LQH43NN680J03L

Spec No JELF243A-0116A-01 P1/10 CHIP COIL（CHIP INDUCTORS）LQH43NN□□□□03L REFERNCE SPECIFICATION 1.Scope This reference specification applies to LQH43NN Series, Chip coil (Chip Inductors). 2.Part Numbering (ex) LQ H 43 N N 1R0 M 0 Product ID Structure Dimension Applications Category Inductance Tolerance Features (L×W) and Characteristics 3 Electrode L Packaging L:Taping 3.Rating ・Operating Temperature Range ・Storage Temperature Range Customer’s Part Number -40 to +105°C -40 to +105°C Inductance Self Resonant Frequency (MHz min) (H) LQH43NN1R0M03L 1.0 LQH43NN1R2M03L 1.2 LQH43NN1R5M03L 1.5 LQH43NN1R8M03L 1.8 LQH43NN2R2M03L 2.2 LQH43NN2R7M03L 2.7 0.32 53 LQH43NN3R3M03L 3.3 0.35 47 LQH43NN3R9M03L 3.9 0.38 41 4.7 0.40 38 0.47 33 0.50 31 LQH43NN4R7M03L LQH43NN4R7K03L LQH43NN5R6M03L LQH43NN5R6K03L LQH43NN6R8M03L LQH43NN6R8K03L LQH43NN8R2M03L LQH43NN8R2K03L LQH43NN100K03L LQH43NN100J03L LQH43NN120K03L LQH43NN120J03L LQH43NN150K03L LQH43NN150J03L LQH43NN180K03L LQH43NN180J03L LQH43NN220K03L LQH43NN220J03L LQH43NN270K03L LQH43NN270J03L LQH43NN330K03L LQH43NN330J03L LQH43NN390K03L LQH43NN390J03L LQH43NN470K03L LQH43NN470J03L 5.6 6.8 Tolerance (%) Q (min.) DC Resistance ( max) MURATA Part Number 0.20 *Rated Current (mA) 120 100 85 M:±20 M:±20 K:±10 20 0.30 75 62 500 30 450 8.2 27 0.56 10 23 400 12 0.62 21 380 15 0.73 19 360 18 0.82 17 340 0.94 15 320 27 1.1 14 300 33 1.2 12 270 22 K:±10 J:± 5 35 39 47 MURATA MFG.CO., LTD 1.4 1.5 11 240 10 220 SpecNo. JELF243A-0116A-01 Customer’s Part Number P2/9 Inductance MURATA Part Number (H) LQH43NN560K03L LQH43NN560J03L LQH43NN680K03L LQH43NN680J03L LQH43NN820K03L LQH43NN820J03L LQH43NN101K03L LQH43NN101J03L LQH43NN121K03L LQH43NN121J03L LQH43NN151K03L LQH43NN151J03L LQH43NN181K03L LQH43NN181J03L LQH43NN221K03L LQH43NN221J03L LQH43NN271K03L LQH43NN271J03L LQH43NN331K03L LQH43NN331J03L LQH43NN391K03L LQH43NN391J03L LQH43NN471K03L LQH43NN471J03L LQH43NN561K03L LQH43NN561J03L LQH43NN681K03L LQH43NN681J03L LQH43NN821K03L LQH43NN821J03L LQH43NN102K03L LQH43NN102J03L LQH43NN122K03L LQH43NN122J03L LQH43NN152K03L LQH43NN152J03L LQH43NN182K03L LQH43NN182J03L LQH43NN222K03L LQH43NN222J03L Tolerance (%) Q (min.) 56 DC Resistance ( max) Self Resonant Frequency (MHz min) *Rated Current (mA) 1.7 9.3 200 1.9 8.4 180 82 2.2 7.5 170 100 2.5 6.8 160 120 3.0 6.2 150 150 3.7 5.5 130 180 4.5 5.0 120 220 5.4 4.5 110 270 6.8 4.0 100 330 8.2 3.6 95 9.7 3.3 90 470 11.8 3.0 80 560 14.5 2.7 70 680 17.0 2.5 65 820 20.5 2.2 60 1000 25.0 2.0 50 1200 30.0 1.8 45 1500 37.0 1.6 40 1800 45.0 1.5 35 50.0 1.3 30 68 390 35 K:±10 J:± 5 40 2200 LQH43NN242K03L 2400 53.0 1.2 25 LQH43NN242J03L *When applied Rated current to the Products , self temperature rise shall be limited to 20°C max and Inductance will be within ±10% of initial Inductance value. MURATA MFG.CO., LTD SpecNo. JELF243A-0116A-01 P3/9 4. Testing Conditions Temperature : Ordinary Temperature (15 to 35°C) Temperature : 20 ± 2°C : Ordinary Humidity (25 to 85 %(RH)) Humidity : 60 to 70 %(RH) Humidity Atmospheric Pressure : 86 to 106 kPa 5.Appearance and Dimensions (No marking) 3.2±0.2 2.6±0.2 3.6±0.2 A 3.2±0.2 4.5±0.3 A: 3.5max. (in mm) ■Unit Mass (Typical value) 0.13g 1.0 min. 1.0 min. 1.0 min. 6.Electrical Performance No. 6.1 Item Inductance 6.2 Q 6.3 6.4 DC Resistance Self Resonant Frequency(S.R.F) Rated Current 6.5 Specification Inductance shall meet item 3. DC Resistance shall meet item 3. S.R.F shall meet item 3. Self temperaturer rise shall be limited to 20°C max. Inductance Change : within ± 10% Test Method Measuring Equipment: Keysight 4192A or equivalent Measuring Frequency: 1MHz／1.0 to 390μH 1kHz／470 to 2400μH Measuring Equipment: Keysight 4192A or equivalent Measuring Frequency: 1MHz / 1.0 to 82μH 796kHz / 100 to 820μH 252kHz / 1000 to 2400 μH Measuring Equipment:Digital multi meter Measuring Equipment: Keysight 4991A or equivalent The rated current is applied. 7.Mechanical Performance No. 7.1 7.2 Item Shear Test Bending Test Specification Chip coil shall not be damaged. Test Method Substrate: Glass-epoxy substrate Applied Direction : Chip Coil F Force : 5N Substrate Hold Duration: 5±1 s Substrate: Glass-epoxy substrate (100  40  1.6mm) Speed of Applying Force: 1mm / s Deflection: 2mm Hold Duration: 5 s Pressure jig R230 F Deflection 45 MURATA MFG.CO., LTD 45 Product (in mm) SpecNo. JELF243A-0116A-01 P4/9 No. 7.3 Item Vibration Specification Chip coil shall not be damaged. 7.4 Solderability The wetting area of the electrode shall be at least 90% covered with new solder coating. Test Method Oscillation Frequency: 10 to 55 to 10Hz for 1 minute Total Amplitude: 1.5mm Testing Time: A period of 2 hours in each of 3 mutually perpendicular directions. (Total 6 hours) Flux: Ethanol solution of rosin,25(wt)% (Immersed for 5s to 10s) Solder: Sn-3.0Ag-0.5Cu Pre-Heating: 150±10°C / 60 to 90seconds Solder Temperature: 240±5°C Immersion Time: 3±1 s 8.Environmental Performance (It shall be soldered on the substrate.) No. 8.1 Item Heat Resistance 8.2 Cold Resistance 8.3 Humidity 8.4 Temperature Cycle Specification Appearance:No damage Inductance Change : within ±5% Q-factor Change : within ±20% Test Method Temperature: 105±2°C 48 Time: 1000± 0 hours Then measured after exposure in the room condition for 24±2 hours. Temperature: -40±2°C 48 Time: 1000± 0 hours Then measured after exposure in the room condition for 24±2 hours. Temperature: 85±2°C Humidity: 80 to 85%(RH) 48 Time: 1000± 0 hours Then measured after exposure in the room condition for 24±2 hours. 1 cycle: step 1 : -40±2°C / 30±3 min step 2 : Ordinary temp. / 10 to 15 min step 3 : +105±2°C / 30±3 min step 4 : Ordinary temp. / 10 to 15 min Total of 10 cycles Then measured after exposure in the room condition for 24±2 hours. 9. Specification of Packaging ※ Lead- in/out wire 5.5±0.05 4.9±0.1 4.9 4.0±0.1 3.6 3.6±0. 2.0±0.05 (0.3) 0.3±0.05 ※The packing directions of the chip coil in taping are unified with the in/out 12.0±0.3 +0.1  1.5 -0 1.75±0.1 9.1 Appearance and Dimensions of plastic tape positions of the lead wire. (in mm) 8.0±0.1 2.7±0.2 Direction of feed Dimension of the Cavity is measured at the bottom side. MURATA MFG.CO., LTD SpecNo. JELF243A-0116A-01 P5/9 9.2 Specification of Taping (1) Packing quantity (standard quantity) 500 pcs / reel (2) Packing Method Products shall be packed in the each embossed cavity of plastic tape and sealed by cover tape. (3) Sprocket hole The sprocket holes are to the right as the tape is pulled toward the user. (4) Spliced point Plastic tape and Cover tape has no spliced point. (5) Missing components number Missing components number within 0.025 % of the number per reel or 1 pc., whichever is greater, and are not continuous. The specified quantity per reel is kept. 9.3 Pull Strength Embossed carrier tape Cover tape 10N min. 5N min. 9.4 Peeling off force of cover tape Speed of Peeling off Peeling off force 165 to 180 degree 300mm/min 0.2 to 0.7N (minimum value is typical) F Cover tape Plastic tape 9.5 Dimensions of Leader-tape, Trailer and Reel There shall be leader-tape (cover tape) and trailer-tape (empty tape) as follows. Trailer : 160 min. Leader 2.0±0.5 190 min Label 210 min Empty tape Cover tape  13.0±0.2  60± 1 0  21.0±0.8 13.0±1 0 Direction of feed 17.0±1.4 (in mm) 0  180± 3 9.6 Marking for reel Customer part number, MURATA part number, Inspection number(1), RoHS marking(2), Quantity etc ･･･ □□ OOOO  1) (1) (2) (3) (1) Factory Code (2) Date First digit Second digit Third, Fourth digit : Year / Last digit of year : Month / Jan. to Sep. 1 to 9, Oct. to Dec. : Day (3) Serial No. 2) « Expression of RoHS marking » ROHS – Y (△) (1) (2) (1) RoHS regulation conformity parts. (2) MURATA classification number 9.7 Marking for Outside package (corrugated paper box) Customer name, Purchasing order number, Customer part number, MURATA part number, RoHS marking (2) ,Quantity, etc ･･･ MURATA MFG.CO., LTD O, N, D SpecNo. JELF243A-0116A-01 P6/9 9.8. Specification of Outer Case Outer Case Dimensions Standard Reel Quantity in Outer Case (mm) (Reel) W D H 186 186 93 4 Above Outer Case size is typical. It depends on a quantity of an order Label H D W 10. Caution 10.1 Limitation of Applications Please contact us before using our products for the applications listed below which require especially high reliability for the prevention of defects which might directly cause damage to the third party's life, body or property. (1) Aircraft equipment (7) Traffic signal equipment (2) Aerospace equipment (8) Disaster prevention / crime prevention equipment (3)Undersea equipment (9) Data-processing equipment (4)Power plant control equipment (10) Applications of similar complexity and /or reliability requirements to the applications listed in the above (5) Medical equipment (6) Transportation equipment (vehicles, trains, ships, etc.) 10.2 Corrosive gas Please refrain from use since contact with environments with corrosive gases (sulfur gas [hydrogen sulfide, sulfur dioxide, etc.], chlorine, ammonia, etc.) or oils (cutting oil, silicone oil, etc.) that have come into contact with the previously stated corrosive gas environment will result in deterioration of product quality or an open from deterioration due 11. Notice This product is designed for solder mounting. Please consult us in advance for applying other mounting method such as conductive adhesive. 11.1 Land pattern designing Recommended land patterns for reflow soldering are as follows: These have been designed for Electric characteristics and solderability. Please follow the recommended patterns. Otherwise, their performance which includes electrical performance or solderability may be affected, or result to "position shift" in soldering process. Reflow Soldering 4.5 1.5 1.5 1.5 2.8 0.3 2.1 1.2 1.5 7.5 (in mm) 11.2 Flux, Solder ・Use rosin-based flux. ・Don’t use highly acidic flux with halide content exceeding 0.2(wt)% (chlorine conversion Flux value). ・ Don’t use water-soluble flux. ・Use Sn-3.0Ag-0.5Cu solder Solder ・Standard thickness of solder paste : 200μm to 300μm Other flux (except above) Please contact us for details, then use. MURATA MFG.CO., LTD SpecNo. JELF243A-0116A-01 11.3 P7/9 Soldering conditions (Reflow)  Pre-heating should be in such a way that the temperature difference between solder and product surface is limited to 150°C max. Cooling into solvent after soldering also should be in such a way that the temperature difference is limited to 100°C max. Insufficient pre-heating may cause cracks on the product, resulting in the deterioration of product quality.  Standard soldering profile and the limit soldering profile is as follows. The excessive limit soldering conditions may cause leaching of the electrode and / or resulting in the deterioration of product quality. Soldering profile Reflow soldering profile Temp. (℃) 260℃ 245℃±3℃ 230℃ 220℃ Limit Profile 180 150 Standard Profile 30s～60s 60s max. 90s±30s Pre-heating Heating Peak temperature Cycle of reflow Time. (s) Standard Profile Limit Profile 150～180°C 、90s±30s above 220°C、30s～60s above 230°C、60s max. 245±3°C 260°C,10s 2 times 2 time 11.4 Reworking with soldering iron. The following conditions must be strictly followed when using a soldering iron. Pre-heating 150°C,1 min Tip temperature 350°C max. Soldering iron output 80W max. Tip diameter φ3mm max. Soldering time 3(+1,-0)s Times 2 times Note : Do not directly touch the products with the tip of the soldering iron in order to prevent the crack on the products due to the thermal shock. 11.5 Solder Volume ・Solder shall be used not to be exceeded the upper limits as shown below. ・Accordingly increasing the solder volume, the mechanical stress to Chip is also increased. Exceeding solder volume may cause the failure of mechanical or electrical performance. Upper Limit Recommendable T 1/3T≦t≦T (T: Lower flange thickness) t MURATA MFG.CO., LTD SpecNo. JELF243A-0116A-01 P8/9 11.6 Product's location The following shall be considered when designing and laying out P.C.B.'s. (1) P.C.B. shall be designed so that products are not subject to the mechanical stress due to warping the board. ［Products direction］ a Products shall be locatedin the sideways direction (Length:a b) to the mechanical stress. b 〈 Poor example 〉 〈 Good example 〉 (2) Products location on P.C.B. separation Products (A,B,C,D) shall be located carefully so that products are not subject to the mechanical stress due to warping the board. Because they may be subjected the mechanical stress in order of A C B  D. Seam b A C B D Slit Length:a b a 11.7 Cleaning Conditions Products shall be cleaned on the following conditions. (1) Cleaning temperature shall be limited to 60°C max.(40°C max for IPA.) (2) Ultrasonic cleaning shall comply with the following conditions with avoiding the resonance phenomenon at the mounted products and P.C.B. Power : 20 W /l max. Frequency : 28kHz to 40kHz Time : 5 minutes max. (3) Cleaner 1. Alternative cleaner ･Isopropyl alcohol (IPA) 2. Aqueous agent ･PINE ALPHA ST-100S (4) There shall be no residual flux and residual cleaner after cleaning. In the case of using aqueous agent, products shall be dried completely after rinse with de-ionized water in order to remove the cleaner. (5) Other cleaning Please contact us. 11.8 Resin coating The inductance value may change due to high cure-stress of resin to be used for coating/molding products. An open circuit issue may occur by mechanical stress caused by the resin, amount/cured shape of resin, or operating condition etc. Some resin contains some impurities or chloride possible to generate chlorine by hydrolysis under some operating condition may cause corrosion of wire of coil, leading to open circuit. So, please pay your careful attention when you select resin in case of coating/molding the products with the resin. Prior to use the coating resin, please make sure no reliability issue is observed by evaluating products mounted on your board. 11.9 Caution for use ・Sharp material such as a pair of tweezers or other material such as bristles of cleaning brush, shall not be touched to the winding portion to prevent the breaking of wire. ・Mechanical shock should not be applied to the products mounted on the board to prevent the breaking of the core. 11.10 Handling of a substrate After mounting products on a substrate, do not apply any stress to the product caused by bending or twisting to the substrate when cropping the substrate, inserting and removing a connector from the substrate or tightening screw to the substrate. Excessive mechanical stress may cause cracking in the product. Bending Twisting MURATA MFG.CO., LTD SpecNo. JELF243A-0116A-01 P9/9 11.11 Storage and Handling Requirements (1) Storage period Use the products within 12 months after delivered. Solderability should be checked if this period is exceeded. (2) Storage conditions  Products should be stored in the warehouse on the following conditions. Temperature : -10 ~ 40°C Humidity : 15 to 85% relative humidity No rapid change on temperature and humidity The electrode of the products is coated with solder. Don't keep products in corrosive gases such as sulfur, chlorine gas or acid, or it may cause oxidization of electrode, resulting in poor solderability.  Products should not be stored on bulk packaging condition to prevent the chipping of the core and the breaking of winding wire caused by the collision between the products.  Products should be stored on the palette for the prevention of the influence from humidity, dust and so on.  Products should be stored in the warehouse without heat shock, vibration, direct sunlight and so on. (3) Handling Condition Care should be taken when transporting or handling product to avoid excessive vibration or mechanical shock. 12. Note (1) Please make sure that your product has been evaluated in view of your specifications with our product being mounted to your product. (2) You are requested not to use our product deviating from the agreed specifications. (3) The contents of this reference specification are subject to change without advance notice. Please approve our product specifications or transact the approval sheet for product specifications before ordering. MURATA MFG.CO., LTD