Reference Only
Spec No.JELF243C-0015T-01
P.1/12
CHIP COIL (CHIP INDUCTORS) LQP03TN□□□□02D REFERENCE SPECIFICATION
1.Scope
This reference specification applies to LQP03TN_02 series, Chip coil (Chip Inductors).
2.Part Numbering
(ex)
LQ
P
03
T
N
0N6
B
0
2
Product ID Structure Dimension Applications Category Inductance Tolerance Features
(L×W)
and
Characteristics
D
Electrode Packaging
D:Taping
*B:Bulk
*Bulk packing also available. (A product is put in the plastic bag under the taping conditions.)
3.Rating
・Operating Temperature Range. –55°C to +125°C
(Ambient temperature: Rated current can be handled in this temperature range.)
・Storage Temperature Range. –55°C to +125°C
Customer
Part Number
Inductance
MURATA
Part Number
(nH)
LQP03TN0N6B02D
LQP03TN0N6C02D
LQP03TN0N7B02D
LQP03TN0N7C02D
LQP03TN0N8B02D
LQP03TN0N8C02D
LQP03TN0N9B02D
LQP03TN0N9C02D
LQP03TN1N0B02D
LQP03TN1N0C02D
LQP03TN1N1B02D
LQP03TN1N1C02D
LQP03TN1N2B02D
LQP03TN1N2C02D
LQP03TN1N3B02D
LQP03TN1N3C02D
LQP03TN1N4B02D
LQP03TN1N4C02D
LQP03TN1N5B02D
LQP03TN1N5C02D
LQP03TN1N6B02D
LQP03TN1N6C02D
LQP03TN1N7B02D
LQP03TN1N7C02D
LQP03TN1N8B02D
LQP03TN1N8C02D
LQP03TN1N9B02D
LQP03TN1N9C02D
LQP03TN2N0B02D
LQP03TN2N0C02D
LQP03TN2N1B02D
LQP03TN2N1C02D
LQP03TN2N2B02D
LQP03TN2N2C02D
LQP03TN2N3B02D
LQP03TN2N3C02D
LQP03TN2N4B02D
LQP03TN2N4C02D
Tolerance
Q
(min)
0.6
DC
Resistance
(Ω max)
0.07
Self
Resonant
Frequency
(MHz)
Min.
*Typ.
Rated
Current
(mA)
850
20000
0.7
0.08
0.8
800
18000
0.9
20000
1.0
0.10
1.1
750
17000
1.2
1.3
16000
1.4
1.5
B:±0.1nH
C:±0.2nH
14
19600
17900
20000
1.6
0.15
15000
1.7
19100
1.8
17700
600
15100
1.9
12500
14800
2.0
13900
2.1
11000
13400
2.2
12900
2.3
0.20
2.4
MURATA MFG.CO., LTD
10000
12200
500
Spec No.JELF243C-0015T-01
Customer
Part Number
Reference Only
Inductance
MURATA
Part Number
(nH)
LQP03TN2N5B02D
LQP03TN2N5C02D
LQP03TN2N6B02D
LQP03TN2N6C02D
LQP03TN2N7B02D
LQP03TN2N7C02D
LQP03TN2N8B02D
LQP03TN2N8C02D
LQP03TN2N9B02D
LQP03TN2N9C02D
LQP03TN3N0B02D
LQP03TN3N0C02D
LQP03TN3N1B02D
LQP03TN3N1C02D
LQP03TN3N2B02D
LQP03TN3N2C02D
LQP03TN3N3B02D
LQP03TN3N3C02D
LQP03TN3N4B02D
LQP03TN3N4C02D
LQP03TN3N5B02D
LQP03TN3N5C02D
LQP03TN3N6B02D
LQP03TN3N6C02D
LQP03TN3N7B02D
LQP03TN3N7C02D
LQP03TN3N8B02D
LQP03TN3N8C02D
LQP03TN3N9B02D
LQP03TN3N9C02D
LQP03TN4N0B02D
LQP03TN4N0C02D
LQP03TN4N1B02D
LQP03TN4N1C02D
LQP03TN4N2B02D
LQP03TN4N2C02D
LQP03TN4N3H02D
LQP03TN4N3J02D
LQP03TN4N7H02D
LQP03TN4N7J02D
LQP03TN5N1H02D
LQP03TN5N1J02D
LQP03TN5N6H02D
LQP03TN5N6J02D
LQP03TN6N2H02D
LQP03TN6N2J02D
LQP03TN6N8H02D
LQP03TN6N8J02D
LQP03TN7N5H02D
LQP03TN7N5J02D
LQP03TN8N2H02D
LQP03TN8N2J02D
LQP03TN9N1H02D
LQP03TN9N1J02D
Tolerance
Q
(min)
DC
Resistance
(Ω max)
P.2/12
Self
Resonant
Frequency
(MHz)
Min.
*Typ.
12200
2.5
10000
2.6
0.20
2.7
13300
13000
9500
2.9
12400
3.0
11900
3.1
11300
8000
3.2
0.25
10600
10900
B:±0.1nH
C:±0.2nH
450
9400
3.4
7000
3.5
9600
3.6
9500
6000
3.7
0.30
5700
3.9
8200
8100
14
3.8
400
7900
8600
4.0
8400
4.1
5300
8600
4.2
4.3
9800
0.40
4.7
4400
8800
5.1
4200
8600
350
8000
5.6
6.2
500
11800
2.8
3.3
Rated
Current
(mA)
4000
H:±3%
J:±5%
7900
3900
8000
7.5
3700
6700
8.2
3600
6600
3300
5900
6.8
0.60
0.70
9.1
MURATA MFG.CO., LTD
300
250
Spec No.JELF243C-0015T-01
Customer
Part Number
Reference Only
Inductance
MURATA
Part Number
(nH)
LQP03TN10NH02D
LQP03TN10NJ02D
LQP03TN11NH02D
LQP03TN11NJ02D
LQP03TN12NH02D
LQP03TN12NJ02D
LQP03TN13NH02D
LQP03TN13NJ02D
LQP03TN15NH02D
LQP03TN15NJ02D
LQP03TN16NH02D
LQP03TN16NJ02D
LQP03TN18NH02D
LQP03TN18NJ02D
LQP03TN20NH02D
LQP03TN20NJ02D
LQP03TN22NH02D
LQP03TN22NJ02D
LQP03TN24NH02D
LQP03TN24NJ02D
LQP03TN27NH02D
LQP03TN27NJ02D
LQP03TN30NH02D
LQP03TN30NJ02D
LQP03TN33NH02D
LQP03TN33NJ02D
LQP03TN36NH02D
LQP03TN36NJ02D
LQP03TN39NH02D
LQP03TN39NJ02D
LQP03TN43NH02D
LQP03TN43NJ02D
LQP03TN47NH02D
LQP03TN47NJ02D
LQP03TN51NH02D
LQP03TN51NJ02D
LQP03TN56NH02D
LQP03TN56NJ02D
LQP03TN62NH02D
LQP03TN62NJ02D
LQP03TN68NH02D
LQP03TN68NJ02D
LQP03TN75NJ02D
LQP03TN75NH02D
LQP03TN82NH02D
LQP03TN82NJ02D
LQP03TN91NH02D
LQP03TN91NJ02D
LQP03TNR10H02D
LQP03TNR10J02D
LQP03TNR11H02D
LQP03TNR11J02D
LQP03TNR12H02D
LQP03TNR12J02D
Tolerance
Q
(min)
DC
Resistance
(Ω max)
0.70
10
P.3/12
Self
Resonant
Frequency
(MHz)
Min.
*Typ.
3200
Rated
Current
(mA)
5800
14
11
0.80
12
5400
2900
0.70
13
0.80
4300
2600
15
0.70
3800
16
0.95
3700
0.80
3400
18
12
2.30
3600
22
1.90
3300
150
3200
24
27
2.30
2000
2.95
1700
2900
140
2700
30
33
2600
H:±3%
2400
J:±5%
3.00
39
43
200
2200
20
36
250
1500
2200
9
47
120
3.60
1300
3.90
1200
2000
51
56
1800
62
8
68
100
1100
1500
75
1000
1400
900
1300
82
91
8
10
100
80
110
120
MURATA MFG.CO., LTD
12
800
1100
Spec No.JELF243C-0015T-01
Customer
Part Number
Reference Only
Inductance
MURATA
Part Number
(nH)
LQP03TNR13H02D
LQP03TNR13J02D
LQP03TNR15H02D
LQP03TNR15J02D
LQP03TNR16H02D
LQP03TNR16J02D
LQP03TNR18H02D
LQP03TNR18J02D
LQP03TNR20H02D
LQP03TNR20J02D
LQP03TNR22H02D
LQP03TNR22J02D
LQP03TNR24H02D
LQP03TNR24J02D
LQP03TNR27H02D
LQP03TNR27J02D
*Typical value is actual performance.
Q
(min)
DC
Resistance
(Ω max)
Tolerance
P.4/12
Self
Resonant
Frequency
(MHz)
Min.
*Typ.
Rated
Current
(mA)
960
130
150
9
650
11
600
13
500
880
80
840
160
180
H:±3%
J:±5%
200
790
5
220
750
710
630
240
15
270
70
60
450
580
4. Testing Conditions
《Unless otherwise specified》
Temperature : Ordinary Temperature / 15°C to 35°C
Humidity : Ordinary Humidity / 25%(RH) to 85 %(RH)
《In case of doubt》
Temperature : 20°C ± 2°C
Humidity
: 60%(RH) to 70 %(RH)
Atmospheric Pressure : 86kPa to 106 kPa
5. Appearance and Dimensions
(0.6nH to 62nH)
(68nH to 270nH)
0.3±0.03
0.3±0.03
■Unit Mass (Typical value)
0.0002g
0.6±0.03
0.6±0.03
0.3±0.03
0.15±0.05
0.3±0.03
0.15±0.05
MURATA MFG.CO., LTD
(in mm)
Spec No.JELF243C-0015T-01
Reference Only
P.5/12
6. Marking
Polarity Marking :white
Coloring side
Polarity Marking
7.Electrical Performance
No.
7.1
Item
Inductance
Specification
Inductance shall meet item 3.
7.2
Q
Q shall meet item 3.
Test Method
Measuring Equipment:
KEYSIGHT E4991A or equivalent
Measuring Frequency:
(0.6nH~30nH) 500MHz
(33nH~120nH) 300MHz
(130nH~270nH) 100MHz
Measuring Condition:
Test signal level / about 0dBm
Electrical length / 10mm
Weight / about 1N to 5N
Measuring Fixture: KEYSIGHT 16197A
Position coil under test as shown in below
and contact coil with each terminal by
adding weight. Coloring side should be a
topside, and should be in the direction of
the fixture for position of chip coil.
↑
Polarity Marking
7.3
7.4
7.5
DC Resistance
Self Resonant
Frequency(S.R.F)
Rated Current
DC Resistance shall meet item 3.
S.R.F shall meet item 3.
Self temperature rise shall be
limited to 25°C max.
Measuring Method:See P.12
Measuring Equipment:Digital multi meter
Measuring Equipment:
KEYSIGHT N5230A or equivalent
The rated current is applied.
MURATA MFG.CO., LTD
Spec No.JELF243C-0015T-01
Reference Only
P.6/12
8.Mechanical Performance
No.
8.1
Item
Shear Test
Specification
Chip coil shall not be damaged
after tested as test method.
Test Method
Substrate:Glass-epoxy substrate
Land
0.3
0.3
0.9
(in mm)
Force:2N
Hold Duration:5 s±1 s
Applied Direction: Parallel to PCB.
Chip coil
F
Substrate
8.2
Bending Test
Chip coil shall not be damaged
after tested as test method.
Substrate:Glass-epoxy substrate
(100mm×40mm×0.8mm)
Speed of Applying Force:1mm /s
Deflection:1mm
Hold Duration:30 s
Pressure jig
R340
F
Deflection
45
8.3
Vibration
Appearance:No damage
Inductance Change: within ±10%
8.4
Solderability
The electrode shall be at least 90%
covered with new solder coating.
8.5
Resistance to
Soldering Heat
Appearance:No damage
Inductance Change: within ±10%
45
Product
(in mm)
Substrate:Glass-epoxy substrate
Oscillation Frequency:
10Hz to 2000Hz to 10Hz for 20 min
Total amplitude 1.5 mm or Acceleration
amplitude 196 m/s2 whichever is smaller.
Testing Time:
A period of 2h in each of
3 mutually perpendicular directions.
Flux: Ethanol solution of rosin 25(wt)%
(Immersed for 5s to 10s)
Solder:Sn-3.0Ag-0.5Cu
Pre-Heating:150°C±10°C / 60s to 90s
Solder Temperature:240°C±5°C
Immersion Time:3s±1s
Flux: Ethanol solution of rosin 25(wt)%
(Immersed for 5s to 10s)
Solder:Sn-3.0Ag-0.5Cu
Pre-Heating:150°C±10°C / 60s to 90s
Solder Temperature:260°C±5°C
Immersion Time:5s±1s
Then measured after exposure in the room
condition for 24h±2h.
MURATA MFG.CO., LTD
Reference Only
Spec No.JELF243C-0015T-01
P.7/12
9.Environmental Performance
It shall be soldered on the substrate.
No.
Item
Specification
9.1 Heat Resistance
Appearance:No damage
Inductance Change: within ±10%
9.2
Cold Resistance
9.3
Humidity
9.4
Temperature
Cycle
Test Method
Substrate:Glass-epoxy substrate
Temperature:125°C
Time:1000h (+48h,-0h)
Then measured after exposure in the
room condition for 24h±2h.
Substrate:Glass-epoxy substrate
Temperature:-55°C
Time:1000 h (+48h,-0h)
Then measured after exposure in the
room condition for 24h±2h.
Substrate:Glass-epoxy substrate
Temperature:40°C±2°C
Humidity:90%(RH) to 95%(RH)
Time:1000 h(+48h,-0h)
Then measured after exposure in the
room condition for 24h±2h.
Substrate:Glass-epoxy substrate
1 cycle:
1 step: -55°C / 30min±3 min
2 step:Ordinary temp. / 10~15 min
3 step: 125°C / 30min±3 min
4 step: Ordinary temp. / 10~15 min
Total of 10 cycles
Then measured after exposure in the
room condition for 24h±2h.
10.Specification of Packaging
10.1 Appearance and Dimensions of paper tape (8mm-wide)
4.0±0.1
+0.1
φ1.5 -0
1.75±0.1
※A
Polarity
Marking
8.0±0.2
2.0±0.05
3.5±0.05
2.0±0.05
0.35±0.03
Direction of feed
※A
0.55 max.
(in mm)
0N6~62N、R13~R27; 0.67±0.03
68N~R12; 0.65±0.03
10.2 Specification of Taping
(1) Packing quantity (standard quantity)
15,000 pcs. / reel
(2) Packing Method
Products shall be packed in the cavity of the base tape and sealed by cover tape.
(3) Sprocket hole
The sprocket holes are to the right as the tape is pulled toward the user.
(4) Spliced point
Base tape and Cover tape has no spliced point.
(5) Missing components number
Missing components number within 0.1 % of the number per reel or 1 pc. , whichever is greater,
and are not continuous. The Specified quantity per reel is kept.
MURATA MFG.CO., LTD
Reference Only
Spec No.JELF243C-0015T-01
P.8/12
10.3 Pull Strength
Cover tape
5N min
10.4 Peeling off force of cover tape
Speed of Peeling off
Cover tape
300mm/min
0.1N to 0.6N
(minimum value is typical)
Peeling off force
F
165°to 180゜
Base tape
10.5 Dimensions of Leader-tape, Trailer and Reel
There shall be leader-tape ( top tape and empty tape) and trailer-tape (empty tape) as follows.
Trailer
160 min.
2.0±0.5
Leader
Label
190 min.
Empty tape
210 min.
Cover tape
φ 13.0±0.2
+1
φ 60 -0
φ 21.0±0.8
9.0 +1
-0
Direction of feed
13.0±1.4
(in mm)
+0
φ 180 -3
10.6 Marking for reel
Customer part number, MURATA part number, Inspection number(∗1) , RoHS Marking (∗2),
Quantity etc ・・・
□□ OOOO ×××
∗1)
(1)
(2)
(3)
(1) Factory Code
(2) Date
First digit : Year / Last digit of year
Second digit : Month / Jan. to Sep. → 1 to 9, Oct. to Dec. → O,N,D
Third, Fourth digit : Day
(3) Serial No.
∗2)
ROHS – Y (△)
(1) (2)
(1) RoHS regulation conformity parts.
(2) MURATA classification number
10.7 Marking for Outside package (corrugated paper box)
Customer name, Purchasing order number, Customer part number, MURATA part number,
RoHS Marking (∗2) ,Quantity, etc ・・・
10.8 Specification of Outer Case
Label
H
D
W
Outer Case Dimensions
(mm)
W
D
H
186
186
93
Standard Reel Quantity
in Outer Case (Reel)
5
∗ Above Outer Case size is typical. It depends on a quantity of an order.
MURATA MFG.CO., LTD
Reference Only
Spec No.JELF243C-0015T-01
P.9/12
11. ! Caution
Limitation of Applications
Please contact us before using our products for the applications listed below which require especially
high reliability for the prevention of defects which might directly cause damage to the third party's life,
body or property.
(1) Aircraft equipment
(6) Transportation equipment (vehicles, trains, ships, etc.)
(7) Traffic signal equipment
(2) Aerospace equipment
(3) Undersea equipment
(8) Disaster prevention / crime prevention equipment
(4) Power plant control equipment (9) Data-processing equipment
(5) Medical equipment
(10) Applications of similar complexity and /or reliability
requirements to the applications listed in the above
12. Notice
Products can only be soldered with reflow.
This product is designed for solder mounting.
Please consult us in advance for applying other mounting method such as conductive adhesive.
12.1 Land pattern designing
Chip Coil
c
Land
a
b
c
Solder resist
0.2~0.3
0.8~0.9
0.2~0.3
(in mm)
a
b
12.2 Flux, Solder
・ Use rosin-based flux.
Don’t use highly acidic flux with halide content exceeding 0.2(wt)% (chlorine conversion value).
Don’t use water-soluble flux.
・ Use Sn-3.0Ag-0.5Cu solder.
・ Standard thickness of solder paste : 100μm~150μm.
12.3 Reflow soldering conditions
・ Pre-heating should be in such a way that the temperature difference between solder and
product surface is limited to 150°C max. Cooling into solvent after soldering also should be
in such a way that the temperature difference is limited to 100°C max.
Insufficient pre-heating may cause cracks on the product, resulting in the deterioration of
products quality.
・ Standard soldering profile and the limit soldering profile is as follows.
The excessive limit soldering conditions may cause leaching of the electrode and / or resulting
in the deterioration of product quality.
・Reflow soldering profile
Temp.
(℃)
260℃
245℃±3℃
230℃
220℃
Limit Profile
180
150
Standard Profile
30s~60s
60s max.
90s±30s
Pre-heating
Heating
Peak temperature
Cycle of reflow
Time. (s)
Standard Profile
Limit Profile
150°C~180°C 、90s±30s
above 220°C、30s~60s
above 230°C、60s max.
245°C±3°C
260°C,10s
2 times
2 times
MURATA MFG.CO., LTD
Reference Only
Spec No.JELF243C-0015T-01
P.10/12
12.4 Reworking with soldering iron
The following conditions must be strictly followed when using a soldering iron.
Pre-heating
Tip temperature
Soldering iron output
Tip diameter
Soldering time
Time
150°C,1 min
350°C max.
80W max.
φ3mm max.
3(+1,-0)s
2 times
Note : Do not directly touch the products with the tip of the soldering iron in order to prevent the
crack on the products due to the thermal shock.
12.5 Solder Volume
・ Solder shall be used not to be exceeded the upper limits as shown below.
Upper Limit
Recommendable
t
1/3T≦t≦T
T : thickness of product
Accordingly increasing the solder volume, the mechanical stress to Chip is also increased.
Exceeding solder volume may cause the failure of mechanical or electrical performance.
12.6 Attention regarding P.C.B. bending
The following shall be considered when designing and laying out P.C.B.'s.
(1) P.C.B. shall be designed so that products are not subject to the mechanical stress due to
warping the board.
[Products direction]
a
b
〈 Poor example 〉
Products shall be located in the sideways
direction (Length:a<b) to the mechanical
stress.
〈 Good example 〉
(2) Products location on P.C.B. separation
Seam
b
C
B
D
A
Slit
Products (A,B,C,D) shall be located carefully
so that products are not subject to the
mechanical stress due to warping the board.
Because they may be subjected the mechanical
stress in order of A>C>B ≅ D.
Length:a< b
a
12.7 Cleaning Conditions
Products shall be cleaned on the following conditions.
(1) Cleaning temperature shall be limited to 60°C max.(40°C max for IPA)
(2) Ultrasonic cleaning shall comply with the following conditions with avoiding the resonance
phenomenon at the mounted products and P.C.B.
Power : 20 W / l max.
Frequency : 28kHz to 40kHz
Time : 5 min max.
(3) Cleaner
1. Alcohol type cleaner
Isopropyl alcohol (IPA)
2. Aqueous agent
PINE ALPHA ST-100S
(4) There shall be no residual flux and residual cleaner after cleaning.
In the case of using aqueous agent, products shall be dried completely after rinse with de-ionized
water in order to remove the cleaner.
(5) Other cleaning
Please contact us.
MURATA MFG.CO., LTD
Spec No.JELF243C-0015T-01
Reference Only
P.11/12
12.8 Resin coating
When products are coated with resin, please contact us in advance.
12.9 Handling of a substrate
(1)There is a possibility of chip cracking caused by PCBexpansion/contraction with heat, because stress
on a chip is different depending on PCB material and structure.
When the thermal expansion coefficient greatly differs between the board used for mounting and the chip,
it will cause cracking of the chip due to the thermal expansion and contraction.
The chip is assumed to be mounted on the PCB of glass-epoxy material, and we don't test with other
PCB material which has different thermal expansion coefficient from Glass-epoxy.
When other PCB materials are considered, please be sure to evaluate by yourself.
(2)After mounting products on a substrate, do not apply any stress to the product caused by bending or
twisting to the substrate when cropping the substrate, inserting and removing a connector from the
substrate or tightening screw to the substrate.
Excessive mechanical stress may cause cracking in the product.
In case of the mounting on flexible PCB, there is a possibility of chip cracking caused by mechanical stress
even from small bending or twisting.
When the flexible PCB is considered, please be sure to evaluate by yourself.
Bending
Twisting
12.10 Storage and Handing Requirements
(1) Storage period
Use the products within 12 months after delivered.
Solderability should be checked if this period is exceeded.
(2) Storage conditions
・Products should be stored in the warehouse on the following conditions.
Temperature : -10°C ~ 40°C
Humidity
: 15% to 85% relative humidity No rapid change on temperature and humidity.
・Products should not be stored on bulk packaging condition to prevent the chipping of the
core and the breaking of winding wire caused by the collision between the products.
・Products should be stored on the palette for the prevention of the influence from humidity,
dust and so on.
・Products should be stored in the warehouse without heat shock, vibration, direct sunlight and
so on.
(3) Handling Condition
Care should be taken when transporting or handling product to avoid excessive vibration or
mechanical shock.
13.! Note
(1)Please make sure that your product has been evaluated in view of your specifications with our product being
mounted to your product.
(2)You are requested not to use our product deviating from the reference specifications.
(3)The contents of this reference specification are subject to change without advance notice.
Please approve our product specifications or transact the approval sheet for product specifications
before ordering.
MURATA MFG.CO., LTD
Reference Only
Spec No.JELF243C-0015T-01
P.12/12
(1) Residual elements and stray elements of test fixture can be described by F-parameter shown in following.
I2
I1
Zm
A
B
C
D
V2
V1
Test Head
Test fixture
Zx
V1
=
I1
A B
C D
V2
I2
Product
(2) The impedance of chip coil Zx and measured value Zm can be described by input/output current/voltage.
Zm=
V1
I1
,
V2
Zx= I
2
(3) Thus,the relation between Zx and Zm is following;
Zm-β
where, α= D / A =1
Zx= α 1-ZmΓ
β= B / D =Zsm-(1-Yom Zsm)Zss
Γ= C / A =Yom
Zsm:measured impedance of short chip
Zss:residual impedance of short chip (0.480nH)
Yom:measured admittance when opening the fixture
(4) Lx and Qx shall be calculated with the following equation.
Im(Zx)
Im(Zx)
Qx=
Lx= 2πf
,
Re(Zx)
Lx :Inductance of chip coil
Qx:Q of chip coil
f :Measuring frequency
MURATA MFG.CO., LTD