LQP15MN18NG02

Reference Only Spec No.JELF243C-0007Q-01 P.1/10 CHIP COIL (CHIP INDUCTORS) LQP15MN□□□□02D Reference Specification 1.Scope This reference specification applies to LQP15MN_02 series, Chip coil (Chip Inductors). 2.Part Numbering (ex) LQ P 15 M N Product ID Structure Dimension Applications Category (L×W) and Characteristics 1N0 W 0 2 Inductance Tolerance Features Electrode D Packaging D:Taping *B:Bulk Bulk packing also available. (A product is put in the plastic bag under the taping conditions.) 3.Rating ・Operating Temperature Range. –40°C to +85°C (Ambient temperature: Rated current can be handled in this temperature range.) ・Storage Temperature Range. –40°C to +85°C Customer Part Number Inductance MURATA Part Number (nH) LQP15MN1N0W02D LQP15MN1N0B02D LQP15MN1N1W02D LQP15MN1N1B02D LQP15MN1N2W02D LQP15MN1N2B02D LQP15MN1N3W02D LQP15MN1N3B02D LQP15MN1N4W02D LQP15MN1N5W02D LQP15MN1N5B02D LQP15MN1N6W02D LQP15MN1N6B02D LQP15MN1N7W02D LQP15MN1N8W02D LQP15MN1N8B02D LQP15MN1N9W02D LQP15MN2N0W02D LQP15MN2N0B02D LQP15MN2N1W02D LQP15MN2N2W02D LQP15MN2N2B02D LQP15MN2N3W02D LQP15MN2N4W02D LQP15MN2N4B02D LQP15MN2N5W02D LQP15MN2N6W02D LQP15MN2N7W02D LQP15MN2N7B02D LQP15MN2N8W02D LQP15MN2N9W02D LQP15MN3N0W02D LQP15MN3N0B02D LQP15MN3N1W02D LQP15MN3N2W02D LQP15MN3N3W02D LQP15MN3N3B02D Q (min) Tolerance DC Resistance (Ω max) Self Resonant Frequency (MHz min) 1.0 Rated Current (mA) 400 0.1 1.1 390 1.2 1.3 1.4 0.2 280 0.3 220 0.2 280 1.5 1.6 1.7 1.8 1.9 2.0 2.1 W:±0.05nH B:±0.1nH 13 6000 2.2 2.3 0.3 220 0.4 190 2.4 2.5 2.6 2.7 2.8 2.9 3.0 3.1 3.2 3.3 MURATA MFG.CO.,LTD Reference Only Spec No.JELF243C-0007Q-01 Customer Part Number P.2/10 Inductance MURATA Part Number (nH) LQP15MN3N4W02D LQP15MN3N5W02D LQP15MN3N6W02D LQP15MN3N6B02D LQP15MN3N7W02D LQP15MN3N8W02D LQP15MN3N9W02D LQP15MN3N9B02D LQP15MN4N3B02D LQP15MN4N7B02D LQP15MN5N1B02D LQP15MN5N6B02D LQP15MN6N2B02D LQP15MN6N8B02D LQP15MN7N5B02D LQP15MN8N2B02D LQP15MN9N1B02D LQP15MN10NG02D LQP15MN12NG02D LQP15MN15NG02D LQP15MN18NG02D LQP15MN22NG02D LQP15MN27NG02D LQP15MN33NG02D Q (min) Tolerance DC Resistance (Ω max) Self Resonant Frequency (MHz min) Rated Current (mA) 3.4 3.5 3.6 3.7 3.8 W:±0.05nH B:±0.1nH 0.5 3.9 4.3 4.7 5.1 5.6 6.2 6.8 7.5 8.2 9.1 10 12 15 18 22 27 33 170 6000 B:±0.1nH 0.6 160 0.7 140 0.9 130 13 G:±2% 1.1 5500 110 1.3 1.3 1.6 1.8 2.0 2.6 3.1 3.8 4500 4500 3700 3300 3100 2800 2500 2100 100 100 90 90 80 70 70 60 4. Testing Conditions 《Unless otherwise specified》 《In case of doubt》 Temperature : 20°C ± 2°C Temperature : Ordinary Temperature / 15°C to 35°C : Ordinary Humidity / 25%(RH) to 85%(RH) Humidity : 60%(RH) to 70%(RH) Humidity Atmospheric Pressure : 86kPa to 106 kPa 0.5±0.10 5. Appearance and Dimensions 1.0±0.10 ■Unit Mass (Typical value) 0.35±0.10 0.0006g 0.25±0.10 *The pattern of the coil differs in each inductance value. 0.25±0.10 (in mm) MURATA MFG.CO.,LTD Reference Only Spec No.JELF243C-0007Q-01 P.3/10 6.Electrical Performance No. 6.1 Item Inductance Specification Inductance shall meet item 3. 6.2 Q Q shall meet item 3. Test Method Measuring Equipment: KEYSIGHT 4291A or equivalent Measuring Frequency:500MHz Measuring Condition: Test signal level / about 7dBm Electrical length / 0.94cm Weight / about 1N to 5N Measuring Fixture: KEYSIGHT 16193A Position coil under test as shown in below and contact coil with each terminal by adding weight. Coil pattern should be a topside, and inner end of the coil should be in the direction of the fixture for position of chip coil. Inner end of the coil 0.5mm 11.5mm 6.3 6.4 6.5 DC Resistance Self Resonant Frequency(S.R.F) Rated Current DC Resistance shall meet item 3. S.R.F shall meet item 3. Self temperature rise shall be limited to 25°C max. Measuring Method:See the endnote. Measuring Equipment:Digital multi meter Measuring Equipment: KEYSIGHT 8753C or equivalent The rated current is applied. 7.Mechanical Performance No. 7.1 Item Shear Test Specification Chip coil shall not be damaged after tested as test method. Test Method Substrate:Glass-epoxy substrate Force:10N Hold Duration:5s±1s Applied Direction: Parallel to PCB. Chip Coil F Substrate 7.2 Bending Test Chip coil shall not be damaged after tested as test method. Substrate:Glass-epoxy substrate (100mm×40mm×1.6mm) Speed of Applying Force:1mm/s Deflection:2mm Hold Duration:30 s Pressure jig R340 F Deflection 45 MURATA MFG.CO.,LTD 45 Product (in mm) Reference Only Spec No.JELF243C-0007Q-01 P.4/10 No. 7.3 Item Vibration Specification Appearance:No damage Inductance Change: within ±10% 7.4 Solderability The electrode shall be at least 90% covered with new solder coating. 7.5 Resistance to Soldering Heat Appearance:No damage Inductance Change: within ±10% Test Method Oscillation Frequency: 10Hz to 55Hz to 10Hz for 1 min Total Amplitude:1.5mm Testing Time: A period of 2 h in each of 3 mutually perpendicular directions. Flux: Ethanol solution of rosin 25(wt)% (Immersed for 5s to 10s) Solder:Sn-3.0Ag-0.5Cu Pre-Heating:150°C±10°C / 60s to 90s Solder Temperature:240°C±5°C Immersion Time:3s±1s Flux: Ethanol solution of rosin 25(wt)% (Immersed for 5s to 10s) Solder:Sn-3.0Ag-0.5Cu Pre-Heating:150°C±10°C / 60s to 90s Solder Temperature:270°C±5°C Immersion Time:10s±1s Then measured after exposure in the room condition for 24h±2h. 8.Environmental Performance It shall be soldered on the substrate. No. Item Specification 8.1 Heat Resistance Appearance:No damage Inductance Change: within ±10% 8.2 Cold Resistance 8.3 Humidity 8.4 Temperature Cycle Test Method Temperature:85°C±2°C Time:1000h(+48h,-0h) Then measured after exposure in the room condition for 24h±2h. Temperature:-40°C±2°C Time:1000h(+48h,-0h) Then measured after exposure in the room condition for 24h±2h. Temperature:40°C±2°C Humidity:90%(RH) to 95%(RH) Time:1000h(+48h,-0h) Then measured after exposure in the room condition for 24h±2h. 1 cycle: 1 step:-40°C±2°C / 30 min ± 3 min 2 step:Ordinary temp. / 10 min to 15 min 3 step:+85°C±2°C / 30 min ± 3 min 4 step:Ordinary temp. / 10 min to 15 min Total of 10 cycles Then measured after exposure in the room condition for 24h±2h. 9.Specification of Packaging 9.1 Appearance and Dimensions of paper tape (8mm-wide) 1.20±0.05 0.70±0.05 Direction of feed MURATA MFG.CO.,LTD 8.0±0.2 Φ 1.5±0.1 0 3.5±0.05 2.0±0.05 2.0±0.05 4.0±0.1 1.75±0.1 Electrode which is connected to the inner end of the coil. 0.8 max (in mm) Reference Only Spec No.JELF243C-0007Q-01 P.5/10 9.2 Specification of Taping (1) Packing quantity (standard quantity) 10,000 pcs / reel (2) Packing Method Products shall be packed in the cavity of the base tape and sealed by top tape and bottom tape. (3) Sprocket hole The sprocket holes are to the right as the tape is pulled toward the user. (4) Spliced point Base tape and Top tape has no spliced point. (5) Missing components number Missing components number within 0.1 % of the number per reel or 1 pc., whichever is greater, and are not continuous. The Specified quantity per reel is kept. 9.3 Pull Strength Top tape Bottom tape 5N min. 9.4 Peeling off force of cover tape Speed of Peeling off 165 to 180 degree 300mm/min 0.1N to 0.6N (minimum value is typical) Peeling off force Top tape F Bottom tape Base tape 9.5 Dimensions of Leader-tape, Trailer and Reel There shall be leader-tape ( top tape and empty tape) and trailer-tape (empty tape) as follows. 2.0±0.5 Trailer 160 min. Leader Label 190 min. Empty tape 210 min. Top tape φ 13.0±0.2 +1 φ 60 -0 φ 21.0±0.8 9.0 +1 -0 Direction of feed 13.0±1.4 +0 (in mm) φ 180 -3 9.6 Marking for reel Customer part number, MURATA part number, Inspection number(∗1) , RoHS Marking (∗2), Quantity etc ･･･ ∗1) (1) Factor (2) Date (3) Serial No. □□ OOOO ××× (1) (2) (3) First digit : Year / Last digit of year Second digit : Month / Jan. to Sep. → 1 to 9, Oct. to Dec. → O,N,D Third, Fourth digit : Day ∗2) ROHS – Y (△) (1) RoHS regulation conformity parts. (2) MURATA classification number MURATA MFG.CO.,LTD (1) (2) Reference Only Spec No.JELF243C-0007Q-01 P.6/10 9.7 Marking for Outside package (corrugated paper box) Customer name, Purchasing order number, Customer part number, MURATA part number, RoHS Marking (∗2) ,Quantity, etc ･･･ 9.8. Specification of Outer Case Outer Case Dimensions (mm) W D H 186 186 93 Label H Standard Reel Quantity in Outer Case (Reel) 5 D ∗ Above Outer Case size is typical. It depends on a quantity of an order. W 10. Caution Limitation of Applications Please contact us before using our products for the applications listed below which require especially high reliability for the prevention of defects which might directly cause damage to the third party's life, body or property. (1) Aircraft equipment (6) Transportation equipment (vehicles, trains, ships, etc.) (7) Traffic signal equipment (2) Aerospace equipment (3) Undersea equipment (8) Disaster prevention / crime prevention equipment (4) Power plant control equipment (9) Data-processing equipment (10) Applications of similar complexity and /or reliability (5) Medical equipment requirements to the applications listed in the above 11. Notice Products can only be soldered with reflow. This product is designed for solder mounting. Please consult us in advance for applying other mounting method such as conductive adhesive. 11.1 Land pattern designing Chip Coil c Land Solder resist a b c a 0.4 1.4~1.5 0.5~0.6 (in mm) b 11.2 Flux, Solder ・Use rosin-based flux. Don’t use highly acidic flux with halide content exceeding 0.2(wt)% (chlorine conversion value). Don’t use water-soluble flux. ・Use Sn-3.0Ag-0.5Cu solder. ・Standard thickness of solder paste : 100μm~150μm. 11.3 Reflow soldering conditions ・Pre-heating should be in such a way that the temperature difference between solder and product surface is limited to 150°C max. Cooling into solvent after soldering also should be in such a way that the temperature difference is limited to 100°C max. Insufficient pre-heating may cause cracks on the product, resulting in the deterioration of products quality. ・Standard soldering profile and the limit soldering profile is as follows. The excessive limit soldering conditions may cause leaching of the electrode and / or resulting in the deterioration of product quality. MURATA MFG.CO.,LTD Reference Only Spec No.JELF243C-0007Q-01 P.7/10 ・Reflow soldering profile Temp. (℃) 260℃ 245℃±3℃ 220℃ 230℃ Limit Profile 180 150 Standard Profile 30s～60s 60s max. 90s±30s Pre-heating Heating Peak temperature Cycle of reflow Time. (s) Standard Profile Limit Profile 150°C～180°C 、90s±30s above 220°C､30s～60s above 230°C､60s max. 245°C±3°C 260°C,10s 2 times 2 times 11.4 Reworking with soldering iron The following conditions must be strictly followed when using a soldering iron. Pre-heating Tip temperature Soldering iron output Tip diameter Soldering time Time 150°C,1 min 350°C max. 80W max. φ3mm max. 3(+1,-0)s 2 times Note : Do not directly touch the products with the tip of the soldering iron in order to prevent the crack on the products due to the thermal shock. 11.5 Solder Volume ・Solder shall be used not to be exceeded the upper limits as shown below. Upper Limit 1/3T≦t≦T T : thickness of product Recommendable t Accordingly increasing the solder volume, the mechanical stress to Chip is also increased. Exceeding solder volume may cause the failure of mechanical or electrical performance. 11.6 Attention regarding P.C.B. bending The following shall be considered when designing and laying out P.C.B.'s. (1) P.C.B. shall be designed so that products are not subject to the mechanical stress due to warping the board. ［Products direction］ a b 〈 Poor example〉 〈 Good example〉 Products shall be located in the sideways direction (Length: a＜b) to the mechanical stress. (2) Components location on P.C.B. separation. It is effective to implement the following measures, to reduce stress in separating the board. It is best to implement all of the following three measures; however, implement as many measures as possible to reduce stress. MURATA MFG.CO.,LTD Reference Only Spec No.JELF243C-0007Q-01 P.8/10 Contents of Measures Stress Level (1) Turn the mounting direction of the component parallel to the board separation surface. A > D *1 (2) Add slits in the board separation part. A > B (3) Keep the mounting position of the component away from the board separation surface. A > C *1 A > D is valid when stress is added vertically to the perforation as with Hand Separation. If a Cutting Disc is used, stress will be diagonal to the PCB, therefore A > D is invalid. Seam b A C B D Slit Length:a< b a (3) Mounting Components Near Screw Holes When a component is mounted near a screw hole, it may be affected by the board deflection that occurs during the tightening of the screw. Mount the capacitor in a position as far away from the screw holes as possible. 11.7 Cleaning Conditions Products shall be cleaned on the following conditions. (1) Cleaning temperature shall be limited to 60°C max.(40°C max for IPA) (2) Ultrasonic cleaning shall comply with the following conditions with avoiding the resonance phenomenon at the mounted products and P.C.B. Power : 20 W / l max. Frequency : 28kHz to 40kHz Time : 5 min max. (3) Cleaner 1. Alcohol type cleaner Isopropyl alcohol (IPA) 2. Aqueous agent PINE ALPHA ST-100S (4) There shall be no residual flux and residual cleaner after cleaning. In the case of using aqueous agent, products shall be dried completely after rinse with de-ionized water in order to remove the cleaner. (5) Other cleaning Please contact us. 11.8 Resin coating Inductance value may be changed due to the large cure-stress of the resin when products are coated with resin. In this case, take care when you select resin to prevent the deterioration of the product quality. 11.9 Caution for use The pattern of the chip coil is covered with the protection film. But the handing the chip coil shall be taken care so that the chip coil would not be damaged with the pick-up nozzle, the sharp substance and so on. MURATA MFG.CO.,LTD Reference Only Spec No.JELF243C-0007Q-01 P.9/10 11.10 Handling of a substrate After mounting products on a substrate, do not apply any stress to the product caused by bending or twisting to the substrate when cropping the substrate, inserting and removing a connector from the substrate or tightening screw to the substrate. Excessive mechanical stress may cause cracking in the product. Bending Twisting 11.11 Storage and Handing Requirements (1) Storage period Use the products within 12 months after delivered.Solderability should be checked if this period is exceeded. (2) Storage conditions ・Products should be stored in the warehouse on the following conditions. Temperature ： -10°C ~ 40°C Humidity ： 15% to 85% relative humidity No rapid change on temperature and humidity. ・Products should not be stored on bulk packaging condition to prevent the chipping of the core and the breaking of winding wire caused by the collision between the products. ・Products should be stored on the palette for the prevention of the influence from humidity, dust and so on. ・Products should be stored in the warehouse without heat shock, vibration, direct sunlight and so on. (3) Handling Condition Care should be taken when transporting or handling product to avoid excessive vibration or mechanical shock. 12.Structure, Construction material 13. No. ① ② ③ Item Substrate Pattern of the Coil Electrode General Material Name Composition of Glass and Ceramic Ni alloy + Ag plating Ni alloy + Ni plating + Sn plating ④ Coating Polyimide ! △ Notes (1)Please make sure that your product has been evaluated in view of your specifications with our product being mounted to your product. (2)You are requested not to use our product deviating from the reference specifications. (3)The contents of this reference specification are subject to change without advance notice. Please approve our product specifications or transact the approval sheet for product specifications before ordering. MURATA MFG.CO.,LTD Reference Only Spec No.JELF243C-0007Q-01 P.10/10 (1) Residual elements and stray elements of test fixture can be described by F-parameter shown in following. I2 I1 Zm V1 Test Head A B C D Test fixture V2 Zx V1 = I1 A B C D V2 I2 Product (2) The impedance of chip coil Zx and measured value Zm can be described by input/output current/voltage. V1 V2 Zm= Zx= I1 ， I2 (3) Thus,the relation between Zx and Zm is following; Zm-β where, α= D / A =1 Zx= α β= B / D =Zsm-(1-Yom Zsm) Zss 1-ZmΓ Γ= C / A =Yom Zsm:measured impedance of short chip Zss:residual impedance of short chip (0.556nH) Yom:measured admittance when opening the fixture (4) Lx and Qx shall be calculated with the following equation. Im(Zx) Im(Zx) Lx= Qx= 2πf ， Re(Zx) Lx :Inductance of chip coil Qx :Q of chip coil f :Measuring frequency MURATA MFG.CO.,LTD