LQM21PH2R2NGCD

Reference Only Spec No. JELF243B-9103B-01 P.1/9 CHIP COIL (CHIP INDUCTORS) LQM21PH□□□□GCD SPECIFICATION Reference Specification【AEC-Q200】 1. Scope This reference specification applies to LQM21PH_GC series, Chip Coil (Chip Inductors) for automotive Electronics based on AEC-Q200. 2. Part Numbering (ex) LQ M 21 P H Product ID Structure Dimension Applications Category (L×W) and Characteristics 2R2 N G Inductance Tolerance Dimension (T) C Other D Packaging D: Taping 3. Rating ・Operating Temperature Range. ・Storage Temperature Range. – 55°C to +125°C – 55°C to +125°C Inductance Self Resonant Frequency (MHz min.) 85℃*2 125℃*2 4：8kV Rated Current (A) (μH) Tolerance DC Resistance (Ω) LQM21PH2R2MGCD 2.2 ±20% 0.23±25% 40 0.8 0.6 4 LQM21PH2R2NGCD 2.2 ±30% 0.23±25% 40 0.8 0.6 4 Customer Part Number MURATA Part Number ESD Rank *1 (※1)When applied Rated current to the products, temperature rise caused by self-generated heat shall be limited to R a te d C u rre n t ( A ) 40 ℃ max (※2) As for the Rated current marked with (※2), Rated Current is derated as right figure depending on the operating temperature. Rated current at 85°C Rated current at 125°C 0 85 125 Operating Temperature (°C) 4. Testing Conditions 《Unless otherwise specified》 《In case of doubt》 Temperature : Ordinary Temperature / 15°C to 35°C Temperature : 20°C ± 2°C Humidity : Ordinary Humidity / 25%(RH) to 85%(RH) Humidity : 60%(RH) to 70%(RH) Atmospheric Pressure : 86kPa to 106kPa 5. Appearance and Dimensions 0.5±0.2 ■Unit Mass (Typical value) 0.012g 0.9±0.1 2.0±0.15 1.25±0.15 (in mm) MURATA MFG.CO., LTD Reference Only Spec No. JELF243B-9103B-01 P.2/9 6. Electrical Performance No. 6.1 Item Inductance Specification Inductance shall meet item 3. 6.2 DC Resistance DC Resistance shall meet item 3. Test Method Measuring Equipment: KEYSIGHT 4294A or equivalent (1mA) Measuring Frequency: 1MHz Measuring Equipment: Digital multi meter Digital multi meter (TR6846 or equivalent) a terminal1 SW b terminal2 DC resistance shall be measured after putting chip coil between the terminal 2 under the condition of opening between a and b. Every measurement the terminal 1 shall be shorted between a and b when changing chip coil. 6.3 Self Resonant Frequency S.R.F shall meet item 3. Measuring Equipment: KEYSIGHT 4294A or equivalent Self temperature rise shall be limited to 40°C max. The rated current is applied. (S.R.F) 6.4 Rated Current 7. AEC-Q200 Requirement 7.1 Performance (based on Table 5 for Magnetics(Inductors / Transformer) AEC-Q200 Rev.D issued June. 1 2010 No Stress 3 High Temperature Exposure AEC-Q200 Test Method 1000hours at 125 deg C Set for 24hours at room temperature, then measured. Murata Specification / Deviation Meet Table A after testing. Table A Appearance Inductance (at 1MHz) 4 Temperature Cycling 1000cycles -55 deg C to + 125deg C Set for 24hours at room temperature,then measured. Meet Table A after testing. 7 Biased Humidity 1000hours at 85 deg C, 85%RH unpowered.. Meet Table B after testing. Table B Appearance Inductance (at 1MHz) 8 Operational Life Apply 125 deg C 1000 hours Set for 24hours at room temperature, then measured Meet Table A after testing. MURATA MFG.CO., LTD No damage Within ±20% No damage Within ±50% Reference Only Spec No. JELF243B-9103B-01 P.3/9 AEC-Q200 No Stress 9 External Visual Murata Specification / Deviation Test Method Visual inspection 10 Physical Dimension Meet ITEM 5 （Style and Dimensions） No abnormalities No defects 12 Resistance to Solvents Per MIL-STD-202 Method 215 Not Applicable 13 Mechanical Shock Per MIL-STD-202 Method 213 100g’s/6ms/Half sine Meet Table A after testing. 14 Vibration 5g's for 20 minutes, 12cycles eah of 3 orientations Test from 10-2000Hz. 12cycles each of 3 orientations Meet Table A after testing. 15 Resistance to Soldering Heat No-heating Solder temperature 260C+/-5 deg C Immersion time 10s Pre-heating: 150 to 180C /90±30s Meet Table A after testing. 17 ESD Per AEC-Q200-002 Meet Item 3 (Rating) No defects 18 Solderbility Per J-STD-002 Method B : Not Applicable 95% of the terminations is to be soldered. 19 Electrical Characterization Measured : Inductance No defects 20 Flammability Per UL-94 Not Applicable 21 Board Flex Epoxy-PCB(1.6mm) Deflection 2mm(min) 60s minimum holding time Murata deviation request: 30s Per AEC-Q200-006 A force of 17.7N for 60s Murata deviation request: 10N for 10s 22 Terminal Strength Meet Table A after testing. No defect MURATA MFG.CO., LTD Reference Only Spec No. JELF243B-9103B-01 P.4/9 8. Specification of Packaging 1.75 ±0.1 8.1 Appearance and Dimensions of paper tape (8mm-wide) B A A: 1.45±0.05 B: 2.25±0.10 T: 1.1max 8.0 ±0.2 (2.75) 3.5 ±0.05 φ1.5 ± 0.1 0 T 4.0 ±0.1 4.0 ±0.1 2.0 ±0.05 Direction of feed (in mm) 8.2 Specification of Taping (1) Packing quantity (standard quantity) 4,000 pcs. / reel (2) Packing Method Products shall be packed in the cavity of the base tape and sealed by top tape and bottom tape. (3) Sprocket hole The sprocket holes are to the right as the tape is pulled toward the user. (4) Spliced point Base tape and Top tape has no spliced point. (5) Missing components number Missing components number within 0.1% of the number per reel or 1 pc., whichever is greater, and are not continuous. The Specified quantity per reel is kept. 8.3 Pull Strength Top tape Bottom tape 5N min. 5N min. 8.4 Peeling off force of cover tape Speed of Peeling off Peeling off force 165 to 180 degree 300mm/ min 0.1 to 0.6N (minimum value is typical) F Top tape Bottom tape Base tape 8.5 Dimensions of Leader-tape, Trailer and Reel There shall be leader-tape ( top tape and empty tape) and trailer-tape (empty tape) as follows. Leader Trailer 2.0±0.5 160 min. 190 min. Label Empty tape 210 min. Cover tape  13.0±0.2 1  60± 0  21.0±0.8 9± 10 Direction of feed 13±1.4 (in mm) 0  180± 3 MURATA MFG.CO., LTD Reference Only Spec No. JELF243B-9103B-01 P.5/9 8.6 Marking for reel Customer part number, MURATA part number, Inspection number (1) ,RoHS marking (2), Quantity etc ･･･ □□ OOOO  1) (1) (2) (3) (1) Factory Code (2) Date First digit : Year / Last digit of year Second digit : Month / Jan. to Sep.  1 to 9, Oct. to Dec.  O, N, D Third, Fourth digit : Day (3) Serial No. 2) ROHS – Y (△) (1) (2) (1) RoHS regulation conformity parts. (2) MURATA classification number 8.7 Marking for Outside package (corrugated paper box) Customer name, Purchasing order number, Customer part number, MURATA part number, RoHS marking (2), Quantity, etc ･･･ 8.8. Specification of Outer Case Label H D W Outer Case Dimensions (mm) W D H 186 186 93 Standard Reel Quantity in Outer Case (Reel) 5   Above Outer Case size is typical. It depends on a quantity of an order. 9. ! Caution Limitation of Applications Please contact us before using our products for the applications listed below which require especially high reliability for the prevention of defects which might directly cause damage to the third party's life, body or property. (1) Aircraft equipment (6) Transportation equipment (vehicles, trains, ships, etc.) (7) Traffic signal equipment (2) Aerospace equipment (8) Disaster prevention / crime prevention equipment (3) Undersea equipment (4) Power plant control equipment (9) Data-processing equipment (5) Medical equipment (10) Applications of similar complexity and /or reliability requirements to the applications listed in the above 10. Notice This product is designed for solder mounting. Please consult us in advance for applying other mounting method such as conductive adhesive. 10.1 Land pattern designing Chip Coil Land Solder Resist c a b c 1.2 3.0 to 4.0 1.0 a (in mm) b 10.2 Flux, Solder ・Use rosin-based flux. Don’t use highly acidic flux with halide content exceeding 0.2(wt)% (chlorine conversion value). Don’t use water-soluble flux. ・Use Sn-3.0Ag-0.5Cu solder. MURATA MFG.CO., LTD Reference Only Spec No. JELF243B-9103B-01 ・Standard thickness of solder paste: 100μm to 150μm. P.6/9 10.3 Flow soldering / Reflow soldering conditions ・Pre-heating should be in such a way that the temperature difference between solder and product surface is limited to 150°C max. Cooling into solvent after soldering also should be in such a way that the temperature difference is limited to 100°C max. Insufficient pre-heating may cause cracks on the product, resulting in the deterioration of products quality. ・Standard soldering profile and the limit soldering profile is as follows. The excessive limit soldering conditions may cause leaching of the electrode and/or resulting in the deterioration of product quality. Soldering profile (1) Flow soldering profile Temp. (℃) 265℃±3℃ 250℃ Limit Profile 150 Heating Time 60s min. Pre-heating Heating Cycle of flow Standard Profile Time. (s) Standard Profile Limit Profile 150℃, 60s min. 250℃, 4s～6s 265℃±3℃, 5s 2 times 2 times (2) Reflow soldering profile Temp. (℃) 260℃ 245℃±3℃ 220℃ 230℃ Limit Profile 180 150 Standard Profile 30s～60s 60s max. 90s±30s Pre-heating Heating Peak temperature Cycle of reflow Time. (s) Standard Profile Limit Profile 150°C～180°C, 90s±30s above 220°C, 30s～60s above 230°C, 60s max. 245°C±3°C 260°C, 10s 2 times 2 times MURATA MFG.CO., LTD Reference Only Spec No. JELF243B-9103B-01 10.4 Reworking with soldering iron The following conditions must be strictly followed when using a soldering iron. P.7/9 Pre-heating 150°C, 1 min Tip temperature 350°C max. Soldering iron output 80W max. Tip diameter φ3mm max. Soldering time 3(+1, -0)s Time 2 times Note : Do not directly touch the products with the tip of the soldering iron in order to prevent the crack on the products due to the thermal shock. 10.5 Solder Volume ・Solder shall be used not to be exceeded the upper limits as shown below. ・Accordingly increasing the solder volume, the mechanical stress to Chip is also increased. Exceeding solder volume may cause the failure of mechanical or electrical performance. Upper Limit Recommendable 1/3T≦t≦T T： thickness of electrode t 10.6 Product’s location The following shall be considered when designing and laying out P.C.B.'s. (1) P.C.B. shall be designed so that products are not subject to the mechanical stress due to warping the board. ［Products direction］ a b 〈 Poor example 〉 Products shall be located in the sideways direction (Length: a‹b) to the mechanical stress. 〈 Good example 〉 (2)Components location on P.C.B. separation. It is effective to implement the following measures, to reduce stress in separating the board. It is best to implement all of the following three measures; however, implement as many measures as possible to reduce stress. Contents of Measures Stress Level (1) Turn the mounting direction of the component parallel to the board separation surface. A > D *1 (2) Add slits in the board separation part. A > B (3) Keep the mounting position of the component away from the board separation surface. A > C Perforation C B D A Slit *1 A > D is valid when stress is added vertically to the perforation as with Hand Separation. If a Cutting Disc is used, stress will be diagonal to the PCB, therefore A > D is invalid. (3) Mounting Components Near Screw Holes When a component is mounted near a screw hole, it may be affected by the board deflection that occurs during the tightening of the screw. Mount the component in a position as far away from the screw holes as possible. MURATA MFG.CO., LTD Reference Only Spec No. JELF243B-9103B-01 Screw Hole P.8/9 Recommended 10.7 Cleaning Conditions Products shall be cleaned on the following conditions. (1) Cleaning temperature shall be limited to 60°C max. (40°C max for IPA.) (2) Ultrasonic cleaning shall comply with the following conditions with avoiding the resonance phenomenon at the mounted products and P.C.B. Power : 20 W / l max. Frequency : 28kHz to 40kHz Time : 5 min max. (3) Cleaner 1. Alcohol type cleaner Isopropyl alcohol (IPA) 2. Aqueous agent PINE ALPHA ST-100S (4) There shall be no residual flux and residual cleaner after cleaning. In the case of using aqueous agent, products shall be dried completely after rinse with de-ionized water in order to remove the cleaner. (5) Other cleaning Please contact us. 10.8 Resin coating The inductance value may change and/or it may affect on the product's performance due to high cure-stress of resin to be used for coating/molding products. So please pay your careful attention when you select resin. In prior to use, please make the reliability evaluation with the product mounted in your application set. 10.9 Caution for use There is possibility that the inductance value change due to magnetism. Don‘t use a magnet or a pair of tweezers with magnetism when chip coil are handled. (The tip of the tweezers should be molded with resin or pottery.) 10.10 Magnetic Saturation When the excessive current over rated current is applied, the inductance value may change due to magnetism. 10.11 Handling of a substrate After mounting products on a substrate, do not apply any stress to the product caused by bending or twisting to the substrate when cropping the substrate, inserting and removing a connector from the substrate or tightening screw to the substrate. Excessive mechanical stress may cause cracking in the product. Bending Twisting MURATA MFG.CO., LTD Reference Only Spec No. JELF243B-9103B-01 P.9/9 10.12 Storage and Handing Requirements (1) Storage period Use the products within 6 months after delivered. Solderability should be checked if this period is exceeded. (2) Storage conditions ・Products should be stored in the warehouse on the following conditions. Temperature ： -10°C to 40°C ： 15% to 85% relative humidity No rapid change on temperature and humidity Humidity Don't keep products in corrosive gases such as sulfur, chlorine gas or acid, or it may cause oxidization of electrode, resulting in poor solderability. ・Products should be stored on the palette for the prevention of the influence from humidity, dust and so on. ・Products should be stored in the warehouse without heat shock, vibration, direct sunlight and so on. ・Products should be stored under the airtight packaged condition. (3) Handling Condition Care should be taken when transporting or handling product to avoid excessive vibration or mechanical shock. 11. ! Note (1) Please make sure that your product has been evaluated in view of your specifications with our product being mounted to your product. (2) You are requested not to use our product deviating from the reference specifications. (3) The contents of this reference specification are subject to change without advance notice. Please approve our product specifications or transact the approval sheet for product specifications before ordering. MURATA MFG.CO., LTD