LQH5BPZ4R7NT0L

Reference Only Spec No. JELF243A-9127F-01 P.1/10 CHIP COIL（CHIP INDUCTORS）LQH5BPZ□□□□T0□ Murata Standard Reference Specification【AEC-Q200】 1.Scope This reference specification applies to LQH5BPZ_T0 series Chip coil (Chip Inductors) for automotive Electronics based on AEC-Q200 except for Power train and Safety. 2.Part Numbering (ex) LQ H Product ID 5B P Z R47 N T0 L Structure Dimension Applications Category Inductance Tolerance Dimension Packaging (L×W) and (T) L:Taping (φ180mm/reel) Characteristics K:Taping (φ330mm/reel) 3.Rating ・Operating Temperature Range. (Ambient temperature; Self-temperature rise is not included) (Product temperature; Self- temperature rise is included) ・Storage Temperature Range. -40 to +105°C -40 to +125°C -40 to +125°C 3 Rated Current(A) Inductance Customer Part Number DC Resistance (Ω) Self Resonant Frequency (MHz min) 0.47 0.012±20% 220 7.7 4.0 2.05 1.0 0.019±20% 90 5.8 3.1 1.68 1.2 0.019±20% 90 5.4 3.1 1.68 1.5 0.024±20% 70 5.0 3.0 1.63 0.030±20% 55 4.0 2.6 1.37 2.7 0.035±20% 50 3.8 2.5 1.23 3.3 0.044±20% 40 3.5 2.3 1.21 4.7 0.058±20% 40 3.0 2.0 1.09 6.8 0.083±20% 30 2.5 1.65 0.96 10 0.106±20% 25 2.0 1.60 0.87 0.187±20% 18 1.6 1.20 0.62 0.259±20% 15 1.4 1.05 0.55 MURATA Part Number (µH) LQH5BPZR47NT0L LQH5BPZR47NT0K LQH5BPZ1R0NT0L LQH5BPZ1R0NT0K LQH5BPZ1R2NT0L LQH5BPZ1R2NT0K LQH5BPZ1R5NT0L LQH5BPZ1R5NT0K LQH5BPZ2R2NT0L LQH5BPZ2R2NT0K LQH5BPZ2R7NT0L LQH5BPZ2R7NT0K LQH5BPZ3R3NT0L LQH5BPZ3R3NT0K LQH5BPZ4R7NT0L LQH5BPZ4R7NT0K LQH5BPZ6R8NT0L LQH5BPZ6R8NT0K LQH5BPZ100MT0L LQH5BPZ100MT0K LQH5BPZ150MT0L LQH5BPZ150MT0K LQH5BPZ220MT0L LQH5BPZ220MT0K 2.2 Tolerance (%) N:±30 2(Based on Temperature rise) 1 Based on Inductance Ambient Ambient change temperature temperature 85°C 105°C ESD 5A : 8kV 5A 15 22 M:±20 1: When applied Rated current to the Products, Inductance will be within ±30% of nominal Inductance value. 2: When applied Rated current to the Products ,temperature rise caused by self-generated heat shall be limited to 40°C max. 3: Keep the temperature（ambient temperature plus self-generation of heat) under 125°C. MURATA MFG.CO., LTD Reference Only Spec No. JELF243A-9127F-01 P.2/10 4. Testing Conditions 《Unless otherwise specified》 Temperature : Ordinary Temperature (15 to 35°C) Humidity : Ordinary Humidity (25 to 85 % (RH)) 《In case of doubt》 Temperature : 20 ± 2°C Humidity : 60 to 70 % (RH) Atmospheric Pressure : 86 to 106 kPa 5.Appearance and Dimensions 5.0±0.2 2.0±0.2 （0.2） 5.0±0.2 ※ No Marking. ■Unit Mass (Typical value) 0.22 g 5.0±0.2 (in mm) 1.5±0.2 1.5±0.2 6.Electrical Performance No. 6.1 Item Inductance Specification Inductance shall meet item 3. Test Method Measuring Equipment : KEYSIGHT 4284A or equivalent Measuring Frequency: 100kHz 6.2 DC Resistance DC Resistance shall meet item 3. Measuring Equipment:Digital multi meter 6.3 Self Resonant Frequency(S.R.F) S.R.F shall meet item 3. Measuring Equipment: KEYSIGHT E4991A or equivalent 7. AEC-Q200 Requirement 7.1 Performance (based on Table 5 for Magnetics(Inductors / Transformer) AEC-Q200 Rev.D issued June. 1 2010 AEC-Q200 No Stress 3 High Temperature Exposure Test Method 1000hours at 105 °C Set for 24hours at room temperature, then measured. Murata Specification / Deviation Meet Table A after testing. Table A Appearance Inductance change (at 100kHz) DC Resistance change 4 Temperature Cycling 1000cycles -40 °C to + 125 °C Set for 24hours at room temperature,then measured. Meet Table A after testing. 7 Biased Humidity 1000hours at 85 °C, 85%RH unpowered. Meet Table A after testing. MURATA MFG.CO., LTD No damage Within ±10% Within ±10% Spec No. JELF243A-9127F-01 AEC-Q200 Reference Only Murata Specification / Deviation No Stress 8 Operational Life Test Method Apply 85 °C 1000 hours Set for 24hours at room temperature, then measured Meet Table A after testing. 9 Visual inspection No abnormalities External Visual 10 Physical Dimension Meet ITEM 5 (Style and Dimensions) No defects 12 Resistance to Solvents Per MIL-STD-202 Method 215 Not Applicable 13 Mechanical Shock Per MIL-STD-202 Method 213 Condition C: 100g’s/6ms/Half sine Meet Table A after testing. 14 Vibration 5g's for 20 minutes, 12cycles eah of 3 orientations Test from 10-2000Hz. 12cycles each of 3 orientations Meet Table A after testing. 15 Resistance to Soldering Heat No-heating Solder temperature 260C+/-5 °C Immersion time 10s Meet Table A after testing. 17 ESD Per AEC-Q200-002 ESD Rank: Refer to Item 3. Rating. No defects 18 Solderbility Per J-STD-002 Method b : Not Applicable 90% of the terminations is to be soldered. (Except exposed wire) 19 Electrical Characterization Measured : Inductance No defects 20 Flammability Per UL-94 Not Applicable 21 Board Flex Epoxy-PCB(1.6mm) Deflection 2mm(min) 60s minimum holding time Meet Table A after testing. Murata deviation request: 5s 22 Terminal Strength Per AEC-Q200-006 A force of 17.7N for 60s No defects MURATA MFG.CO., LTD P.3/10 Reference Only Spec No. JELF243A-9127F-01 P.4/10 8. Specification of Packaging 8.1 Appearance and Dimensions of plastic tape Dimension of the Cavity is measured at the bottom side. 8.2 Specification of Taping (1) Packing quantity (standard quantity) φ180 mm reel : 500 pcs. / reel φ330 mm reel : 3000 pcs. / reel (2) Packing Method Products shall be packed in the each embossed cavity of plastic tape and sealed by cover tape. (3) Sprocket hole The sprocket holes are to the right as the tape is pulled toward the user. (4) Spliced point Plastic tape and Cover tape has no spliced point. (5) Missing components number Missing components number within 0.025 % of the number per reel or 1 pc., whichever is greater, and are not continuous. The specified quantity per reel is kept. 8.3 Pull Strength Embossed carrier tape 10N min. Cover tape 5N min. 8.4 Peeling off force of cover tape Speed of Peeling off Peeling off force 165 to 180 degree 300mm/min 0.2 to 0.7N (minimum value is typical) F Cover tape Plastic tape MURATA MFG.CO., LTD Reference Only Spec No. JELF243A-9127F-01 P.5/10 8.5 Dimensions of Leader-tape, Trailer and Reel There shall be leader-tape (cover tape) and trailer-tape (empty tape) as follows. « Packaging Code : L (φ180mm reel) » Trailer : 160 min. 2.0±0.5 Leader Label 190 min 210 min Empty tape Cover tape  13.0±0.2  60± 1 0  21.0±0.8 13.0±1 0 Direction of feed 17.0±1.4 (in mm) 0  180± 3 « Packaging Code : K (φ330mm reel) » 2.0±0.5 Trailer 160min. Label 50min. 13.0±0.2 13.5±1.0 21.0±0.8 17.5±1.0 Leader 210min.. 190min. Empty Tape Cover tape Direction of feed 330±2.0 (in mm) 8.6 Marking for reel Customer part number, MURATA part number, Inspection number(1), RoHS marking(2), Quantity etc ･･･ 1) (1) Factory Code (2) Date □□ OOOO  (1) (2) (3) First digit : Year / Last digit of year Second digit : Month / Jan. to Sep.  1 to 9, Oct. to Dec.  O, N, D Third, Fourth digit : Day (3) Serial No. 2) « Expression of RoHS marking » ROHS – Y (△) (1) (2) (1) RoHS regulation conformity (2) MURATA classification number 8.7 Marking for Outside package (corrugated paper box) Customer name, Purchasing order number, Customer part number, MURATA part number, RoHS marking (2) ,Quantity, etc ･･･ 8.8 Specification of Outer Case Label H D W Outer Case imensions (mm) W D H Standard Reel Quantity in Outer Case (Reel) φ180mm 186 186 93 5 φ330mm 340 340 95 5 Reel Above Outer Case size is typical. It depends on a quantity of an order. MURATA MFG.CO., LTD Reference Only Spec No. JELF243A-9127F-01 9. P.6/10 Caution 9.1 Limitation of Applications Please contact us before using our products for the applications listed below which require especially high reliability for the prevention of defects which might directly cause damage to the third party's life, body or property. (1) Aircraft equipment (6) Transportation equipment (trains, ships, etc.) (2) Aerospace equipment (7) Traffic signal equipment (3) Undersea equipment (8) Disaster prevention / crime prevention equipment (4) Power plant control equipment (9) Data-processing equipment (5) Medical equipment (10) Applications of similar complexity and /or reliability requirements to the applications listed in the above 9.2 Caution(Rating) Do not exceed maximum rated current of the product. Thermal stress may be transmitted to the product and short/open circuit of the product or falling off the product may be occurred. 9.3 Fail-safe Be sure to provide an appropriate fail-safe function on your product to prevent a second damage that may be caused by the abnormal function or the failure of our product. 9.4 Corrosive gas Please refrain from use since contact with environments with corrosive gases (sulfur gas [hydrogen sulfide, sulfur dioxide, etc.], chlorine, ammonia, etc.) or oils (cutting oil, silicone oil, etc.) that have come into contact with the previously stated corrosive gas environment will result in deterioration of product quality or an open from deterioration due to corrosion of product electrode, etc. We will not bear any responsibility for use under these environments. 10. Notice This product is designed for solder mounting. Please consult us in advance for applying other mounting method such as conductive adhesive. 10.1 Land pattern designing (Reflow Soldering) Recommended land patterns for reflow soldering are as follows: These have been designed for Electric characteristics and solderability. Please follow the recommended patterns. Otherwise, their performance which includes electrical performance or solderability may be affected, or result to "position shift" in soldering process. Land Chip Colil 5.5 Solder Resist 4.1 (in mm) 10.2 Flux, Solder Flux Solder 1.8 1.85 ・Use rosin-based flux. ・Don’t use highly acidic flux with halide content exceeding 0.2(wt)% (chlorine conversion value). ・Don’t use water-soluble flux. ・Use Sn-3.0Ag-0.5Cu solder. ・Standard thickness of solder paste : 100μm to 150μm MURATA MFG.CO., LTD Reference Only Spec No. JELF243A-9127F-01 P.7/10 10.3 Soldering conditions (Reflow) ・Pre-heating should be in such a way that the temperature difference between solder and product surface is limited to 100°C max. Cooling into solvent after soldering also should be in such a way that the temperature difference is limited to 100°C max. Insufficient pre-heating may cause cracks on the product, resulting in the deterioration of product quality. ・Standard soldering profile and the limit soldering profile is as follows. The excessive limit soldering conditions may cause leaching of the electrode and / or resulting in the deterioration of product quality. Reflow soldering profile Temp. (℃) 260℃ 245℃±3℃ 230℃ 220℃ Limit Profile 180 150 Standard Profile 30s～60s 60s max. 90s±30s Time. (s) Standard Profile Pre-heating Heating Peak temperature Cycle of reflow Limit Profile 150～180°C 、90s±30s above 220°C、30s～60s above 230°C、60s max. 245±3°C 260°C,10s 2 times 2 times 10.4 Reworking with soldering iron. The following conditions must be strictly followed when using a soldering iron. Pre-heating 150°C,1 min Tip temperature 380°C max. Soldering iron output 80W max. Tip diameter φ3mm max. Soldering time 3(+1,-0)s Times 2 times Note : Do not directly touch the products with the tip of the soldering iron in order to prevent the crack on the products due to the thermal shock. 10.5 Solder Volume ・Solder shall be used not to be exceeded the upper limits as shown below. ・Accordingly increasing the solder volume, the mechanical stress to Chip is also increased. Exceeding solder volume may cause the failure of mechanical or electrical performance. Excessively Recommendable MURATA MFG.CO., LTD Reference Only Spec No. JELF243A-9127F-01 P.8/10 10.6 Product's location The following shall be considered when designing and laying out P.C.B.’s. (1) P.C.B. shall be designed so that products are not subject to the mechanical stress due to warping the board. ［Products direction］ Electrode The electorode part of the products should be located like the picture to the mechanical stress. (Poor example) Electrode (Good example) (2) Components location on P.C.B. separation. It is effective to implement the following measures, to reduce stress in separating the board. It is best to implement all of the following three measures; however, implement as many measures as possible to reduce stress. Contents of Measures Stress Level (1) Turn the mounting direction of the component parallel to the board separation surface. A > D 1 (2) Add slits in the board separation part. A > B (3) Keep the mounting position of the component away from the board separation surface. A > C Seam C B Electrode A D Slit 1 A > D is valid when stress is added vertically to the perforation as with Hand Separation. If a Cutting Disc is used, stress will be diagonal to the PCB, therefore A > D is invalid. Electrode (3) Mounting Components Near Screw Holes When a component is mounted near a screw hole, it may be affected by the board deflection that occurs during the tightening of the screw. Mount the component in a position as far away from the screw holes as possible. Screw Hole Recommended 10.7 Cleaning Conditions Products shall be cleaned on the following conditions. (1) Cleaning temperature shall be limited to 60°C max.(40°C max for IPA.) (2) Ultrasonic cleaning shall comply with the following conditions with avoiding the resonance phenomenon at the mounted products and P.C.B. Power : 20 W / l max. Frequency : 28kHz to 40kHz Time : 5 minutes max. (3) Cleaner 1. Alternative cleaner ・Isopropyl alcohol (IPA) 2. Aqueous agent ・PINE ALPHA ST-100S (4) There shall be no residual flux and residual cleaner after cleaning. In the case of using aqueous agent, products shall be dried completely after rinse with de-ionized water in order to remove the cleaner. (5) Other cleaning Please contact us. MURATA MFG.CO., LTD Spec No. JELF243A-9127F-01 Reference Only P.9/10 10.8 Resin coating The inductance value may change due to high cure-stress of resin to be used for coating/molding products. An open circuit issue may occur by mechanical stress caused by the resin, amount/cured shape of resin, or operating condition etc. Some resin contains some impurities or chloride possible to generate chlorine by hydrolysis under some operating condition may cause corrosion of wire of coil, leading to open circuit. So, please pay your careful attention when you select resin in case of coating/molding the products with the resin. Prior to use the coating resin, please make sure no reliability issue is observed by evaluating products mounted on your board. 10.9 Caution for use ・Sharp material such as a pair of tweezers or other material such as bristles of cleaning brush, shall not be touched to the winding portion to prevent the breaking of wire. ・Mechanical shock should not be applied to the products mounted on the board to prevent the breaking of the core 10.10 Handling of a substrate After mounting products on a substrate, do not apply any stress to the product caused by bending or twisting to the substrate when cropping the substrate, inserting and removing a connector from the substrate or tightening screw to the substrate. Excessive mechanical stress may cause cracking in the product. Bending Twisting 10.11 Storage and Handling Requirements (1) Storage period Use the products within 12 months after delivered. Solderability should be checked if this period is exceeded. (2) Storage conditions ・Products should be stored in the warehouse on the following conditions. Temperature : -10 ~ 40°C Humidity : 15 to 85% relative humidity No rapid change on temperature and humidity The electrode of the products is coated with solder. Don't keep products in corrosive gases such as sulfur,chlorine gas or acid, or it may cause oxidization of electrode, resulting in poor solderability. ・Products should not be stored on bulk packaging condition to prevent the chipping of the core and the breaking of winding wire caused by the collision between the products. ・Products should be stored on the palette for the prevention of the influence from humidity, dust and so on. ・Products should be stored in the warehouse without heat shock, vibration, direct sunlight and so on. (3) Handling Condition Care should be taken when transporting or handling product to avoid excessive vibration or mechanical shock. 11． Note (1) Please make sure that your product has been evaluated in view of your specifications with our product being mounted to your product. (2) You are requested not to use our product deviating from the reference specifications. (3) The contents of this reference specification are subject to change without advance notice. Please approve our product specifications or transact the approval sheet for product specifications before ordering MURATA MFG.CO., LTD