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LQM18DN220M70L

LQM18DN220M70L

  • 厂商:

    MURATA-PS(村田)

  • 封装:

    -

  • 描述:

    LQM18DN220M70L

  • 数据手册
  • 价格&库存
LQM18DN220M70L 数据手册
Spec No.: JELF243B-0086D-01 P1/11 Chip Coil (Chip Inductors) LQM18DN□□□□70□ REFERENCE SPECIFICATION 1. Scope This reference specification applies to chip coils (chip inductors) LQM18DN□□□□70□ series for general electronic equipment. 2. Part Numbering (Ex.) LQ Product ID M 18 DN 6R8 M 70 L Type Dimension (L × W) Application and characteristic Inductance Tolerance Category Packaging L: taping *B: bulk *B: Bulk packing is also available. (The product sealed on the carrier tape is stored in a plastic bag.) 3. Part Number and Rating Operating temperature range -55°C to +125°C Storage temperature range -55°C to +125°C Inductance Customer Part number Murata Part number Nominal Tolerance value (%) (μH) DC resistance (Ω) Self-resonant frequency (MHz min.) Rated current (mA) Based on Based on inductance temperature change rise LQM18DN6R8M70L 6.8 ±20 0.74±0.22 40 120 330 LQM18DN100M70L 10 ±20 1.05±0.32 32 100 300 LQM18DN150M70L 15 ±20 1.95±0.59 24 80 220 LQM18DN220M70L 22 ±20 2.40±0.72 15 50 200 LQM18DN330M70L 33 ±20 2.40±0.72 13 30 200 LQM18DN470M70L 47 ±20 2.55±0.77 10 20 180 4. Testing Conditions Unless otherwise specified Temperature: ordinary temperature (15°C to 35°C) Humidity: ordinary humidity [25% to 85% (RH)] In case of doubt Temperature: 20°C±2°C Humidity: 60% to 70% (RH) Atmospheric pressure: 86 kPa to 106 kPa MURATA MFG CO., LTD Spec No.: JELF243B-0086D-01 P2/11 5. Appearance and Dimensions ■ Equivalent Circuit ■ Unit mass (typical value): 0.005 g 6. Marking No marking. 7. Electrical Performance No. Item Specification Test method 7.1 Inductance Meet chapter 3 ratings. Measuring equipment: Keysight 4294A or the equivalent Measuring frequency: 1 MHz 7.2 DC resistance Meet chapter 3 ratings. Measuring equipment: digital multimeter Measuring circuit: Measure with the product set to terminal 2 and the switch pressed (open between a and b). When setting or removing the product, press the switch to short between a and b 7.3 Self-resonant frequency Meet chapter 3 ratings. Measuring equipment: Keysight E4294A or the equivalent 7.4 Rated current When rated current is applied to the Apply the rated current specified in chapter 3. products, inductance will be within ±50% of initial inductance value range. Temperature rise caused by selfgenerated heat shall be limited to 40°C max. MURATA MFG CO., LTD Spec No.: JELF243B-0086D-01 P3/11 8. Mechanical Performance The product is soldered on a substrate for test.(Except Drop, Resistance to soldering heat, Solderability) (Test shall be done using Flux, Solder and Soldering condition which are specified in chapter 12 except the case of being specified special condition.) No. Item Specification Test method 8.1 Shear test No significant mechanical damage or no sign of electrode peeling off shall be observed. Applying force: 10 N Holding time: 5 s Force application direction: 8.2 Bending test No significant mechanical damage or no sign of electrode peeling off shall be observed. Test substrate: glass-epoxy substrate (100 mm × 40 mm × 1.6 mm) Pressurizing speed: 1.0 mm/s Pressure jig: R230 Amount of bending: 2 mm Holding time: 20 s 8.3 Vibration Appearance shall have no significant mechanical damage. Oscillation frequency: 10 Hz to 2000 Hz to 10 Hz/20 min Amplitude: total amplitude of 3.0 mm or acceleration amplitude of 196 m/s2, whichever is smaller Test time: 3 directions perpendicular to each other, 2 h for each direction (6 h in total) 8.4 Resistance to soldering heat Appearance: No significant mechanical damage shall be observed. Inductance change rate: within ±30% (Inductance value: 6.8 μH to 10 μH) Inductance change rate: within +50 % (Inductance value: 15 μH to 47 μH) Flux: Ethanol solution of rosin, 25(wt)% Pre-heating: 150°C/60 s Solder: Sn-3.0Ag-0.5Cu solder Solder temperature: 260°C±5°C Immersion time: 10 s Post-treatment: left for 4 hours to 48 hours at room temperature. 8.5 Solderability 95% or more of the outer electrode shall be covered with new solder seamlessly. Flux: Ethanol solution of rosin, 25(wt)% Pre-heating: 150°C/60 s Solder: Sn-3.0Ag-0.5Cu solder Solder temperature: 245°C±3°C Immersion time: 3 s MURATA MFG CO., LTD Spec No.: JELF243B-0086D-01 P4/11 9. Environmental Performance The product is soldered on a substrate for test. (Test shall be done using Flux, Solder and Soldering condition which are specified in chapter 12 except the case of being specified special condition.) No. Item Specification Test method 9.1 Heat resistance Appearance: No significant mechanical damage shall be observed. Inductance change rate: within ±50% (Inductance value: 6.8 μH to 22 μH) Inductance change rate: within +40 %, 60% (Inductance value: 33 μH to 47 μH) Temperature: 125°C±2°C Test time: 1000 h (+48 h, -0 h) Post-treatment: left for 4 hours to 48 hours at room temperature. 9.2 Cold resistance Appearance: No significant mechanical damage shall be observed. Inductance change rate: within ±50% Temperature: -55°C±2°C Test time: 1000 h (+48 h, -0 h) Post-treatment: left for 4 hours to 48 hours at room temperature. 9.3 Humidity Appearance: No significant mechanical damage shall be observed. Inductance change rate: within ±50% Temperature: 40°C±2°C Humidity: 90% to 95% (RH) Test time: 1000 h (+48 h, -0 h) Post-treatment: left for 4 hours to 48 hours at room temperature. 9.4 Temperature cycle Appearance: No significant mechanical damage shall be observed. Inductance change rate: within ±50% Single cycle conditions: Step 1: -55°C (+0°C, -3°C), 30 min (+3 min, -0 min) Step 2: ordinary temperature, 3 min max. Step 3: +125°C (+3°C, -0°C), 30 min (+3 min, -0 min) Step 4: ordinary temperature, 3 min max. Number of testing: 100 cycles Post-treatment: left for 4 hours to 48 hours at room temperature. 10. Specification of Packaging 10.1 Appearance and dimensions of tape (8 mm width/plastic tape) A (0.95) B (1.8) t 1.0 max. t' (0.30) (in mm) * The dimensions of the cavity are measured at its bottom. MURATA MFG CO., LTD Spec No.: JELF243B-0086D-01 P5/11 10.2 Taping specifications Packing quantity (Standard quantity) 4000 pcs/reel Packing method The products are placed in cavities of a carrier tape and sealed by a cover tape (top tape and bottom tape when the cavities of the carrier tape are punched type). Feed hole position The feed holes on the carrier tape are on the right side when the cover tape (top tape when the cavities of the carrier tape are punched type) is pulled toward the user. Joint The carrier tape and cover tape (top tape when the cavities of the carrier tape are punched type) are seamless. Number of missing products Number of missing products within 0.025% of the number per reel or 1 pc., whichever is greater, and are not continuous. The specified quantity per reel is kept. 10.3 Break down force of tape Cover tape (or top tape) 5 N min. Bottom tape (only when the cavities of the carrier tape are punched type) 5 N min. 10.4 Peeling off force of tape Speed of peeling off Peeling off force 300 mm/min 0.1 N to 0.7 N (The lower limit is for typical value.) 10.5 Dimensions of leader section, trailer section and reel A vacant section is provided in the leader (start) section and trailer (end) section of the tape for the product. The leader section is further provided with an area consisting only of the cover tape (or top tape). (See the diagram below.) MURATA MFG CO., LTD Spec No.: JELF243B-0086D-01 P6/11 10.6 Marking for reel Customer part number, Murata part number, inspection number (*1), RoHS marking (*2), quantity, etc. *1 Expression of inspection No.: (1) Factory code  (2) Date □□ ○○○○ First digit: year/last digit of year (1) (2) (3) Second digit: month/Jan. to Sep.→1 to 9, Oct. to Dec.→O, N, D Third, Fourth digit: day (3) Serial No. *2 Expression of RoHS marking: (1) RoHS regulation conformity ROHSY () (2) Murata classification number (1) (2) 10.7 Marking on outer box (corrugated box) Customer name, purchasing order number, customer part number, Murata part number, RoHS marking (*2), quantity, etc. 10.8 Specification of outer box Label H D W 11. Dimensions of outer box (mm) W D H 186 186 93 Standard reel quantity in outer box (reel) 5 * Above outer box size is typical. It depends on a quantity of an order. Caution 11.1 Restricted applications Please contact us before using our products for the applications listed below which require especially high reliability for the prevention of defects which might directly cause damage to the third party's life, body or property. (1) Aircraft equipment (6) Transportation equipment (vehicles, trains, ships, etc.) (2) Aerospace equipment (7) Traffic signal equipment (3) Undersea equipment (8) Disaster/crime prevention equipment (4) Power plant control equipment (9) Data-processing equipment (5) Medical equipment (10) Applications of similar complexity and/or reliability requirements to the applications listed in the above 11.2 Precautions on rating Avoid using in exceeded the rated temperature range, rated voltage, or rated current. Usage when the ratings are exceeded could lead to wire breakage, burning, or other serious fault. 11.3 Inrush current If an inrush current (or pulse current or rush current) that significantly exceeds the rated current is applied to the product, overheating could occur, resulting in wire breakage, burning, or other serious fault. MURATA MFG CO., LTD Spec No.: JELF243B-0086D-01 P7/11 12. Precautions for Use This product is designed to be mounted by soldering. If you want to use other mounting method, for example, using a conductive adhesive, please consult us beforehand. Also, if repeatedly subjected to temperature cycles or other thermal stress, due to the difference in the coefficient of thermal expansion with the mounting substrate, the solder (solder fillet part) in the mounting part may crack. The occurrence of cracks due to thermal stress is affected by the size of the land where mounted, the solder volume, and the heat dissipation of the mounting substrate. Carefully design it when a large change in ambient temperature is assumed. 12.1 Land dimensions c The following diagram shows the recommended land dimensions for flow and reflow soldering: flow reflow a 0.8 0.7 b 2.5 2.0 c 0.7 0.7 (in mm) land p attern sold er resist a b 12.2 Flux and solder used Flux • Use a rosin-based flux. • Do not use a highly acidic flux with a halide content exceeding 0.2(wt)% (chlorine conversion value). • Do not use a water-soluble flux. Solder • Use Sn-3.0Ag-0.5Cu solder. • Standard thickness of solder paste: 100 μm to 150 μm If you want to use a flux other than the above, please consult our technical department. 12.3 Soldering conditions (flow, reflow) • Pre-heating should be in such a way that the temperature difference between solder and product surface is limited to 100°C max. Cooling into solvent after soldering also should be in such a way that the temperature difference is limited to 100°C max. Insufficient pre-heating may cause cracks on the product, resulting in the deterioration of product quality. • Standard soldering profile and the limit soldering profile is as follows. The excessive limit soldering conditions may cause leaching of the electrode and/or resulting in the deterioration of product quality. (1) Flow Temp. (℃) 265℃±3℃ 250℃ Limit Profile 150 Heating Time 60s min. Standard Profile Time. (s) Standard profile Limit profile Pre-heating 150°C/60 s min. 150°C/60 s min. Heating 250°C/4 s to 6 s 265°C±3°C/5 s 2 times 2 times Number of flow cycles MURATA MFG CO., LTD Spec No.: JELF243B-0086D-01 P8/11 (2) Reflow Temp. (℃) 260℃ 245℃±3℃ 230℃ 220℃ Limit Profile 180 150 Standard Profile 30s~60s 60s max. 90s±30s Time. (s) Standard profile Limit profile Pre-heating 150°C to 180°C/90 s±30 s 150°C to 180°C/90 s±30 s Heating Above 220°C/30 s to 60 s Above 230°C/60 s max. 245°C±3°C 260°C/10 s 2 times 2 times Peak temperature Number of reflow cycles 12.4 Reworking with soldering iron The following requirements must be met to rework a soldered product using a soldering iron. Item Requirement Pre-heating Tip temperature of soldering iron Power consumption of soldering iron Tip diameter of soldering iron Soldering time Number of reworking operations 150°C/approx. 1 min 350°C max. 60 W max. ø3 mm max. 3 s (+1 s, -0 s) 2 times max. * Avoid a direct contact of the tip of the soldering iron with the product. Such a direction contact may cause cracks in the ceramic body due to thermal shock. 12.5 Solder volume Solder shall be used not to increase the volume too much. An increased solder volume increases mechanical stress on the product. Exceeding solder volume may cause the failure of mechanical or electrical performance. MURATA MFG CO., LTD Spec No.: JELF243B-0086D-01 P9/11 12.6 Product's location The following shall be considered when designing and laying out PCBs. (1) PCB shall be designed so that products are not subject to mechanical stress due to warping the board. [Products direction] Products shall be located in the sideways direction (length: a < b) to the mechanical stress. a b 〈 Poor example〉 〈 Good example〉 (2) Components location on PCB separation It is effective to implement the following measures, to reduce stress in separating the board. It is best to implement all of the following three measures; however, implement as many measures as possible to reduce stress. Contents of measures Stress level (1) Turn the mounting direction of the component parallel to the board separation surface. A > D*1 (2) Add slits in the board separation part. A>B (3) Keep the mounting position of the component away from the board separation surface. A>C *1 A > D is valid when stress is added vertically to the perforation as with hand separation. If a cutting disc is used, stress will be diagonal to the PCB, therefore A > D is invalid. (3) Mounting components near screw holes When a component is mounted near a screw hole, it may be affected by the board deflection that occurs during the tightening of the screw. Mount the component in a position as far away from the screw holes as possible. 12.7 Handling of substrate After mounting products on a substrate, do not apply any stress to the product caused by bending or twisting to the substrate when cropping the substrate, inserting and removing a connector from the substrate or tightening screw to the substrate. Excessive mechanical stress may cause cracking in the product. Bending Twisting MURATA MFG CO., LTD Spec No.: JELF243B-0086D-01 P10/11 12.8 Cleaning When cleaning this product, observe the following conditions. Any cleaning may cause deterioration in the quality of the product, so please check the quality of this product before use. (1) The cleaning temperature shall be 60°C max. If isopropyl alcohol (IPA) is used, the cleaning temperature shall be 40°C max. (2) When ultrasonic cleaning is used, under some cleaning conditions, the substrate could resonate and the substrate vibrations could result in chip cracks, solder breakage, and other problems. Be sure to always perform a test cleaning beforehand using an actual cleaning device, and then check the quality of the products. (3) Cleaner Alcohol-based cleaner: IPA Aqueous agent: PINE ALPHA ST-100S (4) There shall be no residual flux or residual cleaner. When using aqueous agent, rinse the product with deionized water adequately and completely dry it so that no cleaner is left. * For other cleaning, please consult our technical department. 12.9 Storage and transportation Storage period Use the product within 6 months after delivery. If you do not use the product for more than 6 months, check solderability before using it. Storage conditions • The products shall be stored in a room not subject to rapid changes in temperature and humidity. The recommended temperature range is -10°C to +40°C. The recommended relative humidity range is 15% to 85%. Keeping the product in corrosive gases, such as sulfur, chlorine gas or acid may cause the poor solderability. • Do not place the products directly on the floor; they should be placed on a palette so that they are not affected by humidity or dust. • Avoid keeping the products in a place exposed to direct sunlight, heat or vibration. • Do not keep products in bulk packaging. Bulk storage could result in collisions between the products or between the products and other parts, resulting in chipping or wire breakage. • Avoid storing the product by itself bare (i.e. exposed directly to air). Transportation Excessive vibration and impact reduces the reliability of the products. Exercise caution when handling the products. 12.10 Resin coating (including moisture-proof coating) When the product is coated/molded with resin, its electrical characteristics may change. A wire breakage issue may occur by mechanical stress caused by the resin, amount/cured shape of resin, or operating condition etc. Some resins contain impurities or hydrolyzable chlorine, which could result in corrosion of the conducting materials, leading to wire breakage. So, please pay your careful attention when you select resin in case of coating/molding the products with the resin. Prior to use the coating resin, please make sure no reliability issue is observed by evaluating products mounted on your board. 12.11 Mounting conditions Check the mounting condition before using. Using mounting conditions (nozzles, equipment conditions, etc.) that are not suitable for products may lead to pick up errors, misalignment, or damage to the product. 12.12 Operating environment Do not use this product under the following environmental conditions as it may cause deterioration of product quality. (1) In the corrodible atmosphere such as acidic gases, alkaline gases, chlorine, sulfur gases, organic gases and etc. (the sea breeze, Cl2, H2S, NH3, SO2, NO2, etc) (2) In the atmosphere where liquid such as organic solvent, may splash on the products. (3) In the atmosphere where the temperature/humidity changes rapidly and it is easy to dew. MURATA MFG CO., LTD Spec No.: JELF243B-0086D-01 P11/11 12.13 Mounting density If this product is placed near heat-generating products, be sure to implement sufficient heat-dissipating measures. If this product is subjected to a significant amount of heat from other products, this could adversely affect product quality, resulting in a circuit malfunction or failure of the mounted section. Also, be sure that the product is used in a manner so that the heat that the product is subjected to from other products does not exceed the upper limit of the rated operating temperature for the product. 12.14 Handling of product Inductance could change due to the effect of magnetism. Do not use magnetized tweezers, magnets, or other similar tools when handling the product (instead, use tweezers with resin or ceramic tips). 13. Note (1) Please make sure that your product has been evaluated in view of your specifications with our product being mounted to your product. (2) You are requested not to use our product deviating from the reference specifications. (3) The contents of this reference specification are subject to change without advance notice. Please approve our product specifications or transact the approval sheet for product specifications before order MURATA MFG CO., LTD
LQM18DN220M70L 价格&库存

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LQM18DN220M70L
  •  国内价格
  • 50+0.64670
  • 250+0.62692
  • 500+0.60817
  • 1000+0.59047
  • 2000+0.57277

库存:2750