LQP03TG1N1C02D

Spec No.: JELF243C_0016K-01 P1/13 CHIP COILS (CHIP INDUCTORS) LQP03TG□□□□02□ REFERENCE SPECIFICATION 1. Scope This reference specification applies to chip coils (chip inductors) LQP03TG_02 series for general electronic equipment. 2. Part Numbering (Ex.) LQ P 03 Product Structure Dimension ID (L × W) T G 0N1 B 0 2 Application Category Inductance Tolerance Performance Electrode and specification characteristic *B: Bulk packing is also available (taping condition: however, products without reels are put in plastic bags). D Packaging D: taping *B: bulk 3. Part Number and Rating Operating temperature range Storage temperature range -55°C to +125°C -55°C to +125°C Inductance Customer Part number Murata Part number Q (Min.) DC resistance (Ω max.) Nominal value (nH) Tolerance LQP03TG0N1B02D 0.1 B: ±0.1 nH - LQP03TG0N2B02D 0.2 B: ±0.1 nH - LQP03TG0N2C02D 0.2 C: ±0.2 nH LQP03TG0N3B02D 0.3 B: ±0.1 nH LQP03TG0N3C02D 0.3 C: ±0.2 nH Self-resonant frequency (MHz) Rated current (mA) Lower limit *Typical value 0.07 20000 20000 850 0.08 20000 20000 850 - 0.08 20000 20000 850 - 0.08 18000 20000 850 - 0.08 18000 20000 850 LQP03TG0N4B02D 0.4 B: ±0.1 nH - 0.08 18000 20000 850 LQP03TG0N4C02D 0.4 C: ±0.2 nH - 0.08 18000 20000 850 LQP03TG0N5B02D 0.5 B: ±0.1 nH 11 0.08 18000 20000 850 LQP03TG0N5C02D 0.5 C: ±0.2 nH 11 0.08 18000 20000 850 LQP03TG0N6B02D 0.6 B: ±0.1 nH 11 0.08 18000 20000 850 LQP03TG0N6C02D 0.6 C: ±0.2 nH 11 0.08 18000 20000 850 LQP03TG0N7B02D 0.7 B: ±0.1 nH 12 0.10 18000 20000 750 LQP03TG0N7C02D 0.7 C: ±0.2 nH 12 0.10 18000 20000 750 LQP03TG0N8B02D 0.8 B: ±0.1 nH 12 0.10 18000 20000 750 LQP03TG0N8C02D 0.8 C: ±0.2 nH 12 0.10 18000 20000 750 LQP03TG0N9B02D 0.9 B: ±0.1 nH 12 0.12 18000 20000 700 LQP03TG0N9C02D 0.9 C: ±0.2 nH 12 0.12 18000 20000 700 LQP03TG1N0B02D 1.0 B: ±0.1 nH 12 0.15 17000 20000 600 LQP03TG1N0C02D 1.0 C: ±0.2 nH 12 0.15 17000 20000 600 LQP03TG1N1B02D 1.1 B: ±0.1 nH 12 0.15 17000 20000 600 LQP03TG1N1C02D 1.1 C: ±0.2 nH 12 0.15 17000 20000 600 LQP03TG1N2B02D 1.2 B: ±0.1 nH 13 0.15 15000 18100 600 LQP03TG1N2C02D 1.2 C: ±0.2 nH 13 0.15 15000 18100 600 LQP03TG1N3B02D 1.3 B: ±0.1 nH 13 0.15 15000 18200 600 LQP03TG1N3C02D 1.3 C: ±0.2 nH 13 0.15 15000 18200 600 LQP03TG1N4B02D 1.4 B: ±0.1 nH 13 0.15 14000 17800 600 LQP03TG1N4C02D 1.4 C: ±0.2 nH 13 0.15 14000 17800 600 LQP03TG1N5B02D 1.5 B: ±0.1 nH 13 0.15 13500 16400 600 LQP03TG1N5C02D 1.5 C: ±0.2 nH 13 0.15 13500 16400 600 MURATA MFG CO., LTD Spec No.: JELF243C_0016K-01 P2/13 Inductance Customer Part number Murata Part number Nominal value (nH) Q (Min.) Tolerance DC resistance (Ω max.) Self-resonant frequency (MHz) Lower limit *Typical value Rated current (mA) LQP03TG1N6B02D 1.6 B: ±0.1 nH 13 0.15 13000 16100 600 LQP03TG1N6C02D 1.6 C: ±0.2 nH 13 0.15 13000 16100 600 LQP03TG1N7B02D 1.7 B: ±0.1 nH 13 0.20 12500 16400 500 LQP03TG1N7C02D 1.7 C: ±0.2 nH 13 0.20 12500 16400 500 LQP03TG1N8B02D 1.8 B: ±0.1 nH 13 0.20 12500 15000 500 LQP03TG1N8C02D 1.8 C: ±0.2 nH 13 0.20 12500 15000 500 LQP03TG1N9B02D 1.9 B: ±0.1 nH 13 0.25 12500 15900 450 LQP03TG1N9C02D 1.9 C: ±0.2 nH 13 0.25 12500 15900 450 LQP03TG2N0B02D 2.0 B: ±0.1 nH 13 0.25 12500 14800 450 LQP03TG2N0C02D 2.0 C: ±0.2 nH 13 0.25 12500 14800 450 LQP03TG2N1B02D 2.1 B: ±0.1 nH 13 0.25 12000 14800 450 LQP03TG2N1C02D 2.1 C: ±0.2 nH 13 0.25 12000 14800 450 LQP03TG2N2B02D 2.2 B: ±0.1 nH 13 0.25 12000 14300 450 LQP03TG2N2C02D 2.2 C: ±0.2 nH 13 0.25 12000 14300 450 LQP03TG2N3B02D 2.3 B: ±0.1 nH 13 0.25 11500 14100 450 LQP03TG2N3C02D 2.3 C: ±0.2 nH 13 0.25 11500 14100 450 LQP03TG2N4B02D 2.4 B: ±0.1 nH 13 0.25 11000 13700 450 LQP03TG2N4C02D 2.4 C: ±0.2 nH 13 0.25 11000 13700 450 LQP03TG2N5B02D 2.5 B: ±0.1 nH 13 0.25 11000 13800 450 LQP03TG2N5C02D 2.5 C: ±0.2 nH 13 0.25 11000 13800 450 LQP03TG2N6B02D 2.6 B: ±0.1 nH 13 0.25 11000 13900 450 LQP03TG2N6C02D 2.6 C: ±0.2 nH 13 0.25 11000 13900 450 LQP03TG2N7B02D 2.7 B: ±0.1 nH 13 0.25 11000 13100 450 LQP03TG2N7C02D 2.7 C: ±0.2 nH 13 0.25 11000 13100 450 LQP03TG2N8B02D 2.8 B: ±0.1 nH 13 0.25 9500 12200 450 LQP03TG2N8C02D 2.8 C: ±0.2 nH 13 0.25 9500 12200 450 LQP03TG2N9B02D 2.9 B: ±0.1 nH 13 0.25 9500 12200 450 LQP03TG2N9C02D 2.9 C: ±0.2 nH 13 0.25 9500 12200 450 LQP03TG3N0B02D 3.0 B: ±0.1 nH 13 0.25 9500 11500 450 LQP03TG3N0C02D 3.0 C: ±0.2 nH 13 0.25 9500 11500 450 LQP03TG3N1B02D 3.1 B: ±0.1 nH 13 0.32 9500 11800 400 LQP03TG3N1C02D 3.1 C: ±0.2 nH 13 0.32 9500 11800 400 LQP03TG3N2B02D 3.2 B: ±0.1 nH 13 0.32 9500 11600 400 LQP03TG3N2C02D 3.2 C: ±0.2 nH 13 0.32 9500 11600 400 LQP03TG3N3B02D 3.3 B: ±0.1 nH 13 0.32 9500 11200 400 LQP03TG3N3C02D 3.3 C: ±0.2 nH 13 0.32 9500 11200 400 LQP03TG3N4B02D 3.4 B: ±0.1 nH 13 0.35 8000 10300 350 LQP03TG3N4C02D 3.4 C: ±0.2 nH 13 0.35 8000 10300 350 LQP03TG3N5B02D 3.5 B: ±0.1 nH 13 0.35 8000 10000 350 LQP03TG3N5C02D 3.5 C: ±0.2 nH 13 0.35 8000 10000 350 LQP03TG3N6B02D 3.6 B: ±0.1 nH 13 0.35 8000 9400 350 LQP03TG3N6C02D 3.6 C: ±0.2 nH 13 0.35 8000 9400 350 LQP03TG3N7B02D 3.7 B: ±0.1 nH 13 0.35 7000 8600 350 LQP03TG3N7C02D 3.7 C: ±0.2 nH 13 0.35 7000 8600 350 MURATA MFG CO., LTD Spec No.: JELF243C_0016K-01 P3/13 Inductance Customer Part number Murata Part number Nominal value (nH) Q (Min.) Tolerance DC resistance (Ω max.) Self-resonant frequency (MHz) Lower limit *Typical value Rated current (mA) LQP03TG3N8B02D 3.8 B: ±0.1 nH 13 0.35 7000 8600 350 LQP03TG3N8C02D 3.8 C: ±0.2 nH 13 0.35 7000 8600 350 LQP03TG3N9B02D 3.9 B: ±0.1 nH 13 0.35 6500 8100 350 LQP03TG3N9C02D 3.9 C: ±0.2 nH 13 0.35 6500 8100 350 LQP03TG4N3H02D 4.3 H: ±3% 13 0.58 6500 8000 300 LQP03TG4N3J02D 4.3 J: ±5% 13 0.58 6500 8000 300 LQP03TG4N7H02D 4.7 H: ±3% 12 0.72 6500 7800 250 LQP03TG4N7J02D 4.7 J: ±5% 12 0.72 6500 7800 250 LQP03TG5N1H02D 5.1 H: ±3% 12 0.72 6500 7800 250 LQP03TG5N1J02D 5.1 J: ±5% 12 0.72 6500 7800 250 LQP03TG5N6H02D 5.6 H: ±3% 12 0.88 6000 7500 250 LQP03TG5N6J02D 5.6 J: ±5% 12 0.88 6000 7500 250 LQP03TG6N2H02D 6.2 H: ±3% 12 1.15 6000 7400 200 LQP03TG6N2J02D 6.2 J: ±5% 12 1.15 6000 7400 200 LQP03TG6N8H02D 6.8 H: ±3% 12 1.15 5400 6300 200 LQP03TG6N8J02D 6.8 J: ±5% 12 1.15 5400 6300 200 LQP03TG7N5H02D 7.5 H: ±3% 12 1.22 4800 5600 200 LQP03TG7N5J02D 7.5 J: ±5% 12 1.22 4800 5600 200 LQP03TG8N2H02D 8.2 H: ±3% 12 1.40 4800 6200 200 LQP03TG8N2J02D 8.2 J: ±5% 12 1.40 4800 6200 200 LQP03TG9N1H02D 9.1 H: ±3% 11 1.40 4500 5200 200 LQP03TG9N1J02D 9.1 J: ±5% 11 1.40 4500 5200 200 LQP03TG10NH02D 10 H: ±3% 11 1.52 4500 5200 190 LQP03TG10NJ02D 10 J: ±5% 11 1.52 4500 5200 190 LQP03TG11NH02D 11 H: ±3% 11 1.65 4100 4700 180 LQP03TG11NJ02D 11 J: ±5% 11 1.65 4100 4700 180 LQP03TG12NH02D 12 H: ±3% 11 1.78 3700 4400 180 LQP03TG12NJ02D 12 J: ±5% 11 1.78 3700 4400 180 LQP03TG13NH02D 13 H: ±3% 11 1.82 3400 3800 170 LQP03TG13NJ02D 13 J: ±5% 11 1.82 3400 3800 170 LQP03TG15NH02D 15 H: ±3% 11 1.90 3100 3600 170 LQP03TG15NJ02D 15 J: ±5% 11 1.90 3100 3600 170 LQP03TG16NH02D 16 H: ±3% 11 2.03 2900 3300 160 LQP03TG16NJ02D 16 J: ±5% 11 2.03 2900 3300 160 LQP03TG18NH02D 18 H: ±3% 11 2.28 2800 3200 160 LQP03TG18NJ02D 18 J: ±5% 11 2.28 2800 3200 160 LQP03TG20NH02D 20 H: ±3% 9 2.57 2600 2900 140 LQP03TG20NJ02D 20 J: ±5% 9 2.57 2600 2900 140 LQP03TG22NH02D 22 H: ±3% 9 2.85 2500 2900 140 LQP03TG22NJ02D 22 J: ±5% 9 2.85 2500 2900 140 LQP03TG24NH02D 24 H: ±3% 7 3.17 2000 2400 120 LQP03TG24NJ02D 24 J: ±5% 7 3.17 2000 2400 120 LQP03TG27NH02D 27 H: ±3% 7 3.65 1700 2200 120 LQP03TG27NJ02D 27 J: ±5% 7 3.65 1700 2200 120 MURATA MFG CO., LTD Spec No.: JELF243C_0016K-01 P4/13 Inductance Customer Part number Murata Part number Q (Min.) DC resistance (Ω max.) Nominal value (nH) Tolerance LQP03TG33NJ02D 33 J: ±5% 7 LQP03TG39NJ02D 39 J: ±5% 7 LQP03TG47NJ02D 47 J: ±5% LQP03TG56NJ02D 56 J: ±5% LQP03TG68NJ02D 68 LQP03TG82NJ02D LQP03TGR10J02D LQP03TGR12J02D * Typical value is actual performance. 120 Self-resonant frequency (MHz) Rated current (mA) Lower limit *Typical value 4.25 1600 2000 110 4.60 1500 2000 110 7 5.20 1300 1700 100 7 5.60 1200 1500 100 J: ±5% 6 6.25 1100 1400 90 82 J: ±5% 6 7.15 1000 1300 90 100 J: ±5% 6 8.05 900 1200 80 J: ±5% 6 8.75 800 1000 80 4. Testing Conditions Unless otherwise specified Temperature: ordinary temperature (15°C to 35°C) Humidity: ordinary humidity [25% to 85% (RH)] In case of doubt Temperature: 20°C±2°C Humidity: 60% to 70% (RH) Atmospheric pressure: 86 kPa to 106 kPa 5. Appearance and Dimensions Unit mass (typical value): 0.2 mg 6. Marking MURATA MFG CO., LTD Spec No.: JELF243C_0016K-01 P5/13 7. Electrical Performance No. Item 7.1 Inductance 7.2 Q Specification Meet chapter 3 ratings. Meet chapter 3 ratings. Test method Measuring equipment: Keysight E4991A or the equivalent Measuring frequency: 500 MHz 0.1 nH to 27 nH 300 MHz 33 nH to 120 nH Measuring conditions: Measurement signal level: Approx. 0 dBm Measurement terminal distance: 0.2 mm Electrical length: 10 mm Measuring fixture: Keysight 16197A Position the chip coil under test as shown in the measuring example below and connect it to the electrode by applying weight. Measurement example: 7.3 DC resistance 7.4 Self-resonant frequency 7.5 Rated current Meet chapter 3 ratings. Meet chapter 3 ratings. Product temperature rise: 25°C max. Measuring method: see "Electrical performance: Measuring method for inductance/Q" in the Appendix. Measuring equipment: digital multimeter Measuring equipment: Keysight 8753C or the equivalent Apply the rated current specified in chapter 3. 8. Mechanical Performance No. Item 8.1 Shear test Specification Test method No significant mechanical damage or no Test substrate: glass-epoxy substrate sign of electrode peeling off shall be Applying force: 2 N observed. Holding time: 5 s±1 s Force application direction: 8.2 Bending test No significant mechanical damage or no Test substrate: glass-epoxy substrate (100 mm × 40 sign of electrode peeling off shall be mm × 0.8 mm) observed. Pressurizing speed: 1 mm/s Pressure jig: R340 Deflection: 1 mm Holding time: 30 s MURATA MFG CO., LTD Spec No.: JELF243C_0016K-01 No. Item 8.3 Vibration 8.4 Solderability 8.5 Resistance to soldering heat P6/13 Specification Appearance shall have no significant mechanical damage. Inductance change rate: within ±10% Test method Oscillation frequency: 10 Hz to 2000 Hz to 10 Hz, for approx. 20 min Total amplitude: total amplitude of 1.5 mm or acceleration amplitude of 196 m/s2, whichever is smaller Test time: 3 directions perpendicular to each other, 2 h for each direction (6 h in total) 90% or more of the outer electrode shall Flux: immersed in ethanol solution with a rosin content be covered with new solder seamlessly. of 25(wt)% for 5 s to 10 s Solder: Sn-3.0Ag-0.5Cu solder Pre-heating: 150°C±10°C/60 s to 90 s Solder temperature: 240°C±5°C Immersion time: 3 s±1 s Appearance: No significant mechanical Flux: immersed in ethanol solution with a rosin content damage shall be observed. of 25(wt)% for 5 s to 10 s Inductance change rate: within ±10% Solder: Sn-3.0Ag-0.5Cu solder Pre-heating: 150°C±10°C/60 s to 90 s Solder temperature: 260°C±5°C Immersion time: 5 s±1 s Post-treatment: left at a room condition for 24 h±2 h 9. Environmental Performance The product is soldered on a glass-epoxy substrate for test. No. Item Specification 9.1 Heat resistance Appearance: No significant mechanical damage shall be observed. Inductance change rate: within ±10% 9.2 Cold resistance Appearance: No significant mechanical damage shall be observed. Inductance change rate: within ±10% 9.3 Humidity Appearance: No significant mechanical damage shall be observed. Inductance change rate: within ±10% 9.4 Temperature cycle Appearance: No significant mechanical damage shall be observed. Inductance change rate: within ±10% Test method Temperature: 125°C±2°C Test time: 1000 h (+48 h, -0 h) Post-treatment: left at a room condition for 24 h±2 h Temperature: -55°C±3°C Test time: 1000 h (+48 h, -0 h) Post-treatment: left at a room condition for 24 h±2 h Temperature: 40°C±2°C Humidity: 90% (RH) to 95% (RH) Test time: 1000 h (+48 h, -0 h) Post-treatment: left at a room condition for 24 h±2 h Single cycle conditions: Step 1: -55°C±2°C/30 min±3 min Step 2: ordinary temperature/10 min to 15 min Step 3: +125°C±2°C/30 min±3 min Step 4: ordinary temperature/10 min to 15 min Number of testing: 10 cycles Post-treatment: left at a room condition for 24 h±2 h 10. Specification of Packaging 10.1 Appearance and dimensions of tape (8 mm width/paper tape) A (0.35) B (0.67) t 0.55 max. (in mm) MURATA MFG CO., LTD Spec No.: JELF243C_0016K-01 P7/13 10.2 Taping specifications Packing quantity (Standard quantity) 15000 pcs/reel Packing method The products are placed in cavities of a carrier tape and sealed by a cover tape (top tape and bottom tape when the cavities of the carrier tape are punched type). Feed hole position The feed holes on the carrier tape are on the right side when the cover tape (top tape when the cavities of the carrier tape are punched type) is pulled toward the user. Joint The carrier tape and cover tape (top tape when the cavities of the carrier tape are punched type) are seamless. Number of missing products Number of missing products within 0.1% of the number per reel or 1 pc., whichever is greater, and are not continuous. The specified quantity per reel is kept. 10.3 Break down force of tape Cover tape (or top tape) 5 N min. Bottom tape (only when the cavities of the carrier tape are punched type) 5 N min. 10.4 Peeling off force of tape Speed of peeling off Peeling off force 300 mm/min 0.1 N to 0.6 N (The lower limit is for typical value.) 10.5 Dimensions of leader section, trailer section and reel A vacant section is provided in the leader (start) section and trailer (end) section of the tape for the product. The leader section is further provided with an area consisting only of the cover tape (or top tape). (See the diagram below.) MURATA MFG CO., LTD Spec No.: JELF243C_0016K-01 P8/13 10.6 Marking for reel Customer part number, Murata part number, inspection number (*1), RoHS marking (*2), quantity, etc. *1 Expression of inspection No.: (1) Factory code  (2) Date □□ ○○○○ First digit: year/last digit of year (1) (2) (3) Second digit: month/Jan. to Sep.→1 to 9, Oct. to Dec.→O, N, D Third, Fourth digit: day (3) Serial No. *2 Expression of RoHS marking: (1) RoHS regulation conformity ROHSY () (2) Murata classification number (1) (2) 10.7 Marking on outer box (corrugated box) Customer name, purchasing order number, customer part number, Murata part number, RoHS marking (*2), quantity, etc. 10.8 Specification of outer box Label H D W 11. Dimensions of outer box (mm) W D H 186 186 93 Standard reel quantity in outer box (reel) 5 * Above outer box size is typical. It depends on a quantity of an order. Caution 11.1 Restricted applications Please contact us before using our products for the applications listed below which require especially high reliability for the prevention of defects which might directly cause damage to the third party's life, body or property. (1) Aircraft equipment (2) Aerospace equipment (3) Undersea (4) Power plant control equipment equipment (5) Medical equipment (6) Transportation equipment (vehicles, (7) Traffic signal (8) Disaster/crime trains, ships, etc.) equipment prevention equipment (9) Data-processing (10) Applications of similar complexity and/or reliability equipment requirements to the applications listed in the above 11.2 Precautions on rating Avoid using in exceeded the rated temperature range, rated voltage, or rated current. Usage when the ratings are exceeded could lead to wire breakage, burning, or other serious fault. 11.3 Inrush current If an inrush current (or pulse current or rush current) that significantly exceeds the rated current is applied to the product, overheating could occur, resulting in wire breakage, burning, or other serious fault. 12. Precautions for Use This product is for use only with reflow soldering. It is designed to be mounted by soldering. If you want to use other mounting method, for example, using a conductive adhesive, please consult us beforehand. Also, if repeatedly subjected to temperature cycles or other thermal stress, due to the difference in the coefficient of thermal expansion with the mounting substrate, the solder (solder fillet part) in the mounting part may crack. The occurrence of cracks due to thermal stress is affected by the size of the land where mounted, the solder volume, and the heat dissipation of the mounting substrate. Carefully design it when a large change in ambient temperature is assumed. MURATA MFG CO., LTD Spec No.: JELF243C_0016K-01 P9/13 12.1. Land dimensions The following diagram shows the recommended land dimensions for reflow soldering: a 0.2 to 0.3 b 0.8 to 0.9 c 0.2 to 0.3 (in mm) 12.2 Flux and solder used Flux • Use a rosin-based flux. • Do not use a highly acidic flux with a halide content exceeding 0.2(wt)% (chlorine conversion value). • Do not use a water-soluble flux. Solder • Use Sn-3.0Ag-0.5Cu solder. • Standard thickness of solder paste: 100 μm to 150 μm If you want to use a flux other than the above, please consult our technical department. 12.3 Soldering conditions (reflow) • Pre-heating should be in such a way that the temperature difference between solder and product surface is limited to 150°C max. Cooling into solvent after soldering also should be in such a way that the temperature difference is limited to 100°C max. Insufficient pre-heating may cause cracks on the product, resulting in the deterioration of product quality. • Standard soldering profile and the limit soldering profile is as follows. The excessive limit soldering conditions may cause leaching of the electrode and/or resulting in the deterioration of product quality. Temp. (℃) 260℃ 245℃±3℃ 220℃ 230℃ Limit Profile 180 150 Standard Profile 30s～60s 60s max. 90s±30s Time. (s) Standard profile Limit profile Pre-heating 150°C to 180°C/90 s±30 s 150°C to 180°C/90 s±30 s Heating Above 220°C/30 s to 60 s Above 230°C/60 s max. 245°C±3°C 260°C/10 s 2 times 2 times Peak temperature Number of reflow cycles MURATA MFG CO., LTD Spec No.: JELF243C_0016K-01 P10/13 12.4 Reworking with soldering iron The following requirements must be met to rework a soldered product using a soldering iron. Item Requirement Pre-heating 150°C/approx. 1 min Tip temperature of soldering iron 350°C max. Power consumption of soldering iron 80 W max. Tip diameter of soldering iron Soldering time ø3 mm max. 3 s (+1 s, -0 s) Number of reworking operations 2 times max. * Avoid a direct contact of the tip of the soldering iron with the product. Such a direction contact may cause cracks in the ceramic body due to thermal shock. 12.5 Solder volume Solder shall be used not to be exceeded the upper limits as shown below. An increased solder volume increases mechanical stress on the product. Exceeding solder volume may cause the failure of mechanical or electrical performance. 12.6 Product's location The following shall be considered when designing and laying out PCBs. (1) PCB shall be designed so that products are not subject to mechanical stress due to warping the board. [Products direction] Products shall be located in the sideways direction (length: a < b) to the mechanical stress. a b 〈 Poor example〉 〈 Good example〉 (2) Components location on PCB separation It is effective to implement the following measures, to reduce stress in separating the board. It is best to implement all of the following three measures; however, implement as many measures as possible to reduce stress. Contents of measures Stress level (1) Turn the mounting direction of the component parallel to the board separation surface. A > D*1 (2) Add slits in the board separation part. A>B (3) Keep the mounting position of the component away from the board separation surface. A>C *1 A > D is valid when stress is added vertically to the perforation as with hand separation. If a cutting disc is used, stress will be diagonal to the PCB, therefore A > D is invalid. MURATA MFG CO., LTD Spec No.: JELF243C_0016K-01 P11/13 (3) Mounting components near screw holes When a component is mounted near a screw hole, it may be affected by the board deflection that occurs during the tightening of the screw. Mount the component in a position as far away from the screw holes as possible. 12.7 Handling of substrate (1) The stress applied to the chip varies depending on the material and construction of the mounted substrate. If the coefficients of thermal expansion for the substrate and chip vary significantly, the difference in thermal expansion and shrinkage could cause cracks to form in the chip. We assume that the products are mounted on glass-epoxy substrate. Assessment has not been conducted on substrates where the coefficient of thermal expansion varies significantly from glass-epoxy substrates. If mounting on these substrates, be sure to conduct full assessments before use. (2) After mounting products on a substrate, do not apply any stress to the product caused by bending or twisting to the substrate when cropping the substrate, inserting and removing a connector from the substrate or tightening screw to the substrate. Excessive mechanical stress may cause cracking in the product. Also, if mounting on flexible substrates, excessive mechanical stress could be applied to the chip by even slight bending or twisting when handling this substrate, and so please conduct full assessments before use. Bending Twisting 12.8 Cleaning The product shall be cleaned under the following conditions. (1) The cleaning temperature shall be 60°C max. If isopropyl alcohol (IPA) is used, the cleaning temperature shall be 40°C max. (2) Perform ultrasonic cleaning under the following conditions. Exercise caution to prevent resonance phenomenon in mounted products and the PCB. Item Requirement Power Time 20 W/L max. 5 min max. Frequency 28 kHz to 40 kHz (3) Cleaner Alcohol-based cleaner: IPA Aqueous agent: PINE ALPHA ST-100S (4) There shall be no residual flux or residual cleaner. When using aqueous agent, rinse the product with deionized water adequately and completely dry it so that no cleaner is left. * For other cleaning, consult our technical department. MURATA MFG CO., LTD Spec No.: JELF243C_0016K-01 P12/13 12.9 Storage and transportation Storage period Use the product within 12 months after delivery. If you do not use the product for more than 12 months, check solderability before using it. Storage conditions • The products shall be stored in a room not subject to rapid changes in temperature and humidity. The recommended temperature range is -10°C to +40°C. The recommended relative humidity range is 15% to 85%. Keeping the product in corrosive gases, such as sulfur, chlorine gas or acid may cause the poor solderability. • Do not place the products directly on the floor; they should be placed on a palette so that they are not affected by humidity or dust. • Avoid keeping the products in a place exposed to direct sunlight, heat or vibration. • Do not keep products in bulk packaging. Bulk storage could result in collisions between the products or between the products and other parts, resulting in chipping or wire breakage. • Avoid storing the product by itself bare (i.e. exposed directly to air). Transportation Excessive vibration and impact reduces the reliability of the products. Exercise caution when handling the products. 12.10 Resin coating (including moisture-proof coating) Before applying any resin coating, please consult our technical department. 12.11 Mounting conditions Check the mounting condition before using. Using mounting conditions (nozzles, equipment conditions, etc.) that are not suitable for products may lead to pick up errors, misalignment, or damage to the product. 12.12 Operating environment Do not use this product under the following environmental conditions as it may cause deterioration of product quality. (1) In the corrodible atmosphere such as acidic gases, alkaline gases, chlorine, sulfur gases, organic gases and etc. (the sea breeze, Cl2, H2S, NH3, SO2, NO2, etc) (2) In the atmosphere where liquid such as organic solvent, may splash on the products. (3) In the atmosphere where the temperature/humidity changes rapidly and it is easy to dew. 12.13 Mounting density If this product is placed near heat-generating products, be sure to implement sufficient heat-dissipating measures. If this product is subjected to a significant amount of heat from other products, this could adversely affect product quality, resulting in a circuit malfunction or failure of the mounted section. Also, be sure that the product is used in a manner so that the heat that the product is subjected to from other products does not exceed the upper limit of the rated operating temperature for the product. 13. Note (1) Please make sure that your product has been evaluated in view of your specifications with our product being mounted to your product. (2) You are requested not to use our product deviating from the reference specifications. (3) The contents of this reference specification are subject to change without advance notice. Please approve our product specifications or transact the approval sheet for product specifications before ordering. MURATA MFG CO., LTD Spec No.: JELF243C_0016K-01 P13/13 Appendix Electrical performance: Measuring method for inductance/Q (Q measurement is applicable only when the Q value is included in the rating table.) Perform measurement using the method described below. (Perform correction for the error deriving from the measuring terminal.) (1) Residual elements and stray elements of the measuring terminal can be expressed by the F parameter for the 2-pole terminal as shown in the figure below. (2) The product's impedance value (Zx) and measured impedance value (Zm) can be expressed as shown below, by using the respective current and voltage for input/output. Zm= V1 I1 Zx= V2 I2 (3) Thus, the relationship between the product's impedance value (Zx) and measured impedance value (Zm) is as follows. Zx=α Zm-β 1-ZmΓ Here, α = D/A = 1 β = B/D = Zsm - (1 - Yom Zsm) Zss Γ = C/A = Yom Zsm: measured impedance of short chip Zss: residual impedance of short chip (0 nH) Yom: measured admittance when measuring terminal is open (4) Calculate inductance Lx and Qx using the equations shown below. Im(Zx) Lx: inductance of chip coil Lx= 2πf Qx: Q of chip coil Im(Zx) Qx= f: measuring frequency Re(Zx) MURATA MFG CO., LTD