Spec No.JELF243A-0100F-01
Reference Only
CHIP COIL (CHIP INDUCTORS) LQW15AN□□□□80D
P.1/15
Reference Specification
1.Scope
This Reference Specification applies to LQW15AN_80 series, Chip coil (Chip Inductors).
2.Part Numbering
(ex)
LQ
W
15
Product ID
Structure
Dimension
(L×W)
A
N
1N3
C
Applications Category Inductance Tolerance
and
Characteristics
8
0
D
Features
Electrode
Packaging
D:Taping
*B:Bulk
* Bulk packing also available. (A product is put in the plastic bag under the taping conditions.)
3.Rating
・Operating Temperature Range.
・Storage Temperature Range.
Customer
Part Number
MURATA
Part Number
LQW15AN1N3C80D
LQW15AN1N3D80D
LQW15AN1N5C80D
LQW15AN1N5D80D
LQW15AN1N6C80D
LQW15AN1N6D80D
LQW15AN1N7C80D
LQW15AN1N7D80D
LQW15AN2N2B80D
LQW15AN2N2C80D
LQW15AN2N2D80D
LQW15AN2N2G80D
LQW15AN2N3B80D
LQW15AN2N3C80D
LQW15AN2N3D80D
LQW15AN2N3G80D
LQW15AN2N4B80D
LQW15AN2N4C80D
LQW15AN2N4D80D
LQW15AN2N4G80D
LQW15AN2N5B80D
LQW15AN2N5C80D
LQW15AN2N5D80D
LQW15AN2N5G80D
LQW15AN2N6B80D
LQW15AN2N6C80D
LQW15AN2N6D80D
LQW15AN2N6G80D
LQW15AN2N7B80D
LQW15AN2N7C80D
LQW15AN2N7D80D
LQW15AN2N7G80D
LQW15AN2N8B80D
LQW15AN2N8C80D
LQW15AN2N8D80D
LQW15AN2N8G80D
LQW15AN2N9B80D
LQW15AN2N9C80D
LQW15AN2N9D80D
LQW15AN2N9G80D
–55°C ~ +125°C
–55°C ~ +125°C
Inductance
(nH)
Tolerance
Q
(min.)
1.3
1.5
1.6
C:±0.2nH
D:±0.5nH
DC
Resistance
(Ω max.)
Rated
Current
(mA)
0.012
3150
0.028
2100
20
1.7
Self
Resonant
Frequency
(GHz min.)
18.0
0.045
1450
0.065
1150
0.022
2530
2.2
2.3
15.5
2.4
2.5
2.6
30
0.030
B:±0.1nH
C:±0.2nH
D:±0.5nH
G:±2%
0.035
2.7
28
2.8
27
2.9
25
MURATA MFG.CO.,LTD
2100
14.5
1950
14.0
0.047
13.5
12.5
1500
Spec No.JELF243A-0100F-01
Customer
Part Number
Reference Only
MURATA
Part Number
LQW15AN3N0B80D
LQW15AN3N0C80D
LQW15AN3N0D80D
LQW15AN3N0G80D
LQW15AN3N3B80D
LQW15AN3N3C80D
LQW15AN3N3D80D
LQW15AN3N3G80D
LQW15AN3N4B80D
LQW15AN3N4C80D
LQW15AN3N4D80D
LQW15AN3N4G80D
LQW15AN3N5B80D
LQW15AN3N5C80D
LQW15AN3N5D80D
LQW15AN3N5G80D
LQW15AN3N6B80D
LQW15AN3N6C80D
LQW15AN3N6D80D
LQW15AN3N6G80D
LQW15AN3N7B80D
LQW15AN3N7C80D
LQW15AN3N7D80D
LQW15AN3N7G80D
LQW15AN3N8B80D
LQW15AN3N8C80D
LQW15AN3N8D80D
LQW15AN3N8G80D
LQW15AN3N9B80D
LQW15AN3N9C80D
LQW15AN3N9D80D
LQW15AN3N9G80D
LQW15AN4N0B80D
LQW15AN4N0C80D
LQW15AN4N0D80D
LQW15AN4N0G80D
LQW15AN4N1B80D
LQW15AN4N1C80D
LQW15AN4N1D80D
LQW15AN4N1G80D
LQW15AN4N2B80D
LQW15AN4N2C80D
LQW15AN4N2D80D
LQW15AN4N2G80D
LQW15AN4N3B80D
LQW15AN4N3C80D
LQW15AN4N3D80D
LQW15AN4N3G80D
LQW15AN4N4B80D
LQW15AN4N4C80D
LQW15AN4N4D80D
LQW15AN4N4G80D
Inductance
(nH)
Tolerance
3.0
P.2/15
Q
(min.)
DC
Resistance
(Ω max.)
Self
Resonant
Frequency
(GHz min.)
Rated
Current
(mA)
20
0.063
12.5
1350
14.0
2000
10.0
1950
10.0
1950
3.3
3.4
30
0.030
3.5
3.6
3.7
3.8
B:±0.1nH
C:±0.2nH
D:±0.5nH
G:±2%
35
0.030
3.9
4.0
4.1
30
0.044
4.2
1800
9.6
4.3
32
4.4
34
MURATA MFG.CO.,LTD
0.052
1600
Spec No.JELF243A-0100F-01
Customer
Part Number
Reference Only
MURATA
Part Number
LQW15AN4N5B80D
LQW15AN4N5C80D
LQW15AN4N5D80D
LQW15AN4N5G80D
LQW15AN4N6B80D
LQW15AN4N6C80D
LQW15AN4N6D80D
LQW15AN4N6G80D
LQW15AN4N7B80D
LQW15AN4N7C80D
LQW15AN4N7D80D
LQW15AN4N7G80D
LQW15AN4N8B80D
LQW15AN4N8C80D
LQW15AN4N8D80D
LQW15AN4N8G80D
LQW15AN4N9B80D
LQW15AN4N9C80D
LQW15AN4N9D80D
LQW15AN4N9G80D
LQW15AN5N0B80D
LQW15AN5N0C80D
LQW15AN5N0D80D
LQW15AN5N0G80D
LQW15AN5N1B80D
LQW15AN5N1C80D
LQW15AN5N1D80D
LQW15AN5N1G80D
LQW15AN5N2B80D
LQW15AN5N2C80D
LQW15AN5N2D80D
LQW15AN5N2G80D
LQW15AN5N3B80D
LQW15AN5N3C80D
LQW15AN5N3D80D
LQW15AN5N3G80D
LQW15AN5N4B80D
LQW15AN5N4C80D
LQW15AN5N4D80D
LQW15AN5N4G80D
LQW15AN5N5B80D
LQW15AN5N5C80D
LQW15AN5N5D80D
LQW15AN5N5G80D
LQW15AN5N6B80D
LQW15AN5N6C80D
LQW15AN5N6D80D
LQW15AN5N6G80D
LQW15AN5N7B80D
LQW15AN5N7C80D
LQW15AN5N7D80D
LQW15AN5N7G80D
LQW15AN5N8B80D
LQW15AN5N8C80D
LQW15AN5N8D80D
LQW15AN5N8G80D
Inductance
(nH)
Tolerance
4.5
Q
(min.)
32
4.7
31
4.8
30
4.9
Self
Resonant
Frequency
(GHz min.)
Rated
Current
(mA)
0.060
9.6
1450
0.071
8.0
1200
27
5.0
5.2
DC
Resistance
(Ω max.)
34
4.6
5.1
P.3/15
32
10.0
B:±0.1nH
C:±0.2nH
D:±0.5nH
G:±2%
5.3
35
0.040
5.4
1770
8.0
5.5
5.6
5.7
30
5.8
MURATA MFG.CO.,LTD
Spec No.JELF243A-0100F-01
Customer
Part Number
Reference Only
MURATA
Part Number
LQW15AN5N9B80D
LQW15AN5N9C80D
LQW15AN5N9D80D
LQW15AN5N9G80D
LQW15AN6N0B80D
LQW15AN6N0C80D
LQW15AN6N0D80D
LQW15AN6N0G80D
LQW15AN6N1B80D
LQW15AN6N1C80D
LQW15AN6N1D80D
LQW15AN6N1G80D
LQW15AN6N2B80D
LQW15AN6N2C80D
LQW15AN6N2D80D
LQW15AN6N2G80D
LQW15AN6N3G80D
LQW15AN6N3J80D
LQW15AN6N4G80D
LQW15AN6N4J80D
LQW15AN6N5G80D
LQW15AN6N5J80D
LQW15AN6N6G80D
LQW15AN6N6J80D
LQW15AN6N7G80D
LQW15AN6N7J80D
LQW15AN6N8G80D
LQW15AN6N8J80D
LQW15AN6N9G80D
LQW15AN6N9J80D
LQW15AN7N0G80D
LQW15AN7N0J80D
LQW15AN7N1G80D
LQW15AN7N1J80D
LQW15AN7N2G80D
LQW15AN7N2J80D
LQW15AN7N3G80D
LQW15AN7N3J80D
LQW15AN7N4G80D
LQW15AN7N4J80D
LQW15AN7N5G80D
LQW15AN7N5J80D
LQW15AN7N6G80D
LQW15AN7N6J80D
LQW15AN7N7G80D
LQW15AN7N7J80D
LQW15AN7N8G80D
LQW15AN7N8J80D
LQW15AN7N9G80D
LQW15AN7N9J80D
LQW15AN8N0G80D
LQW15AN8N0J80D
LQW15AN8N1G80D
LQW15AN8N1J80D
LQW15AN8N2G80D
LQW15AN8N2J80D
Inductance
(nH)
Tolerance
5.9
Q
(min.)
DC
Resistance
(Ω max.)
30
0.040
P.4/15
Self
Resonant
Frequency
(GHz min.)
Rated
Current
(mA)
1770
8.0
6.0
6.1
B:±0.1nH
C:±0.2nH
D:±0.5nH
G:±2%
32
0.056
1600
32
0.056
8.0
1600
6.2
33
6.3
32
6.4
33
6.5
32
0.057
7.8
0.065
1380
7.0
6.6
6.7
0.078
1280
0.068
1450
30
6.8
6.9
32
7.0
33
8.5
0.069
8.0
1420
7.1
7.2
7.3
G:±2%
J:±5%
32
7.4
30
7.5
35
7.0
7.6
0.050
1700
7.7
7.8
30
7.9
8.0
8.1
32
8.2
MURATA MFG.CO.,LTD
0.069
6.5
1500
Spec No.JELF243A-0100F-01
Customer
Part Number
Reference Only
MURATA
Part Number
LQW15AN8N3G80D
LQW15AN8N3J80D
LQW15AN8N4G80D
LQW15AN8N4J80D
LQW15AN8N5G80D
LQW15AN8N5J80D
LQW15AN8N6G80D
LQW15AN8N6J80D
LQW15AN8N7G80D
LQW15AN8N7J80D
LQW15AN8N8G80D
LQW15AN8N8J80D
LQW15AN8N9G80D
LQW15AN8N9J80D
LQW15AN9N0G80D
LQW15AN9N0J80D
LQW15AN9N1G80D
LQW15AN9N1J80D
LQW15AN9N2G80D
LQW15AN9N2J80D
LQW15AN9N3G80D
LQW15AN9N3J80D
LQW15AN9N4G80D
LQW15AN9N4J80D
LQW15AN9N5G80D
LQW15AN9N5J80D
LQW15AN9N6G80D
LQW15AN9N6J80D
LQW15AN9N7G80D
LQW15AN9N7J80D
LQW15AN9N8G80D
LQW15AN9N8J80D
LQW15AN9N9G80D
LQW15AN9N9J80D
LQW15AN10NG80D
LQW15AN10NJ80D
LQW15AN11NG80D
LQW15AN11NJ80D
LQW15AN12NG80D
LQW15AN12NJ80D
LQW15AN13NG80D
LQW15AN13NJ80D
LQW15AN14NG80D
LQW15AN14NJ80D
LQW15AN15NG80D
LQW15AN15NJ80D
LQW15AN16NG80D
LQW15AN16NJ80D
LQW15AN17NG80D
LQW15AN17NJ80D
LQW15AN18NG80D
LQW15AN18NJ80D
LQW15AN19NG80D
LQW15AN19NJ80D
Inductance
(nH)
Tolerance
P.5/15
Q
(min.)
DC
Resistance
(Ω max.)
Self
Resonant
Frequency
(GHz min.)
Rated
Current
(mA)
32
0.069
6.5
1500
8.3
8.4
8.5
8.6
8.7
31
0.070
8.8
1420
6.5
8.9
9.0
30
9.1
0.080
32
9.2
9.3
34
9.4
33
9.5
32
9.6
G:±2%
J:±5%
33
0.081
6.0
6.2
9.7
33
9.8
34
9.9
32
10
31
11
32
0.083
30
0.093
1400
12
1240
5.2
13
14
0.111
1150
15
31
0.114
5.5
0.126
5.0
1000
0.130
5.2
1050
0.156
5.0
920
16
17
18
19
MURATA MFG.CO.,LTD
30
Reference Only
Spec No.JELF243A-0100F-01
Customer
Part Number
MURATA
Part Number
LQW15AN20NG80D
LQW15AN20NJ80D
LQW15AN21NG80D
LQW15AN21NJ80D
LQW15AN22NG80D
LQW15AN22NJ80D
LQW15AN23NG80D
LQW15AN23NJ80D
LQW15AN24NG80D
LQW15AN24NJ80D
LQW15AN25NG80D
LQW15AN25NJ80D
LQW15AN26NG80D
LQW15AN26NJ80D
LQW15AN27NG80D
LQW15AN27NJ80D
LQW15AN30NG80D
LQW15AN30NJ80D
LQW15AN33NG80D
LQW15AN33NJ80D
LQW15AN36NG80D
LQW15AN36NJ80D
LQW15AN39NG80D
LQW15AN39NJ80D
LQW15AN43NG80D
LQW15AN43NJ80D
LQW15AN47NG80D
LQW15AN47NJ80D
LQW15AN51NG80D
LQW15AN51NJ80D
LQW15AN53NG80D
LQW15AN53NJ80D
LQW15AN56NG80D
LQW15AN56NJ80D
LQW15AN68NG80D
LQW15AN68NJ80D
LQW15AN75NG80D
LQW15AN75NJ80D
Inductance
(nH)
Tolerance
Q
(min.)
DC
Resistance
(Ω max.)
P.6/15
Self
Resonant
Frequency
(GHz min.)
0.186
20
800
30
21
0.202
4.5
Current derating (%)
780
22
23
29
0.201
24
31
0.212
25
31
0.221
760
4.0
770
750
4.1
26
29
27
30
33
G:±2%
J:±5%
720
0.288
4.0
680
0.309
3.8
660
0.336
3.6
620
0.431
3.5
540
30
36
39
0.282
28
0.456
530
3.4
43
30
47
0.516
0.648
515
3.2
440
51
0.696
415
2.9
53
25
56
0.996
340
68
1.128
2.5
75
1.224
2.4
320
100
50
0
Rated
Current
(mA)
0
85
125
Temperature
(℃)
.
Derating of Rated Current depend on Operating Temperature
4. Testing Conditions
《Unless otherwise specified》
《In case of doubt》
Temperature : Ordinary Temperature / 15°C to 35°C
Temperature : 20°C±2°C
Humidity
: Ordinary Humidity
/ 25%(RH) to 85%(RH)
Humidity
: 60%(RH) to 70%(RH)
Atmospheric Pressure : 86kPa to 106 kPa
MURATA MFG.CO.,LTD
Reference Only
Spec No.JELF243A-0100F-01
P.7/15
5. Appearance and Dimensions
1.0 ± 0.1
0.5 ± 0.1
0.1± 0.05
■Unit mass (Typical value)
0.0009g
0.6 ± 0.1
(in mm)
0.2 ± 0.1
6.Electrical Performance
No.
6.1
Item
Inductance
Specification
Inductance shall meet item 3.
Test Method
Measuring Equipment:
KEYSIGHT 4287A or equivalent
Measuring Frequency:
100MHz
250MHz/1.3nH~43nH
200MHz/47nH~75nH
Measuring Condition:
Test signal level / about 0dBm
Electrode spaces / 0.5mm
Electrical length / 10mm
Weight / about 1N~3N
Measuring Fixture: KEYSIGHT 16197A
6.2
Q
Q shall meet item 3.
Position coil under test as shown in below and
contact coil with each terminal by adding weight.
1005 Size Guide
Measuring Method:See the endnote.
6.3
DC Resistance
DC Resistance shall meet item 3.
Measuring Equipment:Digital multi meter
6.4
Self Resonant
Frequency(S.R.F)
S.R.F shall meet item 3.
Measuring Equipment: KEYSIGHT 8720C or
equivalent
6.5
Rated Current
Self temperature rise shall be
limited to 40°C max.
The rated current is applied.
MURATA MFG.CO.,LTD
Spec No.JELF243A-0100F-01
Reference Only
P.8/15
7.Mechanical Performance
No.
7.1
Item
Shear Test
Specification
Chip coil shall not be damaged
after tested as test method.
Test Method
Substrate:Glass-epoxy substrate
1.42
1.2
Chip Coil
Pattern
Solder resist
Substrate
0.65
0.66
0.5
0.6
Chip Coil
Applied Direction:
(in mm)
F
Substrate
Force:5N
Hold Duration:5s±1s
7.2
Bending Test
Substrate:Glass-epoxy substrate
(100mm×40mm×0.8mm)
Speed of Applying Force:1mm / s
Deflection:2mm
Hold Duration:5s
Pressure jig
R230
F
Deflection
45
45
Product (in mm)
7.3
Vibration
Oscillation Frequency:
10Hz~55Hz~10Hz for 1 min
Total Amplitude:1.5mm
Time : A period of 2 hours in each of
3 mutually perpendicular directions.
(Total 6hours)
7.4
Solderability
The wetting area of the electrode
shall be at least 90% covered with
new solder coating.
Flux:Ethanol solution of rosin,25(wt)%
Includes activator equivalent to 0.06(wt)%
chlorine.(immersed for 5s to 10s)
Solder:Sn-3.0Ag-0.5Cu
Pre-Heating:150°C±10°C / 60s to 90s
Solder Temperature:240°C±5°C
Immersion Time:3s±1s
7.5
Resistance to
Soldering Heat
Appearance:No damage
Inductance Change: within ±5%
Flux:Ethanol solution of rosin,25(wt)%
Includes activator equivalent to 0.06(wt)%
Chlorine.(immersed for 5s to 10s)
Solder:Sn-3.0Ag-0.5Cu
Pre-Heating:150°C±10°C / 60s to 90s
Solder Temperature:270°C±5°C
Immersion Time:10s±1s
Then measured after exposure in the room
condition for 24h±2h.
MURATA MFG.CO.,LTD
Reference Only
Spec No.JELF243A-0100F-01
P.9/15
8.Environmental Performance
It shall be soldered on the substrate.
No.
Item
Specification
8.1 Heat Resistance
Appearance:No damage
Inductance Change: within ±5%
Q Change: within ±20%
8.2
Cold Resistance
8.3
Humidity
8.4
Temperature
Cycle
Test Method
Temperature:125°C±2°C
Time:1000h (+48h,0h)
Then measured after exposure in the room
condition for 24h±2h.
Temperature:-55°C±2°C
Time:1000h (+48h,-0h)
Then measured after exposure in the room
condition for 24h±2 h.
Appearance:No damage
Inductance Change: within ±5%
Q Change: within ±20%
Temperature:70°C±2°C
Humidity:90%(RH) to 95%(RH)
Time:1000h (+48h,-0h)
Then measured after exposure in the room
condition for 24h±2h.
1 cycle:
1 step:-55°C±2°C / 30min±3 min
2 step:Ordinary temp. / 10min to 15 min
3 step:+125°C±2°C / 30min±3 min
4 step:Ordinary temp. / 10min to15 min
Total of 10 cycles
Then measured after exposure in the room
condition for 24h±2h.
9.Specification of Packaging
9.1 Appearance and Dimensions of paper tape (8mm-wide)
φ1.5±
00.1
1.75±0.1
1.180±0.03
8.0±0.2
4.0±0.1
3.5±0.05
2.0±0.05
(in mm)
0.75±0.03
2.0±0.05
Direction
of feed
0.80 max
9.2 Specification of Taping
(1) Packing quantity (standard quantity)
10,000 pcs. / reel
(2) Packing Method
Products shall be packed in the cavity of the base tape and sealed by Cover tape.
(3) Sprocket hole
The sprocket holes are to the right as the tape is pulled toward the user.
(4) Spliced point
Base tape and Cover tape has no spliced point.
(5) Missing components number
Missing components number within 0.1% of the number per reel or 1 pc., whichever is greater,
and are not continuous. The Specified quantity per reel is kept.
9.3 Pull Strength
Cover tape
5N min.
9.4 Peeling off force of cover tape
Speed of Peeling off
Peeling off force
300mm/min
0.1 to 0.6N
(minimum value is typical)
165°to 180゜
F
Cover tape
Base tape
MURATA MFG.CO.,LTD
Reference Only
Spec No.JELF243A-0100F-01
P.10/15
9.5 Dimensions of Leader-tape,Trailer and Reel
There shall be leader-tape ( cover tape and empty tape) and trailer-tape (empty tape) as follows.
Trailer
160 min.
2.0±0.5
Leader
Label
190 min.
Empty tape
210 min.
Cover tape
φ 13.0±0.2
+1
φ 60 -0
φ 21.0±0.8
9.0 +1
-0
Direction of feed
(in mm)
13.0±1.4
φ 180
+0
-3
9.6 Marking for reel
Customer part number, MURATA part number, Inspection number(∗1) ,RoHS Marking(∗2),
Quantity etc ・・・
□□ OOOO ×××
∗1)
(1)
(2)
(3)
(1) Factory Code
(2) Date
First digit
: Year / Last digit of year
Second digit
: Month / Jan. to Sep. → 1 to 9, Oct. to Dec. → O, N, D
Third, Fourth digit : Day
(3) Serial No.
∗2)
ROHS – Y (△)
(1) (2)
(1) RoHS regulation conformity parts.
(2) MURATA classification number
9.7 Marking for Outside package (corrugated paper box)
Customer name, Purchasing order number, Customer part number, MURATA part number,
RoHS Marking (∗2) ,Quantity, etc ・・・
9.8. Specification of Outer Case
Label
H
Outer Case Dimensions
(mm)
W
D
H
186
186
93
Standard Reel Quantity
in Outer Case (Reel)
5
D
W
∗ Above Outer Case size is typical. It depends on a quantity of an order.
10. ! Caution
Limitation of Applications
Please contact us before using our products for the applications listed below which require especially
high reliability for the prevention of defects which might directly cause damage to the third party's life,
body or property.
(1) Aircraft equipment
(6) Transportation equipment (vehicles, trains, ships, etc.)
(7) Traffic signal equipment
(2) Aerospace equipment
(3) Undersea equipment
(8) Disaster prevention / crime prevention equipment
(4) Power plant control equipment (9) Data-processing equipment
(10) Applications of similar complexity and /or reliability
(5) Medical equipment
requirements to the applications listed in the above
11. Notice
Products can only be soldered with reflow.
This product is designed for solder mounting.
Please consult us in advance for applying other mounting method such as conductive adhesive.
MURATA MFG.CO.,LTD
Reference Only
Spec No.JELF243A-0100F-01
P.11/15
11.1 Land pattern designing
Recommended land patterns for reflow soldering are as follows:
These have been designed for Electric characteristics and solderability.
Please follow the recommended patterns. Otherwise, their performance which includes electrical performance
or solderability may be affected, or result to "position shift" in soldering process.
Chip Coil
c
Land
a
b
c
Solder resist
0.6
1.42
0.66
(in mm)
a
b
11.2 Flux, Solder
・Use rosin-based flux.
Includes middle activator equivalent to 0.06(wt)% to 0.1(wt) % Chlorine.
Don’t use highly acidic flux with halide content exceeding 0.2(wt) % (chlorine conversion value).
Don’t use water-soluble flux.
・Use Sn-3.0Ag-0.5Cu solder.
・Standard thickness of solder paste : 50μm to 100μm.
11.3 Reflow soldering conditions
・Pre-heating should be in such a way that the temperature difference between solder and product
surface is limited to 150°C max. Cooling into solvent after soldering also should be in such a way
that the temperature difference is limited to 100°C max.
Insufficient pre-heating may cause cracks on the product, resulting in the deterioration of products
quality.
・Standard soldering profile and the limit soldering profile is as follows.
The excessive limit soldering conditions may cause leaching of the electrode and / or resulting
in the deterioration of product quality.
・Reflow soldering profile
Temp.
(℃)
260℃
245℃±3℃
230℃
220℃
Limit Profile
180
150
Standard Profile
30s~60s
60s max.
90s±30s
Pre-heating
Heating
Peak temperature
Cycle of reflow
Time. (s)
Standard Profile
Limit Profile
150°C~180°C 、90s±30s
above 220°C、30s~60s
above 230°C、60s max.
245°C±3°C
260°C,10s
2 times
2 times
11.4 Solder Volume
・Solder shall be used not to be exceeded the upper limits as shown below.
・Accordingly increasing the solder volume, the mechanical stress to Chip is also increased.
Exceeding solder volume may cause the failure of mechanical or electrical performance.
T
⇔
Upper Limit
Recommendable(t)
1/3T≦t≦T
T:thickness of product
MURATA MFG.CO.,LTD
Reference Only
Spec No.JELF243A-0100F-01
P.12/15
11.5 Product’s location
The following shall be considered when designing and laying out P.C.B.'s.
(1) P.C.B. shall be designed so that products are not subject to the mechanical stress due to
warping the board.
[Products direction]
a
Products shall be located in the sideways
direction (Length:a<b) to the mechanical
stress.
b
〈 Poor example 〉
〈 Good example〉
(2) Components location on P.C.B. separation.
It is effective to implement the following measures, to reduce stress in separating the board.
It is best to implement all of the following three measures; however, implement as many measures as possible
to reduce stress.
Contents of Measures
(1) Turn the mounting direction of the component parallel to the board separation surface.
(2) Add slits in the board separation part.
(3) Keep the mounting position of the component away from the board separation surface.
Seam
b
A
Stress Level
A > D *1
A > B
A > C
C
B
D
Slit
Length:a< b
a
*1 A > D is valid when stress is added vertically to the perforation as with Hand Separation.
If a Cutting Disc is used, stress will be diagonal to the PCB, therefore A > D is invalid.
(3) Mounting Components Near Screw Holes
When a component is mounted near a screw hole, it may be affected by the board deflection that occurs during
the tightening of the screw. Mount the component in a position as far away from the screw holes as possible.
MURATA MFG.CO.,LTD
Spec No.JELF243A-0100F-01
Reference Only
P.13/15
11.6 Cleaning Conditions
Products shall be cleaned on the following conditions.
(1) Cleaning temperature shall be limited to 60°C max.(40°C max for IPA)
(2) Ultrasonic cleaning shall comply with the following conditions with avoiding the resonance
phenomenon at the mounted products and P.C.B.
Power : 20 W / l max.
Frequency : 28kHz to 40kHz
Time : 5 min max.
(3) Cleaner
1. Alcohol type cleaner
Isopropyl alcohol (IPA)
2. Aqueous agent
PINE ALPHA ST-100S
(4) There shall be no residual flux and residual cleaner after cleaning.
In the case of using aqueous agent, products shall be dried completely after rinse with de-ionized
water in order to remove the cleaner.
(5) Other cleaning
Please contact us.
11.7 Resin coating
The inductance value may change due to high cure-stress of resin to be used for coating/molding products.
An open circuit issue may occur by mechanical stress caused by the resin, amount/cured shape of resin,
or operating condition etc. Some resin contains some impurities or chloride possible to generate chlorine
by hydrolysis under some operating condition may cause corrosion of wire of coil, leading to open circuit.
So, please pay your careful attention when you select resin in case of coating/molding the products with the resin.
Prior to use the coating resin, please make sure no reliability issue is observed by evaluating products mounted
on your board.
11.8 Caution for use
・Sharp material such as a pair of tweezers or other material such as bristles of cleaning brush , shall not be touched
to the winding portion to prevent the
breaking of wire.
・Mechanical shock should not be applied to the products mounted on the board to prevent the breaking of the core.
11.9 Notice of product handling at mounting
In some mounting machines,when picking up components support pin pushes up the components from the
bottom of base tape. In this case, please remove the support pin. The support pin may damage the
components and break wire.
In rare case ,the laser recognition can not recognize this component. Please contact us when you use laser
recognition. (There is no problem with the permeation and reflection type.)
MURATA MFG.CO.,LTD
Spec No.JELF243A-0100F-01
Reference Only
P.14/15
11.10Handling of a substrate
After mounting products on a substrate, do not apply any stress to the product caused by bending or twisting to the
substrate when cropping the substrate, inserting and removing a connector from the substrate or tightening screw to
the substrate.
Excessive mechanical stress may cause cracking in the product.
Bending
Twisting
11.11 Storage and Handing Requirements
(1) Storage period
Use the products within 12 months after delivered.
Solderability should be checked if this period is exceeded.
(2) Storage conditions
・Products should be stored in the warehouse on the following conditions.
Temperature : -10°C to 40°C
: 15% to 85% relative humidity No rapid change on temperature and humidity
Humidity
・Don't keep products in corrosive gases such as sulfur,chlorine gas or acid, or it may cause
oxidization of electrode, resulting in poor solderability.
・Products should not be stored on bulk packaging condition to prevent the chipping of the
core and the breaking of winding wire caused by the collision between the products.
・Products should be stored on the palette for the prevention of the influence from humidity,
dust and so on.
・Products should be stored in the warehouse without heat shock, vibration, direct sunlight and
so on.
(3) Handling Condition
Care should be taken when transporting or handling product to avoid excessive vibration or
mechanical shock.
12. ! Note
(1)Please make sure that your product has been evaluated in view of your specifications with our product being
mounted to your product.
(2)You are requested not to use our product deviating from the reference specifications.
(3)The contents of this reference specification are subject to change without advance notice.
Please approve our product specifications or transact the approval sheet for product specifications
before ordering.
MURATA MFG.CO.,LTD
Reference Only
Spec No.JELF243A-0100F-01
P.15/15
(1) Residual elements and stray elements of test fixture can be described by F-parameter shown in following.
I2
I1
Zm
V1
Test Head
A
B
C
D
V2
Test fixture
Zx
V1 =
I1
Product
A B
C D
V2
I2
(2) The impedance of chip coil Zx and measured value Zm can be described by input/output current/voltage.
Zm=
V1
I1
,
Zx=
V2
I2
(3) Thus,the relation between Zx and Zm is following;
Zx=α
Zm-β
1-ZmΓ
where, α= D / A =1
β= B / D =Zsm-(1-Yom Zsm)Zss
Γ= C / A =Yom
Zsm:measured impedance of short chip
Zss:residual impedance of short chip (0.556nH)
Yom:measured admittance when opening the fixture
(4) Lx and Qx shall be calculated with the following equation.
Lx=
Im(Zx)
2πf
,
Qx=
Im(Zx)
Re(Zx)
Lx :Inductance of chip coil
Qx:Q of chip coil
f :Measuring frequency
MURATA MFG.CO.,LTD