LQM21NN2R2K10D

Reference Only Spec No. JELF243B-0005R-01 P.1/9 CHIP COIL (CHIP INDUCTORS) LQM21NN□□□□10□ REFERENCE SPECIFICATION 1. Scope This reference specification applies to LQM21NN_10 series, Chip coil (Chip Inductors). 2. Part Numbering (ex) LQ M 21 N N R10 K 1 0 D Product ID Structure Dimension Applications Category Inductance Tolerance Features Electrode Packaging D: Taping (L×W) and Characteristics (Paper tape) L: Taping *B:Bulk packing also available (Plastic tape) *B: Bulk 3. Rating ・Operating Temperature Range ・Storage Temperature Range Customer Part Number – 40°C to + 85°C – 55°C to +125°C MURATA Part Number Inductance (μH) LQM21NNR10K10D LQM21NNR12K10D LQM21NNR15K10D LQM21NNR18K10D LQM21NNR22K10D LQM21NNR27K10D LQM21NNR33K10D LQM21NNR39K10D LQM21NNR47K10D LQM21NNR56K10D LQM21NNR68K10D LQM21NNR82K10D LQM21NN1R0K10D LQM21NN1R2K10D LQM21NN1R5K10D LQM21NN1R8K10D LQM21NN2R2K10D LQM21NN2R7K10L LQM21NN3R3K10L LQM21NN3R9K10L LQM21NN4R7K10L 0.10 0.12 0.15 0.18 0.22 0.27 0.33 0.39 0.47 0.56 0.68 0.82 1.0 1.2 1.5 1.8 2.2 2.7 3.3 3.9 4.7 Q (min.) Tolerance 20 25 ±10% 45 Self DC Resonant Resistance Frequency (Ωmax.) (MHz min.) 0.26 0.29 0.32 0.35 0.38 0.42 0.48 0.53 0.57 0.63 0.72 0.81 0.40 0.47 0.50 0.57 0.63 0.69 0.80 0.89 1.00 340 310 270 250 220 200 180 165 150 140 125 115 107 97 87 80 71 66 59 53 47 Rated Current (mA) 250 200 150 50 30 4. Testing Conditions 《Unless otherwise specified》 《In case of doubt》 Temperature : Ordinary Temperature / 15°C to 35°C Temperature : 20°C± 2°C Humidity : Ordinary Humidity / 25%(RH) to 85%(RH) Humidity : 60%(RH) to 70%(RH) Atmospheric Pressure : 86kPa to 106kPa MURATA MFG.CO., LTD Reference Only Spec No. JELF243B-0005R-01 P.2/9 5. Appearance and Dimensions 0.5±0.3 Ferrite Electrode T 2.0±0.2 1.25±0.2 (in mm) Inductance: 0.10H to 2.2H 0.85mm±0.2mm Inductance: 2.7H to 4.7H 1.25mm±0.2mm Unit Mass Inductance: 0.10H to 2.2H 0.010g (Typical value) Inductance: 2.7H to 4.7H 0.014g Dimension of T 6. Electrical Performance No. 6.1 Item Inductance Specification Inductance shall meet item 3. 6.2 Q Q shall meet item 3. 6.3 DC Resistance Self Resonant Frequency (S.R.F) Rated Current DC Resistance shall meet item 3. 6.4 6.5 S.R.F shall meet item 3. Self temperature rise shall be limited to 25°C max. 0 Inductance Change: within ± 5 % Test Method Measuring Equipment: KEYSIGHT 4291A or equivalent (1mA) Measuring Frequency: 25MHz/ 0.1μH to 0.82μH 10MHz/ 1.0μH to 4.7μH Measuring Equipment: Digital multi meter Measuring Equipment: KEYSIGHT 4195A or equivalent (1mA) The rated current is applied. 7. Mechanical Performance No. 7.1 Item Shear Test Specification Chip coil shall not be damaged after tested as test method. Test Method Applied Direction: Solder Chip Coil Force: 10N Hold Duration: 5s ±1s MURATA MFG.CO., LTD Substrate Ｆ Spec No. JELF243B-0005R-01 No. 7.2 Item Bending Test Reference Only Specification Chip coil shall not be damaged after tested as test method. P.3/9 Test Method Substrate: Glass-epoxy substrate (100mm40mm1.6mm) Pressure jig R340 F Deflection 45 7.3 Vibration Appearance: No damage Inductance Change: within ±10% 7.4 Solderability The wetting area of the electrode shall be at least 90% covered with new solder coating. 7.5 Resistance to Soldering Heat Appearance: No damage Inductance Change: within ±10% 45 Product (in mm) Speed of Applying Force:1mm/ s Deflection: 2mm Hold Duration: 30s Oscillation Frequency: 10Hz to 55Hz to 10Hz for 1min Total Amplitude: 1.5mm Testing Time: A period of 2 h in each of 3 mutually Perpendicular directions. Flux: Ethanol solution of rosin 25(wt)% (Immersed for 5s to 10s) Solder: Sn-3.0Ag-0.5Cu Pre-Heating: 150°C±10°C/60s to 90s Solder Temperature: 240°C±5°C Immersion Time: 3s ±1s Flux: Ethanol solution of rosin 25(wt)% (Immersed for 5s to 10s) Solder: Sn-3.0Ag-0.5Cu Pre-Heating: 150°C±10°C/60s to 90s Solder Temperature: 270°C±5°C Immersion Time: 10s±1s Then measured after exposure in the room condition for 24h±2h. 8. Environmental Performance It shall be soldered on the substrate. No. Item Specification 8.1 Heat Appearance: No damage Resistance Inductance Change: within ±10% Q Change: within ±20% 8.2 Cold Resistance 8.3 Humidity 8.4 Temperature Cycle Test Method Temperature: 85°C±2°C Time: 1000 h (+48h, -0h) Then measured after exposure in the room condition for 48h±2h. Temperature: - 40°C±2°C Time: 1000 h (+48h, -0h) Then measured after exposure in the room condition for 48h±2h. Temperature: 40°C±2°C Humidity: 90%(RH) to 95%(RH) Time: 1000 h (+48h,-0h) Then measured after exposure in the room condition for 48h±2h. 1 cycle: 1 step: - 40°C±2°C/ 30 min±3 min 2 step: Ordinary temp./ 10 min to 15 min 3 step: 85°C±2°C/ 30 min± 3 min 4 step: Ordinary temp./ 10 min to 15 min Total of 10 cycles Then measured after exposure in the room condition for 48h±2h. MURATA MFG.CO., LTD Reference Only Spec No. JELF243B-0005R-01 P.4/9 9. Specification of Packaging 9.1 Appearance and Dimensions of paper tape,plastic tape (8mm-wide) Type Dimensions (in mm) 2.0±0.05 4.0±0.1 4.0±0.1 1.75±0.1 3.5±0.05 8mm-wide Paper tape 2.25±0.1 LQM21NN R10K10D to 2R2K10D φ1.5± 00.1 8.0±0.3 P/N 1.45±0.1 Direction of feed 1.3±0.1 φ1.5± 00.1 3.5±0.05 8mm-wide Plastic tape 1.75±0.1 0.2±0.1 8.0±0.3 2.0±0.05 4.0±0.1 4.0±0.1 2.25±0.1 LQM21NN 2R7K10L 3R3K10L 3R9K10L 4R7K10L 1.1max 1.45±0.1 Direction of feed ・Dimension of the Cavity is measured at the bottom side. 9.2 Specification of Taping (1) Packing quantity (standard quantity) ･Inductance : 0.10H to 2.2H (Paper tape) 4,000 pcs./ reel ･Inductance : 2.7H to 4.7 H (Plastic tape) 3,000 pcs./ reel (2) Packing Method (Paper tape) Products shall be packed in the cavity of the base tape and sealed by top tape and bottom tape. (Plastic tape) Products shall be packed in the each embossed cavity of plastic tape and sealed by cover tape. (3) Sprocket hole The sprocket holes are to the right as the tape is pulled toward the user. (4) Spliced point (Paper tape) Base tape and Top tape has no spliced point. (Plastic tape) Plastic tape and Cover tape has no spliced point. (5) Missing components number Missing components number within 0.1% of the number per reel or 1 pc., whichever is greater, and are not continuous. The Specified quantity per reel is kept. 9.3 Pull Strength 【Case of Paper tape】 Top tape 5N min. Bottom tape 【Case of Plastic tape】 Plastic tape 10N min. Cover tape 5N min. MURATA MFG.CO., LTD Reference Only Spec No. JELF243B-0005R-01 P.5/9 9.4 Peeling off force 【Case of Paper tape】 【Case of Plastic tape】 165 to 180 degree Top tape F Bottom tape 165 to 180 degree F Cover tape Base tape Plastic tape Speed of Peeling off 300mm/ min Paper tape: 0.1N to 0.6N Plastic tape: 0.2N to 0.7N (minimum value is typical) Peeling off force 9.5 Dimensions of Leader-tape, Trailer and Reel There shall be leader-tape (top tape/cover tape and empty tape) and trailer-tape (empty tape) as follows. 2.0±0.5 Trailer 160 min. Leader Label 190 min. 210 min. Empty tape  13.0±0.2 Top tape:Paper tape +1  60 -0 9.0  21.0±0.8 +1 -0 Cover tape:Plastic tape Direction of feed 13.0±1.4 +0  180 -3 (in mm) 9.6 Marking for reel Customer part number, MURATA part number, Inspection number (1), RoHS Marking (2), Quantity etc ･･･ □□ OOOO  1) (1) (2) (3) (1) Factory Code (2) Date First digit : Year/ Last digit of year Second digit : Month/ Jan. to Sep.  1 to 9, Oct. to Dec.  O, N, D Third, Fourth digit : Day (3) Serial No. 2) ROHS – Y (△) (1) (2) (1) RoHS regulation conformity parts. (2) MURATA classification number 9.7 Marking for Outside package (corrugated paper box) Customer name, Purchasing order number, Customer part number, MURATA part number, RoHS Marking (2), Quantity, etc ･･･ 9.8. Specification of Outer Case Label H D W Outer Case Dimensions (mm) W D H 186 186 93 Standard Reel Quantity in Outer Case (Reel) 5   Above Outer Case size is typical. It depends on a quantity of an order. MURATA MFG.CO., LTD Reference Only Spec No. JELF243B-0005R-01 P.6/9 10. ！ Caution Limitation of Applications Please contact us before using our products for the applications listed below which require especially high reliability for the prevention of defects which might directly cause damage to the third party's life, body or property. (1) Aircraft equipment (6) Transportation equipment (vehicles, trains, ships, etc.) (7) Traffic signal equipment (2) Aerospace equipment (3) Undersea equipment (8) Disaster prevention / crime prevention equipment (4) Power plant control equipment (9) Data-processing equipment (5) Medical equipment (10) Applications of similar complexity and /or reliability requirements to the applications listed in the above 11. Notice This product is designed for solder mounting. Please consult us in advance for applying other mounting method such as conductive adhesive. 11.1 Land pattern designing Chip coil c a Solder Resist b Land a b c 1.2 3.0 to 4.0 1.0 (in mm) 11.2 Flux, Solder ･ Use rosin-based flux. Don’t use highly acidic flux with halide content exceeding 0.2(wt) % (chlorine conversion value). Don’t use water-soluble flux. ･ Use Sn-3.0Ag-0.5Cu solder. ･ Standard thickness of solder paste: 100m to 150m. 11.3 Flow soldering/ Reflow soldering conditions ･ Pre-heating should be in such a way that the temperature difference between solder and product surface is limited to 150°C max. Cooling into solvent after soldering also should be in such a way that the temperature difference is limited to 100°C max. Insufficient pre-heating may cause cracks on the product, resulting in the deterioration of products quality. ･Standard soldering profile and the limit soldering profile is as follows. The excessive limit soldering conditions may cause leaching of the electrode and/or resultingin the deterioration of product quality. Soldering profile (1) Flow soldering profile Temp. (℃) 265℃±3℃ 250℃ Limit Profile 150 Heating Time 60s min. Pre-heating Heating Cycle of flow Standard Profile Time. (s) Standard Profile Limit Profile 150℃, 60s min. 250℃, 4s～6s 265℃±3℃, 5s 2 times 2 times MURATA MFG.CO., LTD Spec No. JELF243B-0005R-01 Reference Only P.7/9 (2) Reflow soldering profile Temp. (℃) 260℃ 245℃±3℃ 230℃ 220℃ Limit Profile 180 150 Standard Profile 30s～60s 60s max. 90s±30s Pre-heating Heating Peak temperature Cycle of reflow Time. (s) Standard Profile Limit Profile 150°C～180°C, 90s±30s above 220°C, 30s～60s above 230°C, 60s max. 245°C±3°C 260°C, 10s 2 times 2 times 11.4 Reworking with soldering iron. The following conditions must be strictly followed when using a soldering iron. Pre-heating Tip temperature Soldering iron output Tip diameter Soldering time Time 150°C, 1 min 350°C max. 80W max. φ3mm max. 3(+1,-0)s 2 times Note : Do not directly touch the products with the tip of the soldering iron in order to prevent the crack on the products due to the thermal shock. 11.5 Solder Volume ･ Solder shall be used not to be exceeded the upper limits as shown below. ･ Accordingly increasing the solder volume, the mechanical stress to Chip is also increased. Exceeding solder volume may cause the failure of mechanical or electrical performance. Upper Limit Recommendable t 1/3T≦t≦T T： thickness of product 11.6 Product’s location The following shall be considered when designing and laying out P.C.B.'s. (1) P.C.B. shall be designed so that products are not subject to the mechanical stress due to warping the board. ［Products direction］ a b 〈 Poor example 〉 〈 Good example 〉 Products shall be located in the sideways direction (Length: ab) to the mechanical stress. (2)Components location on P.C.B. separation. It is effective to implement the following measures, to reduce stress in separating the board. It is best to implement all of the following three measures; however, implement as many measures as possible to reduce stress. Contents of Measures Stress Level (1) Turn the mounting direction of the component parallel to the board separation surface. A > D *1 (2) Add slits in the board separation part. A > B (3) Keep the mounting position of the component away from the board separation A > C surface. MURATA MFG.CO., LTD Reference Only Spec No. JELF243B-0005R-01 P.8/9 C Perforation B D A Slit *1 A > D is valid when stress is added vertically to the perforation as with Hand Separation. If a Cutting Disc is used, stress will be diagonal to the PCB, therefore A > D is invalid. (3) Mounting Components Near Screw Holes When a component is mounted near a screw hole, it may be affected by the board deflection that occurs during the tightening of the screw. Mount the component in a position as far away from the screw holes as possible. Screw Hole Recommended 11.7 Cleaning Conditions Products shall be cleaned on the following conditions. (1) Cleaning temperature shall be limited to 60°C max. (40°C max for IPA.) (2) Ultrasonic cleaning shall comply with the following conditions with avoiding the resonance phenomenon at the mounted products and P.C.B. Power : 20 W/ l max. Frequency : 28kHz to 40kHz Time : 5 min max. (3) Cleaner 1. Alcohol type cleaner Isopropyl alcohol (IPA) 2. Aqueous agent PINE ALPHA ST-100S (4) There shall be no residual flux and residual cleaner after cleaning. In the case of using aqueous agent, products shall be dried completely after rinse with de-ionized water in order to remove the cleaner. (5) Other cleaning Please contact us. 11.8 Resin coating The inductance value may change and/or it may affect on the product's performance due to high cure-stress of resin to be used for coating / molding products. So please pay your careful attention when you select resin. In prior to use, please make the reliability evaluation with the product mounted in your application set. 11.9 Caution for use There is possibility that the inductance value change due to magnetism. Don‘t use a magnet or a pair of tweezers with magnetism when chip coil are handled. (The tip of the tweezers should be molded with resin or pottery.) 11.10 Magnetic Saturation When the excessive current over rated current is applied, the inductance value may change due to magnetism. MURATA MFG.CO., LTD Spec No. JELF243B-0005R-01 Reference Only P.9/9 11.11 Handling of a substrate After mounting products on a substrate, do not apply any stress to the product caused by bending or twisting to the substrate when cropping the substrate, inserting and removing a connector from the substrate or tightening screw to the substrate. Excessive mechanical stress may cause cracking in the product. Bending Twisting 11.12 Storage and Handing Requirements (1) Storage period Use the products within 6 months after delivered. Solderability should be checked if this period is exceeded. (2) Storage conditions ・Products should be stored in the warehouse on the following conditions. Temperature ： -10°C to 40°C Humidity ： 15% to 85% relative humidity No rapid change on temperature and humidity Don't keep products in corrosive gases such as sulfur, chlorine gas or acid, or it may cause oxidization of electrode, resulting in poor solderability. ・ Products should be stored on the palette for the prevention of the influence from humidity, dust and so on. ・ Products should be stored in the warehouse without heat shock, vibration, direct sunlight and so on. ・Products should be stored under the airtight packaged condition. (3) Handling Condition Care should be taken when transporting or handling product to avoid excessive vibration or mechanical shock. 12． ! Note (1) Please make sure that your product has been evaluated in view of your specifications with our product being mounted to your product. (2) You are requested not to use our product deviating from the reference specifications. (3) The contents of this reference specification are subject to change without advance notice. Please approve our product specifications or transact the approval sheet for product specifications before ordering. MURATA MFG.CO., LTD