SpecNo.JELF243A-0045T-01
P1/8
CHIP COIL（CHIP INDUCTORS）LQH55DN□□□□03L
REFERENCE SPECIFICATION
1.Scope
This reference specification applies to LQH55DN Series, Chip coil (Chip Inductors).
2.Part Numbering
(ex)
LQ
H
55
D
N
R12
M
0
3
L
Product ID Structure Dimension Applications Category Inductance Tolerance Features Electrode Packaging
(L×W)
and
L:Taping
Characteristics
3.Rating
・Operating Temperature Range
・Storage Temperature Range
Customer
Part Number
-40 to +80°C
-40 to +85°C
MURATA
Part Number
(μH)
LQH55DNR12M03L
0.12
0.007±40%
Self
Resonant
Frequency
(MHz min)
450
LQH55DNR27M03L
0.27
0.010±40%
300
5.3
LQH55DNR47M03L
0.47
0.013±40%
200
4.8
LQH55DN1R0M03L
1.0
0.019±40%
150
4.0
LQH55DN1R5M03L
1.5
0.022±40%
110
3.7
LQH55DN2R2M03L
2.2
0.029±40%
80
3.2
LQH55DN3R3M03L
3.3
0.036±40%
40
2.9
LQH55DN4R7M03L
4.7
0.041±40%
30
2.7
LQH55DN6R8M03L
6.8
0.074±40%
25
2.0
LQH55DN100M03L
10
0.093±40%
20
1.7
LQH55DN150M03L
15
0.15 ±40%
17
1.4
LQH55DN220M03L
22
0.19 ±40%
15
1.2
LQH55DN330M03L
33
0.32 ±40%
12
0.9
LQH55DN470M03L
47
0.40 ±40%
10
0.8
LQH55DN680M03L
68
0.67 ±40%
7.6
0.64
LQH55DN101M03L
100
0.86 ±40%
6.5
0.56
LQH55DN151M03L
150
1.9 ±40%
5.0
0.42
LQH55DN221M03L
220
2.4 ±40%
4.0
0.32
LQH55DN331M03L
330
4.4 ±40%
3.1
0.27
LQH55DN471M03L
470
5.4 ±40%
2.4
0.24
LQH55DN681M03L
680
8.1 ±40%
1.9
0.19
LQH55DN102M03L
1000
10.3 ±40%
1.7
0.15
LQH55DN222M03L
2200
21.5 ±40%
1.2
0.10
LQH55DN472M03L
4700
43.6 ±40%
0.8
0.07
LQH55DN103M03L
10000
100
0.5
0.05
Inductance
Tolerance
(%)
±20
DC
Resistance
(Ω)
±40%
∗Rated
Current
(A)
6.0
∗When applied Rated current to the Products , self temperature rise shall be limited to 40℃ max and Inductance
will be within ±40% of initial Inductance value.
4.Testing Conditions
Temperature : Ordinary Temperature (15 to 35°C)
Humidity
: Ordinary Humidity (25 to 85 % (RH))
Temperature
: 20 ± 2°C
Humidity
: 60 to 70 % (RH)
Atmospheric Pressure : 86 to 106 kPa
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SpecNo.JELF243A-0045T-01
P2/8
5.Appearance and Dimensions
5.0±0.3
4.7±0.3
5.0±0.3
■Unit Mass (Typical value)
0.48g
5.7±0.3
(in mm)
※ No marking.
1.3min. 1.7min. 1.3min.
6.Electrical Performance
No.
6.1
Item
Inductance
Specification
Inductance shall meet item 3.
Test Method
Measuring Equipment :
KEYSIGHT 4194A or equivalent
Measuring Frequency :
1 MHz / 0.12μH to 68μH
100 kHz / 100μH to 680μH
10 kHz / 1000μH to 10000μH
6.2
DC Resistance
DC Resistance shall meet item 3.
Measuring Equipment : Digital multi meter
6.3
Self Resonant
Frequency(S.R.F)
S.R.F shall meet item 3.
Measuring Equipment :
f < 1 MHz : KEYSIGHT 4194A or equivalent
f ≥ 1 MHz : KEYSIGHT E4991A or equivalent
Specification
Chip coil shall not be damaged.
Test Method
Substrate : Glass-epoxy substrate
Applied Direction :
Chip Coil
7.Mechanical Performance
No.
7.1
Item
Shear Test
F
Substrate
Force : 10N
Hold Duration : 5±1 s
7.2
Bending Test
Chip coil shall not be damaged.
Substrate : Glass-epoxy substrate
(100 × 40 × 1.6mm)
Speed of Applying Force : 1mm / s
Deflection : 2mm
Hold Duration : 30 s
Pressure jig
R340
F
Deflection
45
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45
Product
(in mm)
SpecNo.JELF243A-0045T-01
P3/8
No.
7.3
Item
Vibration
Specification
Chip coil shall not be damaged.
Test Method
Oscillation Frequency :
10 to 55 to 10Hz for 1 minute
Total Amplitude : 1.5mm
Testing Time :
A period of 2 hours in each of 3 mutually
perpendicular directions.
(Total 6 hours)
7.4
Solderability
The wetting area of the electrode hall
be at least 90% covered with new
solder coating.
Flux : Ethanol solution of rosin, 25(wt)%
(Immersed for 5s to 10s)
Solder : Sn-3.0Ag-0.5Cu
Pre-Heating : 150±10°C / 60 to 90seconds
Solder Temperature : 240±5°C
Immersion Time : 3±1 s
7.5
Resistance to
Soldering Heat
Appearance : No damage
Inductance Change : within ± 5%
Flux : Ethanol solution of rosin, 25(wt)%
(Immersed for 5s to 10s)
Solder : Sn-3.0Ag-0.5Cu
Pre-Heating : 150±10°C / 60 to 90seconds
Solder Temperature : 270±5°C
Immersion Time : 10±1 s
Then measured after exposure in the room
condition for 24±2 hours.
8.Environmental Performance (It shall be soldered on the substrate.)
No.
8.1
Item
Heat Resistance
Specification
Appearance : No damage
Inductance Change : within ± 5 %
Rdc Change : within ± 5 %
Test Method
Temperature : 85±2°C
Time : 1000h (+48 h, -0 h)
Then measured after exposure in the room
condition for 24±2 hours.
8.2
Cold Resistance
Temperature : -40±2°C
Time : 1000h (+48 h, -0 h)
Then measured after exposure in the room
condition for 24±2 hours.
8.3
Humidity
Temperature : 40±2°C
Humidity : 90 to 95%(RH)
Time : 1000h (+48 h, -0 h)
Then measured after exposure in the room
condition for 24±2 hours.
8.4
Temperature
Cycle
1 cycle :
step 1 : -40±2°C / 30±3 min
step 2 : Ordinary temp. / 10 to 15 min
step 3 : +85±2°C / 30±3 min
step 4 : Ordinary temp. / 10 to 15 min
Total of 10 cycles
Then measured after exposure in the room
condition for 24±2 hours.
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SpecNo.JELF243A-0045T-01
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9.Specification of Packaging
5.5±0.05
6.1±0.1
( 0.4±0.05
0.4 )
※The packing directions of the chip coil
in taping are unified with the in/out
12.0±0.3
Lead- in/out wire
+0.1
φ 1.5 -0
1.75±0.1
9.1 Appearance and Dimensions of plastic tape
positions of the lead wire.
Dimension of the Cavity is measured
at the bottom side.
4.0±0.1
5.4±0.1
8.0±0.1
2.0±0.05
Direction of feed
5.0±0.2
(in mm)
9.2 Specification of Taping
(1) Packing quantity (standard quantity)
350 pcs. / reel
(2) Packing Method
Products shall be packed in the each embossed cavity of plastic tape and sealed by cover tape.
(3) Sprocket hole
The sprocket holes are to the right as the tape is pulled toward the user.
(4) Spliced point
Plastic tape and Cover tape has no spliced point.
(5) Missing components number
Missing components number within 0.1 % of the number per reel or 1 pc., whichever is greater, and are
not continuous. The specified quantity per reel is kept.
9.3 Pull Strength
Embossed carrier tape
10N min.
Cover tape
5N min.
9.4 Peeling off force of cover tape
165 to 180 degree
Speed of Peeling off
300 mm / min
Peeling off force
0.1 to 0.5N
(minimum value is typical)
F
Cover tape
Plastic tape
9.5 Dimensions of Leader-tape, Trailer and Reel
There shall be leader-tape (cover tape) and trailer-tape (empty tape) as follows.
Trailer : 160 min.
Leader
2.0±0.5
190 min
Label
210 min
Empty tape Cover tape
φ 13.0±0.2
φ 60± 1
0
.
φ 21.0±0.8
13.0±1
0
Direction of feed
17.0±1.4
(in mm)
0
φ 180± 3
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SpecNo.JELF243A-0045T-01
P5/8
9.6 Marking for reel
Customer part number, MURATA part number, Inspection number(∗1), RoHS marking(∗2), Quantity etc ･･･
∗1)
(1) Factory Code
(2) Date
□□ OOOO ×××
(1)
(2)
(3)
First digit
: Year / Last digit of year
Second digit
: Month / Jan. to Sep. → 1 to 9, Oct. to Dec. → O, N, D
Third, Fourth digit : Day
(3) Serial No.
∗2) « Expression of RoHS marking »
ROHS – Y (△)
(1) (2)
(1) RoHS regulation conformity
(2) MURATA classification number
9.7 Marking for Outside package (corrugated paper box)
Customer name, Purchasing order number, Customer part number, MURATA part number,
RoHS marking (∗2) ,Quantity, etc ･･･
9.8. Specification of Outer Case
Outer Case Dimensions (mm)
Label
H
W
D
H
Standard Reel Quantity
in Outer Case (Reel)
186
186
93
4
Above Outer Case size is typical. It depends on a quantity of an order
D
W
10.
Caution
Limitation of Applications
Please contact us before using our products for the applications listed below which require especially high reliability for
the prevention of defects which might directly cause damage to the third party's life, body or property.
(6) Transportation equipment (vehicles, trains, ships, etc.)
(7) Traffic signal equipment
(8) Disaster prevention / crime prevention equipment
(9) Data-processing equipment
(10) Applications of similar complexity and /or reliability requirements
to the applications listed in the above
(1) Aircraft equipment
(2) Aerospace equipment
(3) Undersea equipment
(4) Power plant control equipment
(5) Medical equipment
11.Notice
This product is designed for solder mounting.
Please consult us in advance for applying other mounting method such as conductive adhesive.
11.1 Land pattern designing
Recommended land pattern for reflow soldering is as follows:
It has been designed for Electric characteristics and solderability.
Please follow the recommended patterns. Otherwise, their performance which includes electrical performance or
solderability may be affected, or result to "position shift" in soldering process.
3.5
8.0
(in mm)
3.0
2.0
3.0
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SpecNo.JELF243A-0045T-01
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11.2 Flux, Solder
Flux
Solder
・Use rosin-based flux.
・Don’t use highly acidic flux with halide content exceeding 0.2(wt)% (chlorine conversion value).
・Don’t use water-soluble flux.
・Use Sn-3.0Ag-0.5Cu solder
・Standard thickness of solder paste : 200μm to 300μm
Other flux (except above) Please contact us for details, then use.
11.3 Reflow soldering conditions
・Pre-heating should be in such a way that the temperature difference between solder and product surface is limited to
150°C max. Cooling into solvent after soldering also should be in such a way that the temperature difference is
limited to 100°C max.
Insufficient pre-heating may cause cracks on the product, resulting in the deterioration of product quality.
・Standard soldering profile and the limit soldering profile is as follows.
The excessive limit soldering conditions may cause leaching of the electrode and / or resulting in the deterioration of
product quality.
Temp.
(℃)
260℃
245℃±3℃
230℃
220℃
Limit Profile
180
150
Standard Profile
30s～60s
60s max.
90s±30s
Time. (s)
Standard Profile
Pre-heating
Heating
Peak temperature
Cycle of reflow
Limit Profile
150～180°C 、90s±30s
above 220°C、30s～60s
above 230°C、60s max.
245±3°C
260°C, 10s
2 times
1 time
11.4 Reworking with soldering iron.
The following conditions must be strictly followed when using a soldering iron.
Pre-heating
150°C,1 min
Tip temperature
350°C max.
Soldering iron output
80W max.
Tip diameter
φ3mm max.
Soldering time
3(+1,-0)s
Times
2 times
Note : Do not directly touch the products with the tip of the soldering iron in order to prevent the crack
on the products due to the thermal shock.
11.5 Soldering Volume
・Solder shall be used not to be exceeded the upper limits as shown below.
・Accordingly increasing the solder volume, the mechanical stress to Chip is also increased.
Exceeding solder volume may cause the failure of mechanical or electrical performance.
Upper Limit
Recommendable
T
t
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1/3T≦ t ≦T
(T: Lower flange thickness)
SpecNo.JELF243A-0045T-01
P7/8
11.6 Product’s location
The following shall be considered when designing and laying out P.C.B.'s.
(1) P.C.B. shall be designed so that products are not subject to the mechanical stress due to warping the board.
［Products direction］
a
Products shall be located in the sideways
direction (Length:a＜b) to the mechanical stress.
b
〈 Poor example〉
〈 Good example 〉
(2) Components location on P.C.B. separation.
It is effective to implement the following measures, to reduce stress in separating the board.
It is best to implement all of the following three measures; however, implement as many measures
as possible to reduce stress.
Contents of Measures
Stress Level
(1) Turn the mounting direction of the component parallel to
the board separation surface.
A > D ∗1
(2) Add slits in the board separation part.
A > B
(3) Keep the mounting position of the component away from
the board separation surface.
A > C
Seam
b
A
C
B
D
Slit
∗1 A > D is valid when stress is added vertically to
the perforation as with Hand Separation.
If a Cutting Disc is used, stress will be diagonal to
the PCB, therefore A > D is invalid.
Length:a< b
a
(3) Mounting Components Near Screw Holes
When a component is mounted near a screw hole,
it may be affected by the board deflection that occurs
during the tightening of the screw. Mount the component
in a position as far away from the screw holes as possible.
Screw Hole
Recommended
11.7 Cleaning Conditions
Products shall be cleaned on the following conditions.
(1) Cleaning temperature shall be limited to 60°C max.(40°C max for IPA)
(2) Ultrasonic cleaning shall comply with the following conditions with avoiding the resonance phenomenon at
the mounted products and P.C.B.
Power : 20 W / l max.
Frequency : 28kHz to 40kHz
Time : 5 minutes max.
(3) Cleaner
1. Alternative cleaner
・Isopropyl alcohol (IPA)
2. Aqueous agent
・PINE ALPHA ST-100S
(4) There shall be no residual flux and residual cleaner after cleaning.
In the case of using aqueous agent, products shall be dried completely after rinse with de-ionized water in
order to remove the cleaner.
(5) Other cleaning
Please contact us.
11.8 Resin coating
The inductance value may change due to high cure-stress of resin to be used for coating/molding products. An open
circuit issue may occur by mechanical stress caused by the resin, amount/cured shape of resin, or operating condition
etc. Some resin contains some impurities or chloride possible to generate chlorine by hydrolysis under some operating
condition may cause corrosion of wire of coil, leading to open circuit. So, please pay your careful attention when you
select resin in case of coating/molding the products with the resin. Prior to use the coating resin, please make sure no
reliability issue is observed by evaluating products mounted on your board.
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SpecNo.JELF243A-0045T-01
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11.9 Caution for use
・Sharp material such as a pair of tweezers or other material such as bristles of cleaning brush, shall not be touched to
the winding portion to prevent the breaking of wire.
・Mechanical shock should not be applied to the products mounted on the board to prevent the breaking of the core
11.10 Handling of a substrate
After mounting products on a substrate, do not apply any stress to the product caused by bending or twisting to the
substrate when cropping the substrate, inserting and removing a connector from the substrate or tightening screw to
the substrate.
Excessive mechanical stress may cause cracking in the product.
Bending
Twisting
11.11 Storage and Handling Requirements
(1) Storage period
Use the products within 12 months after delivered.
Solderability should be checked if this period is exceeded.
(2) Storage conditions
・Products should be stored in the warehouse on the following conditions.
Temperature : -10 ~ 40°C
Humidity
: 15 to 85% relative humidity No rapid change on temperature and humidity
・The electrode of the products is coated with solder. Don't keep products in corrosive gases such as
sulfur,chlorine gas or acid, or it may cause oxidization of electrode, resulting in poor solderability.
・Products should not be stored on bulk packaging condition to prevent the chipping of the core and the breaking
of winding wire caused by the collision between the products.
・Products should be storedon the palette for the prevention of the influence from humidity, dust and so on.
・Products should be stored in the warehouse without heat shock, vibration, direct sunlight and so on.
(3) Handling Condition
Care should be taken when transporting or handling product to avoid excessive vibration or mechanical shock.
12.
Note
(1) Please make sure that your product has been evaluated in view of your specifications with our product being
mounted to your product.
(2) You are requested not to use our product deviating from the reference specifications.
(3) The contents of this reference specification are subject to change without advance notice.
Please approve our product specifications or transact the approval sheet for product specifications before ordering.
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