mm) Speed of Applying Force : 1mm / s Deflection : 2mm Hold Duration : 30s Pressure jig R340 F Deflection 45 45 Product (in mm) 7.3 Vibration Oscillation Frequency : 10Hz ~ 55Hz ~ 10Hz for 1 min Total Amplitude : 1.5mm Testing Time : A period of 2 hours in each of 3 mutually perpendicular directions. (Total 6 hours) 7.4 Solderability The wetting area of the electrode shall be at least 90% covered with new solder coating. Flux: Ethanol solution of rosin, 25(wt)% (Immersed for 5s to 10s) Solder : Sn-3.0Ag-0.5Cu Pre-Heating : 150±10°C / 60 to 90seconds Solder Temperature : 240±5°C Immersion Time : 3±1 s 7.5 Resistance to Soldering Heat Appearance:No damage Inductance Change : within ±5% Flux: Ethanol solution of rosin, 25(wt)% (Immersed for 5s to 10s) Solder : Sn-3.0Ag-0.5Cu Pre-Heating: 150±10°C / 60 to 90seconds Solder Temperature: 270±5°C Immersion Time: 10±1 s Then measured after exposure in the room condition for 24±2 hours. MURATA MFG.CO., LTD Reference Only Spec No. JELF243A-0032R-01 P.5/10 8. Environmental Performance (It shall be soldered on the substrate.) No. 8.1 Item Heat Resistance Specification Appearance : No damage Inductance Change : within ± 5% Q Change : within ±20% Test Method Temperature : 85 °C ± 2 °C Time : 1000h (+48h , -0h) Then measured after exposure in the room condition for 24±2 hours. 8.2 Cold Resistance Temperature : -40 °C ± 2 °C Time: 1000h (+48h , -0h) Then measured after exposure in the room condition for 24±2 hours.. 8.3 Humidity Temperature : 40 °C ± 2 °C Humidity : 90 %(RH) to 95 %(RH) Time : 1000h (+48h , -0h) Then measured after exposure in the room condition for 24±2 hours. 8.4 Temperature Cycle 1 cycle : 1 step : - 40 °C ± 2 °C / 30 min ± 3 min 2 step : Ordinary temp. / 10 min ~ 15 min 3 step : + 85 °C ± 2 °C / 30 min ± 3 min 4 step : Ordinary temp. / 10min ~ 15 min Total of 10 cycles Then measured after exposure in the room condition for 24±2 hours. 9. Specification of Packaging +0.1 φ 1.5 - 0 ※Lead-in / out wire 1.75 ±0.1 9.1 Appearance and Dimensions of plastic tape (0.2 ) ※The packing directions of the chip coil positions of the lead wire. 8 .0 ±0 .2 3 .6 ± 0 .1 3 .5 ±0 .0 5 in taping are unified with the in/out Dimension of the Cavity is measured at the bottom side. 4.0±0.1 1.9±0.1 4.0±0.1 2.0±0.05 Direction of feed 2.0±0.1 (in mm) 9.2 Specification of Taping (1) Packing quantity (standard quantity) 2,000 pcs / reel (2) Packing Method Products shall be packed in the each embossed cavity of plastic tape and sealed by cover tape. (3) Sprocket hole The sprocket holes are to the right as the tape is pulled toward the user. (4) Spliced point Plastic tape and Cover tape has no spliced point. (5) Missing components number Missing components number within 0.1 % of the number per reel or 1 pc., whichever is greater, and are not continuous. The specified quantity per reel is kept. 9.3 Pull Strength Plastic tape Cover tape 10N min. MURATA MFG.CO., LTD Reference Only Spec No. JELF243A-0032R-01 P.6/10 9.4 Peeling off force of cover tape Speed of Peeling off 165 to 180 degree 300 mm / min F Cover tape 0.2N to 0.7N (minimum value is typical) Peeling off force Plastic tape 9.5 Dimensions of Leader-tape, Trailer and Reel There shall be leader-tape (cover tape) and trailer-tape (empty tape) as follows. Leader Trailer 2.0±0.5 160 min. 190 min. Label Empty tape 210 min. Cover tape φ 13.0±0.2 1 φ 60± 0 φ 21.0±0.8 9± 10 Direction of feed 13±1.4 0 φ 180± 3 9.6 Marking for reel Customer part number, MURATA part number, Inspection number(∗1), RoHS marking(∗2), Quantity etc ･･･ ∗1) (1) Factory Code (2) Date □□ OOOO ××× (1) (2) (3) First digit : Year / Last digit of year Second digit : Month / Jan. to Sep. → 1 to 9, Oct. to Dec. → O, N, D Third, Fourth digit : Day (3) Serial No. ∗2) « Expression of RoHS marking » ROHS – Y (△) (1) (2) (1) RoHS regulation conformity (2) MURATA classification number 9.7 Marking for Outside package (corrugated paper box) Customer name, Purchasing order number, Customer part number, MURATA part number, RoHS marking (∗2) ,Quantity, etc ･･･ 9.8. Specification of Outer Case Outer Case Dimensions (mm) Label H D W 10. W D H 186 186 93 Standard Reel Quantity in Outer Case (Reel) 5 ∗Above Outer Case size is typical. It depends on a quantity of an order Caution Limitation of Applications Please contact us before using our products for the applications listed below which require especially high reliability for the prevention of defects which might directly cause damage to the third party's life, body or property. (1) Aircraft equipment (6) Transportation equipment (vehicles, trains, ships, etc.) (2) Aerospace equipment (7) Traffic signal equipment (3) Undersea equipment (8) Disaster prevention / crime prevention equipment (4) Power plant control equipment (9) Data-processing equipment (10) Applications of similar complexity and /or reliability (5) Medical equipment requirements to the applications listed in the above MURATA MFG.CO., LTD Reference Only Spec No. JELF243A-0032R-01 P.7/10 11. Notice This product is designed for solder mounting. Please consult us in advance for applying other mounting method such as conductive adhesive. 11.1 Land pattern designing Recommended land patterns for flow and reflow soldering are as follows: It has been designed for Electric characteristics and solderability. Please follow the recommended patterns. Otherwise, their performance which includes electrical performance or solderability may be affected, or result to "position shift" in soldering process. Chip Coil c Land Solder resist a a 1.0 b 4.5 c 1.5 b (in mm) 11.2 Flux, Solder Flux Solder ・Use rosin-based flux. ・Don’t use highly acidic flux with halide content exceeding 0.2(wt)% (chlorine conversion value). ・Don’t use water-soluble flux. ・Use Sn-3.0Ag-0.5Cu solder ・Standard thickness of solder paste : 200μm to 300μm Other flux (except above) Please contact us for details, then use. 11.3 Flow soldering / Reflow soldering conditions ・Pre-heating should be in such a way that the temperature difference between solder and product surface is limited to 150°C max. Cooling into solvent after soldering also should be in such a way that the temperature difference is limited to 100°C max. Insufficient pre-heating may cause cracks on the product, resulting in the deterioration of products quality. ・Standard soldering profile and the limit soldering profile is as follows. The excessive limit soldering conditions may cause leaching of the electrode and / or resulting in the deterioration of product quality. Soldering profile (1)Flow soldering profile Temp. (℃) 265℃±3℃ 250℃ Limit Profile 150 Heating Time Time. (s) 60s min. Standard Profile Pre-heating Heating Cycle of flow Standard Profile Limit Profile 150℃、60s min. 250℃、4s～6s 265℃±3℃、5s 2 times 2 times MURATA MFG.CO., LTD Reference Only Spec No. JELF243A-0032R-01 P.8/10 (2)Reflow soldering profile Temp. (℃) 260℃ 245℃±3℃ 230℃ 220℃ Limit Profile 180 150 Standard Profile 30s～60s 60s max. 90s±30s Time. (s) Standard Profile 150～180°C 、90s±30s Pre-heating Heating Peak temperature Limit Profile above 220°C、30s～60s above 230°C、60s max. 245±3°C 260°C,10s 2 times 2 times Cycle of reflow 11.4 Reworking with soldering iron. The following conditions must be strictly followed when using a soldering iron. Pre-heating 150°C,1 min Tip temperature 350°C max. Soldering iron output 80W max. Tip diameter φ3mm max. Soldering time 3(+1,-0)s Times 2 times Note : Do not directly touch the products with the tip of the soldering iron in order to prevent the crack on the products due to the thermal shock. 11.5 Solder Volume ・Solder shall be used not to be exceeded the upper limits as shown below. ・Accordingly increasing the solder volume, the mechanical stress to Chip is also increased. Exceeding solder volume may cause the failure of mechanical or electrical performance. Upper Limit Recommendable T t 1/3T≦t≦T T: Lower flange thickness 11.6 Product’s location The following shall be considered when designing and laying out P.C.B.'s. (1) P.C.B. shall be designed so that products are not subject to the mechanical stress due to warping the board. ［Products direction］ a b 〈 Poor example 〉 〈 Good example〉 MURATA MFG.CO., LTD Products shall be located in the sideways direction (Length:a D ∗1 (2) Add slits in the board separation part. A > B (3) Keep the mounting position of the component away from the board separation surface. A > C Seam b A C B ∗1 A > D is valid when stress is added vertically to the perforation as with Hand Separation. If a Cutting Disc is used, stress will be diagonal to the PCB, therefore A > D is invalid. D Slit Length:a< b a (3) Mounting Components Near Screw Holes When a component is mounted near a screw hole, it may be affected by the board deflection that occurs during the tightening of the screw. Mount the component in a position as far away from the screw holes as possible. Screw Hole Recommended 11.7 Cleaning Conditions Products shall be cleaned on the following conditions. (1) Cleaning temperature shall be limited to 60°C max.(40°C max for IPA.) (2) Ultrasonic cleaning shall comply with the following conditions with avoiding the resonance phenomenon at the mounted products and P.C.B. Power : 20 W / l max. Frequency : 28kHz to 40kHz Time : 5 min max. (3) Cleaner 1. Alcohol type cleaner 2. Aqueous agent ･Isopropyl alcohol (IPA) ･PINE ALPHA ST-100S (4) There shall be no residual flux and residual cleaner after cleaning. In the case of using aqueous agent, products shall be dried completely after rinse with de-ionized water in order to remove the cleaner. (5) Other cleaning Please contact us. 11.8 Resin coating The inductance value may change due to high cure-stress of resin to be used for coating/molding products. An open circuit issue may occur by mechanical stress caused by the resin, amount/cured shape of resin, or operating condition etc. Some resin contains some impurities or chloride possible to generate chlorine by hydrolysis under some operating condition may cause corrosion of wire of coil, leading to open circuit. So, please pay your careful attention when you select resin in case of coating/molding the products with the resin. Prior to use the coating resin, please make sure no reliability issue is observed by evaluating products mounted on your board. 11.9 Caution for use ・Sharp material such as a pair of tweezers or other material such as bristles of cleaning brush, shall not be touched to the winding portion to prevent the breaking of wire. ・Mechanical shock should not be applied to the products mounted on the board to prevent the breaking of the core 11.10 Handling of a substrate After mounting products on a substrate, do not apply any stress to the product caused by bending or twisting to the substrate when cropping the substrate, inserting and removing a connector from the substrate or tightening screw to the substrate. Excessive mechanical stress may cause cracking in the product. Bending Twisting MURATA MFG.CO., LTD Spec No. JELF243A-0032R-01 Reference Only P.10/10 11.11 Storage and Handing Requirements (1) Storage period Use the products within 12 months after delivered. Solderability should be checked if this period is exceeded. (2) Storage conditions ・Products should be stored in the warehouse on the following conditions. Temperature : -10 °C to 40 °C Humidity : 15 % to 85 % relative humidity No rapid change on temperature and humidity The electrode of the products is coated with solder. Don't keep products in corrosive gases such as sulfur, chlorine gas or acid, or it may cause oxidization of electrode, resulting in poor solderability. ・Products should not be stored on bulk packaging condition to prevent the chipping of the core and the breaking of winding wire caused by the collision between the products. ・Products should be stored on the palette for the prevention of the influence from humidity, dust and so on. ・Products should be stored in the warehouse without heat shock, vibration, direct sunlight and so on. (3) Handling Condition Care should be taken when transporting or handling product to avoid excessive vibration or mechanical shock. 12. Note (1)Please make sure that your product has been evaluated in view of your specifications with our product being mounted to your product. (2)You are requested not to use our product deviating from the reference specifications. (3)The contents of this reference specification are subject to change without advance notice. Please approve our product specifications or transact the approval sheet for product specifications before ordering MURATA MFG.CO., LTD