Reference Only
SpecNo.JELF243A-0040S-01
P1/7
CHIP COIL(CHIP INDUCTORS)LQH32CN□□□□33L REFERENCE SPECIFICATION
1.Scope
This reference specification applies to LQH32CN_33 Series, Chip coil (Chip Inductors).
2.Part Numbering
(ex)
LQ
H
32
C
N
R15
M
3
3
L
Product ID Structure Dimension Applications Category Inductance Tolerance Features Electrode Packaging
(L×W)
and
L:Taping
Characteristics
3.Rating
Operating Temperature Range.
Storage Temperature Range.
Customer
Part Number
-40 to +85°C
-40 to +85°C
(µH)
(Ω)
Self
Resonant
Frequency
(MHz min)
∗Rated
Current
(mA)
DC
Resistance
Inductance
MURATA
Part Number
Tolerance(%)
LQH32CNR15M33L
0.15
0.028 ± 30%
400
1450
LQH32CNR27M33L
0.27
0.034 ± 30%
250
1250
LQH32CNR47M33L
0.47
0.042 ± 30%
150
1100
LQH32CN1R0M33L
1.0
0.060 ± 30%
100
1000
LQH32CN2R2M33L
2.2
0.097 ± 30%
64
790
LQH32CN4R7M33L
4.7
0.15 ± 30%
43
650
LQH32CN100K33L
10
0.30 ± 30%
26
450
±20%
±10%
∗ When applied Rated current to the Products , self temperature rise shall be limited to 20℃ max and Inductance will be
within ±10% of initial Inductance value.
4. Testing Conditions
《Unless otherwise specified》
Temperature : Ordinary Temperature (15 to 35°C)
: Ordinary Humidity
(25 to 85 %(RH))
Humidity
《In case of doubt》
Temperature : 20 ± 2°C
Humidity
: 60 to 70 %(RH)
Atmospheric Pressure : 86 to 106 kPa
5.Appearance and Dimensions
2.5±0.2
Fig.1
2.0±0.2
2.5±0.2
2.5±0.2
A
2.5±0.2
2.5±0.2
A : 2.8 max.
3.2±0.3
* Please refer to the dimention A for
2R2M,4R7M,100K types. (See Fig.1)
* No marking.
■Unit Mass (Typical value)
0.060g
(in mm)
0.9±0.3
0.9±0.3
1.3±0.2
MURATA MFG.CO., LTD
SpecNo.JELF243A-0040S-01
Reference Only
P2/7
6.Electrical Performance
No.
6.1
Item
Inductance
Specification
Inductance shall meet item 3.
Test Method
Measuring Equipment:KEYSIGHT 4192A or equivalent
Measuring Frequency:1MHz
6.2
DC Resistance
DC Resistance shall meet item 3.
Measuring Equipment:Digital multi meter
6.3
Self Resonant
Frequency(S.R.F)
S.R.F shall meet item 3.
Measuring Equipment:
KEYSIGHT E4991A or equivalent
7.Mechanical Performance
No.
7.1
Item
Shear Test
Specification
Chip coil shall not be damaged.
Test Method
Substrate: Glass-epoxy substrate
Applied Direction : Chip coil
F
Substrate
Force: 10N
Hold Duration: 5±1s
7.2
Bending Test
Substrate: Glass-epoxy substrate
(100×40×1.6mm)
Speed of Applying Force: 1mm / s
Deflection: 2mm
Hold Duration: 30s
Pressure jig
R340
F
Deflection
45
45
Product
(in mm)
7.3
Vibration
Oscillation Frequency: 10~55~10Hz for 1 minute
Total Amplitude: 1.5mm
Testing Time:
A period of 2 hours in each of 3 mutually
perpendicular directions.
(Total 6 hours)
7.4
Solderability
The wetting area of the electrode
shall be at least 90% covered with
new solder coating.
Flux: Ethanol solution of rosin, 25(wt)%
(Immersed for 5s to 10s)
Solder: Sn-3.0Ag-0.5Cu
Pre-Heating: 150±10°C / 60 to 90seconds
Solder Temperature: 240±5°C
Immersion Time: 3±1 s
7.5
Resistance to
Soldering Heat
Appearance:No damage
Inductance Change: within ± 5%
Flux: Ethanol solution of rosin, 25(wt)%
(Immersed for 5s to 10s)
Solder: Sn-3.0Ag-0.5Cu
Pre-Heating: 150±10°C / 60 to 90seconds
Solder Temperature: 270±5°C
Immersion Time: 10±1 s
Then measured after exposure in the room condition for
24±2 hours.
MURATA MFG.CO., LTD
Reference Only
SpecNo.JELF243A-0040S-01
P3/7
8.Environmental Performance (It shall be soldered on the substrate.)
No.
8.1
Item
Heat Resistance
Specification
Appearance:No damage
Inductance Change: within ± 5%
DC Resistance Change:
within ± 5%
Test Method
8.2
Cold Resistance
Temperature: -40±2°C
Time: 1000± 48
00 hours
Then measured after exposure in the room condition for
24±2 hours.
8.3
Humidity
Temperature: 40±2°C
Humidity: 90 to 95%(RH)
Time: 1000± 48
00 hours
Then measured after exposure in the room condition for
24±2 hours.
8.4
Temperature
Cycle
1 cycle:
1 step: -40±2°C / 30±3 minutes
2 step: Ordinary temp. / 10 to 15 minutes
3 step: +85±2°C / 30±3 min
4 step: Ordinary temp. / 10 to 15 minutes
Total of 10 cycles
Then measured after exposure in the room condition for
24±2 hours.
Temperature: 85±2°C
Time: 1000± 48
00 hours
Then measured after exposure in the room condition for
24±2 hours.
9. Specification of Packaging
3.5±0.05
3.6±0.2
( 0.2 )
※The packing directions of the chip coil
in taping are unified with the in/out
positions of the lead wire.
8.0±0.2
※ Lead- in/out wire
+0.1
φ 1.5 - 0
1.75±0.1
9.1 Appearance and Dimensions of plastic tape
Dimension of the Cavity is measured
at the bottom side.
4.0±0.1
2.9±0.2
4.0±0.1
2.0±0.05
Direction of feed
(in mm)
2.1±0.1
9.2 Specification of Taping
(1) Packing quantity (standard quantity)
2,000 pcs / reel
(2) Packing Method
Products shall be packed in the each embossed cavity of plastic tape and sealed by cover tape.
(3) Sprocket hole
The sprocket holes are to the right as the tape is pulled toward the user.
(4) Spliced point
Plastic tape and Cover tape has no spliced point.
(5) Missing components number
Missing components number within 0.1 % of the number per reel or 1 pc., whichever is greater, and
are not continuous. The specified quantity per reel is kept.
9.3 Pull Strength
Embossed carrier tape
10N min.
Cover tape
5N min.
9.4 Peeling off force of cover tape
Speed of Peeling off
Peeling off force
300mm/min
165 to 180 degree
F
Cover tape
0.2 to 0.7N
(minimum value is typical)
Plastic tape
MURATA MFG.CO., LTD
Reference Only
SpecNo.JELF243A-0040S-01
9.5 Dimensions of Leader-tape, Trailer and Reel
There shall be leader-tape (cover tape) and trailer-tape (empty tape) as follows.
Leader
Trailer
2.0±0.5
P4/7
160 min.
190 min.
Label
Empty tape
210 min.
Cover tape
φ 13.0±0.2
1
φ 60± 0
φ 21.0±0.8
9± 10
Direction of feed
13±1.4
0
φ 180± 3
9.6 Marking for reel
Customer part number, MURATA part number, Inspection number(∗1), RoHS marking(∗2), Quantity etc ・・・
□□ OOOO ×××
∗1)
(1)
(1) Factory Code
(2) Date
First digit
Second digit
Third, Fourth digit
(3) Serial No.
∗2) « Expression of RoHS marking »
(2)
(3)
: Year / Last digit of year
: Month / Jan. to Sep. → 1 to 9, Oct. to Dec. → O, N, D
: Day
ROHS – Y (△)
(1) (2)
(1) RoHS regulation conformity parts.
(2) MURATA classification number
9.7 Marking for Outside package (corrugated paper box)
Customer name, Purchasing order number, Customer part number, MURATA part number,
RoHS marking (∗2) ,Quantity, etc ・・・
9.8. Specification of Outer Case
Label
H
D
W
10.
Outer Case Dimensions
(mm)
W
D
H
186
186
93
Standard Reel Quantity in Outer Case
(Reel)
5
∗ Above Outer Case size is typical. It depends on a quantity of an order.
Caution
Limitation of Applications
Please contact us before using our products for the applications listed below which require especially high reliability
for the prevention of defects which might directly cause damage to the third party's life, body or property.
(1) Aircraft equipment
(7) Traffic signal equipment
(2) Aerospace equipment
(8) Disaster prevention / crime prevention equipment
(9) Data-processing equipment
(3) Undersea equipment
(4) Power plant control equipment (10) Applications of similar complexity and /or reliability requirements
(5) Medical equipment
to the applications listed in the above
(6) Transportation equipment (vehicles, trains, ships, etc.)
MURATA MFG.CO., LTD
SpecNo.JELF243A-0040S-01
Reference Only
P5/7
11. Notice
This product is designed for solder mounting.
Please consult us in advance for applying other mounting method such as conductive adhesive.
11.1 Land pattern designing
Recommended land patterns for flow and reflow soldering are as follows:
These have been designed for Electric characteristics and solderability.
Please follow the recommended patterns. Otherwise, their performance which includes electrical performance or
solderability may be affected, or result to "position shift" in soldering process.
Reflow Soldering ∗
Flow Soldering
5.5
Land
5.5
Chip Coil
2.0
1.0
1.0
Solder Resist
1.0
1.3
1.3
1.0
(in mm)
∗ Applicable to flow soldering.
11.2 Flux, Solder
Flux
Solder
・Use rosin-based flux.
・Don’t use highly acidic flux with halide content exceeding 0.2(wt)% (chlorine conversion
value).
・Don’t use water-soluble flux.
・Use Sn-3.0Ag-0.5Cu solder
・Standard thickness of solder paste : 200μm to 300μm
11.3 Flow soldering conditions / Reflow soldering conditions
・Pre-heating should be in such a way that the temperature difference between solder and product surface is limited
to 150°C max. Cooling into solvent after soldering also should be in such a way that the temperature difference is
limited to 100°C max.
Insufficient pre-heating may cause cracks on the product, resulting in the deterioration of product quality.
・Standard soldering profile and the limit soldering profile is as follows.
The excessive limit soldering conditions may cause leaching of the electrode and / or resulting in the deterioration of
product quality.
Soldering profile
(1)Flow soldering profile
Temp.
(℃)
265℃±3℃
250℃
Limit Profile
150
Heating Time
Standard Profile
60s min.
Time. (s)
Standard Profile
Pre-heating
Heating
Cycle of flow
Limit Profile
150℃、60s min.
250℃、4s~6s
265℃±3℃、5s
2 times
1 time
MURATA MFG.CO., LTD
Reference Only
SpecNo.JELF243A-0040S-01
(2)Reflow soldering profile
Temp.
(℃)
P6/7
260℃
245℃±3℃
230℃
220℃
Limit Profile
180
150
Standard Profile
30s~60s
60s max.
90s±30s
Time. (s)
Standard Profile
Pre-heating
Limit Profile
150~180°C 、90s±30s
Heating
above 220°C、30s~60s
above 230°C、60s max.
245±3°C
260°C,10s
2 times
1 time
Peak temperature
Cycle of reflow
11.4 Reworking with soldering iron.
The following conditions must be strictly followed when using a soldering iron.
Pre-heating
150°C,1 min
Tip temperature
350°C max.
Soldering iron output
80W max.
Tip diameter
φ3mm max.
Soldering time
3(+1,-0)s
Times
2 times
Note : Do not directly touch the products with the tip of the soldering iron in order to prevent the
crack on the products due to the thermal shock.
11.5 Solder Volume
・ Solder shall be used not to be exceed the upper limits as shown below.
・ Accordingly increasing the solder volume, the mechanical stress to Chip is also increased.
Exceeding solder volume may cause the failure of mechanical or electrical performance.
Upper Limit
Recommendable
T
t
1/3T≦ t ≦T
(T: Lower flange thickness)
11.6 Product's location
The following shall be considered when designing and laying out P.C.B.’s.
(1) P.C.B. shall be designed so that products are not subject to the mechanical stress due to warping the board.
[Products direction]
a
b
〈 Poor example〉
Products shall be located in the sideways
direction (Length:aC>B ≅ D.
Seam
b
MURATA MFG.CO., LTD
A
a
C
B
D
Slit
Length:a< b
Reference Only
SpecNo.JELF243A-0040S-01
P7/7
11.7 Cleaning Conditions
Products shall be cleaned on the following conditions.
(1) Cleaning temperature shall be limited to 60°C max.(40°C max for IPA.)
(2) Ultrasonic cleaning shall comply with the following conditions with avoiding the resonance
phenomenon at the mounted products and P.C.B.
Power : 20 W / l max.
Frequency : 28kHz to 40kHz
Time : 5 minutes max.
(3) Cleaner
1. Alternative cleaner
Isopropyl alcohol (IPA)
2. Aqueous agent
PINE ALPHA ST-100S
(4) There shall be no residual flux and residual cleaner after cleaning.
In the case of using aqueous agent, products shall be dried completely after rinse with de-ionized
water in order to remove the cleaner.
(5) Other cleaning
Please contact us.
11.8 Resin coating
The inductance value may change due to high cure-stress of resin to be used for coating/molding products. An
open circuit issue may occur by mechanical stress caused by the resin, amount/cured shape of resin, or
operating condition etc. Some resin contains some impurities or chloride possible to generate chlorine by
hydrolysis under some operating condition may cause corrosion of wire of coil, leading to open circuit. So, please
pay your careful attention when you select resin in case of coating/molding the products with the resin.Prior to
use the coating resin, please make sure no reliability issue is observed by evaluating products mounted on your
board.
11.9 Caution for use
Sharp material such as a pair of tweezers or other material such as bristles of cleaning brush, shall not be touched to
the winding portion to prevent the breaking of wire.
Mechanical shock should not be applied to the products mounted on the board to prevent the breaking of the core
11.10 Handling of a substrate
After mounting products on a substrate, do not apply any stress to the product caused by bending or twisting to the
substrate when cropping the substrate, inserting and removing a connector from the substrate or tightening screw to the
substrate.
Excessive mechanical stress may cause cracking in the product.
Bending
Twisting
11.11 Storage and Handling Requirements
(1) Storage period
Use the products within 12 months after delivered.
Solderability should be checked if this period is exceeded.
(2) Storage conditions
Products should be stored in the warehouse on the following conditions.
Temperature : -10 ~ 40°C
Humidity
: 15 to 85% relative humidity No rapid change on temperature and humidity
The electrode of the products is coated with solder. Don't keep products in corrosive gases such as sulfur,
chlorine gas or acid, or it may cause oxidization of electrode, resulting in poor solderability.
Products should not be stored on bulk packaging condition to prevent the chipping of the core and the
breaking of winding wire caused by the collision between the products.
Products should be stored on the palette for the prevention of the influence from humidity, dust and so on.
Products should be stored in the warehouse without heat shock, vibration, direct sunlight and so on.
(3) Handling Condition
Care should be taken when transporting or handling product to avoid excessive vibration or mechanical
shock.
12.
Note
(1) Please make sure that your product has been evaluated in view of your specifications with our product being
mounted to your product.
(2) You are requested not to use our product deviating from the reference specifications.
(3) The contents of this reference specification are subject to change without advance notice. Please approve our
product specifications or transact the approval sheet for product specifications before ordering
MURATA MFG.CO., LTD