LQP18MN82NG02D

Reference Only Spec No.JELF243C-0009J-01 P.1/9 CHIP COIL (CHIP INDUCTORS) LQP18MN□□□□02D Reference Specification 1.Scope This reference specification applies to LQP18MN_02 series, Chip coil (Chip Inductors). 2.Part Numbering (ex) LQ P 18 M N 1N3 C 0 2 D Product ID Structure Dimension Applications Category Inductance Tolerance Features Electrode Packaging (L×W) and D:Taping Characteristics *B:Bulk Bulk packing also available. (A product is put in the plastic bag under the taping conditions.) 3.Rating ・Operating Temperature Range. –40°C to +85°C (Ambient temperature : Rated current can be handled in this temperature range.) –40°C to +85°C ・Storage Temperature Range. Customer Part Number MURATA Part Number LQP18MN1N3C02D LQP18MN1N5C02D LQP18MN1N8C02D LQP18MN2N2C02D LQP18MN2N7C02D LQP18MN3N3C02D LQP18MN3N9C02D LQP18MN4N7C02D LQP18MN5N6C02D LQP18MN6N8C02D LQP18MN8N2C02D LQP18MN10NG02D LQP18MN12NG02D LQP18MN15NG02D LQP18MN18NG02D LQP18MN22NG02D LQP18MN27NG02D LQP18MN33NG02D LQP18MN39NG02D LQP18MN47NG02D LQP18MN56NG02D LQP18MN68NG02D LQP18MN82NG02D LQP18MNR10G02D Inductance (nH) 1.3 1.5 1.8 2.2 2.7 3.3 3.9 4.7 5.6 6.8 8.2 10 12 15 18 22 27 33 39 47 56 68 82 100 Tolerance Q (min.) DC Self Resonant Resistance Frequency (Ω max.) (MHz min.) 0.3 Rated Current (mA) 300 6000 0.4 250 ±0.2nH 0.5 0.6 0.7 0.8 17 1.0 1.3 1.5 1.9 2.4 ±2% 2.8 2.2 3.4 3.5 4.6 6.1 5900 5200 4700 4300 3600 3400 3000 2700 2300 2100 1900 1700 1400 1200 1000 900 800 700 200 150 100 50 4. Testing Conditions 《Unless otherwise specified》 《In case of doubt》 Temperature : Ordinary Temperature / 15°C to 35°C Temperature : 20°C ± 2°C : Ordinary Humidity / 25%(RH) to 85 %(RH) Humidity : 60%(RH) to 70 %(RH) Humidity Atmospheric Pressure : 86kPa to 106 kPa MURATA MFG.CO.,LTD Reference Only Spec No.JELF243C-0009J-01 P.2/9 0.8±0.15 5. Appearance and Dimensions ■Unit Mass (Typical value) 1.6±0.15 0.5±0.1 0.002g 0.2 min. *The pattern of the coil differs in each inductance value. (in mm) 0.2 min. 6.Electrical Performance No. 6.1 6.2 Item Inductance Q Specification Inductance shall meet item 3. Test Method Measuring Equipment: Agilent4291A or equivalent Measuring Frequency: 500MHz / 1.3nH to 39nH 300MHz / 47nH to 100nH Measuring Condition: Test signal level / about 7dBm Electrical length / 0.94cm Weight / about 1N to 5N Measuring Fixture: Agilent 16193A Position coil under test as shown in below and contact coil with each terminal by adding weight. Coil pattern should be a topside, and inner end of the coil should be in the direction of the fixture for position of chip coil. Q shall meet item 3. 1mm Inner end of the coil. 6.97mm 6.3 6.4 6.5 DC Resistance Self Resonant Frequency(S.R.F) Rated Current DC Resistance shall meet item 3. S.R.F shall meet item 3. Self temperature rise shall be limited to 25°C max. Measuring Method: See P.9 Measuring Equipment: Digital multi meter Measuring Equipment: Agilent 8753C or equivalent The rated current is applied. MURATA MFG.CO.,LTD Reference Only Spec No.JELF243C-0009J-01 P.3/9 7.Mechanical Performance No. 7.1 Item Shear Test Specification Chip coil shall not be damaged after tested as test method. Test Method Substrate: Glass-epoxy substrate Land 0.7 1.0 (in mm) 1.0 0.6 Force:10N Hold Duration:5s±1s Applied Direction: Parallel to PCB. Chip Coil F Substrate Bending Test Chip coil shall not be damaged after tested as test method. Substrate: Glass-epoxy substrate (100mm×40mm×1.6mm) 0 .7 7.2 40 0.6 2.6 100 Solder resist (in mm) Speed of Applying Force:1mm / s Deflection:2mm Hold Duration:30s Pressure jig R340 F Deflection 45 45 Product (in mm) 7.3 Vibration Appearance: No damage Inductance Change:±10% within 7.4 Solderability The wetting area of the electrode shall be at least 95% covered with new solder coating. Pattern side Chip coil Oscillation Frequency: 10Hz to 55Hz to 10Hz for 1 min Total Amplitude:1.5mm Testing Time: A period of 2 hours in each of 3 mutually perpendicular directions. Flux: Ethanol solution of rosin 25(wt)% (Immersed for 5s to 10s) Solder:Sn-3.0Ag-0.5Cu Pre-Heating:150°C±10°C / 60s to 90s Solder Temperature:240°C±5°C Immersion Time:3s±1s The wetting area of the electrode MURATA MFG.CO.,LTD Reference Only Spec No.JELF243C-0009J-01 No. 7.5 Item Resistance to Soldering Heat P.4/9 Specification Appearance: No damage Inductance Change:±10% within Test Method Flux: Ethanol solution of rosin 25(wt)% (Immersed for 5s to 10s) Solder:Sn-3.0Ag-0.5Cu Pre-Heating:150°C±10°C / 60s to 90s Solder Temperature:270°C±5°C Immersion Time:10s±1s Then measured after exposure in the room condition for 24h±2h. 8.Environmental Performance It shall be soldered on the substrate. No. Item Specification 8.1 Heat Resistance Appearance: No damage Inductance Change:±10% within 8.2 Cold Resistance 8.3 Humidity 8.4 Temperature Cycle Test Method Temperature:85°C±2°C Time:1000h (+48h.-0h) Then measured after exposure in the room condition for 24h±2h. Temperature:-40°C±2°C Time:1000h (+48h.-0h) Then measured after exposure in the room condition for 24h±2h. Temperature:40°C±2°C Humidity:90%(RH) to 95%(RH) Time:1000h (+48h.-0h) Then measured after exposure in the room condition for 24h±2h. 1 cycle: 1 step:-40°C±2°C / 30min±3 min 2 step: Ordinary temp. / 10 min to 15 min 3 step:+85°C±2°C / 30min±3 min 4 step: Ordinary temp. / 10min to 15 min Total of 10 cycles Then measured after exposure in the room condition for 24h±2h. 9.Specification of Packaging 9.1 Appearance and Dimensions of paper tape (8mm-wide) Electrode which is connected to the inner end of the coil. 3 .5 ±0 .1 1.75±0.1 8 .0 ±0 .3 0.1 φ 1.5±0 2 .0 ±0 .1 4.0±0.1 2.0±0.1 4.0±0.1 1.19±0.1 Direction of feed 0.8max (in mm) 9.2 Specification of Taping (1) Packing quantity (standard quantity) 4,000 pcs / reel (2) Packing Method Products shall be packed in the cavity of the base tape and sealed by top tape and bottom tape. (3) Sprocket hole The sprocket holes are to the right as the tape is pulled toward the user. (4) Spliced point Base tape and Top tape has no spliced point. MURATA MFG.CO.,LTD Reference Only Spec No.JELF243C-0009J-01 P.5/9 (5) Missing components number Missing components number within 0.1 % of the number per reel or 1 pc., whichever is greater, and are not continuous. The Specified quantity per reel is kept. 9.3 Pull Strength Top tape Bottom tape 5N min. 9.4 Peeling off force of cover tape Speed of Peeling off 165 to 180 degree 300mm/min 0.1N to 0.6N (minimum value is typical) Peeling off force Top tape F Bottom tape Base tape 9.5 Dimensions of Leader-tape, Trailer and Reel There shall be leader-tape ( top tape and empty tape) and trailer-tape (empty tape) as follows. Trailer 160 min. 2.0±0.5 Leader Label 190 min. 210 min. Empty tape Top tape φ 13.0±0.2 +1 φ 60 -0 φ 21.0±0.8 9.0 +1 -0 Direction of feed 13.0±1.4 +0 φ 180 -3 (in mm) 9.6 Marking for reel Customer part number, MURATA part number, Inspection number(∗1) , RoHS Marking (∗2), Quantity etc ･･･ □□ OOOO ××× ∗1) (1) (2) (3) (1) Factory Code (2) Date First digit : Year / Last digit of year Second digit : Month / Jan. to Sep. → 1 to 9, Oct. to Dec. → O,N,D Third, Fourth digit : Day (3) Serial No. ∗2) ROHS – Y (△) (1) (2) (1) RoHS regulation conformity parts. (2) MURATA classification number 9.7 Marking for Outside package (corrugated paper box) Customer name, Purchasing order number, Customer part number, MURATA part number, RoHS Marking (∗2) ,Quantity, etc ･･･ 9.8. Specification of Outer Case Label H D Outer Case Dimensions (mm) W D H 186 186 93 Standard Reel Quantity in Outer Case (Reel) 5 ∗ Above Outer Case size is typical. It depends on a quantity of an order. W MURATA MFG.CO.,LTD Reference Only Spec No.JELF243C-0009J-01 P.6/9 10. ！ Caution Limitation of Applications Please contact us before using our products for the applications listed below which require especially high reliability for the prevention of defects which might directly cause damage to the third party's life, body or property. (1) Aircraft equipment (6) Transportation equipment (vehicles, trains, ships, etc.) (2) Aerospace equipment (7) Traffic signal equipment (8) Disaster prevention / crime prevention equipment (3) Undersea equipment (4) Power plant control equipment (9) Data-processing equipment (10) Applications of similar complexity and /or reliability (5) Medical equipment requirements to the applications listed in the above 11. Notice Products can only be soldered with reflow. This product is designed for solder mounting. Please consult us in advance for applying other mounting method such as conductive adhesive. 11.1 Land pattern designing Chip coil c a Solder Resist b Land a b c 0.7~0.9 1.8~2.2 0.6~0.8 (in mm) 11.2 Flux, Solder ･Use rosin-based flux. Don’t use highly acidic flux with halide content exceeding 0.2(wt)% (chlorine conversion value). Don’t use water-soluble flux. ･Use Sn-3.0Ag-0.5Cu solder. ･Standard thickness of solder paste : 100μm to 150μm. 11.3 Reflow soldering conditions ･Pre-heating should be in such a way that the temperature difference between solder and product surface is limited to 150°C max. Cooling into solvent after soldering also should be in such a way that the temperature difference is limited to 100°C max. Insufficient pre-heating may cause cracks on the product, resulting in the deterioration of products quality. ･Standard soldering profile and the limit soldering profile is as follows. The excessive limit soldering conditions may cause leaching of the electrode and / or resulting in the deterioration of product quality. ・Reflow soldering profile Temp. (℃) 260℃ 245℃±3℃ 220℃ 230℃ Limit Profile 180 150 Standard Profile 30s～60s 60s max. 90s±30s Pre-heating Heating Peak temperature Cycle of reflow Time. (s) Standard Profile Limit Profile 150°C～180°C 、90s±30s above 220°C､30s～60s above 230°C､60s max. 245°C±3°C 260°C,10s 2 times 2 times MURATA MFG.CO.,LTD Reference Only Spec No.JELF243C-0009J-01 P.7/9 11.4 Reworking with soldering iron. The following conditions must be strictly followed when using a soldering iron. Pre-heating Tip temperature Soldering iron output Tip diameter Soldering time Times 150°C,1 min 350°C max. 80W max. Φ3mm max. 3(+1,-0)s 2 times Note : Do not directly touch the products with the tip of the soldering iron in order to prevent the crack on the products due to the thermal shock. 11.5 Solder Volume ･ Solder shall be used not to be exceeded the upper limits as shown below. Upper Limit 1/3T≦t≦T T : thickness of product Recommendable t Accordingly increasing the solder volume, the mechanical stress to Chip is also increased. Exceeding solder volume may cause the failure of mechanical or electrical performance. 11.6 Attention regarding P.C.B. bending The following shall be considered when designing and laying out P.C.B.'s. (1) P.C.B. shall be designed so that products are not subject to the mechanical stress due to warping the board. ［Products direction］ a Products shall be located in the sideways direction (Length: a＜b) to the mechanical stress. b 〈 Poor example〉 〈 Good example〉 (2) Products location on P.C.B. separation Seam b C B D A Slit Length:a< b Products (A,B,C,D) shall be located carefully so that products are not subject to the mechanical stress due to warping the board. Because they may be subjected the mechanical stress in order of A＞C＞B≅D. a 11.7 Cleaning Conditions Products shall be cleaned on the following conditions. (1) Cleaning temperature shall be limited to 60°C max.(40°C max for IPA) (2) Ultrasonic cleaning shall comply with the following conditions with avoiding the resonance phenomenon at the mounted products and P.C.B. Power : 20 W / l max. Frequency : 28kHz to 40kHz Time : 5 min max. (3) Cleaner 1. Alcohol type cleaner Isopropyl alcohol (IPA) 2. Aqueous agent PINE ALPHA ST-100S (4) There shall be no residual flux and residual cleaner after cleaning. In the case of using aqueous agent, products shall be dried completely after rinse with de-ionized water in order to remove the cleaner. (5) Other cleaning Please contact us. MURATA MFG.CO.,LTD Reference Only Spec No.JELF243C-0009J-01 P.8/9 11.8 Resin coating Inductance value may be changed due to the large cure-stress of the resin when products are coated with resin. In this case, take care when you select resin to prevent the deterioration of the product quality. 11.9 Caution for use The pattern of the chip coil is covered with the protection film. But the handing the chip coil shall be taken care so that the chip coil would not be damaged with the pick-up nozzle, the sharp substance and so on. 11.10 Handling of a substrate After mounting products on a substrate, do not apply any stress to the product caused by bending or twisting to the substrate when cropping the substrate, inserting and removing a connector from the substrate or tightening screw to the substrate. Excessive mechanical stress may cause cracking in the product. Bending Twisting 11.11 Storage and Handing Requirements (1) Storage period Use the products within 12 months after delivered. Solderability should be checked if this period is exceeded. (2) Storage conditions ・Products should be stored in the warehouse on the following conditions. Temperature ： -10°C ~ 40°C Humidity ： 15% to 85% relative humidity No rapid change on temperature and humidity. ・Products should not be stored on bulk packaging condition to prevent the chipping of the core and the breaking of winding wire caused by the collision between the products. ・Products should be stored on the palette for the prevention of the influence from humidity, dust and so on. ・Products should be stored in the warehouse without heat shock, vibration, direct sunlight and so on. (3) Handling Condition Care should be taken when transporting or handling product to avoid excessive vibration or mechanical shock. 12．! Note (1)Please make sure that your product has been evaluated in view of your specifications with our product being mounted to your product. (2)You are requested not to use our product deviating from the reference specifications. (3)The contents of this reference specification are subject to change without advance notice. Please approve our product specifications or transact the approval sheet for product specifications before ordering. MURATA MFG.CO.,LTD Reference Only Spec No.JELF243C-0009J-01 P.9/9 (1) Residual elements and stray elements of test fixture can be described by F-parameter shown in following. I2 I1 A Zm B V2 V1 C Test Head Zx D Test fixture V1 I1 = A B C D V2 I2 Product (2) The impedance of chip coil Zx and measured value Zm can be described by input/output current/voltage. Zm= V1 I1 ， V2 Zx= I 2 (3) Thus,the relation between Zx and Zm is following; Zm-β where, α= D / A =1 Zx= α β= B / D =Zsm-(1-Yom Zsm)Zss 1-ZmΓ Γ= C / A =Yom Zsm:measured impedance of short chip Zss:residual impedance of short chip (0.771nH) Yom:measured admittance when opening the fixture (4) Lx and Qx shall be calculated with the following equation. Im(Zx) Im(Zx) Qx= Lx= 2πf ， Re(Zx) Lx :Inductance of chip coil Qx:Q of chip coil f:Measuring frequency MURATA MFG.CO.,LTD