LQH43CN1R2M03L

SpecNo.JELF243A-0042R-01 P1/8 CHIP COIL（CHIP INDUCTORS）LQH43CN□□□□03L REFERENCE SPECIFICATION 1.Scope This reference specification applies to Chip coil (Chip Inductors) LQH43CN_03 Series. 2.Part Numbering (ex) LQ H 43 C N 1R0 M 0 3 Product ID Structure Dimension Applications Category Inductance Tolerance Features (L×W) and Characteristics Electrode L Packaging L:Taping 3.Rating Operating Temperature Range Storage Temperature Range -40 to +85°C -40 to +85°C Inductance DC Resistance ( max.) Self Resonant Frequency (MHz min.) *Rated Current (mA) 1.0 0.08 100 1080 LQH43CN1R5M03L 1.5 0.09 85 1000 LQH43CN2R2M03L 2.2 0.11 60 900 LQH43CN3R3M03L 3.3 0.13 47 800 LQH43CN4R7M03L 4.7 0.15 35 750 LQH43CN6R8M03L 6.8 0.20 30 720 LQH43CN100K03L 10 0.24 23 650 LQH43CN150K03L 15 0.32 20 570 LQH43CN220K03L 22 0.60 15 420 LQH43CN330K03L 33 1.0 12 310 LQH43CN470K03L 47 1.1 10 280 LQH43CN680K03L 68 1.7 8.4 220 LQH43CN101K03L 100 2.2 6.8 190 LQH43CN151K03L 150 3.5 5.5 130 LQH43CN221K03L 220 4.0 4.5 110 LQH43CN331K03L 330 6.8 3.6 100 LQH43CN471K03L 470 8.5 3.0 90 Customer MURATA Part Number Part Number (H) LQH43CN1R0M03L Tolerance (%) M:±20 K:±10 *When applied Rated current to the Products, Inductance will be within ±10% of initial Inductance value. When applied Rated current to the Products, temperature rise caused by self-generated heat shall be limited to 20°C max. 4. Testing Conditions Temperature : Ordinary Temperature (15 to 35°C) Temperature : 20 ± 2°C Humidity : Ordinary Humidity (25 to 85 %(RH)) Humidity : 60 to 70 %(RH) Atmospheric Pressure : 86 to 106 kPa MURATA MFG.CO., LTD SpecNo.JELF243A-0042R-01 P2/9 5.Appearance and Dimensions 3.2±0.2 2.6±0.2 3.6±0.2 ■Unit Mass (Typical value) 0.13g 3.2±0.2 4.5±0.3 (in mm) ※ No marking. 1.0 min. 1.0 min. 1.0 min. 6.Electrical Performance No. 6.1 Item Inductance Specification Inductance shall meet item 3. 6.2 6.3 DC Resistance Self Resonant Frequency(S.R.F) DC Resistance shall meet item 3. S.R.F shall meet item 3. Test Method Measuring Equipment: KEYSIGHT 4192A or equivalent Measuring Frequency: 1MHz／1.0 to 330H 1kHz／470H Measuring Equipment:Digital multi meter Measuring Equipment: KEYSIGHT E4991A or equivalent 7.Mechanical Performance No. 7.1 7.2 Item Shear Test Specification Chip coil shall not be damaged. Test Method Substrate: Glass-epoxy substrate Chip Coil Applied Direction : F Force: 20N Substrate Hold Duration: 5±1 s Substrate: Glass-epoxy substrate (100  40  1.6mm) Speed of Applying Force: 1mm / s Deflection: 2mm Hold Duration: 30 s Bending Test Pressure jig R340 F Deflection 45 7.3 Vibration 7.4 Solderability The wetting area of the electrode shall be at least 90% covered with new solder coating. 45 Product (in mm) Oscillation Frequency: 10 to 55 to 10Hz for 1 minute Total Amplitude: 1.5mm Testing Time: A period of 2 hours in each of 3 mutually perpendicular directions. (Total 6 hours) Flux: Ethanol solution of rosin, 25(wt)% (Immersed for 5s to 10s) Solder: Sn-3.0Ag-0.5Cu Pre-Heating: 150±10°C / 60 to 90seconds Solder Temperature: 240±5°C Immersion Time: 3±1 s MURATA MFG.CO., LTD SpecNo.JELF243A-0042R-01 No. 7.5 Item Resistance to Soldering Heat P3/9 Specification Appearance:No damage Inductance Change : within ± 5% Test Method Flux: Ethanol solution of rosin, 25(wt)% (Immersed for 5s to 10s) Solder: Sn-3.0Ag-0.5Cu Pre-Heating: 150±10°C / 60 to 90seconds Solder Temperature: 270±5°C Immersion Time: 10±1 s Then measured after exposure in the room condition for 24±2 hours. 8.Environmental Performance (It shall be soldered on the substrate.) No. 8.1 Item Heat Resistance 8.2 Cold Resistance 8.3 Humidity 8.4 Temperature Cycle Specification Appearance:No damage Inductance Change : within ±5% Test Method Temperature: 85±2°C Time: 1000± 48 0 hours Then measured after exposure in the room condition for 24±2 hours. Temperature: -40±2°C Time: 1000± 48 0 hours Then measured after exposure in the room condition for 24±2 hours. Temperature: 40±2°C Humidity: 90 to 95%(RH) Time: 1000± 48 hours 0 Then measured after exposure in the room condition for 24±2 hours. 1 cycle: step 1 : -40±2°C / 30±3 min step 2 : Ordinary temp. / 10 to 15 min step 3 : +85±2°C / 30±3 min step 4 : Ordinary temp. / 10 to 15 min Total of 10 cycles Then measured after exposure in the room condition for 24±2 hours. 9. Specification of Packaging 9.1 Appearance and Dimensions of plastic tape Dimension of the Cavity is measured at the bottom side. 9.2 Specification of Taping (1) Packing quantity (standard quantity) 500 pcs / reel (2) Packing Method Products shall be packed in the each embossed cavity of plastic tape and sealed by cover tape. (3) Sprocket hole The sprocket holes are to the right as the tape is pulled toward the user. (4) Spliced point Plastic tape and Cover tape has no spliced point. (5) Missing components number Missing components number within 0.025% of the number per reel or 1 pc., whichever is greater, and are not continuous. The specified quantity per reel is kept. MURATA MFG.CO., LTD SpecNo.JELF243A-0042R-01 P4/9 9.3 Pull Strength Embossed carrier tape Cover tape 10N min. 5N min. 9.4 Peeling off force of cover tape Speed of Peeling off 300mm/min 0.2 to 0.7N Peeling off force (minimum value is typical) 165 to 180 degree F Cover tape Plastic tape 9.5 Dimensions of Leader-tape, Trailer and Reel There shall be leader-tape (cover tape) and trailer-tape (empty tape) as follows. Trailer : 160 min. Leader 2.0±0.5 190 min Label 210 min Empty tape Cover tape  13.0±0.2  60± 1 0  21.0±0.8 13.0±1 0 Direction of feed 17.0±1.4 (in mm) 0  180± 3 9.6 Marking for reel Customer part number, MURATA part number, Inspection number(1), RoHS marking(2), Quantity etc ･･･ □□ OOOO  1) (1) (1) Factory Code (2) Date First digit Second digit (2) (3) : Year / Last digit of year : Month / Jan. to Sep.  1 to 9, Oct. to Dec.  O, N, D Third, Fourth digit : Day (3) Serial No. 2) « Expression of RoHS marking » ROHS – Y (△) (1) (2) (1) RoHS regulation conformity parts. (2) MURATA classification number 9.7 Marking for Outside package (corrugated paper box) Customer name, Purchasing order number, Customer part number, MURATA part number, RoHS marking (2) ,Quantity, etc ･･･ 9.8. Specification of Outer Case Label H D Outer Case Dimensions Standard Reel Quantity in Outer Case (mm) (Reel) W D H 186 186 93 4 Above Outer Case size is typical. It depends on a quantity of an order W MURATA MFG.CO., LTD SpecNo.JELF243A-0042R-01 10. P5/9 Caution 10.1 Limitation of Applications Please contact us before using our products for the applications listed below which require especially high reliability for the prevention of defects which might directly cause damage to the third party's life, body or property. (1) Aircraft equipment (7) Traffic signal equipment (2) Aerospace equipment (8) Disaster prevention / crime prevention equipment (3)Undersea equipment (9) Data-processing equipment (4)Power plant control equipment (10) Applications of similar complexity and /or reliability requirements (5) Medical equipment to the applications listed in the above (6) Transportation equipment (vehicles, trains, ships, etc.) 10.2 Corrosive gas Please refrain from use since contact with environments with corrosive gases (sulfur gas [hydrogen sulfide, sulfur dioxide, etc.], chlorine, ammonia, etc.) or oils (cutting oil, silicone oil, etc.) that have come into contact with the previously stated corrosive gas environment will result in deterioration of product quality or an open from deterioration due to corrosion of product electrode, etc. We will not bear any responsibility for use under these environments. 11. Notice This product is designed for solder mounting. Please consult us in advance for applying other mounting method such as conductive adhesive. 11.1 Land pattern designing Recommended land patterns for flow and reflow soldering are as follows: These have been designed for Electric characteristics and solderability. Please follow the recommended patterns. Otherwise, their performance which includes electrical performance or solderability may be affected, or result to "position shift" in soldering process. Flow Soldering 7.5 Land Reflow Soldering * 7.5 Chip Coil 3.0 1.5 1.5 Solder Resist 1.5 1.5 1.5 1.5 (in mm) * Applicable to flow soldering. 11.2 Flux, Solder ・Use rosin-based flux. ・Don’t use highly acidic flux with halide content exceeding 0.2(wt)% (chlorine conversion Flux value). ・ Don’t use water-soluble flux. ・Use Sn-3.0Ag-0.5Cu solder Solder ・Standard thickness of solder paste : 200μm to 300μm Other flux (except above) Please contact us for details, then use. MURATA MFG.CO., LTD SpecNo.JELF243A-0042R-01 P6/9 11.3 Flow soldering conditions / Reflow soldering conditions  Pre-heating should be in such a way that the temperature difference between solder and product surface is limited to 150°C max. Cooling into solvent after soldering also should be in such a way that the temperature difference is limited to 100°C max. Insufficient pre-heating may cause cracks on the product, resulting in the deterioration of product quality. Standard soldering profile and the limit soldering profile is as follows. The excessive limit soldering conditions may cause leaching of the electrode and / or resultingin the deterioration of product quality. soldering profile (1)Flow soldering profile Temp. (℃) 265℃±3℃ 250℃ Limit Profile 150 Heating Time 60s min. Standard Profile Time. (s) Standard Profile Limit Profile 150°C、60s min. 250°C、4s～6s 265°C±3°C、5s 2 times 1 time Pre-heating Heating Cycle of flow (2)Reflow soldering profile Temp. (℃) 260℃ 245℃±3℃ 230℃ 220℃ Limit Profile 180 150 Standard Profile 30s～60s 60s max. 90s±30s Pre-heating Heating Peak temperature Cycle of reflow Time. (s) Standard Profile Limit Profile 150～180°C 、90s±30s above 220°C、30s～60s above 230°C、60s max. 245±3°C 260°C,10s 2 times 1 time MURATA MFG.CO., LTD SpecNo.JELF243A-0042R-01 P7/9 11.4 Reworking with soldering iron. The following conditions must be strictly followed when using a soldering iron. Pre-heating 150°C,1 min Tip temperature 350°C max. Soldering iron output 80W max. Tip diameter 3mm max. Soldering time 3(+1,-0)s Times 2 times Note : Do not directly touch the products with the tip of the soldering iron in order to prevent the crack on the products due to the thermal shock. 11.5 Solder Volume  Solder shall be used not to be exceeded the upper limits as shown below.  Accordingly increasing the solder volume, the mechanical stress to Chip is also increased. Exceeding solder volume may cause the failure of mechanical or electrical performance. Upper Limit Recommendable T t 1/3T≦t≦T (T: Lower flange thickness) 11.6 Product's location The following shall be considered when designing and laying out P.C.B.'s. (1) P.C.B. shall be designed so that products are not subject to the mechanical stress due to warping the board. ［Products direction］ Electrode Products shall be locatedin the sideways direction (Length:ab) to the mechanical stress. Poor example） (Good example) Electrode (2) Components location on P.C.B. separation. It is effective to implement the following measures, to reduce stress in separating the board. It is best to implement all of the following three measures; however, implement as many measures as possible to reduce stress. Contents of Measures Stress Level (1) Turn the mounting direction of the component parallel to the board separation surface. A > (2) Add slits in the board separation part. A > B (3) Keep the mounting position of the component away from the board separation surface. A > C Seam C B Electrode A D D 1 1 A > D is valid when stress is added vertically to the perforation as with Hand Separation. If a Cutting Disc is used, stress will be diagonal to the PCB, therefore A > D is invalid. Slit Electrode (3) Mounting Components Near Screw Holes When a component is mounted near a screw hole, it may be affected by the board deflection that occurs during the tightening of the screw. Mount the component in a position as far away from the screw holes as possible. MURATA MFG.CO., LTD Screw Hole Recommended SpecNo.JELF243A-0042R-01 P8/9 11.7 Cleaning Conditions Products shall be cleaned on the following conditions. (1) Cleaning temperature shall be limited to 60°C max.(40°C max for IPA.) (2) Ultrasonic cleaning shall comply with the following conditions with avoiding the resonance phenomenon at the mounted products and P.C.B. Power : 20 W /l max. Frequency : 28kHz to 40kHz Time : 5 minutes max. (3) Cleaner 1. Alternative cleaner ･Isopropyl alcohol (IPA) 2. Aqueous agent ･PINE ALPHA ST-100S (4) There shall be no residual flux and residual cleaner after cleaning. In the case of using aqueous agent, products shall be dried completely after rinse with de-ionized water in order to remove the cleaner. (5) Other cleaning Please contact us. 11.8 Resin coating The inductance value may change due to high cure-stress of resin to be used for coating/molding products. An open circuit issue may occur by mechanical stress caused by the resin, amount/cured shape of resin, or operating condition etc. Some resin contains some impurities or chloride possible to generate chlorine by hydrolysis under some operating condition may cause corrosion of wire of coil, leading to open circuit. So, please pay your careful attention when you select resin in case of coating/molding the products with the resin. Prior to use the coating resin, please make sure no reliability issue is observed by evaluating products mounted on your board. 11.9 Caution for use ・Sharp material such as a pair of tweezers or other material such as bristles of cleaning brush, shall not be touched to the winding portion to prevent the breaking of wire. ・Mechanical shock should not be applied to the products mounted on the board to prevent the breaking of the core. 11.10 Handling of a substrate After mounting products on a substrate, do not apply any stress to the product caused by bending or twisting to the substrate when cropping the substrate, inserting and removing a connector from the substrate or tightening screw to the substrate. Excessive mechanical stress may cause cracking in the product. Bending Twisting 11.11 Storage and Handling Requirements (1) Storage period Use the products within 12 months after delivered. Solderability should be checked if this period is exceeded. (2) Storage conditions  Products should be stored in the warehouse on the following conditions. Temperature : -10 ~ 40°C Humidity : 15 to 85% relative humidity No rapid change on temperature and humidity The electrode of the products is coated with solder. Don't keep products in corrosive gases such as sulfur, chlorine gas or acid, or it may cause oxidization of electrode, resulting in poor solderability.  Products should not be stored on bulk packaging condition to prevent the chipping of the core and the breaking of winding wire caused by the collision between the products.  Products should be stored on the palette for the prevention of the influence from humidity, dust and so on.  Products should be stored in the warehouse without heat shock, vibration, direct sunlight and so on. (3) Handling Condition Care should be taken when transporting or handling product to avoid excessive vibration or mechanical shock. MURATA MFG.CO., LTD SpecNo.JELF243A-0042R-01 12． P9/9 Note (1) Please make sure that your product has been evaluated in view of your specifications with our product being mounted to your product. (2) You are requested not to use our product deviating from the reference specifications. (3) The contents of this reference specification are subject to change without advance notice. Please approve our product specifications or transact the approval sheet for product specifications before ordering. MURATA MFG.CO., LTD