LQP02TN36NH02D

Reference Only Spec No. JELF243C-0014AA-01 P.1/14 CHIP COIL (CHIP INDUCTORS) LQP02TN□□□□02□ Reference Specification 1.Scope This reference specification applies to LQP02TN series, Chip coil (Chip Inductors). 2.Part Numbering (ex) LQ P 02 T N 0N4 B 0 Product ID Structure Dimension Applications Category Inductance Tolerance Features (L×W) and Characteristics 2 D Electrode Packaging D：8mm-wide / paper tape L：4mm-wide / plastic tape *B:Bulk *Bulk packing also available. (A product is put in the plastic bag under the taping conditions.) 3.Rating ・Operating Temperature Range. –55°C to +125°C (Ambient temperature : Rated current can be handled in this temperature range.) ・Storage Temperature Range. –55°C to +125°C Customer Part Number Inductance MURATA Part Number (nH) LQP02TN0N2B02D LQP02TN0N2B02L LQP02TN0N2C02D LQP02TN0N2C02L LQP02TN0N3B02D LQP02TN0N3B02L LQP02TN0N3C02D LQP02TN0N3C02L LQP02TN0N4B02D LQP02TN0N4B02L LQP02TN0N4C02D LQP02TN0N4C02L LQP02TN0N5B02D LQP02TN0N5B02L LQP02TN0N5C02D LQP02TN0N5C02L LQP02TN0N6B02D LQP02TN0N6B02L LQP02TN0N6C02D LQP02TN0N6C02L LQP02TN0N7B02D LQP02TN0N7B02L LQP02TN0N7C02D LQP02TN0N7C02L LQP02TN0N8B02D LQP02TN0N8B02L LQP02TN0N8C02D LQP02TN0N8C02L LQP02TN0N9B02D LQP02TN0N9B02L LQP02TN0N9C02D LQP02TN0N9C02L LQP02TN1N0B02D LQP02TN1N0B02L LQP02TN1N0C02D LQP02TN1N0C02L Tolerance Q (min) DC Resistance (Ω max) Self Resonant Frequency (MHz) Min. *Typ. Rated Current (mA) 0.2 - 20000 0.3 0.4 18000 20000 0.5 0.50 0.6 0.7 B:±0.1nH C:±0.2nH 320 17000 8 16500 0.8 0.9 16100 13000 1.0 MURATA MFG.CO., LTD 0.60 15900 220 Spec No. JELF243C-0014AA-01 Customer Part Number Reference Only MURATA Part Number Inductance (nH) LQP02TN1N1B02D LQP02TN1N1B02L LQP02TN1N1C02D LQP02TN1N1C02L LQP02TN1N2B02D LQP02TN1N2B02L LQP02TN1N2C02D LQP02TN1N2C02L LQP02TN1N3B02D LQP02TN1N3B02L LQP02TN1N3C02D LQP02TN1N3C02L LQP02TN1N4B02D LQP02TN1N4B02L LQP02TN1N4C02D LQP02TN1N4C02L LQP02TN1N5B02D LQP02TN1N5B02L LQP02TN1N5C02D LQP02TN1N5C02L LQP02TN1N6B02D LQP02TN1N6B02L LQP02TN1N6C02D LQP02TN1N6C02L LQP02TN1N7B02D LQP02TN1N7B02L LQP02TN1N7C02D LQP02TN1N7C02L LQP02TN1N8B02D LQP02TN1N8B02L LQP02TN1N8C02D LQP02TN1N8C02L LQP02TN1N9B02D LQP02TN1N9B02L LQP02TN1N9C02D LQP02TN1N9C02L LQP02TN2N0B02D LQP02TN2N0B02L LQP02TN2N0C02D LQP02TN2N0C02L LQP02TN2N1B02D LQP02TN2N1B02L LQP02TN2N1C02D LQP02TN2N1C02L LQP02TN2N2B02D LQP02TN2N2B02L LQP02TN2N2C02D LQP02TN2N2C02L LQP02TN2N3B02D LQP02TN2N3B02L LQP02TN2N3C02D LQP02TN2N3C02L Q (min) DC Resistance (Ω max) Tolerance P.2/14 Self Resonant Frequency (MHz min) Min. *Typ. Rated Current (mA) 1.1 12500 15300 1.2 1.3 14800 0.60 11500 220 1.4 14400 1.5 11700 9500 1.6 1.7 B:±0.1nH C:±0.2nH 8 12000 11800 0.70 1.8 11300 1.9 12000 9000 2.0 2.1 11100 11200 0.75 2.2 10000 7500 2.3 MURATA MFG.CO., LTD 9700 200 Spec No. JELF243C-0014AA-01 Customer Part Number Reference Only MURATA Part Number Inductance (nH) LQP02TN2N4B02D LQP02TN2N4B02L LQP02TN2N4C02D LQP02TN2N4C02L LQP02TN2N5B02D LQP02TN2N5B02L LQP02TN2N5C02D LQP02TN2N5C02L LQP02TN2N6B02D LQP02TN2N6B02L LQP02TN2N6C02D LQP02TN2N6C02L LQP02TN2N7B02D LQP02TN2N7B02L LQP02TN2N7C02D LQP02TN2N7C02L LQP02TN2N8B02D LQP02TN2N8B02L LQP02TN2N8C02D LQP02TN2N8C02L LQP02TN2N9B02D LQP02TN2N9B02L LQP02TN2N9C02D LQP02TN2N9C02L LQP02TN3N0B02D LQP02TN3N0B02L LQP02TN3N0C02D LQP02TN3N0C02L LQP02TN3N1B02D LQP02TN3N1B02L LQP02TN3N1C02D LQP02TN3N1C02L LQP02TN3N2B02D LQP02TN3N2B02L LQP02TN3N2C02D LQP02TN3N2C02L LQP02TN3N3B02D LQP02TN3N3B02L LQP02TN3N3C02D LQP02TN3N3C02L LQP02TN3N4B02D LQP02TN3N4B02L LQP02TN3N4C02D LQP02TN3N4C02L LQP02TN3N5B02D LQP02TN3N5B02L LQP02TN3N5C02D LQP02TN3N5C02L LQP02TN3N6B02D LQP02TN3N6B02L LQP02TN3N6C02D LQP02TN3N6C02L Q (min) DC Resistance (Ω max) Tolerance 2.4 P.3/14 Self Resonant Frequency (MHz) Min. *Typ. 0.75 Rated Current (mA) 9500 2.5 9300 0.80 2.6 9100 2.7 9200 2.8 12000 2.9 200 1.10 11800 3.0 B:±0.1nH C:±0.2nH 8 7500 3.1 12000 3.2 10400 3.3 1.30 10400 3.4 3.5 10200 3.6 10100 MURATA MFG.CO., LTD 180 Spec No. JELF243C-0014AA-01 Customer Part Number Reference Only Inductance MURATA Part Number (nH) LQP02TN3N7B02D LQP02TN3N7B02L LQP02TN3N7C02D LQP02TN3N7C02L LQP02TN3N8B02D LQP02TN3N8B02L LQP02TN3N8C02D LQP02TN3N8C02L LQP02TN3N9B02D LQP02TN3N9B02L LQP02TN3N9C02D LQP02TN3N9C02L LQP02TN4N0B02D LQP02TN4N0B02L LQP02TN4N0C02D LQP02TN4N0C02L LQP02TN4N1B02D LQP02TN4N1B02L LQP02TN4N1C02D LQP02TN4N1C02L LQP02TN4N2B02D LQP02TN4N2B02L LQP02TN4N2C02D LQP02TN4N2C02L LQP02TN4N3H02D LQP02TN4N3H02L LQP02TN4N3J02D LQP02TN4N3J02L LQP02TN4N7H02D LQP02TN4N7H02L LQP02TN4N7J02D LQP02TN4N7J02L LQP02TN5N1H02D LQP02TN5N1H02L LQP02TN5N1J02D LQP02TN5N1J02L LQP02TN5N6H02D LQP02TN5N6H02L LQP02TN5N6J02D LQP02TN5N6J02L LQP02TN6N2H02D LQP02TN6N2H02L LQP02TN6N2J02D LQP02TN6N2J02L LQP02TN6N8H02D LQP02TN6N8H02L LQP02TN6N8J02D LQP02TN6N8J02L LQP02TN7N5H02D LQP02TN7N5H02L LQP02TN7N5J02D LQP02TN7N5J02L Q (min) DC Resistance (Ω max) Tolerance P.4/14 Self Resonant Frequency (MHz) Min. *Typ. 3.7 10300 3.8 10100 7500 3.9 Rated Current (mA) 9700 B:±0.1nH C:±0.2nH 1.30 4.0 9800 4.1 9600 4.2 8700 180 7000 8 4.3 8800 4.7 8600 1.50 6500 5.1 5.6 160 8300 H:±3% J:±5% 6000 7500 1.80 6.2 7400 5500 6.8 140 7100 2.00 7.5 MURATA MFG.CO., LTD 4500 6500 Spec No. JELF243C-0014AA-01 Customer Part Number Reference Only Inductance MURATA Part Number (nH) LQP02TN8N2H02D LQP02TN8N2H02L LQP02TN8N2J02D LQP02TN8N2J02L LQP02TN9N1H02D LQP02TN9N1H02L LQP02TN9N1J02D LQP02TN9N1J02L LQP02TN10NH02D LQP02TN10NH02L LQP02TN10NJ02D LQP02TN10NJ02L LQP02TN11NH02D LQP02TN11NH02L LQP02TN11NJ02D LQP02TN11NJ02L LQP02TN12NH02D LQP02TN12NH02L LQP02TN12NJ02D LQP02TN12NJ02L LQP02TN13NH02D LQP02TN13NH02L LQP02TN13NJ02D LQP02TN13NJ02L LQP02TN15NH02D LQP02TN15NH02L LQP02TN15NJ02D LQP02TN15NJ02L LQP02TN16NH02D LQP02TN16NH02L LQP02TN16NJ02D LQP02TN16NJ02L LQP02TN18NH02D LQP02TN18NH02L LQP02TN18NJ02D LQP02TN18NJ02L LQP02TN20NH02D LQP02TN20NH02L LQP02TN20NJ02D LQP02TN20NJ02L LQP02TN22NH02D LQP02TN22NH02L LQP02TN22NJ02D LQP02TN22NJ02L LQP02TN24NH02D LQP02TN24NH02L LQP02TN24NJ02D LQP02TN24NJ02L LQP02TN27NH02D LQP02TN27NH02L LQP02TN27NJ02D LQP02TN27NJ02L Q (min) DC Resistance (Ω max) Tolerance 8.2 P.5/14 Self Resonant Frequency (MHz) Min. *Typ. 4500 Rated Current (mA) 6200 2.10 9.1 5600 8 4000 10 2.50 5300 11 4400 2.80 3500 140 12 4200 13 7 15 3.20 3000 H:±3% J:±5% 3800 16 3600 3.50 2500 18 3400 20 3100 5.00 2300 22 3000 120 6 24 2800 5.50 27 2000 2500 MURATA MFG.CO., LTD Spec No. JELF243C-0014AA-01 Customer Part Number Reference Only Inductance MURATA Part Number (nH) LQP02TN30NH02D LQP02TN30NH02L LQP02TN30NJ02D LQP02TN30NJ02L LQP02TN33NH02D LQP02TN33NH02L LQP02TN33NJ02D LQP02TN33NJ02L LQP02TN36NH02D LQP02TN36NH02L LQP02TN36NJ02D LQP02TN36NJ02L LQP02TN39NH02D LQP02TN39NH02L LQP02TN39NJ02D LQP02TN39NJ02L Q (min) DC Resistance (Ω max) Tolerance 6 30 P.6/14 Self Resonant Frequency (MHz) Min. *Typ Rated Current (mA) 2600 6.50 1800 33 H:±3% J:±5% 36 2300 4 7.00 39 1600 2100 ＊Typical value is actual performance. 4. Testing Conditions 《Unless otherwise specified》 Temperature : Ordinary Temperature / 15°C to 35°C Humidity : Ordinary Humidity / 25%(RH) to 85 %(RH) 《In case of doubt》 Temperature : 20°C ± 2°C Humidity : 60%(RH) to 70 %(RH) Atmospheric Pressure : 86kPa to 106 kPa 5. Appearance and Dimensions 0.2±0.02 0.4±0.02 0.2±0.02 ■Unit Mass (Typical value) 0.05mg (in mm) 0.095±0.025 MURATA MFG.CO., LTD 90 Spec No. JELF243C-0014AA-01 Reference Only P.7/14 6. Marking Polarity Marking :white Coloring side Polarity Marking 7.Electrical Performance No. 7.1 Item Inductance Specification Inductance shall meet item 3. 7.2 Q Q shall meet item 3. Test Method Measuring Equipment: KEYSIGHT E4991A or equivalent Measuring Frequency: (0.2nH～30nH) 500MHz (33nH～39nH) 300MHz Measuring Condition: Test signal level / about 0dBm Electrical length / 27.3mm Weight / about 3N Measuring Fixture: KEYSIGHT 16196D Insert Chip coil in the hole in order that the polarity marking is at the top of the side surface. Contact coil with each terminal by adding the weigh cover. See diagram below. Polarity Marking Chip coil placement hole: φ0.3mm 7.3 7.4 7.5 DC Resistance Self Resonant Frequency(S.R.F) Rated Current DC Resistance shall meet item 3. S.R.F shall meet item 3. Self temperature rise shall be limited to 25°C max. Measuring Method:See P.14 Measuring Equipment:Digital multi meter Measuring Equipment: KEYSIGHT 8753C or equivalent The rated current is applied. 8.Mechanical Performance No. 8.1 Item Shear Test Specification Chip coil shall not be damaged after tested as test method. Test Method Substrate:Glass-epoxy substrate Land 0.23 0.2 0.56 (in mm) Force:1N Hold Duration:5 s±1 s Applied Direction: Parallel to PCB. MURATA MFG.CO., LTD Reference Only Spec No. JELF243C-0014AA-01 No. 8.2 Item Bending Test Specification Chip coil shall not be damaged after tested as test method. P.8/14 Test Method Substrate:Glass-epoxy substrate (100mm×40mm×0.8mm) Speed of Applying Force:1mm /s Deflection:1mm Hold Duration:30 s Pressure jig R340 F Deflection 45 8.3 Vibration Appearance:No damage 8.4 Solderability The electrode shall be at least 90% covered with new solder coating. 8.5 Resistance to Soldering Heat Appearance:No damage Inductance Change: within ±10% 45 Product (in mm) Substrate:Glass-epoxy substrate Oscillation Frequency: 10Hz to 2000Hz to 10Hz for 20 min Total amplitude 1.5 mm or Acceleration amplitude 196 m/s2 whichever is smaller. Testing Time:A period of 2h in each of 3 mutually perpendicular directions. Flux: Ethanol solution of rosin 25(wt)% (Immersed for 5s to 10s) Solder:Sn-3.0Ag-0.5Cu Pre-Heating:150°C±10°C / 60s to 90s Solder Temperature:240°C±5°C Immersion Time:3s±1s Flux: Ethanol solution of rosin 25(wt)% (Immersed for 5s to 10s) Solder:Sn-3.0Ag-0.5Cu Pre-Heating:150°C±10°C / 60s to 90s Solder Temperature:260°C±5°C Immersion Time:5s±1s Then measured after exposure in the room condition for 24h±2h. 9.Environmental Performance It shall be soldered on the substrate. No. Item Specification 9.1 Heat Resistance Appearance:No damage Inductance Change: within ±10% 9.2 Cold Resistance 9.3 Humidity 9.4 Temperature Cycle Test Method Substrate:Glass-epoxy substrate Temperature:125°C±2°C Time:1000h (+48h,-0h) Then measured after exposure in the room condition for 24h±2h. Substrate:Glass-epoxy substrate Temperature:-55°C±3°C Time:1000 h (+48h,-0h) Then measured after exposure in the room condition for 24h±2h. Substrate:Glass-epoxy substrate Temperature:40°C±2°C Humidity:90%(RH) to 95%(RH) Time:1000 h(+48h,-0h) Then measured after exposure in the room condition for 24h±2h. Substrate:Glass-epoxy substrate 1 cycle: 1 step:-55°C±2°C / 30min±3 min 2 step:Ordinary temp. / 10~15 min 3 step:125°C±2°C / 30±3 min 4 step: Ordinary temp. / 10~15 min Total of 10 cycles Then measured after exposure in the room condition for 24h±2h. MURATA MFG.CO., LTD Spec No. JELF243C-0014AA-01 Reference Only 10.Specification of Packaging +0.1 φ1.5 -0 (0.47) Polarity Marking 8.0±0.2 1.75±0.1 3.5±0.05 10.1 Appearance and Dimensions of paper tape 【8mm-wide / paper tape】 2.0±0.05 2.0±0.05 4.0±0.1 (0.24) 0.39 max. Direction of feed (in mm) 1.0±0.02 φ0.8±0.04 (0.43) 1.8±0.02 Polarity Marking (0.2) 1.0±0.02 (0.21) 4.0±0.05 2.0±0.04 0.9±0.05 【4mm-wide / plastic tape】 (0.23) Dimension of the Cavity is measured at the bottom side. 10.2 Specification of Taping 【8mm-wide / paper tape】 (1) Packing quantity (standard quantity) 20,000 pcs. / reel (2) Packing Method Products shall be packed in the cavity of the base tape and sealed by cover tape. (3) Sprocket hole The sprocket holes are to the right as the tape is pulled toward the user. (4) Spliced point Base tape and Cover tape has no spliced point. (5) Missing components number Missing components number within 0.1 % of the number per reel or 1 pc. , whichever is greater, and are not continuous. The Specified quantity per reel is kept. 【4mm-wide / plastic tape】 (1) Packing quantity (standard quantity) 40,000 pcs. / reel (2) Packing Method Products shall be packed in the each embossed cavity of plastic tape and sealed by cover tape. (3) Sprocket hole Sprocket hole shall be located on the left-hand side toward the direction of feed. (4) Spliced point Plastic tape and Cover tape has no spliced point. (5) Missing components number Missing components number within 0.1 % of the number per reel or 1 pc. , whichever is greater, and are not continuous. The Specified quantity per reel is kept. MURATA MFG.CO., LTD P.9/14 Reference Only Spec No. JELF243C-0014AA-01 P.10/14 10.3 Pull Strength Cover tape 5N min 10.4 Peeling off force of cover tape Speed of Peeling off 300mm/min 0.1N to 0.6N (minimum value is typical) Peeling off force 【8mm-wide / paper tape】 【4mm-wide / plastic tape】 Cover tape F 165°to 180゜ 165 to 180 degree F Base tape Cover tape Plastic tape 10.5 Dimensions of Leader-tape, Trailer and Reel There shall be leader-tape ( top tape and empty tape) and trailer-tape (empty tape) as follows. 【8mm-wide / paper tape】 2.0±0.5 Trailer 160 min. Leader Label 190 min. Empty tape 210 min. Cover tape φ 13.0±0.2 +1 φ 60 -0 φ 21.0±0.8 9.0 +1 -0 Direction of feed 13.0±1.4 (in mm) +0 φ 180 -3 【4mm-wide / plastic tape】 2.0±0.5 Trailer 160 min. Leader Label 190 min. Empty tape 210 min. Cover tape φ 13.0±0.2 +1 φ 60 -0 φ 21.0±0.8 9.0 +1 4.4±0.5 -0 Direction of feed 13.0±1.4 7.0±0.5 +0 φ 180 -3 10.6 Marking for reel Customer part number, MURATA part number, Inspection number(∗1) ,RoHS Marking(∗2), Quantity etc ･･･ ∗1) □□ OOOO ××× (1) (2) (3) (1) Factory Code (2) Date First digit : Year / Last digit of year Second digit : Month / Jan. to Sep. → 1 to 9, Oct. to Dec. → O,N,D Third, Fourth digit : Day (3) Serial No. ∗2) ROHS – Y (△) (1) (2) (1) RoHS regulation conformity parts. (2) MURATA classification number MURATA MFG.CO., LTD Reference Only Spec No. JELF243C-0014AA-01 10.7 Marking for Outside package (corrugated paper box) Customer name, Purchasing order number, Customer part number, MURATA part number, RoHS Marking (∗2) ,Quantity, etc ･･･ 10.8 Specification of Outer Case Label H D Outer Case Dimensions (mm) W D H 186 186 93 W Standard Reel Quantity in Outer Case (Reel) 5(8mm-wide / paper tape) 10(4mm-wide / plastic tape) ∗ Above Outer Case size is typical. It depends on a quantity of an order. 11. ！ Caution Limitation of Applications Please contact us before using our products for the applications listed below which require especially high reliability for the prevention of defects which might directly cause damage to the third party's life, body or property. (1) Aircraft equipment (6) Transportation equipment (vehicles, trains, ships, etc.) (7) Traffic signal equipment (2) Aerospace equipment (3) Undersea equipment (8) Disaster prevention / crime prevention equipment (4) Power plant control equipment (9) Data-processing equipment (5) Medical equipment (10) Applications of similar complexity and /or reliability requirements to the applications listed in the above 12. Notice Products can only be soldered with reflow. This product is designed for solder mounting. Please consult us in advance for applying other mounting method such as conductive adhesive. 12.1 Land pattern designing Chip Coil c Land Solder resist a b c 0.16~0.20 0.40~0.56 0.20~0.23 (in mm) ａ ｂ 12.2 Flux, Solder ・ Use rosin-based flux. Don’t use highly acidic flux with halide content exceeding 0.2(wt)% (chlorine conversion value). Don’t use water-soluble flux. ・ Use Sn-3.0Ag-0.5Cu solder. ・ Standard thickness of solder paste : 50μm to 80μm. 12.3 Reflow soldering conditions ・ Pre-heating should be in such a way that the temperature difference between solder and product surface is limited to 150°C max. Cooling into solvent after soldering also should be in such a way that the temperature difference is limited to 100°C max. Insufficient pre-heating may cause cracks on the product, resulting in the deterioration of products quality. ・ Standard soldering profile and the limit soldering profile is as follows. The excessive limit soldering conditions may cause leaching of the electrode and / or resulting in the deterioration of product quality. MURATA MFG.CO., LTD P.11/14 Reference Only Spec No. JELF243C-0014AA-01 P.12/14 ・Reflow soldering profile Temp. (℃) 260℃ 245℃±3℃ 230℃ 220℃ Limit Profile 180 150 Standard Profile 30s～60s 60s max. 90s±30s Pre-heating Heating Peak temperature Cycle of reflow Time. (s) Standard Profile Limit Profile 150°C～180°C 、90s±30s above 220°C､30s～60s above 230°C､60s max. 245°C±3°C 260°C,10s 2 times 2 times 12.4 Solder Volume ･ Solder shall be used not to be exceeded the upper limits as shown below. Upper Limit Recommendable t 1/3T≦t≦T T : thickness of product Accordingly increasing the solder volume, the mechanical stress to Chip is also increased. Exceeding solder volume may cause the failure of mechanical or electrical performance. 12.5 Attention regarding P.C.B. bending The following shall be considered when designing and laying out P.C.B.'s. (1) P.C.B. shall be designed so that products are not subject to the mechanical stress due to warping the board. ［Products direction］ a b 〈 Poor example 〉 Products shall be located in the sideways direction (Length:ａ＜b) to the mechanical stress. 〈 Good example 〉 (2) Products location on P.C.B. separation Seam b C B D A Slit Products (A,B,C,D) shall be located carefully so that products are not subject to the mechanical stress due to warping the board. Because they may be subjected the mechanical stress in order of A＞C＞B ≅ D. Length:a< b a MURATA MFG.CO., LTD Spec No. JELF243C-0014AA-01 Reference Only P.13/14 12.6 Cleaning Conditions Products shall be cleaned on the following conditions. (1) Cleaning temperature shall be limited to 60°C max.(40°C max for IPA) (2) Ultrasonic cleaning shall comply with the following conditions with avoiding the resonance phenomenon at the mounted products and P.C.B. Power : 20 W / l max. Frequency : 28kHz to 40kHz Time : 5 min max. (3) Cleaner 1. Alcohol type cleaner Isopropyl alcohol (IPA) 2. Aqueous agent PINE ALPHA ST-100S (4) There shall be no residual flux and residual cleaner after cleaning. In the case of using aqueous agent, products shall be dried completely after rinse with de-ionized water in order to remove the cleaner. (5) Other cleaning Please contact us. 12.7 Resin coating When products are coated with resin, please contact us in advance. 12.8 Handling of a substrate (1)There is a possibility of chip cracking caused by PCBexpansion/contraction with heat, because stress on a chip is different depending on PCB material and structure. When the thermal expansion coefficient greatly differs between the board used for mounting and the chip, it will cause cracking of the chip due to the thermal expansion and contraction. The chip is assumed to be mounted on the PCB of glass-epoxy material, and we don't test with other PCB material which has different thermal expansion coefficient from Glass-epoxy. When other PCB materials are considered, please be sure to evaluate by yourself.. (2)After mounting products on a substrate, do not apply any stress to the product caused by bending or twisting to the substrate when cropping the substrate, inserting and removing a connector from the substrate or tightening screw to the substrate. Excessive mechanical stress may cause cracking in the product. In case of the mounting on flexible PCB, there is a possibility of chip cracking caused by mechanical stress even from small bending or twisting. When the flexible PCB is considered, please be sure to evaluate by yourself. Bending Twisting 12.9 Storage and Handing Requirements (1) Storage period Use the products within 12 months after deliverd. Solderability should be checked if this period is exceeded. (2) Storage conditions ・Products should be stored in the warehouse on the following conditions. Temperature ： -10°C ~ 40°C Humidity ： 15% to 85% relative humidity No rapid change on temperature and humidity. ・Products should not be stored on bulk packaging condition to prevent the chipping of the core and the breaking of winding wire caused by the collision between the products. ・Products should be stored on the palette for the prevention of the influence from humidity, dust and so on. ・Products should be stored in the warehouse without heat shock, vibration, direct sunlight and so on. MURATA MFG.CO., LTD Reference Only Spec No. JELF243C-0014AA-01 P.14/14 (3) Handling Condition Care should be taken when transporting or handling product to avoid excessive vibration or mechanical shock. 13．! Note (1)Please make sure that your product has been evaluated in view of your specifications with our product being mounted to your product. (2)You are requested not to use our product deviating from the reference specifications. (3)The contents of this reference specification are subject to change without advance notice. Please approve our product specifications or transact the approval sheet for product specifications before ordering. (1) Residual elements and stray elements of test fixture can be described by F-parameter shown in following. I2 I1 Zm A B C D V2 V1 Test Head Test fixture Zx V1 = I1 A B C D V2 I2 Product (2) The impedance of chip coil Zx and measured value Zm can be described by input/output current/voltage. Zm= V1 I1 ， V2 Zx= I 2 (3) Thus,the relation between Zx and Zm is following; Zm-β where, α= D / A =1 Zx= α 1-ZmΓ β= B / D =Zsm-(1-Yom Zsm)Zss Γ= C / A =Yom Zsm:measured impedance of short chip Zss:residual impedance of short chip (0.110nH) Yom:measured admittance when opening the fixture (4) Lx and Qx shall be calculated with the following equation. Im(Zx) Im(Zx) Qx= Lx= 2πf ， Re(Zx) Lx :Inductance of chip coil Qx:Q of chip coil f :Measuring frequency MURATA MFG.CO., LTD