Spec No.JELF243A-0051T-01
Reference Only
CHIP COIL (CHIP INDUCTORS)
LQW15AN□□□□10D
P.1/10
Reference Specification
1.Scope
This Reference Specification applies to LQW15AN_10 series, Chip coil (Chip Inductors).
2.Part Numbering
(ex)
LQ
W
15
A
N
1N3
C
1
0
D
Product ID Structure Dimension Applications Category Inductance Tolerance Features Electrode
(L×W)
and
Characteristics
Packaging
D:Taping
*B:Bulk
* Bulk packing also available. (A product is put in the plastic bag under the taping conditions.)
3.Rating
・Operating Temperature Range.
・Storage Temperature Range.
Customer
Part Number
MURATA
Part Number
LQW15AN1N3C10D
LQW15AN1N3D10D
LQW15AN1N4C10D
LQW15AN1N4D10D
LQW15AN2N2C10D
LQW15AN2N2D10D
LQW15AN2N3C10D
LQW15AN2N3D10D
–55°C ~ +125°C
–55°C ~ +125°C
Inductance
(nH)
LQW15AN3N6C10D
LQW15AN3N6D10D
LQW15AN3N8C10D
LQW15AN3N8D10D
LQW15AN3N9D10D
LQW15AN4N0C10D
LQW15AN4N0D10D
LQW15AN4N2C10D
LQW15AN4N2D10D
LQW15AN4N7D10D
LQW15AN5N1C10D
LQW15AN5N1D10D
LQW15AN5N2C10D
LQW15AN5N2D10D
LQW15AN5N3C10D
LQW15AN5N3D10D
LQW15AN5N4C10D
LQW15AN5N4D10D
LQW15AN5N5C10D
LQW15AN5N5D10D
LQW15AN5N6C10D
LQW15AN5N6D10D
20
0.017
16
1200
0.019
15
1100
0.027
14
1000
2.2
25
2.3
3.3
LQW15AN3N5D10D
Rated
Current
(mA)
C:±0.2nH
D:±0.5nH
2.4
LQW15AN3N5C10D
Self
Resonant
Frequency
(GHz min.)
1.4
LQW15AN3N3D10D
LQW15AN3N4D10D
DC
Resistance
(Ω max.)
1.3
LQW15AN2N4D10D
LQW15AN3N4C10D
Tolerance
Q
(min.)
D:±0.5nH
12
3.4
3.5
C:±0.2nH
D:±0.5nH
0.040
9.5
900
3.6
3.8
3.9
7
D:±0.5nH
4.0
C:±0.2nH
D:±0.5nH
4.2
4.7
6.5
30
D:±0.5nH
5.1
5.2
0.051
5.3
C:±0.2nH
D:±0.5nH
5.4
5.5
5.6
MURATA MFG.CO.,LTD
800
8
Reference Only
Spec No.JELF243A-0051T-01
Customer
Part Number
Inductance
MURATA
Part Number
(nH)
LQW15AN5N7C10D
Tolerance
Q
(min.)
DC
Resistance
(Ω max.)
Rated
Current
(mA)
0.051
8
800
0.056
7.7
760
0.058
6.8
750
0.079
7.5
640
5.7
LQW15AN5N7D10D
LQW15AN5N9C10D
P.2/10
Self
Resonant
Frequency
(GHz min.)
5.9
LQW15AN5N9D10D
LQW15AN6N0C10D
6.0
LQW15AN6N0D10D
LQW15AN6N1C10D
6.1
LQW15AN6N1D10D
LQW15AN7N4C10D
7.4
LQW15AN7N4D10D
LQW15AN7N6C10D
7.6
LQW15AN7N6D10D
LQW15AN7N7C10D
7.7
LQW15AN7N7D10D
LQW15AN7N8C10D
C:±0.2nH
D:±0.5nH
30
7.8
LQW15AN7N8D10D
LQW15AN7N9C10D
7.9
LQW15AN7N9D10D
LQW15AN8N0C10D
8.0
LQW15AN8N0D10D
LQW15AN8N1C10D
8.1
LQW15AN8N1D10D
LQW15AN8N3C10D
8.3
LQW15AN8N3D10D
LQW15AN8N4C10D
8.4
LQW15AN8N4D10D
4. Testing Conditions
《Unless otherwise specified》
《In case of doubt》
Temperature : Ordinary Temperature / 15°C to 35°C
Temperature : 20°C±2°C
: Ordinary Humidity
/ 25%(RH) to 85%(RH)
Humidity
: 60%(RH) to 70%(RH)
Humidity
Atmospheric Pressure : 86kPa to 106 kPa
5. Appearance and Dimensions
1.0±0.1
0.6±0.1
■Unit mass(Typical value)
0.0008g
0.1±0.05
0.5±0.1
0.5±0.1
0.2±0.1
0.2±0.1
MURATA MFG.CO.,LTD
(in mm)
Spec No.JELF243A-0051T-01
Reference Only
P.3/10
6.Electrical Performance
No.
6.1
Item
Inductance
Specification
Inductance shall meet item 3.
Test Method
Measuring Equipment:
KEYSIGHT E4991A or equivalent
Measuring Frequency:
100MHz
250MHz
Measuring Condition:
Test signal level / about 0dBm
Electrode spaces / 0.5mm
Electrical length / 0.94cm
Measuring Fixture: KEYSIGHT 16193A
Position coil under test as shown in below and
contact coil with each terminal by adding weight.
6.2
Q
Q shall meet item 3.
0.5mm
6.3
6.4
6.5
DC Resistance
Self Resonant
Frequency(S.R.F)
Rated Current
DC Resistance shall meet item 3.
S.R.F shall meet item 3.
Self temperature rise shall be
limited to 20°C max.
Measuring Method: See the endnote.
Measuring Equipment:Digital multi meter
Measuring Equipment: KEYSIGHT N5230A
or equivalent
The rated current is applied.
7.Mechanical Performance
No.
7.1
Item
Shear Test
Specification
Chip coil shall not be damaged
after tested as test method.
Test Method
Substrate:Glass-epoxy substrate
Chip Coil
Pattern
1.2
Solder resist
Substrate
0.65
(in mm)
0.5
Applied Direction:
Chip Coil
F
Substrate
7.2
Bending Test
Force:5N
Hold Duration:5s±1s
Substrate:Glass-epoxy substrate
(100mm×40mm×0.8mm)
Speed of Applying Force:1mm / s
Deflection:2mm
Hold Duration:5s
Pressure jig
R340
F
Deflection
45
MURATA MFG.CO.,LTD
45
(in mm)
Product
Reference Only
Spec No.JELF243A-0051T-01
No.
7.3
Item
Vibration
Specification
Chip coil shall not be damaged
after tested as test method.
7.4
Solderability
The wetting area of the electrode
shall be at least 90% covered with
new solder coating.
7.5
Resistance to
Soldering Heat
Appearance:No damage
Inductance Change: within ±5%
P.4/10
Test Method
Oscillation Frequency:
10Hz~55Hz~10Hz for 1 min
Total Amplitude:1.5mm
Testing Time:
A period of 2 hours in each of mutually
perpendicular directions.
Flux:Ethanol solution of rosin,25(wt)%
Includes activator equivalent to 0.06(wt)%
chlorine.(immersed for 5s to 10s)
Solder:Sn-3.0Ag-0.5Cu
Pre-Heating:150°C±10°C / 60s to 90s
Solder Temperature:240°C±5°C
Immersion Time:3s±1s
Flux:Ethanol solution of rosin,25(wt)%
Includes activator equivalent to 0.06(wt)%
chlorine.(immersed for 5s to 10s)
Solder:Sn-3.0Ag-0.5Cu
Pre-Heating:150°C±10°C / 60s to 90s
Solder Temperature:270°C±5°C
Immersion Time:10s±1s
Then measured after exposure in the room
condition for 24h±2h.
8.Environmental Performance
It shall be soldered on the substrate.
No.
Item
Specification
8.1 Heat Resistance
Appearance:No damage
Inductance Change: within ±5%
Q Change: within ±20%
8.2
Cold Resistance
8.3
Humidity
8.4
Temperature
Cycle
Test Method
Temperature:125°C±2°C
Time:1000h (+48h,0h)
Then measured after exposure in the room
condition for 24h±2h.
Temperature:-55°C±2°C
Time:1000h (+48h,-0h)
Then measured after exposure in the room
condition for 24±2 h.
Temperature:70°C±2°C
Humidity:90%(RH) to 95%(RH)
Time:1000h (+48h,-0h)
Then measured after exposure in the room
condition for 24h±2h.
1 cycle:
1 step:-55°C±2°C / 30min±3 min
2 step:Ordinary temp. / 10min to 15 min
3 step:+125°C±2°C / 30min±3 min
4 step:Ordinary temp. / 10min to15 min
Total of 10 cycles
Then measured after exposure in the room
condition for 24h±2h.
9.Tape Packing
9.1 Appearance and Dimensions of paper tape (8mm-wide)
φ1.5±0.1
0
1.75±0.1
1.18±0.03
8.0±0.2
4.0±0.1
3.5±0.05
2.0±0.05
Inductance
1.3nH, 1.4nH
2.2nH~8.4nH
(in mm)
A
2.0±0.05
0.8 max.
Direction of feed
MURATA MFG.CO.,LTD
A (in mm)
0.69±0.03
0.66±0.03
Reference Only
Spec No.JELF243A-0051T-01
P.5/10
9.2 Specification of Taping
(1) Packing quantity (standard quantity)
10,000 pcs. / reel
(2) Packing Method
Products shall be packed in the cavity of the base tape and sealed by Cover tape.
(3) Sprocket hole
The sprocket holes are to the right as the tape is pulled toward the user.
(4) Spliced point
Base tape and Cover tape has no spliced point.
(5) Missing components number
Missing components number within 0.1% of the number per reel or 1 pc., whichever is greater,
and are not continuous. The Specified quantity per reel is kept.
9.3 Pull Strength
Cover tape
Cover tape
5N min.
F
165°to 180゜
9.4 Peeling off force of top tape
Speed of Peeling off
Base tape
300mm/min
0.1 to 0.6N
(minimum value is typical)
Peeling off force
9.5 Dimensions of Leader-tape,Trailer and Reel
There shall be leader-tape ( cover tape and empty tape) and trailer-tape (empty tape) as follows.
2.0±0.5
Trailer
160 min.
Leader
Label
190 min.
Empty tape
210 min.
Cover tape
φ 13.0±0.2
+1
φ 60 -0
φ 21.0±0.8
9.0 +1
-0
Direction of feed
(in mm)
13.0±1.4
+0
φ 180 -3
9.6 Marking for reel
Customer part number, MURATA part number, Inspection number(∗1) ,RoHS Marking(∗2),
Quantity etc ・・・
∗1)
□□ OOOO ×××
(1)
(2)
(3)
(1) Factory Code
(2) Date
First digit
: Year / Last digit of year
Second digit: Month / Jan. to Sep. → 1 to 9, Oct. to Dec. → O, N, D
Third, Fourth digit : Day
(3) Serial No.
∗2)
ROHS – Y (△)
(1) (2)
(1) RoHS regulation conformity parts.
(2) MURATA classification number
9.7 Marking for Outside package (corrugated paper box)
Customer name, Purchasing order number, Customer part number, MURATA part number,
RoHS Marking(∗2) ,Quantity, etc ・・・
MURATA MFG.CO.,LTD
Reference Only
Spec No.JELF243A-0051T-01
9.8. Specification of Outer Case
Label
H
Outer Case Dimensions
(mm)
W
D
H
186
186
93
P.6/10
Standard Reel Quantity
in Outer Case (Reel)
5
D
W
∗ Above Outer Case size is typical. It depends on a quantity of an order.
10. ! Caution
Limitation of Applications
Please contact us before using our products for the applications listed below which require especially
high reliability for the prevention of defects which might directly cause damage to the third party's life,
body or property.
(1) Aircraft equipment
(6) Transportation equipment (vehicles, trains, ships, etc.)
(7) Traffic signal equipment
(2) Aerospace equipment
(8) Disaster prevention / crime prevention equipment
(3) Undersea equipment
(4) Power plant control equipment (9) Data-processing equipment
(5) Medical equipment
(10) Applications of similar complexity and /or reliability
requirements to the applications listed in the above
11. Notice
Products can only be soldered with reflow.
This product is designed for solder mounting.
Please consult us in advance for applying other mounting method such as conductive adhesive.
11.1 Land pattern designing
Recommended land patterns for reflow soldering are as follows:
These have been designed for Electric characteristics and solderability.
Please follow the recommended patterns. Otherwise, their performance which includes electrical performance or
solderability may be affected, or result to "position shift" in soldering process.
Chip Coil
c
Land
Solder resist
a
b
c
0.50
1.2
0.65
(in mm)
a
b
11.2 Flux, Solder
・Use rosin-based flux.
Includes middle activator equivalent to 0.06(wt)% to 0.1(wt) % Chlorine.
Don’t use highly acidic flux with halide content exceeding 0.2(wt) % (chlorine conversion value).
Don’t use water-soluble flux.
・Use Sn-3.0Ag-0.5Cu solder.
・Standard thickness of solder paste : 100μm to 150μm.
11.3 Reflow soldering conditions
・Pre-heating should be in such a way that the temperature difference between solder and product
surface is limited to 150°C max. Cooling into solvent after soldering also should be in such a way
that the temperature difference is limited to 100°C max.
Insufficient pre-heating may cause cracks on the product, resulting in the deterioration of products
quality.
・Standard soldering profile and the limit soldering profile is as follows.
The excessive limit soldering conditions may cause leaching of the electrode and / or resulting
in the deterioration of product quality.
MURATA MFG.CO.,LTD
Spec No.JELF243A-0051T-01
Reference Only
・Reflow soldering profile
Temp.
(℃)
260℃
245℃±3℃
230℃
220℃
Limit Profile
180
150
Standard Profile
30s~60s
60s max.
90s±30s
Pre-heating
Heating
Peak temperature
Cycle of reflow
Time. (s)
Standard Profile
Limit Profile
150°C~180°C 、90s±30s
above 220°C、30s~60s
above 230°C、60s max.
245°C±3°C
260°C,10s
2 times
2 times
11.4 Reworking with soldering iron.
The following conditions must be strictly followed when using a soldering iron.
Pre-heating
Tip temperature
Soldering iron output
Tip diameter
Soldering time
Times
150°C,1 min
350°C max.
80W max.
Φ3mm max.
3(+1,-0)s
2 times
Note : Do not directly touch the products with the tip of the soldering iron in order to prevent the
crack on the products due to the thermal shock.
11.5 Solder Volume
・ Solder shall be used not to be exceeded the upper limits as shown below.
・ Accordingly increasing the solder volume, the mechanical stress to Chip is also increased.
Exceeding solder volume may cause the failure of mechanical or electrical performance.
T
⇔
Upper Limit
Recommendable(t)
1/3T≦t≦T
T:thickness of electrode
11.6 Product’s location
The following shall be considered when designing and laying out P.C.B.'s.
(1) P.C.B. shall be designed so that products are not subject to the mechanical stress due to
warping the board.
[Products direction]
a
b
〈 Poor example〉
〈 Good example〉
Products shall be located in the sideways
direction (Length:a<b) to the mechanical
stress.
MURATA MFG.CO.,LTD
P.7/10
Reference Only
Spec No.JELF243A-0051T-01
P.8/10
(2) Components location on P.C.B. separation.
It is effective to implement the following measures, to reduce stress in separating the board.
It is best to implement all of the following three measures; however, implement as many measures as possible
to reduce stress.
Contents of Measures
(1) Turn the mounting direction of the component parallel to the board separation surface.
(2) Add slits in the board separation part.
(3) Keep the mounting position of the component away from the board separation surface.
Seam
b
Stress Level
A > D *1
A > B
A > C
C
B
D
A
Slit
Length:a< b
a
*1 A > D is valid when stress is added vertically to the perforation as with Hand Separation.
If a Cutting Disc is used, stress will be diagonal to the PCB, therefore A > D is invalid.
(3) Mounting Components Near Screw Holes
When a component is mounted near a screw hole, it may be affected by the board deflection that occurs during
the tightening of the screw. Mount the component in a position as far away from the screw holes as possible.
11.7 Cleaning Conditions
Products shall be cleaned on the following conditions.
(1) Cleaning temperature shall be limited to 60°C max.(40°C max for IPA)
(2) Ultrasonic cleaning shall comply with the following conditions with avoiding the resonance
phenomenon at the mounted products and P.C.B.
Power : 20 W / l max.
Frequency : 28kHz to 40kHz
Time : 5 min max.
(3) Cleaner
1. Alcohol type cleaner
Isopropyl alcohol (IPA)
2. Aqueous agent
PINE ALPHA ST-100S
(4) There shall be no residual flux and residual cleaner after cleaning.
In the case of using aqueous agent, products shall be dried completely after rinse with de-ionized
water in order to remove the cleaner.
(5) Other cleaning
Please contact us.
MURATA MFG.CO.,LTD
Reference Only
Spec No.JELF243A-0051T-01
P.9/10
11.8 Resin coating
The inductance value may change due to high cure-stress of resin to be used for coating/molding products.
An open circuit issue may occur by mechanical stress caused by the resin, amount/cured shape of resin, or
operating condition etc. Some resin contains some impurities or chloride possible to generate chlorine by
hydrolysis under some operating condition may cause corrosion of wire of coil, leading to open circuit.
So, please pay your careful attention when you select resin in case of coating/molding the products with the resin.
Prior to use the coating resin, please make sure no reliability issue is observed by evaluating products
mounted on your board.
11.9 Caution for use
・Sharp material such as a pair of tweezers or other material such as bristles of cleaning brush , shall not be
touched to the winding portion to prevent the breaking of wire
・Mechanical shock should not be applied to the products mounted on the board to prevent the breaking of the core.
11.10 Notice of product handling at mounting
In some mounting machines,when picking up components support pin pushes up the components from the
bottom of base tape. In this case, please remove the support pin. The support pin may damage the
components and break wire.
In rare case ,the laser recognition can not recognize this component. Please contact us when you use laser
recognition. (There is no problem with the permeation and reflection type.)
11.11 Handling of a substrate
After mounting products on a substrate, do not apply any stress to the product caused by bending or twisting to the
substrate when cropping the substrate, inserting and removing a connector from the substrate or tightening screw
to the substrate.
Excessive mechanical stress may cause cracking in the product.
Bending
Twisting
11.12 Storage and Handing Requirements
(1) Storage period
Use the products within 12 months after delivered.
Solderability should be checked if this period is exceeded.
(2) Storage conditions
・Products should be stored in the warehouse on the following conditions.
Temperature : -10°C to 40°C
: 15% to 85% relative humidity No rapid change on temperature and humidity
Humidity
・Don't keep products in corrosive gases such as sulfur,chlorine gas or acid, or it may cause
oxidization of electrode, resulting in poor solderability.
・Products should not be stored on bulk packaging condition to prevent the chipping of the
core and the breaking of winding wire caused by the collision between the products.
・Products should be stored on the palette for the prevention of the influence from humidity,
dust and so on.
・Products should be stored in the warehouse without heat shock, vibration, direct sunlight and
so on.
(3) Handling Condition
Care should be taken when transporting or handling product to avoid excessive vibration or
mechanical shock.
MURATA MFG.CO.,LTD
Reference Only
Spec No.JELF243A-0051T-01
P.10/10
12. ! Note
(1)Please make sure that your product has been evaluated in view of your specifications with our product being
mounted to your product.
(2)You are requested not to use our product deviating from the reference specifications.
(3)The contents of this reference specification are subject to change without advance notice.
Please approve our product specifications or transact the approval sheet for product specifications
before ordering.
(1) Residual elements and stray elements of test fixture can be described by F-parameter shown in following.
I2
I1
A
Zm
B
V2
V1
D
C
Test Head
V1
=
I1
Zx
Test fixture
A B
C D
V2
I2
Product
(2) The impedance of chip coil Zx and measured value Zm can be described by input/output current/voltage.
Zm=
V1
I1
,
Zx=
V2
I2
(3) Thus,the relation between Zx and Zm is following;
Zx=α
where, α= D / A =1
β= B / D =Zsm-(1-Yom Zsm)Zss
Γ= C / A =Yom
Zm-β
1-ZmΓ
Zsm:measured impedance of short chip
Zss:residual impedance of short chip (0.556nH)
Yom:measured admittance when opening the fixture
(4) Lx and Qx shall be calculated with the following equation.
Lx=
Im(Zx)
2πf
,
Qx=
Im(Zx)
Re(Zx)
Lx :Inductance of chip coil
Qx:Q of chip coil
f :Measuring frequency
MURATA MFG.CO.,LTD
Mouser Electronics
Authorized Distributor
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LQW15AN1N3C10D LQW15AN3N3D10D LQW15AN3N4C10D LQW15AN3N4D10D LQW15AN2N2C10D
LQW15AN3N6C10D LQW15AN5N6C10D LQW15AN5N6D10D LQW15AN1N3D10D LQW15AN2N2D10D
LQW15AN2N4D10D LQW15AN3N6D10D LQW15AN3N9D10D LQW15AN4N7D10D LQW15AN5N1C10D
LQW15AN5N1D10D