Reference Only
Spec No. JELF243A-0032R-01
P.1/10
CHIP COIL(CHIP INDUCTORS) LQH31MN□□□□03L REFERENCE SPECIFICATION
1. Scope
This reference specification applies to LQH31MN series, Chip coil (Chip Inductors).
2. Part Numbering
(ex)
LQ
H
31
M
N
R15
M
0
3
L
Product ID Structure Dimension Applications Category Inductance Tolerance Features Electrode Packaging
(L×W)
and
L:Taping
Characteristics
3. Rating
・Operating Temperature Range.
・Storage Temperature Range.
Customer
Part Number
– 40 °C
– 40 °C
to + 85 °C
to + 85 °C
DC
Resistance
(Ω)
Self
Resonant
Frequency
(MHz min.)
∗Rated
Current
(mA)
0.39±40%
250
250
0.22
0.43±40%
250
240
0.33
0.45±40%
250
230
0.83±40%
200
215
0.61±40%
180
200
0.68
0.67±40%
160
190
0.82
0.73±40%
120
185
1.0
0.49±30%
100
175
90
165
1.0±30%
75
155
1.6±30%
60
150
2.2
0.7±30%
50
140
2.7
0.55±30%
43
135
3.3
0.61±30%
38
130
Inductance
MURATA
Part Number
(μH)
LQH31MNR15M03L
LQH31MNR15K03L
LQH31MNR22M03L
LQH31MNR22K03L
LQH31MNR33M03L
LQH31MNR33K03L
LQH31MNR47M03L
LQH31MNR47K03L
LQH31MNR56M03L
LQH31MNR56K03L
LQH31MNR68M03L
LQH31MNR68K03L
LQH31MNR82M03L
LQH31MNR82K03L
LQH31MN1R0M03L
LQH31MN1R0K03L
Tolerance
Q
(min.)
0.15
20
0.47
0.56
M:±20%
K :±10%
30
LQH31MN1R2M03L
LQH31MN1R2K03L
0.9±30%
1.2
LQH31MN1R2J03L
0.37±30%
LQH31MN1R5M03L
LQH31MN1R5K03L
1.5
LQH31MN1R5J03L
LQH31MN1R8M03L
LQH31MN1R8K03L
1.8
M:±20%
K :±10%
J :± 5%
LQH31MN1R8J03L
LQH31MN2R2M03L
LQH31MN2R2K03L
35
LQH31MN2R2J03L
LQH31MN2R7M03L
LQH31MN2R7K03L
LQH31MN2R7J03L
LQH31MN3R3M03L
LQH31MN3R3K03L
LQH31MN3R3J03L
MURATA MFG.CO., LTD
Spec No. JELF243A-0032R-01
Customer
Part Number
Reference Only
DC
Resistance
(Ω)
Self
Resonant
Frequency
(MHz min.)
∗Rated
Current
(mA)
3.9
1.5±30%
35
125
4.7
1.7±30%
31
120
1.8±30%
28
115
2.0±30%
25
110
8.2
2.2±30%
23
105
10
2.5±30%
20
100
12
2.7±30%
18
95
15
3.0±30%
16
90
18
3.4±30%
15
85
22
3.1±30%
14
85
27
3.4±30%
13
85
3.8±30%
12
80
7.2±30%
11
55
8.0±30%
10
55
56
8.9±30%
9.0
50
68
9.9±30%
8.5
50
82
11.0±30%
7.5
45
100
12.0±30%
7.0
45
Inductance
MURATA
Part Number
P.2/10
(μH)
Tolerance
Q
(min.)
LQH31MN3R9M03L
LQH31MN3R9K03L
LQH31MN3R9J03L
LQH31MN4R7M03L
LQH31MN4R7K03L
LQH31MN4R7J03L
LQH31MN5R6M03L
LQH31MN5R6K03L
5.6
LQH31MN5R6J03L
M:±20%
K :±10%
J :± 5%
LQH31MN6R8M03L
LQH31MN6R8K03L
6.8
LQH31MN6R8J03L
35
LQH31MN8R2M03L
LQH31MN8R2K03L
LQH31MN8R2J03L
LQH31MN100K03L
LQH31MN100J03L
LQH31MN120K03L
LQH31MN120J03L
LQH31MN150K03L
LQH31MN150J03L
LQH31MN180K03L
LQH31MN180J03L
LQH31MN220K03L
LQH31MN220J03L
LQH31MN270K03L
LQH31MN270J03L
LQH31MN330K03L
LQH31MN330J03L
LQH31MN390K03L
LQH31MN390J03L
LQH31MN470K03L
LQH31MN470J03L
LQH31MN560K03L
LQH31MN560J03L
LQH31MN680K03L
LQH31MN680J03L
LQH31MN820K03L
LQH31MN820J03L
LQH31MN101K03L
LQH31MN101J03L
33
K:±10%
J :± 5%
39
47
40
∗When applied Rated current to the Products, self temperature rise shall be limited to 20°C max and
Inductance will be within ±10% of initial Inductance value.
MURATA MFG.CO., LTD
Reference Only
Spec No. JELF243A-0032R-01
P.3/10
4. Testing Conditions
《Unless otherwise specified》
Temperature : Ordinary Temperature / 15°C to 35°C
Humidity
: Ordinary Humidity / 25%(RH) to 85%(RH)
《In case of doubt》
Temperature
: 20 ± 2°C
Humidity
: 60%(RH) to 70%(RH)
Atmospheric Pressure : 86kPa to 106 kPa
5. Appearance and Dimensions
1.6±0.2
1.8±0.2
2.3±0.2
■Unit Mass (Typical value)
0.029g
3.2±0.3
1.6±0.2
∗ No polarity.
0.7
min.
0.7
min.
0.7
(in mm)
min.
6. Electrical Performance
No.
6.1
Item
Inductance
Specification
Inductance shall meet item 3.
Test Method
Measuring Equipment :
KEYSIGHT 4192A or equivalent
Measuring Frequency : 1MHz
Measuring Fixture :
Measuring
Fixture
Fig.1
6.2
Q
Q shall meet item 3.
Measuring Equipment :
KEYSIGHT 4192A or equivalent
Measuring Frequency :
25.2MHz / 0.15μH ~ 0.82μH
10MHz / 1.0μH ~ 2.7μH
8MHz / 3.3μH ~ 8.2μH
5MHz / 10μH ~ 18μH
2.5MHz / 22μH ~ 100μH
Measuring Fixture : See Fig.1.
6.3
DC Resistance
DC Resistance shall meet item 3.
Measuring Equipment : Digital multi meter
6.4
Self Resonant
Frequency(S.R.F)
S.R.F shall meet item 3.
Measuring Equipment :
KEYSIGHT E4991A or equivalent
6.5
Temperature
Characteristics
Temperature Coefficient Inductance /
0.15μH ~ 18μH :
150 PPM/ °C±150 PPM / °C
22μH ~ 100μH :
650 PPM/ °C±450 PPM / °C
Temperature coefficient on the basis of step
3 shall meet specification after tested as
follows.It shall be subjected to the condition
of Table 1,and its inductance shall be
measured at each step after reaching the
thermal equilibrium and be calculated.
Table 1
Step1/+20°C ±2°C
Step2/ -25°C ±2°C
Step3/+20°C ±2°C
MURATA MFG.CO., LTD
Step4/+85°C ±2°C
Step5/+20°C ±2°C
Spec No. JELF243A-0032R-01
Reference Only
P.4/10
7. Mechanical Performance
No.
7.1
Item
Shear Test
Specification
Chip coil shall not be damaged after
tested as test method.
Test Method
Substrate : Glass-epoxy substrate
4.5
Chip Coil
Pattern
Solder resist
Substrate
1.5
Applied Direction :
(in mm)
1
Chip Coil
F
Substrate
Force : 10N
Hold Duration : 5s ± 1s
7.2
Bending Test
Chip coil shall not be damaged after
tested as test method.
Substrate : Glass-epoxy substrate
(100mm40mm1.6mm)
Speed of Applying Force : 1mm / s
Deflection : 2mm
Hold Duration : 30s
Pressure jig
R340
F
Deflection
45
45
Product
(in mm)
7.3
Vibration
Oscillation Frequency :
10Hz ~ 55Hz ~ 10Hz for 1 min
Total Amplitude : 1.5mm
Testing Time :
A period of 2 hours in each of 3 mutually
perpendicular directions.
(Total 6 hours)
7.4
Solderability
The wetting area of the electrode shall
be at least 90% covered with new
solder coating.
Flux: Ethanol solution of rosin, 25(wt)%
(Immersed for 5s to 10s)
Solder : Sn-3.0Ag-0.5Cu
Pre-Heating : 150±10°C / 60 to 90seconds
Solder Temperature : 240±5°C
Immersion Time : 3±1 s
7.5
Resistance to
Soldering Heat
Appearance:No damage
Inductance Change : within ±5%
Flux: Ethanol solution of rosin, 25(wt)%
(Immersed for 5s to 10s)
Solder : Sn-3.0Ag-0.5Cu
Pre-Heating: 150±10°C / 60 to 90seconds
Solder Temperature: 270±5°C
Immersion Time: 10±1 s
Then measured after exposure in the room
condition for 24±2 hours.
MURATA MFG.CO., LTD
Reference Only
Spec No. JELF243A-0032R-01
P.5/10
8. Environmental Performance (It shall be soldered on the substrate.)
No.
8.1
Item
Heat Resistance
Specification
Appearance : No damage
Inductance Change : within ± 5%
Q Change : within ±20%
Test Method
Temperature : 85 °C ± 2 °C
Time : 1000h (+48h , -0h)
Then measured after exposure in the room
condition for 24±2 hours.
8.2
Cold Resistance
Temperature : -40 °C ± 2 °C
Time: 1000h (+48h , -0h)
Then measured after exposure in the room
condition for 24±2 hours..
8.3
Humidity
Temperature : 40 °C ± 2 °C
Humidity : 90 %(RH) to 95 %(RH)
Time : 1000h (+48h , -0h)
Then measured after exposure in the room
condition for 24±2 hours.
8.4
Temperature Cycle
1 cycle :
1 step : - 40 °C ± 2 °C / 30 min ± 3 min
2 step : Ordinary temp. / 10 min ~ 15 min
3 step : + 85 °C ± 2 °C / 30 min ± 3 min
4 step : Ordinary temp. / 10min ~ 15 min
Total of 10 cycles
Then measured after exposure in the room
condition for 24±2 hours.
9. Specification of Packaging
+0.1
φ 1.5 - 0
※Lead-in / out wire
1.75 ±0.1
9.1 Appearance and Dimensions of plastic tape
(0.2 )
※The packing directions of the chip coil
positions of the lead wire.
8 .0 ±0 .2
3 .6 ± 0 .1
3 .5 ±0 .0 5
in taping are unified with the in/out
Dimension of the Cavity is measured at the
bottom side.
4.0±0.1
1.9±0.1
4.0±0.1
2.0±0.05
Direction of feed
2.0±0.1
(in mm)
9.2 Specification of Taping
(1) Packing quantity (standard quantity)
2,000 pcs / reel
(2) Packing Method
Products shall be packed in the each embossed cavity of plastic tape and sealed by cover tape.
(3) Sprocket hole
The sprocket holes are to the right as the tape is pulled toward the user.
(4) Spliced point
Plastic tape and Cover tape has no spliced point.
(5) Missing components number
Missing components number within 0.1 % of the number per reel or 1 pc., whichever is greater, and are
not continuous. The specified quantity per reel is kept.
9.3 Pull Strength
Plastic tape
Cover tape
10N min.
MURATA MFG.CO., LTD
Reference Only
Spec No. JELF243A-0032R-01
P.6/10
9.4 Peeling off force of cover tape
Speed of Peeling off
165 to 180 degree
300 mm / min
F
Cover tape
0.2N to 0.7N
(minimum value is typical)
Peeling off force
Plastic tape
9.5 Dimensions of Leader-tape, Trailer and Reel
There shall be leader-tape (cover tape) and trailer-tape (empty tape) as follows.
Leader
Trailer
2.0±0.5
160 min.
190 min.
Label
Empty tape
210 min.
Cover tape
φ 13.0±0.2
1
φ 60± 0
φ 21.0±0.8
9± 10
Direction of feed
13±1.4
0
φ 180± 3
9.6 Marking for reel
Customer part number, MURATA part number, Inspection number(∗1), RoHS marking(∗2), Quantity etc ・・・
∗1)
(1) Factory Code
(2) Date
□□ OOOO ×××
(1)
(2)
(3)
First digit
: Year / Last digit of year
Second digit
: Month / Jan. to Sep. → 1 to 9, Oct. to Dec. → O, N, D
Third, Fourth digit : Day
(3) Serial No.
∗2) « Expression of RoHS marking »
ROHS – Y (△)
(1) (2)
(1) RoHS regulation conformity
(2) MURATA classification number
9.7 Marking for Outside package (corrugated paper box)
Customer name, Purchasing order number, Customer part number, MURATA part number,
RoHS marking (∗2) ,Quantity, etc ・・・
9.8. Specification of Outer Case
Outer Case Dimensions (mm)
Label
H
D
W
10.
W
D
H
186
186
93
Standard Reel
Quantity
in Outer Case (Reel)
5
∗Above Outer Case size is typical. It depends on a quantity
of an order
Caution
Limitation of Applications
Please contact us before using our products for the applications listed below which require especially high
reliability for the prevention of defects which might directly cause damage to the third party's life, body or property.
(1) Aircraft equipment
(6) Transportation equipment (vehicles, trains, ships, etc.)
(2) Aerospace equipment
(7) Traffic signal equipment
(3) Undersea equipment
(8) Disaster prevention / crime prevention equipment
(4) Power plant control equipment
(9) Data-processing equipment
(10) Applications of similar complexity and /or reliability
(5) Medical equipment
requirements to the applications listed in the above
MURATA MFG.CO., LTD
Reference Only
Spec No. JELF243A-0032R-01
P.7/10
11. Notice
This product is designed for solder mounting.
Please consult us in advance for applying other mounting method such as conductive adhesive.
11.1 Land pattern designing
Recommended land patterns for flow and reflow soldering are as follows:
It has been designed for Electric characteristics and solderability.
Please follow the recommended patterns. Otherwise, their performance which includes electrical performance or
solderability may be affected, or result to "position shift" in soldering process.
Chip Coil
c
Land
Solder resist
a
a
1.0
b
4.5
c
1.5
b
(in mm)
11.2 Flux, Solder
Flux
Solder
・Use rosin-based flux.
・Don’t use highly acidic flux with halide content exceeding 0.2(wt)% (chlorine conversion value).
・Don’t use water-soluble flux.
・Use Sn-3.0Ag-0.5Cu solder
・Standard thickness of solder paste : 200μm to 300μm
Other flux (except above) Please contact us for details, then use.
11.3 Flow soldering / Reflow soldering conditions
・Pre-heating should be in such a way that the temperature difference between solder and product surface
is limited to 150°C max. Cooling into solvent after soldering also should be in such a way that the
temperature difference is limited to 100°C max.
Insufficient pre-heating may cause cracks on the product, resulting in the deterioration of products quality.
・Standard soldering profile and the limit soldering profile is as follows.
The excessive limit soldering conditions may cause leaching of the electrode and / or resulting in
the deterioration of product quality.
Soldering profile
(1)Flow soldering profile
Temp.
(℃)
265℃±3℃
250℃
Limit Profile
150
Heating Time
Time. (s)
60s min.
Standard Profile
Pre-heating
Heating
Cycle of flow
Standard Profile
Limit Profile
150℃、60s min.
250℃、4s~6s
265℃±3℃、5s
2 times
2 times
MURATA MFG.CO., LTD
Reference Only
Spec No. JELF243A-0032R-01
P.8/10
(2)Reflow soldering profile
Temp.
(℃)
260℃
245℃±3℃
230℃
220℃
Limit Profile
180
150
Standard Profile
30s~60s
60s max.
90s±30s
Time. (s)
Standard Profile
150~180°C 、90s±30s
Pre-heating
Heating
Peak temperature
Limit Profile
above 220°C、30s~60s
above 230°C、60s max.
245±3°C
260°C,10s
2 times
2 times
Cycle of reflow
11.4 Reworking with soldering iron.
The following conditions must be strictly followed when using a soldering iron.
Pre-heating
150°C,1 min
Tip temperature
350°C max.
Soldering iron output
80W max.
Tip diameter
φ3mm max.
Soldering time
3(+1,-0)s
Times
2 times
Note : Do not directly touch the products with the tip of the soldering iron in order to prevent
the crack on the products due to the thermal shock.
11.5 Solder Volume
・Solder shall be used not to be exceeded the upper limits as shown below.
・Accordingly increasing the solder volume, the mechanical stress to Chip is also increased.
Exceeding solder volume may cause the failure of mechanical or electrical performance.
Upper Limit
Recommendable
T
t
1/3T≦t≦T
T: Lower flange thickness
11.6 Product’s location
The following shall be considered when designing and laying out P.C.B.'s.
(1) P.C.B. shall be designed so that products are not subject to the mechanical stress due to warping the board.
[Products direction]
a
b
〈 Poor example 〉
〈 Good example〉
MURATA MFG.CO., LTD
Products shall be located in the sideways
direction (Length:a D ∗1
(2) Add slits in the board separation part.
A
> B
(3) Keep the mounting position of the component away from
the board separation surface.
A
> C
Seam
b
A
C
B
∗1 A > D is valid when stress is added vertically to
the perforation as with Hand Separation.
If a Cutting Disc is used, stress will be diagonal to
the PCB, therefore A > D is invalid.
D
Slit
Length:a< b
a
(3) Mounting Components Near Screw Holes
When a component is mounted near a screw hole,
it may be affected by the board deflection that occurs
during the tightening of the screw. Mount the component
in a position as far away from the screw holes as possible.
Screw Hole
Recommended
11.7 Cleaning Conditions
Products shall be cleaned on the following conditions.
(1) Cleaning temperature shall be limited to 60°C max.(40°C max for IPA.)
(2) Ultrasonic cleaning shall comply with the following conditions with avoiding the resonance phenomenon
at the mounted products and P.C.B.
Power : 20 W / l max.
Frequency : 28kHz to 40kHz
Time : 5 min max.
(3) Cleaner
1. Alcohol type cleaner
2. Aqueous agent
・Isopropyl alcohol (IPA)
・PINE ALPHA ST-100S
(4) There shall be no residual flux and residual cleaner after cleaning.
In the case of using aqueous agent, products shall be dried completely after rinse with de-ionized water
in order to remove the cleaner.
(5) Other cleaning
Please contact us.
11.8 Resin coating
The inductance value may change due to high cure-stress of resin to be used for coating/molding products.
An open circuit issue may occur by mechanical stress caused by the resin, amount/cured shape of resin, or operating
condition etc. Some resin contains some impurities or chloride possible to generate chlorine by hydrolysis under some
operating condition may cause corrosion of wire of coil, leading to open circuit.
So, please pay your careful attention when you select resin in case of coating/molding the products with the resin.
Prior to use the coating resin, please make sure no reliability issue is observed by evaluating products mounted on
your board.
11.9 Caution for use
・Sharp material such as a pair of tweezers or other material such as bristles of cleaning brush, shall not be touched
to the winding portion to prevent the breaking of wire.
・Mechanical shock should not be applied to the products mounted on the board to prevent the breaking of
the core
11.10 Handling of a substrate
After mounting products on a substrate, do not apply any stress to the product caused by bending or twisting
to the substrate when cropping the substrate, inserting and removing a connector from the substrate or tightening
screw to the substrate.
Excessive mechanical stress may cause cracking in the product.
Bending
Twisting
MURATA MFG.CO., LTD
Spec No. JELF243A-0032R-01
Reference Only
P.10/10
11.11 Storage and Handing Requirements
(1) Storage period
Use the products within 12 months after delivered.
Solderability should be checked if this period is exceeded.
(2) Storage conditions
・Products should be stored in the warehouse on the following conditions.
Temperature
: -10 °C to 40 °C
Humidity : 15 % to 85 % relative humidity No rapid change on temperature and humidity
The electrode of the products is coated with solder. Don't keep products in corrosive gases such as sulfur,
chlorine gas or acid, or it may cause oxidization of electrode, resulting in poor solderability.
・Products should not be stored on bulk packaging condition to prevent the chipping of the core and the
breaking of winding wire caused by the collision between the products.
・Products should be stored on the palette for the prevention of the influence from humidity, dust and so on.
・Products should be stored in the warehouse without heat shock, vibration, direct sunlight and so on.
(3) Handling Condition
Care should be taken when transporting or handling product to avoid excessive vibration or mechanical shock.
12.
Note
(1)Please make sure that your product has been evaluated in view of your specifications with our product being mounted
to your product.
(2)You are requested not to use our product deviating from the reference specifications.
(3)The contents of this reference specification are subject to change without advance notice. Please approve our product
specifications or transact the approval sheet for product specifications before ordering
MURATA MFG.CO., LTD