Reference Only
Spec No.JELF243C-0021H-01
P.1/12
CHIP COIL (CHIP INDUCTORS) LQP03HQ□□□□02D
Reference Specification
1.Scope
This reference specification applies to LQP03HQ_02 series, Chip coil (Chip Inductors).
2.Part Numbering
(ex)
LQ
P
03
H
Q
Product ID Structure Dimension Applications Category
(L×W)
and
Characteristics
0N5
B
0
Inductance Tolerance
2
Features
Electrode
D
Packaging
D:Taping
*B:Bulk
*Bulk packing also available. (A product is put in the plastic bag under the taping conditions.)
・Operating Temperature Range. –55°C to +125°C
(Ambient temperature: Rated current can be handled in this temperature range.)
・Storage Temperature Range. –55°C to +125°C
Customer
Part Number
Inductance
MURATA
Part Number
(nH)
LQP03HQ0N5W02D
LQP03HQ0N5B02D
LQP03HQ0N5C02D
LQP03HQ0N6W02D
LQP03HQ0N6B02D
LQP03HQ0N6C02D
LQP03HQ0N7W02D
LQP03HQ0N7B02D
LQP03HQ0N7C02D
LQP03HQ0N8W02D
LQP03HQ0N8B02D
LQP03HQ0N8C02D
LQP03HQ0N9W02D
LQP03HQ0N9B02D
LQP03HQ0N9C02D
LQP03HQ1N0W02D
LQP03HQ1N0B02D
LQP03HQ1N0C02D
LQP03HQ1N1W02D
LQP03HQ1N1B02D
LQP03HQ1N1C02D
LQP03HQ1N2W02D
LQP03HQ1N2B02D
LQP03HQ1N2C02D
LQP03HQ1N3W02D
LQP03HQ1N3B02D
LQP03HQ1N3C02D
LQP03HQ1N4W02D
LQP03HQ1N4B02D
LQP03HQ1N4C02D
LQP03HQ1N5W02D
LQP03HQ1N5B02D
LQP03HQ1N5C02D
LQP03HQ1N6W02D
LQP03HQ1N6B02D
LQP03HQ1N6C02D
LQP03HQ1N7W02D
LQP03HQ1N7B02D
LQP03HQ1N7C02D
LQP03HQ1N8W02D
LQP03HQ1N8B02D
LQP03HQ1N8C02D
Q
(min)
DC
Resistance
(Ω max)
Tolerance
Self
Resonant
Frequency
(MHz)
Min.
*Typ
Rated
Current
(mA)
0.5
20000
0.6
>20000
0.7
0.8
18000
0.9
0.04
1.0
1.1
1.2
W:±0.05nH
B:±0.1nH
C:±0.2nH
1100
16000
20000
14000
18000
20
17000
13000
1.3
20000
1.4
12000
1.5
18500
0.05
1000
1.6
1.7
0.07
10000
16000
800
1.8
MURATA MFG.CO., LTD
0.08
Reference Only
Spec No.JELF243C-0021H-01
Customer
Part Number
P.2/12
Inductance
MURATA
Part Number
(nH)
LQP03HQ1N9W02D
LQP03HQ1N9B02D
LQP03HQ1N9C02D
LQP03HQ2N0W02D
LQP03HQ2N0B02D
LQP03HQ2N0C02D
LQP03HQ2N1W02D
LQP03HQ2N1B02D
LQP03HQ2N1C02D
LQP03HQ2N2W02D
LQP03HQ2N2B02D
LQP03HQ2N2C02D
LQP03HQ2N3W02D
LQP03HQ2N3B02D
LQP03HQ2N3C02D
LQP03HQ2N4W02D
LQP03HQ2N4B02D
LQP03HQ2N4C02D
LQP03HQ2N5W02D
LQP03HQ2N5B02D
LQP03HQ2N5C02D
LQP03HQ2N6B02D
LQP03HQ2N6C02D
LQP03HQ2N7B02D
LQP03HQ2N7C02D
LQP03HQ2N8B02D
LQP03HQ2N8C02D
LQP03HQ2N9B02D
LQP03HQ2N9C02D
LQP03HQ3N0B02D
LQP03HQ3N0C02D
LQP03HQ3N1B02D
LQP03HQ3N1C02D
LQP03HQ3N2B02D
LQP03HQ3N2C02D
LQP03HQ3N3B02D
LQP03HQ3N3C02D
LQP03HQ3N4B02D
LQP03HQ3N4C02D
LQP03HQ3N5B02D
LQP03HQ3N5C02D
LQP03HQ3N6B02D
LQP03HQ3N6C02D
LQP03HQ3N7B02D
LQP03HQ3N7C02D
LQP03HQ3N8B02D
LQP03HQ3N8C02D
LQP03HQ3N9B02D
LQP03HQ3N9C02D
LQP03HQ4N0B02D
LQP03HQ4N0C02D
LQP03HQ4N1B02D
LQP03HQ4N1C02D
LQP03HQ4N2B02D
LQP03HQ4N2C02D
LQP03HQ4N3H02D
LQP03HQ4N3J02D
Q
(min)
DC
Resistance
(Ω max)
Tolerance
1.9
Self
Resonant
Frequency
(MHz)
Min.
*Typ
10000
2.0
Rated
Current
(mA)
14700
15900
2.1
2.2
14300
W:±0.05nH
B:±0.1nH
C:±0.2nH
2.3
9000
13800
0.12
600
2.4
13000
2.5
2.6
2.7
11600
2.8
2.9
8000
20
3.0
10500
3.1
7500
3.2
3.3
3.4
B:±0.1nH
C:±0.2nH
3.5
3.6
3.7
0.17
500
7000
3.8
9500
3.9
4.0
4.1
4.2
4.3
H:±3%
J:±5%
MURATA MFG.CO., LTD
Reference Only
Spec No.JELF243C-0021H-01
Customer
Part Number
P.3/12
Inductance
MURATA
Part Number
(nH)
LQP03HQ4N4H02D
LQP03HQ4N4J02D
LQP03HQ4N5H02D
LQP03HQ4N5J02D
LQP03HQ4N6H02D
LQP03HQ4N6J02D
LQP03HQ4N7H02D
LQP03HQ4N7J02D
LQP03HQ4N8H02D
LQP03HQ4N8J02D
LQP03HQ4N9H02D
LQP03HQ4N9J02D
LQP03HQ5N0H02D
LQP03HQ5N0J02D
LQP03HQ5N1H02D
LQP03HQ5N1J02D
LQP03HQ5N6H02D
LQP03HQ5N6J02D
LQP03HQ6N2H02D
LQP03HQ6N2J02D
LQP03HQ6N8H02D
LQP03HQ6N8J02D
LQP03HQ7N5H02D
LQP03HQ7N5J02D
LQP03HQ8N2H02D
LQP03HQ8N2J02D
LQP03HQ9N1H02D
LQP03HQ9N1J02D
LQP03HQ10NH02D
LQP03HQ10NJ02D
LQP03HQ11NH02D
LQP03HQ11NJ02D
LQP03HQ12NH02D
LQP03HQ12NJ02D
LQP03HQ13NH02D
LQP03HQ13NJ02D
LQP03HQ15NH02D
LQP03HQ15NJ02D
LQP03HQ16NH02D
LQP03HQ16NJ02D
LQP03HQ18NH02D
LQP03HQ18NJ02D
LQP03HQ20NH02D
LQP03HQ20NJ02D
LQP03HQ22NH02D
LQP03HQ22NJ02D
LQP03HQ24NH02D
LQP03HQ24NJ02D
LQP03HQ27NH02D
LQP03HQ27NJ02D
LQP03HQ30NH02D
LQP03HQ30NJ02D
LQP03HQ33NH02D
LQP03HQ33NJ02D
LQP03HQ36NH02D
LQP03HQ36NJ02D
LQP03HQ39NH02D
LQP03HQ39NJ02D
Q
(min)
DC
Resistance
(Ω max)
Tolerance
Self
Resonant
Frequency
(MHz)
Min.
*Typ
Rated
Current
(mA)
4.4
4.5
7000
9500
4.6
4.7
4.8
0.25
4.9
400
5.0
7700
5.1
5500
5.6
6.2
6.8
7300
0.3
7.5
20
8.2
6400
4500
9.1
10
0.4
H:±3%
J:±5%
5900
11
300
5200
12
0.5
4000
13
5100
15
0.7
16
3500
4200
18
0.8
250
20
3000
22
0.82
3950
24
15
1.6
2000
2900
170
27
30
2700
1700
33
2600
12
2.0
150
36
2400
1500
39
MURATA MFG.CO., LTD
2200
Reference Only
Spec No.JELF243C-0021H-01
Customer
Part Number
P.4/12
Inductance
MURATA
Part Number
(nH)
LQP03HQ43NH02D
LQP03HQ43NJ02D
LQP03HQ47NH02D
LQP03HQ47NJ02D
LQP03HQ51NH02D
LQP03HQ51NJ02D
LQP03HQ56NH02D
LQP03HQ56NJ02D
LQP03HQ62NH02D
LQP03HQ62NJ02D
LQP03HQ68NH02D
LQP03HQ68NJ02D
LQP03HQ75NH02D
LQP03HQ75NJ02D
LQP03HQ82NH02D
LQP03HQ82NJ02D
LQP03HQ91NH02D
LQP03HQ91NJ02D
LQP03HQR10H02D
LQP03HQR10J02D
LQP03HQR11H02D
LQP03HQR11J02D
LQP03HQR12H02D
LQP03HQR12J02D
LQP03HQR13H02D
LQP03HQR13J02D
LQP03HQR15H02D
LQP03HQR15J02D
LQP03HQR16H02D
LQP03HQR16J02D
LQP03HQR18H02D
LQP03HQR18J02D
LQP03HQR20H02D
LQP03HQR20J02D
LQP03HQR22H02D
LQP03HQR22J02D
LQP03HQR24H02D
LQP03HQR24J02D
LQP03HQR27H02D
LQP03HQR27J02D
LQP03HQR30H02D
LQP03HQR30J02D
LQP03HQR33H02D
LQP03HQR33J02D
LQP03HQR36H02D
LQP03HQR36J02D
LQP03HQR39H02D
LQP03HQR39J02D
LQP03HQR43H02D
LQP03HQR43J02D
LQP03HQR47H02D
LQP03HQR47J02D
Q
(min)
DC
Resistance
(Ω max)
Tolerance
Self
Resonant
Frequency
(MHz)
Min.
*Typ
43
Rated
Current
(mA)
2200
1300
47
2.5
130
51
2000
1200
12
56
62
1800
1100
68
1500
5.0
100
75
1400
82
1000
91
10
7.0
1300
100
900
110
1100
120
800
80
130
150
H:±3%
J:±5%
960
8.0
7
880
160
700
180
8.5
200
9.0
220
9.5
1100
1000
75
900
240
9
10.0
650
70
270
11.0
850
300
12.0
600
800
330
13.0
550
750
360
13.5
390
14.5
65
700
60
500
650
430
8
15.5
50
470
16.5
450
600
*Typical value is actual performance.
4. Testing Conditions
《Unless otherwise specified》
Temperature : Ordinary Temperature / 15°C to 35°C
Humidity : Ordinary Humidity / 25%(RH) to 85 %(RH)
《In case of doubt》
Temperature : 20°C ± 2°C
Humidity
: 60%(RH) to 70 %(RH)
Atmospheric Pressure : 86kPa to 106 kPa
MURATA MFG.CO., LTD
Reference Only
Spec No.JELF243C-0021H-01
P.5/12
5. Appearance and Dimensions
Top view
0.6±0.03mm
0.3±0.03mm
End view
Side view
0.4±0.02mm
0.2±0.03mm
Bottom view
■Unit Mass (Typical value)
0.22mg
0.15±0.03mm
6. Marking
Side distinguishing marking : Blue
Coloring side
(blue)
7.Electrical Performance
No.
7.1
Item
Inductance
Specification
Inductance shall meet item 3.
7.2
Q
Q shall meet item 3.
Test Method
Measuring Equipment:
KEYSIGHT E4991A or equivalent
Measuring Frequency: (0.5nH~30nH) 500MHz
(33nH~120nH)300MHz
(130nH~470nH)100MHz
Measuring Condition:
Test signal level / about 0dBm
Electrical length / 10mm
Weight / about 1N to 5N
Measuring Fixture: KEYSIGHT 16197A
Position coil under test as shown in below
and contact coil with each terminal by
adding weight. Bottom side should be
a bottom, and should be in the direction of
the fixture for position of chip coil.
TOP
BOTTOM
7.3
7.4
7.5
DC Resistance
Self Resonant
Frequency(S.R.F)
Rated Current
DC Resistance shall meet item 3.
S.R.F shall meet item 3.
Self temperature rise shall be
limited to 25°C max.
Measuring Method:See the endnote.
Measuring Equipment:Digital multi meter
Measuring Equipment:
KEYSIGHT N5230A or equivalent
The rated current is applied.
MURATA MFG.CO., LTD
Reference Only
Spec No.JELF243C-0021H-01
P.6/12
8.Mechanical Performance
No.
8.1
Item
Shear Test
Specification
Chip coil shall not be damaged
after tested as test method.
Test Method
Substrate:Glass-epoxy substrate
Land
0.3
0.3
(in mm)
0.9
Force:2N
Hold Duration:5 s±1 s
Applied Direction: Parallel to PCB.
Chip coil
F
Substrate
8.2
Bending Test
Chip coil shall not be damaged
after tested as test method.
Substrate:Glass-epoxy substrate
(100mm×40mm×0.8mm)
Speed of Applying Force:1mm /s
Deflection:1mm
Hold Duration:30 s
Pressure jig
R340
F
Deflection
45
8.3
Vibration
Appearance:No damage
Inductance Change: within ±10%
8.4
Solderability
The electrode shall be at least 90%
covered with new solder coating.
8.5
Resistance to
Soldering Heat
Appearance:No damage
Inductance Change: within ±10%
45
Product(in mm)
Substrate: Glass-epoxy substrate
Oscillation Frequency:
10Hz to 2000Hz to 10Hz for 20 min
Total amplitude 1.5 mm or Acceleration
amplitude 196 m/s2 whichever is smaller.
Testing Time:
A period of 2h in each of
3 mutually perpendicular directions.
Flux: Ethanol solution of rosin 25(wt)%
(Immersed for 5s to 10s)
Solder:Sn-3.0Ag-0.5Cu
Pre-Heating:150°C±10°C / 60s to 90s
Solder Temperature:240°C±5°C
Immersion Time:3s±1s
Flux: Ethanol solution of rosin 25(wt)%
(Immersed for 5s to 10s)
Solder:Sn-3.0Ag-0.5Cu
Pre-Heating:150°C±10°C / 60s to 90s
Solder Temperature:260°C±5°C
Immersion Time:5s±1s
Then measured after exposure in the room
condition for 24h±2h.
9.Environmental Performance
It shall be soldered on the substrate.
No.
Item
Specification
9.1 Heat Resistance
Appearance:No damage
Inductance Change: within ±10%
Test Method
Substrate: Glass-epoxy substrate
Temperature:125°C
Time:1000h (+48h,-0h)
Then measured after exposure in the
room condition for 24h±2h.
MURATA MFG.CO., LTD
Reference Only
Spec No.JELF243C-0021H-01
P.7/12
It shall be soldered on the substrate.
No.
Item
Specification
9.2 Cold Resistance
Appearance:No damage
Inductance Change: within ±10%
9.3
Humidity
9.4
Temperature
Cycle
Test Method
Substrate: Glass-epoxy substrate
Temperature:-55°C
Time:1000 h (+48h,-0h)
Then measured after exposure in the
room condition for 24h±2h.
Substrate: Glass-epoxy substrate
Temperature:40°C±2°C
Humidity:90%(RH) to 95%(RH)
Time:1000 h(+48h,-0h)
Then measured after exposure in the
room condition for 24h±2h.
Substrate: Glass-epoxy substrate
1 cycle:
1 step: -55°C / 30min±3 min
2 step:Ordinary temp. / 10~15 min
3 step: 125°C / 30min±3 min
4 step: Ordinary temp. / 10~15 min
Total of 10 cycles
Then measured after exposure in the
room condition for 24h±2h.
10.Specification of Packaging
10.1 Appearance and Dimensions of paper tape (8mm-wide)
+0.1
φ1.5 -0
1.75±0.1
3.5±0.05
4.0±0.1
8.0±0.2
Product
2.0±0.05
(0.68)
2.0±0.05
(0.36)
Direction of feed
0.55 max.
(in mm)
10.2 Specification of Taping
(1) Packing quantity (standard quantity)
15,000 pcs. / reel
(2) Packing Method
Products shall be packed in the cavity of the base tape and sealed by cover tape.
(3) Sprocket hole
The sprocket holes are to the right as the tape is pulled toward the user.
(4) Spliced point
Base tape and Cover tape has no spliced point.
(5) Missing components number
Missing components number within 0.1 % of the number per reel or 1 pc. , whichever is greater,
and are not continuous. The Specified quantity per reel is kept.
10.3 Pull Strength
Cover tape
5N min
10.4 Peeling off force of cover tape
Speed of Peeling off
Peeling off force
300mm/min
0.1N to 0.6N
(minimum value is typical)
165°to 180 ゜
F
Cover tape
Base tape
MURATA MFG.CO., LTD
Reference Only
Spec No.JELF243C-0021H-01
P.8/12
10.5 Dimensions of Leader-tape, Trailer and Reel
There shall be leader-tape ( top tape and empty tape) and trailer-tape (empty tape) as follows.
Trailer
160 min.
2.0±0.5
Leader
Label
190 min.
Empty tape
210 min.
Cover tape
φ 13.0±0.2
+1
φ 60 -0
φ 21.0±0.8
9.0 +1
-0
Direction of feed
(in mm)
13.0±1.4
+0
φ 180 -3
10.6 Marking for reel
Customer part number, MURATA part number, Inspection number(∗1) , RoHS Marking (∗2),
Quantity etc ・・・
□□ OOOO ×××
∗1)
(1) Factory Code
(2) Date
(3) Serial No.
(1)
(2)
(3)
First digit : Year / Last digit of year
Second digit : Month / Jan. to Sep. → 1 to 9, Oct. to Dec. → O,N,D
Third, Fourth digit : Day
∗2)
ROHS – Y (△)
(1) (2)
(1) RoHS regulation conformity parts.
(2) MURATA classification number
10.7 Marking for Outside package (corrugated paper box)
Customer name, Purchasing order number, Customer part number, MURATA part number,
RoHS Marking (∗2) ,Quantity, etc ・・・
10.8 Specification of Outer Case
Label
H
D
W
Outer Case Dimensions
(mm)
W
D
H
186
186
93
Standard Reel Quantity
in Outer Case (Reel)
5
∗ Above Outer Case size is typical. It depends on a quantity of an order.
11. ! Caution
Limitation of Applications
Please contact us before using our products for the applications listed below which require especially
high reliability for the prevention of defects which might directly cause damage to the third party's life,
body or property.
(1) Aircraft equipment
(6) Transportation equipment (vehicles, trains, ships, etc.)
(2) Aerospace equipment
(7) Traffic signal equipment
(3) Undersea equipment
(8) Disaster prevention / crime prevention equipment
(4) Power plant control equipment (9) Data-processing equipment
(5) Medical equipment
(10) Applications of similar complexity and /or reliability
requirements to the applications listed in the above
12. Notice
Products can only be soldered with reflow.
This product is designed for solder mounting.
Please consult us in advance for applying other mounting method such as conductive adhesive.
MURATA MFG.CO., LTD
Reference Only
Spec No.JELF243C-0021H-01
P.9/12
12.1 Land pattern designing
Chip Coil
c
Land
a
b
c
Solder resist
0.3
0.9
0.25~0.30
(in mm)
a
b
12.2 Flux, Solder
・ Use rosin-based flux.
Don’t use highly acidic flux with halide content exceeding 0.2(wt)% (chlorine conversion value).
Don’t use water-soluble flux.
・ Use Sn-3.0Ag-0.5Cu solder.
・ Standard thickness of solder paste : 100μm
12.3 Reflow soldering conditions
・ Pre-heating should be in such a way that the temperature difference between solder and
product surface is limited to 150°C max. Cooling into solvent after soldering also should be
in such a way that the temperature difference is limited to 100°C max.
Insufficient pre-heating may cause cracks on the product, resulting in the deterioration of
products quality.
・ Standard soldering profile and the limit soldering profile is as follows.
The excessive limit soldering conditions may cause leaching of the electrode and / or resulting
in the deterioration of product quality.
・Reflow soldering profile
Temp.
(℃)
260℃
245℃±3℃
220℃
230℃
Limit Profile
180
150
Standard Profile
30s~60s
60s max.
90s±30s
Pre-heating
Heating
Peak temperature
Cycle of reflow
Time. (s)
Standard Profile
Limit Profile
150°C~180°C 、90s±30s
above 220°C、30s~60s
above 230°C、60s max.
245°C±3°C
260°C,10s
2 times
2 times
12.4 Reworking with soldering iron
The following conditions must be strictly followed when using a soldering iron.
Pre-heating
Tip temperature
Soldering iron output
Tip diameter
Soldering time
Time
150°C,1 min
350°C max.
80W max.
φ3mm max.
3(+1,-0)s
2 times
Note : Do not directly touch the products with the tip of the soldering iron in order to prevent the
crack on the products due to the thermal shock.
MURATA MFG.CO., LTD
Reference Only
Spec No.JELF243C-0021H-01
P.10/12
12.5 Solder Volume
・ Solder shall be used not to be exceeded the upper limits as shown below.
Upper Limit
Recommendable
t
1/3T≦t≦1/2T
T : thickness of product
Accordingly increasing the solder volume, the mechanical stress to Chip is also increased.
Exceeding solder volume may cause the failure of mechanical or electrical performance.
12.6 Attention regarding P.C.B. bending
The following shall be considered when designing and laying out P.C.B.'s.
(1) P.C.B. shall be designed so that products are not subject to the mechanical stress due to
warping the board.
[Products direction]
a
b
〈 Poor example 〉
Products shall be located in the sideways
direction (Length:a<b) to the mechanical
stress.
〈 Good example 〉
(2) Components location on P.C.B. separation.
It is effective to implement the following measures, to reduce stress in separating the board.
It is best to implement all of the following three measures; however, implement as many measures as possible
to reduce stress.
Contents of Measures
(1) Turn the mounting direction of the component parallel to the board separation surface.
(2) Add slits in the board separation part.
(3) Keep the mounting position of the component away from the board separation surface.
Seam
b
A
Stress Level
A > D *1
A > B
A > C
C
B
D
Slit
Length:a< b
a
*1 A > D is valid when stress is added vertically to the perforation as with Hand Separation.
If a Cutting Disc is used, stress will be diagonal to the PCB, therefore A > D is invalid.
(3) Mounting Components Near Screw Holes
When a component is mounted near a screw hole, it may be affected by the board deflection that occurs during
the tightening of the screw. Mount the capacitor in a position as far away from the screw holes as possible.
MURATA MFG.CO., LTD
Reference Only
Spec No.JELF243C-0021H-01
P.11/12
12.7 Cleaning Conditions
Products shall be cleaned on the following conditions.
(1) Cleaning temperature shall be limited to 60°C max.(40°C max for IPA)
(2) Ultrasonic cleaning shall comply with the following conditions with avoiding the resonance
phenomenon at the mounted products and P.C.B.
Power : 20 W / l max.
Frequency : 28kHz to 40kHz
Time : 5 min max.
(3) Cleaner
1. Alcohol type cleaner
Isopropyl alcohol (IPA)
2. Aqueous agent
PINE ALPHA ST-100S
(4) There shall be no residual flux and residual cleaner after cleaning.
In the case of using aqueous agent, products shall be dried completely after rinse with de-ionized
water in order to remove the cleaner.
(5) Other cleaning
Please contact us.
12.8 Resin coating
When products are coated with resin, please contact us in advance.
12.9 Handling of a substrate
(1)There is a possibility of chip cracking caused by PCBexpansion/contraction with heat, because stress
on a chip is different depending on PCB material and structure.
When the thermal expansion coefficient greatly differs between the board used for mounting and the chip,
it will cause cracking of the chip due to the thermal expansion and contraction.
The chip is assumed to be mounted on the PCB of glass-epoxy material, and we don't test with other
PCB material which has different thermal expansion coefficient from Glass-epoxy.
When other PCB materials are considered, please be sure to evaluate by yourself.
(2)After mounting products on a substrate, do not apply any stress to the product caused by bending or twisting to
the substrate when cropping the substrate, inserting and removing a connector from the substrate or tightening
screw to the substrate.
Excessive mechanical stress may cause cracking in the product.
In case of the mounting on flexible PCB, there is a possibility of chip cracking caused by mechanical stress
even from small bending or twisting.
When the flexible PCB is considered, please be sure to evaluate by yourself.
Bending
Twisting
12.10 Storage and Handing Requirements
(1) Storage period
Use the products within 12 months after delivered.
Solderability should be checked if this period is exceeded.
(2) Storage conditions
・Products should be stored in the warehouse on the following conditions.
Temperature : -10°C ~ 40°C
Humidity
: 15% to 85% relative humidity No rapid change on temperature and humidity.
・Products should not be stored on bulk packaging condition to prevent the chipping of the
core and the breaking of winding wire caused by the collision between the products.
・Products should be stored on the palette for the prevention of the influence from humidity,
dust and so on.
・Products should be stored in the warehouse without heat shock, vibration, direct sunlight and
so on.
(3) Handling Condition
Care should be taken when transporting or handling product to avoid excessive vibration or
mechanical shock.
MURATA MFG.CO., LTD
Reference Only
Spec No.JELF243C-0021H-01
P.12/12
13.! Note
(1)Please make sure that your product has been evaluated in view of your specifications with our product being
mounted to your product.
(2)You are requested not to use our product deviating from the reference specifications.
(3)The contents of this reference specification are subject to change without advance notice.
Please approve our product specifications or transact the approval sheet for product specifications
before ordering.
(1) Residual elements and stray elements of test fixture can be described by F-parameter shown in following.
I2
I1
A
Zm
V1
Test Head
C
B
V2
D
Test fixture
Zx
V1
=
I1
A B
C D
V2
I2
Product
(2) The impedance of chip coil Zx and measured value Zm can be described by input/output current/voltage.
Zm=
V1
I1
,
V2
Zx= I
2
(3) Thus,the relation between Zx and Zm is following;
Zm-β
where, α= D / A =1
Zx= α 1-ZmΓ
β= B / D =Zsm-(1-Yom Zsm)Zss
Γ= C / A =Yom
Zsm:measured impedance of short chip
Zss:residual impedance of short chip (0.480nH)
Yom:measured admittance when opening the fixture
(4) Lx and Qx shall be calculated with the following equation.
Im(Zx)
Im(Zx)
Qx=
Lx= 2πf
,
Re(Zx)
Lx :Inductance of chip coil
Qx:Q of chip coil
f :Measuring frequency
MURATA MFG.CO., LTD