Reference Only
SpecNo.JELF243A-0043P-01
P1/9
CHIP COIL(CHIP INDUCTORS)LQH43MN□□□□03L REFERENCE SPECIFICATION
1.Scope
This reference specification applies to LQH43MN Series, Chip coil (Chip Inductors).
2.Part Numbering
(ex)
LQ
H
43
M
N
1R0
M
0
3
Product ID Structure Dimension Applications Category Inductance Tolerance Features
(L×W)
and
Characteristics
Electrode
L
Packaging
L:Taping
3.Rating
Operating Temperature Range
Storage Temperature Range
Customer’s
Part Number
MURATA
Part Number
-40 to +85°C
-40 to +85°C
Inductance
(H)
Q
(min.)
Tolerance
(%)
DC
Resistance
( max)
Self
Resonant
Frequency
(MHz min)
LQH43MN1R0M03L
1.0
LQH43MN1R2M03L
1.2
LQH43MN1R5M03L
1.5
LQH43MN1R8M03L
1.8
LQH43MN2R2M03L
2.2
LQH43MN2R7M03L
2.7
0.32
53
LQH43MN3R3M03L
3.3
0.35
47
LQH43MN3R9M03L
3.9
0.38
41
4.7
0.40
38
0.47
33
0.50
31
LQH43MN4R7M03L
LQH43MN4R7K03L
LQH43MN5R6M03L
LQH43MN5R6K03L
LQH43MN6R8M03L
LQH43MN6R8K03L
5.6
6.8
0.20
120
100
85
M:±20
M:±20
K:±10
20
0.30
75
62
LQH43MN100K03L
LQH43MN100J03L
LQH43MN120K03L
LQH43MN120J03L
LQH43MN150K03L
LQH43MN150J03L
LQH43MN180K03L
LQH43MN180J03L
500
30
450
LQH43MN8R2M03L
LQH43MN8R2K03L
*Rated
Current
(mA)
8.2
27
0.56
10
23
400
12
0.62
21
380
15
0.73
19
360
0.82
17
340
22
0.94
15
320
27
1.1
14
300
33
1.2
12
270
18
K:±10
J:± 5
35
LQH43MN220K03L
LQH43MN220J03L
LQH43MN270K03L
LQH43MN270J03L
LQH43MN330K03L
LQH43MN330J03L
MURATA MFG.CO., LTD
SpecNo.JELF243A-0043P-01
Customer’s
Part Number
MURATA
Part Number
Reference Only
Inductance
(H)
LQH43MN390K03L
LQH43MN390J03L
LQH43MN470K03L
LQH43MN470J03L
LQH43MN560K03L
LQH43MN560J03L
LQH43MN680K03L
LQH43MN680J03L
LQH43MN820K03L
LQH43MN820J03L
LQH43MN101K03L
LQH43MN101J03L
LQH43MN121K03L
LQH43MN121J03L
LQH43MN151K03L
LQH43MN151J03L
LQH43MN181K03L
LQH43MN181J03L
LQH43MN221K03L
LQH43MN221J03L
LQH43MN271K03L
LQH43MN271J03L
LQH43MN331K03L
LQH43MN331J03L
LQH43MN391K03L
LQH43MN391J03L
LQH43MN471K03L
LQH43MN471J03L
LQH43MN561K03L
LQH43MN561J03L
LQH43MN681K03L
LQH43MN681J03L
LQH43MN821K03L
LQH43MN821J03L
LQH43MN102K03L
LQH43MN102J03L
LQH43MN122K03L
LQH43MN122J03L
LQH43MN152K03L
LQH43MN152J03L
Q
(min.)
Tolerance
(%)
DC
Resistance
( max)
Self
Resonant
Frequency
(MHz min)
P2/9
*Rated
Current
(mA)
39
1.4
11
240
47
1.5
10
220
56
1.7
9.3
200
68
1.9
8.4
180
82
2.2
7.5
170
100
2.5
6.8
160
120
3.0
6.2
150
150
3.7
5.5
130
180
4.5
5.0
120
5.4
4.5
110
6.8
4.0
100
8.2
3.6
95
9.7
3.3
90
470
11.8
3.0
80
560
14.5
2.7
70
680
17.0
2.5
65
820
20.5
2.2
60
1000
25.0
2.0
50
1200
30.0
1.8
45
1500
37.0
1.6
40
220
270
35
K:±10
J:± 5
330
390
40
*When applied Rated current to the Products , self temperature rise shall be limited to 20℃ max and Inductance will be
within ±10% of initial Inductance value.
MURATA MFG.CO., LTD
Reference Only
SpecNo.JELF243A-0043P-01
4. Testing Conditions
Temperature : Ordinary Temperature (15 to 35°C)
Temperature : 20 ± 2°C
Humidity
: Ordinary Humidity
(25 to 85 %(RH))
Humidity
: 60 to 70 %(RH)
Atmospheric Pressure : 86 to 106 kPa
5.Appearance and Dimensions (No marking)
3.2±0.2
2.6±0.2
3.6±0.2
3.2±0.2
4.5±0.3
1.0 min. 1.0 min. 1.0 min.
(in mm)
■Unit Mass (Typical value)
0.13g
6.Electrical Performance
No.
6.1
Item
Inductance
6.2
Q
6.3
6.4
DC Resistance
Self Resonant
Frequency(S.R.F)
Rated Current
6.5
6.6
Temperature
Characteristics
Specification
Inductance shall meet item 3.
DC Resistance shall meet item 3.
S.R.F shall meet item 3.
Self temperaturer rise shall be limited
to 20°C max.
Inductance Change : within ± 10%
Temperature Coefficient
150 to 1400 PPM/°C
Test Method
Measuring Equipment:
Agilent 4192A or equivalent
Measuring Frequency:
1MHz/1.0 to 390H
1kHz/470 to 1500H
Measuring Equipment:
Agilent 4192A or equivalent
Measuring Frequency:
1MHz / 1.0 to 82H
796kHz / 100 to 820H
252kHz / 1000 to 1500 H
Measuring Equipment:Digital multi meter
Measuring Equipment:
Agilent 4991A or equivalent
The rated current is applied.
Temperature coefficient on the basis of
step 3 shall meet specification after tested
as follows.It shall be subjected to the
condition of Table 1, and its inductanse
shall be measured at each step after
reaching the thermal equiligrium and be
calculated.
Table 1
Step1/+20±2°C
Step2/ -25±2°C
Step3/+20±2°C
MURATA MFG.CO., LTD
Step4/+85±2°C
Step5/+20±2°C
P3/9
SpecNo.JELF243A-0043P-01
Reference Only
P4/9
7.Mechanical Performance
No.
7.1
Item
Shear Test
Specification
Chip coil shall not be damaged.
Test Method
Substrate: Glass-epoxy substrate
Applied Direction : Chip Coil
F
Substrate
Force : 20N
7.2
Hold Duration: 5±1 s
Substrate: Glass-epoxy substrate
(100 40 1.6mm)
Speed of Applying Force: 1mm / s
Deflection: 2mm
Hold Duration: 30 s
Bending Test
Pressure jig
R340
F
Deflection
45
7.3
Vibration
7.4
Solderability
The wetting area of the electrode shall
be at least 90% covered with new
solder coating.
7.5
Resistance to
Soldering Heat
Appearance:No damage
Inductance Change : within ± 5%
45
Product
(in mm)
Oscillation Frequency:
10 to 55 to 10Hz for 1 minute
Total Amplitude: 1.5mm
Testing Time:
A period of 2 hours in each of 3 mutually
perpendicular directions.
(Total 6 hours)
Flux: Ethanol solution of rosin,25(wt)%
(Immersed for 5s to 10s)
Solder: Sn-3.0Ag-0.5Cu
Pre-Heating: 150±10°C / 60 to 90seconds
Solder Temperature: 240±5°C
Immersion Time: 3±1 s
Flux: Ethanol solution of rosin,25(wt)%
(Immersed for 5s to 10s)
Solder: Sn-3.0Ag-0.5Cu
Pre-Heating: 150±10°C / 60 to 90seconds
Solder Temperature: 270±5°C
Immersion Time: 10±1 s
Then measured after exposure in the room
condition for 24±2 hours.
MURATA MFG.CO., LTD
Reference Only
SpecNo.JELF243A-0043P-01
P5/9
8.Environmental Performance (It shall be soldered on the substrate.)
No.
8.1
Item
Heat Resistance
8.2
Cold Resistance
8.3
Humidity
8.4
Temperature
Cycle
Specification
Appearance:No damage
Inductance Change : within ±5%
Q-factor Change : within ±20%
Test Method
Temperature: 85±2°C
48
Time: 1000± 0 hours
Then measured after exposure in the room
condition for 24±2 hours.
Temperature: -40±2°C
48
Time: 1000± 0 hours
Then measured after exposure in the room
condition for 24±2 hours.
Temperature: 40±2°C
Humidity: 90 to 95%(RH)
48
Time: 1000± 0 hours
Then measured after exposure in the room
condition for 24±2 hours.
1 cycle:
step 1 : -40±2°C / 30±3 min
step 2 : Ordinary temp. / 10 to 15 min
step 3 : +85±2°C / 30±3 min
step 4 : Ordinary temp. / 10 to 15 min
Total of 10 cycles
Then measured after exposure in the room
condition for 24±2 hours.
9. Specification of Packaging
※ Lead- in/out wire
5.5±0.05
4.9±0.1
4.9
4.0±0.1
3.6
3.6±0.1
(0.3)
0.3±0.05
※The packing directions of the chip coil
in taping are unified with the in/out
12.0±0.3
+0.1
1.5 -0
1.75±0.1
9.1 Appearance and Dimensions of plastic tape
positions of the lead wire.
8.0±0.1
2.7±0.2
2.0±0.05
Direction of feed
(in mm)
Dimension of the Cavity is measured at the bottom side.
9.2 Specification of Taping
(1) Packing quantity (standard quantity)
500 pcs / reel
(2) Packing Method
Products shall be packed in the each embossed cavity of plastic tape and sealed by cover tape.
(3) Sprocket hole
The sprocket holes are to the right as the tape is pulled toward the user.
(4) Spliced point
Plastic tape and Cover tape has no spliced point.
(5) Missing components number
Missing components number within 0.1 % of the number per reel or 1 pc., whichever is greater,
and are not continuous. The specified quantity per reel is kept.
9.3 Pull Strength
Embossed carrier tape
Cover tape
10N min.
5N min.
MURATA MFG.CO., LTD
Reference Only
SpecNo.JELF243A-0043P-01
P6/9
9.4 Peeling off force of cover tape
165 to 180 degree
Speed of Peeling off
Peeling off force
300mm/min
0.2 to 0.7N
(minimum value is typical)
F
Cover tape
Plastic tape
9.5 Dimensions of Leader-tape, Trailer and Reel
There shall be leader-tape (cover tape) and trailer-tape (empty tape) as follows.
Trailer : 160 min.
Leader
2.0±0.5
190 min
Label
210 min
Empty tape Cover tape
13.0±0.2
60± 1
0
21.0±0.8
13.0±1
0
Direction of feed
17.0±1.4
(in mm)
0
180± 3
9.6 Marking for reel
Customer part number, MURATA part number, Inspection number(1), RoHS marking(2), Quantity etc ・・・
□□ OOOO
1)
(1)
(2)
(3)
(1) Factory Code
(2) Date
First digit
Second digit
: Year / Last digit of year
: Month / Jan. to Sep. 1 to 9, Oct. to Dec. O, N, D
Third, Fourth digit
: Day
(3) Serial No.
2) « Expression of RoHS marking »
ROHS – Y (△)
(1) (2)
(1) RoHS regulation conformity parts.
(2) MURATA classification number
9.7 Marking for Outside package (corrugated paper box)
Customer name, Purchasing order number, Customer part number, MURATA part number,
RoHS marking (2) ,Quantity, etc ・・・
9.8. Specification of Outer Case
Label
H
D
Outer Case Dimensions
Standard Reel Quantity in Outer Case
(mm)
(Reel)
W
D
H
186
186
93
4
Above Outer Case size is typical. It depends on a quantity of an order
W
10.
Caution
Limitation of Applications
Please contact us before using our products for the applications listed below which require especially high reliability
for the prevention of defects which might directly cause damage to the third party's life, body or property.
(1) Aircraft equipment
(7) Traffic signal equipment
(2) Aerospace equipment
(8) Disaster prevention / crime prevention equipment
(3)Undersea equipment
(9) Data-processing equipment
(4)Power plant control equipment (10) Applications of similar complexity and /or reliability requirements
to the applications listed in the above
(5) Medical equipment
(6) Transportation equipment (vehicles, trains, ships, etc.)
MURATA MFG.CO., LTD
Reference Only
SpecNo.JELF243A-0043P-01
P7/9
11. Notice
This product is designed for solder mounting.
Please consult us in advance for applying other mounting method such as conductive adhesive.
11.1 Land pattern designing
Recommended land patterns for reflow soldering are as follows:
These have been designed for Electric characteristics and solderability.
Please follow the recommended patterns. Otherwise, their performance which includes electrical performance or
solderability may be affected, or result to "position shift" in soldering process.
Reflow Soldering
1.5
3.0
7.5
1.5
1.5
1.5
(in mm)
11.2 Flux, Solder
・Use rosin-based flux.
・Don’t use highly acidic flux with halide content exceeding 0.2(wt)% (chlorine conversion
Flux
value).
・ Don’t use water-soluble flux.
・Use Sn-3.0Ag-0.5Cu solder
Solder
・Standard thickness of solder paste : 200μm to 300μm
Other flux (except above) Please contact us for details, then use.
11.3
Soldering conditions (Reflow)
Pre-heating should be in such a way that the temperature difference between solder and product surface
is limited to 150°C max. Cooling into solvent after soldering also should be in such a way that the
temperature difference is limited to 100°C max.
Insufficient pre-heating may cause cracks on the product, resulting in the deterioration of product quality.
Standard soldering profile and the limit soldering profile is as follows.
The excessive limit soldering conditions may cause leaching of the electrode and / or resulting in the
deterioration of product quality.
Soldering profile
Reflow soldering profile
Temp.
(℃)
260℃
245℃±3℃
220℃
230℃
Limit Profile
180
150
Standard Profile
30s~60s
60s max.
90s±30s
Pre-heating
Heating
Peak temperature
Cycle of reflow
Time. (s)
Standard Profile
Limit Profile
150~180°C 、90s±30s
above 220°C、30s~60s above 230°C、60s max.
245±3°C
260°C,10s
2 times
1 time
MURATA MFG.CO., LTD
SpecNo.JELF243A-0043P-01
Reference Only
P8/9
11.4 Reworking with soldering iron.
The following conditions must be strictly followed when using a soldering iron.
Pre-heating
Tip temperature
Soldering iron output
Tip diameter
Soldering time
Times
150°C,1 min
350°C max.
80W max.
3mm max.
3(+1,-0)s
2 times
Note : Do not directly touch the products with the tip of the soldering iron in order to prevent the crack on the
products due to the thermal shock.
11.5 Solder Volume
Solder shall be used not to be exceeded the upper limits as shown below.
Accordingly increasing the solder volume, the mechanical stress to Chip is also increased.
Exceeding solder volume may cause the failure of mechanical or electrical performance.
Upper Limit
Recommendable
T
1/3T≦ t ≦T
(T: Lower flange thickness)
t
11.6 Product's location
The following shall be considered when designing and laying out P.C.B.'s.
(1) P.C.B. shall be designed so that products are not subject to the mechanical stress due to warping the board.
[Products direction]
a
b
〈 Poor example〉
Products shall be locatedin the sideways
direction (Length:ab) to the mechanical
stress.
〈 Good example〉
(2) Products location on P.C.B. separation
Products (A,B,C,D) shall be located carefully so
that products are not subject to the mechanical
stress due to warping the board.
Because they may be subjected the mechanical
stress in order of ACB D.
Seam
b
C
B
D
A
Slit
Length:a b
a
11.7 Cleaning Conditions
Products shall be cleaned on the following conditions.
(1) Cleaning temperature shall be limited to 60°C max.(40°C max for IPA.)
(2) Ultrasonic cleaning shall comply with the following conditions with avoiding the resonance
phenomenon at the mounted products and P.C.B.
Power : 20 W /l max.
Frequency : 28kHz to 40kHz
Time : 5 minutes max.
(3) Cleaner
1. Alternative cleaner
・Isopropyl alcohol (IPA)
2. Aqueous agent
・PINE ALPHA ST-100S
(4) There shall be no residual flux and residual cleaner after cleaning.
In the case of using aqueous agent, products shall be dried completely after rinse with de-ionized water in
order to remove the cleaner.
(5) Other cleaning
Please contact us.
MURATA MFG.CO., LTD
SpecNo.JELF243A-0043P-01
Reference Only
P9/9
11.8 Resin coating
The inductance value may change due to high cure-stress of resin to be used for coating/molding products. An
open circuit issue may occur by mechanical stress caused by the resin, amount/cured shape of resin, or
operating condition etc. Some resin contains some impurities or chloride possible to generate chlorine by
hydrolysis under some operating condition may cause corrosion of wire of coil, leading to open circuit. So,
please pay your careful attention when you select resin in case of coating/molding the products with the resin.
Prior to use the coating resin, please make sure no reliability issue is observed by evaluating products
mounted on your board.
11.9 Caution for use
・Sharp material such as a pair of tweezers or other material such as bristles of cleaning brush, shall not be touched to the
winding portion to prevent the breaking of wire.
・Mechanical shock should not be applied to the products mounted on the board to prevent the breaking of the core.
11.10 Handling of a substrate
After mounting products on a substrate, do not apply any stress to the product caused by bending or twisting to
the substrate when cropping the substrate, inserting and removing a connector from the substrate or tightening
screw to the substrate.
Excessive mechanical stress may cause cracking in the product.
Bending
Twisting
11.11 Storage and Handling Requirements
(1) Storage period
Use the products within 12 months after delivered.
Solderability should be checked if this period is exceeded.
(2) Storage conditions
Products should be stored in the warehouse on the following conditions.
Temperature : -10 ~ 40°C
Humidity
: 15 to 85% relative humidity No rapid change on temperature and humidity
The electrode of the products is coated with solder. Don't keep products in corrosive gases such as
sulfur, chlorine gas or acid, or it may cause oxidization of electrode, resulting in poor solderability.
Products should not be stored on bulk packaging condition to prevent the chipping of the core and the
breaking of winding wire caused by the collision between the products.
Products should be stored on the palette for the prevention of the influence from humidity, dust and so on.
Products should be stored in the warehouse without heat shock, vibration, direct sunlight and so on.
(3) Handling Condition
Care should be taken when transporting or handling product to avoid excessive vibration or mechanical
shock.
12.
Note
(1) Please make sure that your product has been evaluated in view of your specifications with our product being
mounted to your product.
(2) You are requested not to use our product deviating from the reference specifications.
(3) The contents of this reference specification are subject to change without advance notice. Please approve our
product specifications or transact the approval sheet for product specifications before ordering.
MURATA MFG.CO., LTD