Reference Only
SpecNo.JELF243A-0092H-01
CHIP COIL(CHIP INDUCTORS) LQH3NPN□□□□MRE
P1/8
REFERENCE SPECIFICATION
1. Scope
This reference specification applies to LQH3NPN_MR Series, Chip coil (Chip Inductors).
2. Part Numbering
(ex)
LQ
H
3N
P
N
1R0
M
M
R
E
Product ID Structure Dimension Applications Category Inductance Tolerance Dimension Other Packaging
(L×W)
and
(T)
E:Φ180Taping
Characteristics
3. Rating
・Operating Temperature Range
(Ambient temperature; Self-temperature rise is not included)
(Product temperature; Self- temperature rise is included)
・Storage Temperature Range.
Inductance
-40 to +85°C
-40 to +125°C
-40 to +125°C
∗3 Rated Current (mA)
DC
Resistance
(Ω)
Self
Resonant
Frequency
(MHz min)
∗1 Based on
Inductance
change
∗2 Based on
Temperature
rise
1.0
0.042±20%
135
1600
2150
LQH3NPN2R2MMRE
2.2
0.068±20%
75
1380
1750
LQH3NPN3R3MMRE
3.3
0.088±20%
70
1200
1550
LQH3NPN4R7MMRE
4.7
0.105±20%
57
950
1400
LQH3NPN6R8MMRE
6.8
0.155±20%
40
830
1250
LQH3NPN100MMRE
10
0.210±20%
30
590
1150
LQH3NPN220MMRE
22
0.480±20%
20
430
750
LQH3NPN330MMRE
33
0.790±20%
15
380
600
LQH3NPN470MMRE
47
1.140±20%
10
320
460
Customer
Part Number
MURATA
Part Number
(μH)
LQH3NPN1R0MMRE
Tolerance
(%)
M:±20
∗1:When applied Rated current to the Products, Inductance will be within ±30% of nominal Inductance value.
∗2: When applied Rated current to the Products, temperature rise caused by self-generated heat shall be limited
to 40°C max.
∗3: Keep the temperature (ambient temperature plus self-generation of heat) under 125°C.
4. Testing Conditions
《Unless otherwise specified》
Temperature : Ordinary Temperature (15 to 35°C)
: Ordinary Humidity (25 to 85 %(RH))
Humidity
《In case of doubt》
Temperature
Humidity
Atmospheric Pressure
5. Appearance and Dimensions
3. 0±0.2
1. 1±0.1
1.4
方向識別マーク
Polarity Marking
3. 0±0.2
3. 0±0.2
■Unit Mass (Typical value)
0.051g
■部品重量(参考値)
0.045g
(単位:mm)
(in mm)
1.0±0.2
0. 9±0.2
1.0±0.2
0. 9±0.2
MURATA MFG.CO., LTD
: 20 ± 2°C
: 60 to 70 %(RH)
: 86 to 106 kPa
Reference Only
SpecNo.JELF243A-0092H-01
P2/8
6. Marking
Polarity marking is on the upper surface of a Product.
Refer to the 10.1「Appearance and Dimensions of plastic tape」about the Relative position of Polarity Marking.
7. Electrical Performance
No.
7.1
Item
Inductance
Specification
Inductance shall meet item 3.
Test Method
Measuring Equipment: KEYSIGHT 4192A or equivalent
Measuring Frequency: 1MHz
7.2
DC Resistance
DC Resistance shall meet item 3.
Measuring Equipment: Digital multi meter
7.3
Self Resonant
Frequency(S.R.F)
S.R.F shall meet item 3.
Measuring Equipment: KEYSIGHT E4991A or equivalent
8. Mechanical Performance
No.
8.1
Item
Shear Test
Specification
Chip coil shall not be damaged.
Test Method
Substrate: Glass-epoxy substrate
Force: 10N
Hold Duration: 5±1s
Chip coil
F
Substrate
8.2
Bending Test
Substrate: Glass-epoxy substrate
(100×40×1.6mm)
Speed of Applying Force: 0.5mm / s
Deflection: 2mm
Hold Duration: 5seconds.
Pressure jig
R230
F
Deflection
45
45
Product
8.3
Vibration
8.4
Solderability
The wetting area of the electrode
shall be at least 90% covered with
new solder coating.
Flux:Ethanol solution of rosin,25(wt)%
(Immersed for 5s to 10s)
Solder : Sn-3.0Ag-0.5Cu
Pre-Heating:150±10°C / 60 to 90seconds
Solder Temperature:240±5°C
Immersion Time:3±1 s
8.5
Resistance to
Soldering Heat
Appearance: No damage
Inductance Change: within ±10%
Flux: Ethanol solution of rosin,25(wt)%
(Immersed for 5s to 10s)
Solder: Sn-3.0Ag-0.5Cu
Pre-Heating: 150±10°C / 60 to 90seconds
Solder Temperature: 270±5°C
Immersion Time: 10±1 s
Then measured after exposure in the room
condition for 24±2 hours.
(in mm)
Oscillation Frequency: 10~55~10Hz for 1 minute
Total Amplitude: 3.0mm
Testing Time: A period of 2 hours in each of 3
mutually perpendicular directions.
(Total 6 hours)
MURATA MFG.CO., LTD
Reference Only
SpecNo.JELF243A-0092H-01
9. Environmental Performance (It shall be soldered on the substrate.)
No.
9.1
Item
Heat
Resistance
Specification
Appearance: No damage
Inductance Change: within ± 10%
DC Resistance Change: within ± 10%
Test Method
Temperature: 85±2°C
Time: 1000h (+48h , -0h)
Then measured after exposure in the room
condition for 24±2 hours.
9.2
Cold
Resistance
Temperature: -40±2°C
Time: 1000h (+48h , -0h)
Then measured after exposure in the room
condition for 24±2 hours.
9.3
Humidity
Temperature: 40±2°C
Humidity: 90~95%(RH)
Time: 1000h (+48h , -0h)
Then measured after exposure in the room
condition for 24±2 hours.
9.4
Temperature
Cycle
1 cycle:
1 step: -40±2°C / 30±3 minutes
2 step: Ordinary temp. / 10 to 15 minutes
3 step: +85±2°C / 30±3 min
4 step: Ordinary temp. / 10 to 15 minutes
Total of 10 cycles
Then measured after exposure in the room
condition for 24±2 hours.
10. Specification of Packaging
10.1 Appearance and Dimensions of plastic tape
( 0.2 )
+0.1
-0
Polarity mark
Lead-in/out
(in mm)
Direction of feed
Dimension of the Cavity is measured at the bottom side.
10.2 Specification of Taping
(1) Packing quantity (standard quantity)
2,000 pcs / reel
(2) Packing Method
Products shall be packed in the each embossed cavity of plastic tape and sealed by cover tape.
(3) Sprocket hole
The sprocket holes are to the right as the tape is pulled toward the user.
(4) Spliced point
Plastic tape and Cover tape has no spliced point.
(5) Missing components number
Missing components number within 0.1 % of the number per reel or 1 pc., whichever is greater, and are not
continuous. The specified quantity per reel is kept.
10.3 Pull Strength
Embossed carrier tape
10N min.
Cover tape
10N min.
MURATA MFG.CO., LTD
P3/8
Reference Only
SpecNo.JELF243A-0092H-01
P4/8
10.4 Peeling off force of cover tape
Speed of Peeling off
165 to 180 degree
300mm/min
F
Cover tape
0.2 to 0.7N
(minimum value is typical)
Peeling off force
Plastic tape
10.5 Dimensions of Leader-tape, Trailer and Reel
There shall be leader-tape(cover tape) and trailer-tape (empty tape) as follows.
Trailer : 160 min.
Leader
2.0±0.5
Label
190 min
210 min
Empty tape
Cover tape
φ 13.0±0.2
φ 60± 1
0
φ 21.0±0.8
9±1
0
Direction of feed
13±1.4
0
(in mm)
φ 180± 3
10.6 Marking for reel
Customer part number, MURATA part number, Inspection number(∗1), RoHS marking(∗2), Quantity etc ・・・
∗1)
(1) Factory Code
(2) Date
□□ OOOO ×××
(1)
(2)
(3)
First digit
: Year / Last digit of year
Second digit
: Month / Jan. to Sep. → 1 to 9, Oct. to Dec. → O, N, D
Third, Fourth digit : Day
(3) Serial No.
∗2) « Expression of RoHS marking »
ROHS – Y (△)
(1) (2)
(1) RoHS regulation conformity
(2) MURATA classification number
10.7 Marking for Outside package (corrugated paper box)
Customer name, Purchasing order number, Customer part number, MURATA part number,
RoHS Marking (∗2) ,Quantity, etc ・・・
10.8. Specification of Outer Case
Outer Case Dimensions (mm)
Label
H
D
W
11.
W
D
H
Standard Reel Quantity
in Outer Case (Reel)
186
186
93
5
Above Outer Case size is typical. It depends on a quantity
of an order.
Caution
Limitation of Applications
Please contact us before using our products for the applications listed below which require especially high reliability for
the prevention of defects which might directly cause damage to the third party's life, body or property.
(1) Aircraft equipment
(2) Aerospace equipment
(3) Undersea equipment
(4) Power plant control equipment
(5) Medical equipment
(6) Transportation equipment (vehicles, trains, ships, etc.)
(7) Traffic signal equipment
(8) Disaster prevention / crime prevention equipment
(9) Data-processing equipment
(10) Applications of similar complexity and /or reliability requirements
to the applications listed in the above
MURATA MFG.CO., LTD
Reference Only
SpecNo.JELF243A-0092H-01
P5/8
12. Notice
This product is designed for solder mounting. (Reflow soldering only)
Please consult us in advance for applying other mounting method such as conductive adhesive.
12.1 Land pattern designing (Reflow Soldering)
Recommended land pattern for reflow soldering is as follows:
It has been designed for Electric characteristics and solderability.
Please follow the recommended patterns. Otherwise, their performance which includes electrical performance or
solderability may be affected, or result to "position shift" in soldering process.
2.4
0.7
0.7
0.45
3.3
0.75
0.45
Solder Resist
0.75
Land
1.15
1.0 1.15
Chip Coil
3.3
(in mm)
12.2 Flux, Solder
・Use rosin-based flux.
Flux
・Don’t use highly acidic flux with halide content exceeding 0.2(wt)% (chlorine conversion value).
・Don’t use water-soluble flux.
・Use Sn-3.0Ag-0.5Cu solder
Solder
・Standard thickness of solder paste : 100μm to 150μm
Other flux (except above) Please contact us for details, then use.
12.3 Soldering conditions (Reflow)
・Pre-heating should be in such a way that the temperature difference between solder and product surface is limited to
100°C max. Cooling into solvent after soldering also should be in such a way that the temperature difference is limited
to 100°C max.
Insufficient pre-heating may cause cracks on the product, resulting in the deterioration of product quality.
・Standard soldering profile and the limit soldering profile is as follows.
The excessive limit soldering conditions may cause leaching of the electrode and / or resulting in the deterioration of
product quality.
260℃
Temp.
245℃±3℃
220℃
(℃)
230℃
Limit Profile
180
150
Standard Profile
30s~60s
60s max
90s±30s
Time(s)
Standard Profile
Pre-heating
Heating
Peak temperature
Cycle of reflow
Limit Profile
150~180°C 、90s±30s
above 220°C、30s~60s
above 230°C、60s max.
245±3°C
260°C,10s
2 times
2 times
MURATA MFG.CO., LTD
Reference Only
SpecNo.JELF243A-0092H-01
P6/8
12.4 Reworking with soldering iron.
The following conditions must be strictly followed when using a soldering iron.
Pre-heating
150°C,1 min
Tip temperature
350°C max.
Soldering iron output
80W max.
Tip diameter
φ3mm max.
Soldering time
3 (+1,-0)s
Times
1 time
∗Reworking should be limited to only once.
Note: Do not directly touch the products with the tip of the soldering iron in order to prevent the
crack on the products due to the thermal shock.
12.5 Solder Volume
・Solder shall be used not to be exceeded the upper limits as shown below.
・Accordingly increasing the solder volume, the mechanical stress to Chip is also increased.
Exceeding solder volume may cause the failure of mechanical or electrical performance.
Uppre Limit
Recommendable
T t
1/3T≦ t ≦T
(T: Lower flange thickness)
12.6 Product's location
The following shall be considered when designing and laying out P.C.B.’s.
(1) P.C.B. shall be designed so that products are not subject to the mechanical stress due to warping the board.
[Products direction]
Electrode
Products shall be located in the sideways
direction (Length:a D ∗1
(2) Add slits in the board separation part.
A > B
(3) Keep the mounting position of the component away from
the board separation surface.
A > C
Seam
Electrode
C
B
∗1 A > D is valid when stress is added vertically to
the perforation as with Hand Separation.
If a Cutting Disc is used, stress will be diagonal to
the PCB, therefore A > D is invalid.
D
A
Slit
Electrode
(3) Mounting Components Near Screw Holes
When a component is mounted near a screw hole,
it may be affected by the board deflection that occurs
during the tightening of the screw. Mount the component
in a position as far away from the screw holes as possible.
MURATA MFG.CO., LTD
Screw Hole
Recommended
SpecNo.JELF243A-0092H-01
Reference Only
P7/8
12.7 Cleaning Conditions
Products shall be cleaned on the following conditions.
(1) Cleaning temperature shall be limited to 60°C max.(40°C max for IPA.)
(2) Ultrasonic cleaning shall comply with the following conditions with avoiding the resonance
phenomenon at the mounted products and P.C.B.
Power : 20 W / l max.
Frequency : 28kHz to 40kHz
Time : 5 minutes max.
(3) Cleaner
1. Alternative cleaner
・ Isopropyl alcohol (IPA)
2. Aqueous agent
・ PINE ALPHA ST-100S
(4) There shall be no residual flux and residual cleaner after cleaning.
In the case of using aqueous agent, products shall be dried completely after rinse with de-ionized water in order
to remove the cleaner.
(5) Other cleaning
Please contact us.
12.8 Resin coating
The inductance value may change due to high cure-stress of resin to be used for coating/molding products. An open
circuit issue may occur by mechanical stress caused by the resin, amount/cured shape of resin, or operating condition
etc. Some resin contains some impurities or chloride possible to generate chlorine by hydrolysis under some operating
condition may cause corrosion of wire of coil, leading to open circuit. So, please pay your careful attention when you
select resin in case of coating/molding the products with the resin.Prior to use the coating resin, please make sure no
reliability issue is observed by evaluating products mounted on your board.
12.9 Temperature rating of the circuit board and components located around
Temperature may rise up to max. 40°C when applying the rated current to the Products.
Be careful of the temperature rating of the circuit board and components located around.
12.10 Caution for use
・Sharp material such as a pair of tweezers or other material such as bristles of cleaning brush, shall not be touched to
the winding portion to prevent the breaking of wire.
・Mechanical shock should not be applied to the products mounted on the board to prevent the breaking of the core
12.11 Handling of a substrate
After mounting products on a substrate, do not apply any stress to the product caused by bending or twisting to
the substrate when cropping the substrate, inserting and removing a connector from the substrate or tightening
screw to the substrate.
Excessive mechanical stress may cause cracking in the product.
Bending
Twisting
12.12 Storage and Handling Requirements
(1) Storage period
Use the products within 12 months after delivered.
Solderability should be checked if this period is exceeded.
(2) Storage conditions
・Products should be stored in the warehouse on the following conditions.
Temperature : -10 ~ 40°C
Humidity
: 15 to 85% relative humidity No rapid change on temperature and humidity
The electrode of the products is coated with solder. Don't keep products in corrosive gases such as
sulfur,chlorine gas or acid, or it may cause oxidization of electrode, resulting in poor solderability.
・Products should not be stored on bulk packaging condition to prevent the chipping of the core and the breaking of
winding wire caused by the collision between the products.
・Products should be stored on the palette for the prevention of the influence from humidity, dust and so on.
・Products should be stored in the warehouse without heat shock, vibration, direct sunlight and so on.
(3) Handling Condition
Care should be taken when transporting or handling product to avoid excessive vibration or mechanical shock.
MURATA MFG.CO., LTD
SpecNo.JELF243A-0092H-01
13.
Reference Only
P8/8
Note
(1) Please make sure that your product has been evaluated in view of your specifications with our product being
mounted to your product.
(2) You are requested not to use our product deviating from the reference specifications.
(3) The contents of this reference specification are subject to change without advance notice.
Please approve our product specifications or transact the approval sheet for product specifications before ordering.
MURATA MFG.CO., LTD