LQH43NH120J03L

Spec No. JELF243A-9150B-01 P.1/9 CHIP COIL（CHIP INDUCTORS）LQH43NH□□□□03L Murata Standard Reference Specification【AEC-Q200】 1.Scope This reference specification applies to LQH43NH series, Chip coil (Chip Inductors) for automotive Electronics based on AEC-Q200 . 2.Part Numbering (ex) LQ H 43 N H 1R0 M 0 3 L Product ID Structure Dimension Applications Category Inductance Tolerance Features Electrode Packaging (L×W) and L:Taping Characteristics 3.Rating ・Operating Temperature Range. ・Storage Temperature Range. Customer’s Part Number –40 °C to +125 °C –40 °C to +125 °C Self Resonant Frequency (MHz min) 1:Rated Current (mA) 0.033 120 1300 0.043 100 1100 1.5 0.049 85 1000 LQH43NH1R8J03L 1.8 0.043 75 1050 LQH43NH2R2J03L 2.2 0.049 62 1000 LQH43NH2R7J03L 2.7 0.053 53 950 LQH43NH3R3J03L 3.3 0.077 47 800 LQH43NH3R9J03L 3.9 0.12 41 650 LQH43NH4R7J03L 4.7 0.090 38 750 LQH43NH5R6J03L 5.6 0.11 33 650 LQH43NH6R8J03L 6.8 0.18 31 530 LQH43NH8R2J03L 8.2 0.18 27 530 LQH43NH100J03L 10 0.20 23 480 LQH43NH120J03L 12 0.25 21 420 LQH43NH150J03L 15 0.30 19 390 LQH43NH180J03L 18 0.35 17 365 LQH43NH220J03L 22 0.47 15 300 LQH43NH270J03L 27 0.60 14 280 LQH43NH330J03L 33 0.70 12 250 LQH43NH390J03L 39 0.80 11 230 LQH43NH470J03L 47 0.87 10 210 LQH43NH560J03L 56 1.34 9.3 180 LQH43NH680J03L 68 1.52 8.4 170 LQH43NH820J03L 82 1.70 7.5 165 LQH43NH101J03L 100 2.00 6.8 150 LQH43NH121J03L 120 2.60 6.2 130 LQH43NH151J03L 150 3.00 5.5 120 Inductance MURATA Part Number Q Tolerance (min.) (%) (H) LQH43NH1R0M03L 1.0 M: ±20 LQH43NH1R2K03L 1.2 K: ±10 LQH43NH1R5J03L 20 25 30 J: ±5 35 40 DC Resistance () MURATA MFG.CO., LTD Tolerance (%) ±20 ESD 5A: 8kV 5A Spec No. JELF243A-9150B-01 Customer’s Part Number P.2/9 Self Resonant Frequency (MHz min) 1:Rated Current (mA) 3.40 5.0 110 220 3.80 4.5 100 LQH43NH271J03L 270 5.50 4.0 90 LQH43NH331J03L 330 6.20 3.6 85 LQH43NH391J03L 390 6.90 3.3 80 LQH43NH471J03L 470 7.80 3.0 75 LQH43NH561J03L 560 2.7 60 LQH43NH681J03L 680 2.5 55 LQH43NH821J03L 820 14.5 2.2 50 LQH43NH102J03L 1000 15.5 2.0 45 LQH43NH122J03L 1200 20.3 1.8 40 LQH43NH152J03L 1500 23.7 1.6 35 LQH43NH182J03L 1800 26.7 1.5 35 LQH43NH222J03L 2200 30.6 1.3 30 Inductance MURATA Part Number (H) LQH43NH181J03L 180 LQH43NH221J03L Q Tolerance (min.) (%) J: ±5 40 DC Resistance () 11.3 12.9 Tolerance (%) ±20 ESD 5A: 8kV 5A *1:When applied Rated current to the Products, self temperature rise shall be limited to 20°C max and Inductance will be within ±10% of nominal value. 4. Testing Conditions 《Unless otherwise specified》 Temperature : Ordinary Temperature / 15°C to 35°C Humidity : Ordinary Humidity / 25%(RH) to 85%(RH) 《In case of doubt》 Temperature : 20 ± 2°C Humidity : 60%(RH) to 70%(RH) Atmospheric Pressure : 86kPa to 106 kPa 5.Appearance and Dimensions (No marking) 3.2±0.2 2.6±0.2 3.6±0.2 A 3.2±0.2 4.5±0.3 A: 3.5max. ■Unit Mass (Typical value) 0.13g  No Marking. (in mm) 1.0 min. 1.0 min. 1.0 min. MURATA MFG.CO., LTD Spec No. JELF243A-9150B-01 P.3/9 6. Electrical Performance No. 6.1 Item Inductance Specification Inductance shall meet item 3. 6.2 Q Q shall meet item 3. 6.3 6.4 DC Resistance Self Resonant Frequency(S.R.F) DC Resistance shall meet item 3. S.R.F shall meet item 3. Test Method Measuring Equipment: KEYSIGHT 4192A or equivalent Measuring Frequency: 1MHz / 1.0 to 390μH 1kHz / 470 to 2200μH Measuring Equipment: KEYSIGHT 4192A or equivalent Measuring Frequency: 1MHz / 1.0 to 82μH 796kHz / 100 to 820μH 252kHz / 1000 to 2200μH Measuring Equipment:Digital multi meter Measuring Equipment: KEYSIGHT E4991A or equivalent 7. AEC-Q200 Requirement 7.1 Performance (based on Table 5 for Magnetics(Inductors / Transformer) AEC-Q200 Rev.D issued June. 1 2010 AEC-Q200 No Stress 3 High Temperature Exposure Test Method 1000hours at 125 deg C Set for 24hours at room temperature, then measured. Murata Specification / Deviation Meet Table A after testing. Table A Appearance Inductance change 4 Temperature Cycling 1000cycles -40 deg C to + 125 deg C Set for 24hours at room temperature,then measured. 7 Biased Humidity 1000hours at 85 deg C, 85%RH Meet Table A after testing. unpowered. 8 Operational Life Apply 125 deg C 1000 hours Set for 24hours at room temperature, then measured Meet Table A after testing. 9 External Visual Visual inspection No abnormalities No damage Within ±10% Meet Table A after testing. 10 Physical Dimension Meet ITEM 5 (Appearance and Dimensions) No defects 12 Resistance to Solvents Per MIL-STD-202 Method 215 Not Applicable 13 Mechanical Shock Per MIL-STD-202 Method 213 100g’s/6ms/Half sine Meet Table A after testing. 14 Vibration 5g's for 20 minutes, 12cycles eah of 3 orientations Test from 10-2000Hz. 12cycles each of 3 orientations Meet Table A after testing. 15 Resistance to Soldering Heat No-heating Solder temperature 260C+/-5 deg C Immersion time 10s Meet Table A after testing. 17 ESD Per AEC-Q200-002 Meet Item 3 (Rating) No defects 18 Solderbility Per J-STD-002 Method B : Not Applicable 95% of the terminations is to be soldered. (Except exposed wire) 19 Electrical Characterization Measured : Inductance No defects MURATA MFG.CO., LTD Spec No. JELF243A-9150B-01 P.4/9 AEC-Q200 No Stress 20 Flammability Murata Specification / Deviation Test Method 21 Board Flex 22 Terminal Strength Per UL-94 Not Applicable Epoxy-PCB(1.6mm) Deflection 2mm(min) 60s minimum holding time Murata deviation request: 5s Meet Table B after testing. Table B Per AEC-Q200-006 A force of 17.7N for 60s Appearance No damage DC resistance change Within ±10% No defects ※ Lead- in/out wire 5.5±0.05 4.9±0.1 4.9 4.0±0.1 3.6 3.6±0.1 0.3±0.05 (0.3) ※The packing directions of the chip coil in taping are unified with the in/out 12.0±0.3 +0.1  1.5 -0 1.75±0.1 8. Specification of Packaging 8.1 Appearance and Dimensions of plastic tape positions of the lead wire. 8.0±0.1 2.7±0.2 2.0±0.05 Direction of feed Dimension of the Cavity is measured at the bottom side. 8.2 Specification of Taping (1) Packing quantity (standard quantity) 500 pcs / reel (2) Packing Method Products shall be packed in the each embossed cavity of plastic tape and sealed by cover tape. (3) Sprocket hole The sprocket holes are to the right as the tape is pulled toward the user. (4) Spliced point Plastic tape and Cover tape has no spliced point. (5) Missing components number Missing components number within 0.025 % of the number per reel or 1 pc., whichever is greater, and are not continuous. The specified quantity per reel is kept. 8.3 Pull Strength Plastic tape 10N min. Cover tape 5N min. 8.4 Peeling off force of cover tape Speed of Peeling off Peeling off force 300mm / min 165 to 180 degree F Cover tape 0.2N to 0.7N (minimum value is typical) Plastic tape MURATA MFG.CO., LTD Spec No. JELF243A-9150B-01 P.5/9 8.5 Dimensions of Leader-tape, Trailer and Reel There shall be leader-tape (cover tape) and trailer-tape (empty tape) as follows. Trailer : 160 min. Leader 2.0±0.5 190 min Label 210 min Empty tape Cover tape  13.0±0.2  60± 1 0  21.0±0.8 13.0±1 0 Direction of feed 17.0±1.4 (in mm) 0  180± 3 8.6 Marking for reel Customer part number, MURATA part number, Inspection number(1), RoHS marking(2), Quantity etc ･･･ 1) (1) Factory Code (2) Date □□ OOOO  (1) (2) (3) First digit : Year / Last digit of year Second digit : Month / Jan. to Sep.  1 to 9, Oct. to Dec.  O, N, D Third, Fourth digit : Day (3) Serial No. 2) « Expression of RoHS marking » ROHS – Y (△) (1) (2) (1) RoHS regulation conformity (2) MURATA classification number 8.7 Marking for Outside package (corrugated paper box) Customer name, Purchasing order number, Customer part number, MURATA part number, RoHS marking (2) ,Quantity, etc ･･･ 8.8. Specification of Outer Case Outer Case Dimensions (mm) Label H D W W D H Standard Reel Quantity in Outer Case (Reel) 186 186 93 5 Above Outer Case size is typical. It depends on a quantity of an order MURATA MFG.CO., LTD Spec No. JELF243A-9150B-01 9. P.6/9 Caution 9.1 Limitation of Applications Please contact us before using our products for the applications listed below which require especially high reliability for the prevention of defects which might directly cause damage to the third party's life, body or property. (1) Aircraft equipment (2) Aerospace equipment (3) Undersea equipment (4) Power plant control equipment (5) Medical equipment (6) Disaster prevention / crime prevention equipment (7) Traffic signal equipment (8) Transportation equipment (trains, ships, etc.) (9) Applications of similar complexity and /or reliability requirements to the applications listed in the above 9.2 Caution(Rating) Do not exceed maximum rated current of the product. Thermal stress may be transmitted to the product and short/open circuit of the product or falling off the product may be occurred. 9.3 Fail-safe Be sure to provide an appropriate fail-safe function on your product to prevent a second damage that may be caused by the abnormal function or the failure of our product. 9.4 Corrosive gas Please refrain from use since contact with environments with corrosive gases (sulfur gas [hydrogen sulfide, sulfur dioxide, etc.], chlorine, ammonia, etc.) or oils (cutting oil, silicone oil, etc.) that have come into contact with the previously stated corrosive gas environment will result in deterioration of product quality or an open from deterioration due to corrosion of product electrode, etc. We will not bear any responsibility for use under these environments. 10. Notice This product is designed for solder mounting. Please consult us in advance for applying other mounting method such as conductive adhesive. 10.1 Land pattern designing Recommended land patterns for reflow soldering are as follows: It has been designed for Electric characteristics and solderability. Please follow the recommended pattern. Otherwise, their performance which includes electrical performance or solderability may be affected, or result to "position shift" in soldering process. Reflow Soldering  4.5 1.5 1.5 1.5 2.8 0.3 2.1 1.2 1.5 (in mm) 7.5 10.2 Flux, Solder Flux Solder ・Use rosin-based flux. ・Don’t use highly acidic flux with halide content exceeding 0.2(wt)% (chlorine conversion value). ・Don’t use water-soluble flux. ・Use Sn-3.0Ag-0.5Cu solder ・Standard thickness of solder paste : 200μm to 300μm Other flux (except above) Please contact us for details, then use. MURATA MFG.CO., LTD Spec No. JELF243A-9150B-01 P.7/9 10.3 Reflow soldering conditions ・Pre-heating should be in such a way that the temperature difference between solder and product surface is limited to 150°C max. Cooling into solvent after soldering also should be in such a way that the temperature difference is limited to 100°C max. Insufficient pre-heating may cause cracks on the product, resulting in the deterioration of products quality. ・Standard soldering profile and the limit soldering profile is as follows. The excessive limit soldering conditions may cause leaching of the electrode and / or resulting in the deterioration of product quality. ・Reflow soldering profile Temp. (℃) 260℃ 245℃±3℃ 230℃ 220℃ Limit Profile 180 150 Standard Profile 30s～60s 60s max. 90s±30s Time. (s) Standard Profile Pre-heating Limit Profile 150～180°C 、90s±30s Heating above 220°C、30s～60s above 230°C、60s max. 245±3°C 260°C,10s 2 times 2time Peak temperature Cycle of reflow 10.4 Reworking with soldering iron. The following conditions must be strictly followed when using a soldering iron. Pre-heating 150°C,1 min Tip temperature 350°C max. Soldering iron output 80W max. Tip diameter φ3mm max. Soldering time 3(+1,-0)s Times 2 times Note : Do not directly touch the products with the tip of the soldering iron in order to prevent the crack on the products due to the thermal shock. 10.5 Solder Volume ・Solder shall be used not to be exceeded the upper limits as shown below. ・Accordingly increasing the solder volume, the mechanical stress to Chip is also increased. Exceeding solder volume may cause the failure of mechanical or electrical performance. Upper Limit Recommendable T t 1/3T≦t≦T T: Lower flange thickness MURATA MFG.CO., LTD Spec No. JELF243A-9150B-01 P.8/9 10.6 Product’s location The following shall be considered when designing and laying out P.C.B.'s. (1) P.C.B. shall be designed so that products are not subject to the mechanical stress due to warping the board. ［Products direction］ Electrode The electorode part of the products should be located like the picture to the mechanical stress. (Poor example） (Good example) Electrode (2) Components location on P.C.B. separation. It is effective to implement the following measures, to reduce stress in separating the board. It is best to implement all of the following three measures; however, implement as many measures as possible to reduce stress. Contents of Measures Stress Level (1) Turn the mounting direction of the component parallel to the board separation surface. A > D 1 (2) Add slits in the board separation part. A > B (3) Keep the mounting position of the component away from the board separation surface. A > C Seam C B Electrode A D Slit 1 A > D is valid when stress is added vertically to the perforation as with Hand Separation. If a Cutting Disc is used, stress will be diagonal to the PCB, therefore A > D is invalid. Electrode (3) Mounting Components Near Screw Holes When a component is mounted near a screw hole, it may be affected by the board deflection that occurs during the tightening of the screw. Mount the component in a position as far away from the screw holes as possible. Screw Hole Recommended 10.7 Cleaning Conditions Products shall be cleaned on the following conditions. (1) Cleaning temperature shall be limited to 60°C max.(40°C max for alcohol type cleaner.) (2) Ultrasonic cleaning shall comply with the following conditions with avoiding the resonance phenomenon at the mounted products and P.C.B. Power : 20 W / l max. Frequency : 28kHz to 40kHz Time : 5 min max. (3) Cleaner 1. Alternative cleaner ・Isopropyl alcohol (IPA) 2. Aqueous agent ・PINE ALPHA ST-100S (4) There shall be no residual flux and residual cleaner after cleaning. In the case of using aqueous agent, products shall be dried completely after rinse with de-ionized water in order to remove the cleaner. (5) Other cleaning Please contact us. MURATA MFG.CO., LTD Spec No. JELF243A-9150B-01 P.9/9 10.8 Resin coating (moistureproof coating) Do not make any resin coating. The inductance value may change due to high cure-stress of resin to be used for coating/molding products. An open circuit issue may occur by mechanical stress caused by the resin, amount/cured shape of resin, or operating condition etc. Some resin contains some impurities or chloride possible to generate chlorine by hydrolysis under some operating condition may cause corrosion of wire of coil, leading to open circuit. 10.9 Caution for use ・Sharp material such as a pair of tweezers or other material such as bristles of cleaning brush, shall not be touched to the winding portion to prevent the breaking of wire. ・Mechanical shock should not be applied to the products mounted on the board to prevent the breaking of the core 10.10 Handling of a substrate After mounting products on a substrate, do not apply any stress to the product caused by bending or twisting to the substrate when cropping the substrate, inserting and removing a connector from the substrate or tightening screw to the substrate. Excessive mechanical stress may cause cracking in the product. Bending Twisting 10.11 Storage and Handing Requirements (1) Storage period Use the products within 12 months after delivered. Solderability should be checked if this period is exceeded. (2) Storage conditions ・Products should be stored in the warehouse on the following conditions. Temperature : -10 °C to 40 °C Humidity : 15 % to 85 % relative humidity No rapid change on temperature and humidity The electrode of the products is coated with solder. Don't keep products in corrosive gases such as sulfur,chlorine gas or acid, or it may cause oxidization of electrode, resulting in poor solderability. ・Products should not be stored on bulk packaging condition to prevent the chipping of the core and the breaking of winding wire caused by the collision between the products. ・Products should be stored on the palette for the prevention of the influence from humidity, dust and so on. ・Products should be stored in the warehouse without heat shock, vibration, direct sunlight and so on. (3) Handling Condition Care should be taken when transporting or handling product to avoid excessive vibration or mechanical shock. 11. Note (1) Please make sure that your product has been evaluated in view of your specifications with our product being mounted to your product. (2) You are requested not to use our product deviating from the agreed specifications. (3) The contents of this reference specification are subject to change without advance notice. Please approve our product specifications or transact the approval sheet for product specifications before ordering. MURATA MFG.CO., LTD