LQM21FN4R7M70L

Reference Only Spec No. JELF243B-0011L-01 P.1/9 CHIP COIL (CHIP INDUCTORS) LQM21FN□□□□70L REFERENCE SPECIFICATION 1. Scope This specification applies to LQM21FN_70 series, Chip coil (Chip Inductors). 2. Part Numbering (ex) LQ M 21 F N 4R7 Product ID Structure Dimension Applications Category (L×W) and Characteristics M 7 0 Inductance Tolerance Features Electrode L Packaging L: Taping *B: BULK *B: Bulk packing also available 3. Rating Operating Temperature Range Storage Temperature Range Customer Part Number –55°C to + 125°C –55°C to + 125°C MURATA Part Number Inductance (H) LQM21FN4R7M70L 4.7 LQM21FN100M70L 10 Tolerance ±20% DC Resistance (Ω) 0.35±30% 0.60±30% Self Resonant Frequency (MHz min.) 25 15 Rated Current (mA) 120 100 4. Appearance and Dimensions 0.5±0.3 Ferrite Electrode 1.25±0.2 2.0±0.2 1.25±0.2 ■Unit Mass (Typical value) 0.016g (in mm) 5. Testing Conditions 《Unless otherwise specified》 《In case of doubt》 Temperature : Ordinary Temperature / 15°C to 35°C Temperature : 20°C ± 2°C Humidity : Ordinary Humidity / 25%(RH) to 85%(RH) Humidity : 60%(RH) to 70%(RH) Atmospheric Pressure : 86kPa to 106kPa MURATA MFG.CO., LTD Reference Only Spec No. JELF243B-0011L-01 P.2/9 6. Electrical Performance No. 6.1 Item Inductance Specification Inductance shall meet item 3. 6.2 DC Resistance DC Resistance shall meet item 3. Test Method Measuring Equipment: KEYSIGHT 4291A or equivalent (1mA) Measuring Frequency: 1MHz Measuring Equipment: Digital multi meter Digital multi meter (TR6846 or equivalent) a terminal1 terminal2 SW b DC resistance shall be measured after putting chip coil between the terminal 2 under the condition of opening between a and b. Every measurement the terminal 1 shall be shorted between a and b when changing chip coil. 6.3 6.4 Self Resonant Frequency (S.R.F) Rated Current S.R.F shall meet item 3. Self temperature rise shall be limited to 25°C max. Inductance Change: within ±50% Measuring Equipment: Agilent 4291A or equivalent The rated current is applied. 7. Mechanical Performance No. 7.1 Item Shear Test Specification Chip coil shall not be damaged after tested as follows. Test Method Applied Direction Chip Coil F Substrate 7.2 Bending Test Force: 10N Hold Duration: 5s±1s Applied Direction: Parallel to PCB Substrate: Glass-epoxy substrate (100mm×40mm×1.6mm) Pressure jig R340 F Deflection 45 7.3 Vibration 45 Product (in mm) Speed of Applying Force: 1mm/s Deflection: 2mm Hold Duration: 30s Oscillation Frequency: 10Hz to 55Hz to 10Hz for 1 min Total Amplitude: 1.5mm Testing Time: A period of 2h in each of 3 mutually perpendicular directions. MURATA MFG.CO., LTD Reference Only Spec No. JELF243B-0011L-01 P.3/9 No. 7.4 Item Solderability Specification The wetting area of the electrode shall be at least 90% covered with new solder coating. 7.5 Resistance to Soldering Heat Appearance: No damage Inductance Change: within ±20% Test Method Flux: Ethanol solution of rosin 25(wt)% (Immersed for 5s to 10s) Solder: Sn-3.0Ag-0.5Cu Pre-Heating: 150°C±10°C / 60s to 90s Solder Temperature: 240°C±5°C Immersion Time: 3s±1s Flux: Ethanol solution of rosin 25(wt)% (Immersed for 5s to 10s) Solder: Sn-3.0Ag-0.5Cu Pre-Heating: 150°C±10°C / 60s to 90s Solder Temperature: 270°C±5°C Immersion Time: 10s±1s Then measured after exposure in the room condition for 24h±2h. 8. Environmental Performance It shall be soldered on the substrate. No. Item Specification 8.1 Heat Appearance: No damage Resistance Inductance Change: within ±20% 8.2 Humidity 8.3 Temperature Cycle Test Method Temperature: 125°C±2°C Time: 1000h (+48h,-0h) Then measured after exposure in the room condition for 24h±2h. Temperature: 40°C±2°C Humidity: 90%(RH) to 95%(RH) Time: 1000h (+48h,-0h) Then measured after exposure in the room condition for 24h±2h. 1 cycle: 1 step: -55°C±2°C / 30 min±3 min 2 step: Ordinary temp. / 10 min to 15 min 3 step: 125°C±2°C / 30 min to 3 min 4 step: Ordinary temp. / 10 min to15 min Total of 10 cycles Then measured after exposure in the room condition for 24 h±2 h. 9. Specification of Packaging 2 .2 5 ±0 .1 1.45±0.05 0.2±0.1 8 .0 ±0 .3 φ 1.5± 00.1 3 .5 ±0 .0 5 2.0±0.05 4.0±0.1 4.0±0.1 1 .7 5 ±0 .1 9.1 Appearance and Dimensions of paper tape / plastic tape Direction of feed 1.45±0.05 ・Dimension of the Cavity is measured at the bottom side. MURATA MFG.CO., LTD (in mm) Reference Only Spec No. JELF243B-0011L-01 P.4/9 9.2 Specification of Taping (1) Packing quantity (standard quantity) 3,000 pcs / reel (2) Packing Method Products shall be packed in the each embossed cavity of plastic tape and sealed by cover tape. (3) Sprocket hole The sprocket holes are to the right as the tape is pulled toward the user. (4) Spliced point Plastic tape and Cover tape has no spliced point. (5) Missing components number Missing components number within 0.1% of the number per reel or 1 pc., whichever is greater, and are not continuous. The specified quantity per reel is kept. 9.3 Pull Strength Plastic tape Cover tape 10N min. 9.4 Peeling off force of cover tape Speed of Peeling off Peeling off force 300mm / min 0.2N to 0.7N (minimum value is typical) 165 to 180 degree F Cover tape Plastic tape 9.5 Dimensions of Leader-tape, Trailer and Reel There shall be leader-tape ( cover tape ) and trailer-tape (empty tape) as follows. Leader Trailer 2.0±0.5 160 min. 190 min. Label Empty tape 210 min. Cover tape  13.0±0.2 1  60± 0  21.0±0.8 9± 10 Direction of feed 13±1.4 (in mm) 0  180± 3 9.6 Marking for reel Customer part number, MURATA part number, Inspection number (1), RoHS Marking (2), Quantity etc ･･･ 1) □□ OOOO  (1) (2) (3) (1) Factory Code (2) Date First digit : Year / Last digit of year Second digit : Month / Jan. to Sep.  1 to 9, Oct. to Dec.  O, N, D Third, Fourth digit : Day (3) Serial No. 2) ROHS – Y (△) (1) (2) (1) RoHS regulation conformity parts. (2) MURATA classification number 9.7 Marking for Outside package (corrugated paper box) Customer name, Purchasing order number, Customer part number, MURATA part number, RoHS Marking (2), Quantity, etc ･･･ MURATA MFG.CO., LTD Reference Only Spec No. JELF243B-0011L-01 P.5/9 9.8. Specification of Outer Case Label H D W Outer Case Dimensions (mm) W D H 186 186 93 Standard Reel Quantity in Outer Case (Reel) 5   Above Outer Case size is typical. It depends on a quantity of an order 10. ！ Caution Limitation of Applications Please contact us before using our products for the applications listed below which require especially high reliability for the prevention of defects which might directly cause damage to the third party's life, body or property. (1) Aircraft equipment (6) Transportation equipment (vehicles, trains, ships, etc.) (7) Traffic signal equipment (2) Aerospace equipment (3) Undersea equipment (8) Disaster prevention / crime prevention equipment (4) Power plant control equipment (9) Data-processing equipment (5) Medical equipment (10) Applications of similar complexity and /or reliability requirements to the applications listed in the above 11. Notice This product is designed for solder mounting. Please consult us in advance for applying other mounting method such as conductive adhesive. 11.1 Land pattern designing Chip Coil Land Solder Resist c a b a b c 1.2 3.0 to 4.0 1.0 (in mm) 11.2 Flux, Solder  Use rosin-based flux. Don’t use highly acidic flux with halide content exceeding 0.2(wt)% (chlorine conversion value). Don’t use water-soluble flux.  Use Sn-3.0Ag-0.5Cu solder.  Standard thickness of solder paste: 100m to 150m. 11.3 Flow soldering / Reflow soldering conditions  Pre-heating should be in such a way that the temperature difference between solder and product surface is limited to 150°C max. Cooling into solvent after soldering also should be in such a way that the temperature difference is limited to 100°C max. Insufficient pre-heating may cause cracks on the product, resulting in the deterioration of products quality. Standard soldering profile and the limit soldering profile is as follows. The excessive limit soldering conditions may cause leaching of the electrode and/or resulting in the deterioration of product quality. MURATA MFG.CO., LTD Reference Only Spec No. JELF243B-0011L-01 P.6/9 Soldering profile (1) Flow soldering profile Temp. (℃) 265℃±3℃ 250℃ Limit Profile 150 Heating Time Standard Profile Time. (s) 60s min. Standard Profile Limit Profile 150℃, 60s min. 250℃, 4s～6s 265℃±3℃, 5s 2 times 2 times Pre-heating Heating Cycle of flow (2) Reflow soldering profile Temp. (℃) 260℃ 245℃±3℃ 230℃ 220℃ Limit Profile 180 150 Standard Profile 30s～60s 60s max. 90s±30s Pre-heating Heating Peak temperature Cycle of reflow Time. (s) Standard Profile Limit Profile 150°C～180°C, 90s±30s above 220°C, 30s～60s above 230°C, 60s max. 245°C±3°C 260°C, 10s 2 times 2 times 11.4 Reworking with soldering iron. The following conditions must be strictly followed when using a soldering iron. Pre-heating Tip temperature Soldering iron output Tip diameter Soldering time Time 150°C, 1 min 350°C max. 80W max. φ3mm max. 3(+1, -0)s 2 times Note : Do not directly touch the products with the tip of the soldering iron in order to prevent the crack on the products due to the thermal shock. MURATA MFG.CO., LTD Reference Only Spec No. JELF243B-0011L-01 P.7/9 11.5 Solder Volume  Solder shall be used not to be exceeded the upper limits as shown below.  Accordingly increasing the solder volume, the mechanical stress to Chip is also increased. Exceeding solder volume may cause the failure of mechanical or electrical performance. Upper Limit Recommendable t 1/3T≦t≦T T： thickness of product 11.6 Product’s location The following shall be considered when designing and laying out P.C.B.'s. (1) P.C.B. shall be designed so that products are not subject to the mechanical stress due to warping the board. ［Products direction］ a b 〈 Poor example〉 〈 Good example〉 Products shall be located in the sideways direction (Length: a‹b) to the mechanical stress. (2)Components location on P.C.B. separation. It is effective to implement the following measures, to reduce stress in separating the board. It is best to implement all of the following three measures; however, implement as many measures as possible to reduce stress. Contents of Measures (1) Turn the mounting direction of the component parallel to the board separation surface. (2) Add slits in the board separation part. (3) Keep the mounting position of the component away from the board separation surface. Perforation Stress Level A > D *1 A > B A > C C B D A Slit *1 A > D is valid when stress is added vertically to the perforation as with Hand Separation. If a Cutting Disc is used, stress will be diagonal to the PCB, therefore A > D is invalid. (3) Mounting Components Near Screw Holes When a component is mounted near a screw hole, it may be affected by the board deflection that occurs during the tightening of the screw. Mount the component in a position as far away from the screw holes as possible. MURATA MFG.CO., LTD Reference Only Spec No. JELF243B-0011L-01 P.8/9 11.7 Cleaning Conditions Products shall be cleaned on the following conditions. (1) Cleaning temperature shall be limited to 60°C max. (40°C max for IPA.) (2) Ultrasonic cleaning shall comply with the following conditions with avoiding the resonance phenomenon at the mounted products and P.C.B. Power : 20 W / l max. Frequency : 28kHz to 40kHz Time : 5 min max. (3) Cleaner 1. Alcohol type cleaner Isopropyl alcohol (IPA) 2. Aqueous agent PINE ALPHA ST-100S (4) There shall be no residual flux and residual cleaner after cleaning. In the case of using aqueous agent, products shall be dried completely after rinse with de-ionized water in order to remove the cleaner. (5) Other cleaning Please contact us. 11.8 Resin coating The inductance value may change and/or it may affect on the product's performance due to high cure-stress of resin to be used for coating / molding products. So please pay your careful attention when you select resin. In prior to use, please make the reliability evaluation with the product mounted in your application set. 11.9 Caution for use There is possibility that the inductance value change due to magnetism. Don‘t use a magnet or a pair of tweezers with magnetism when chip coil are handled. (The tip of the tweezers should be molded with resin or pottery.) 11.10 Magnetic Saturation When the excessive current over rated current is applied, the inductance value may change due to magnetism. 11.11 Handling of a substrate After mounting products on a substrate, do not apply any stress to the product caused by bending or twisting to the substrate when cropping the substrate, inserting and removing a connector from the substrate or tightening screw to the substrate. Excessive mechanical stress may cause cracking in the product. Bending Twisting MURATA MFG.CO., LTD Reference Only Spec No. JELF243B-0011L-01 P.9/9 11.12 Storage and Handing Requirements (1) Storage period Use the products within 6 months after delivered. Solderability should be checked if this period is exceeded. (2) Storage conditions Products should be stored in the warehouse on the following conditions. Temperature ： -10°C to 40°C Humidity ： 15% to 85% relative humidity No rapid change on temperature and humidity Don't keep products in corrosive gases such as sulfur,chlorine gas or acid, or it may cause oxidization of electrode, resulting in poor solderability. Products should be stored on the palette for the prevention of the influence from humidity, dust and so on. Products should be stored in the warehouse without heat shock, vibration, direct sunlight and so on. Products should be stored under the airtight packaged condition. (3) Handling Condition Care should be taken when transporting or handling product to avoid excessive vibration or mechanical shock. 12．! Note (1) Please make sure that your product has been evaluated in view of your specifications with our product being mounted to your product. (2) You are requested not to use our product deviating from the agreed specifications. (3) The contents of this reference specification are subject to change without advance notice. Please approve our product specifications or transact the approval sheet for product specifications before ordering. MURATA MFG.CO., LTD