LQH32PN220MN0L

Inductor for Power Lines (Power Inductor) Soldering and Mounting 1. Standard Land Pattern Dimensions A high Q value is achieved when the PCB electrode land pattern is designed so that it does not project beyond the chip inductor (chip coil) electrode. Land Pattern + Solder Resist Land Pattern Solder Resist (in mm) Series Standard Land Dimensions LQM18F/18P LQM21D/21F/21P LQM2MP LQM2HP LQM31P LQM32P LQH2MC LQH31C LQH32P LQH44P LQH5BP LQH55D/66S LQW15C_00 LQW15C_10 LQW18C c Part Number a b b 2.2-2.6 c 0.7 LQM21D/21F/21P 1.2 3.0-4.0 1.0 LQM2MP 0.8 2.4 1.8 LQM2HP 1.6 3.0 1.5 LQM31P 2.0 4.2-5.2 1.2 LQM32P 1.9 3.6 2.7 LQH2MC 0.8 2.6 1.0 LQH31C 1.0 4.5 1.5 LQH32P 1.3 3.8 2.0 LQH44P 1.3 4.4 3.0 LQH5BP 1.8 5.5 4.1 LQH55D/66S 2.0 8.0 3.5 LQW15C_00 0.4 1.4 0.6 LQW15C_10 0.4 1.4 0.66 LQW18C 0.7 2.2 1.0 1.8-2.0 0.7 1.4 LQH2HP a LQM18F Flow /18P Reflow 0.8 3.0 5.5 2.0 1.0 LQH32C 1.0 1.3 1.0 0.7 0.45 2.4 0.7 0.45 0.75 3.3 0.75 LQH3NP 1.15 1.0 1.15 3.3 7.5 3.0 1.5 LQH43C LQH43P 9 2. LQH55P 45˚ 1.5 1.5 1.5 7 6. 6 1. Attention should be paid to potential magnetic coupling effects when using the inductor (coil) as a resonator. Continued on the following page. Inductor for Power Lines (Power Inductor) Soldering and Mounting 2. Standard Soldering Conditions (1) Soldering method Chip inductor (Chip coils) can be flow or reflow soldered. Please contact Murata regarding other soldering methods. As for LQH2MC/2HP/3NP/32P/44P/5BP/55D/55P/66S, LQM32P, LQW15C/18C series, please use reflow soldering. Solder: Use Sn-3.0Ag-0.5Cu solder. Flux: Use rosin-based flux, but not strongly acidic flux (with chlorine content exceeding 0.2wt%). Do not use water-soluble flux. The flux used for LQW15C/18C series should use the rosin-based flux that includes middle activator equivalent to 0.06wt% to 0.1wt% chlorine. For additional mounting methods, please contact Murata. (2) Soldering profile Temperature (°C) "Flow Soldering profile (Sn-3.0Ag-0.5Cu solder) T3 T2 t2 Heating T1 Limit Profile Standard Profile Pre-heating t1 time (s) Standard Profile Pre-heating Series Heating Temp. (T1) Time. (t1) Temp. (T2) Time. (t2) LQM18F/18P LQM21D/21F/21P/2MP/2HP LQM31P LQH31C 150°C 60s min. 250°C 4 to 6s LQH32C LQH43C/43P 150°C 60s min. 250°C 4 to 6s Limit Profile Cycle of flow Heating Cycle of flow Temp. (T3) Time. (t2) 2 times max. 265±3°C 5s max. 2 times max. 2 times max. 265±3°C 5s max. 1 times "Reflow Soldering profile (Sn-3.0Ag-0.5Cu solder) Temperature (°C) T4 T2 T1 T3 180 150 Limit Profile Pre-heating t1 Standard Profile t2 90±30s time (s) Standard Profile Temp. (T1) Time. (t1) Peak temperature (T2) LQM18F/18P LQM21D/21F/21P/2MP/2HP LQM31P/32P LQH2MC, LQH2HP LQH31C LQH3NP/32P/43P/44P/5BP/55P LQW15C/18C 220°C 30 to 60s 245±3°C LQH32C LQH43C LQH55D, LQH66S 220°C 30 to 60s 245±3°C Series Heating Limit Profile Temp. (T3) Time. (t2) Peak temperature (T4) 2 times max. 230°C 60s max. 260°C/10s 2 times max. 2 times max. 230°C 60s max. 260°C/10s 1 time Cycle of reflow Heating Cycle of reflow Continued on the following page. Inductor for Power Lines (Power Inductor) (3) Reworking with Soldering Iron Preheating at 150°C for 1 minute is required. Do not directly touch the ceramic element with the tip of the soldering iron. The reworking soldering conditions are as follows: Soldering and Mounting Soldering iron power output: 80W max. Temperature of soldering iron tip: 350°C Diameter of soldering iron end: 3.0mm max. Soldering time: within 3 s 3. Mounting Instructions (1) Land Pattern Dimensions Large lands reduce Q of the mounted chip. Also, large protruding land areas (bordered by lines having dimensions 'c' and 'd' shown) cause floating and electrode leaching. Solder Resist Land c d (2) Land Pattern Designing (LQH series) Please follow the recommended patterns. Otherwise, their performance which includes electrical performance or solderability may be affected, or result to “position shift” in soldering process. (3) Magnetic Coupling Since some chip inductors (chip coils) are constructed like an open magnetic circuit, narrow spacing between inductors (coils) may cause magnetic coupling. LQM, LQH66S and LQH_P series have a magnetically shielded structure. The structure makes their coupling coefficient smaller than that of conventional chip inductors (chip coils). (4) PCB Warping PCB should be designed so that products are not subjected to the mechanical stress caused by warping the board. Magnetic Coupling Products should be located in the sideways direction (Length: a