LQW18AN18NJ0ZD

Spec No.: JELF243A_9116E-01 P1/12 CHIP COILS (CHIP INDUCTORS) LQW18AN□□□□0Z□ Murata Standard Reference Specification [AEC-Q200] 1. Scope This reference specification applies to chip coils (chip inductors) LQW18AN_0Z series for automotive electronics based on AEC-Q200 except for power trains and safeties. 2. Part Numbering (Ex.) LQ W 18 Product Structure Dimension ID (L × W) A N 2N2 D 0 Z D Application Category Inductance Tolerance Performance Category Packaging and Z: Automotive D: taping characteristic *B: bulk *B: Bulk packing is also available (taping condition: however, products without reels are put in plastic bags). 3. Part Number and Rating Operating temperature range -55°C to +125°C Storage temperature range -55°C to +125°C Inductance Customer Part number DC Self-resonant Q resistance frequency (Min.) (Ω max.) (MHz min.) Rated current (mA) ESD Rank 6: 25 kV 6000 700 6 0.059 6000 850 6 0.059 6000 850 6 35 0.059 6000 850 6 35 0.059 6000 850 6 C: ±0.2 nH 35 0.059 6000 850 6 D: ±0.5 nH 35 0.059 6000 850 6 4.7 D: ±0.5 nH 35 0.059 6000 850 6 5.6 C: ±0.2 nH 35 0.082 6000 750 6 LQW18AN5N6D0ZD 5.6 D: ±0.5 nH 35 0.082 6000 750 6 LQW18AN6N2C0ZD 6.2 C: ±0.2 nH 35 0.082 6000 750 6 LQW18AN6N2D0ZD 6.2 D: ±0.5 nH 35 0.082 6000 750 6 LQW18AN6N8C0ZD 6.8 C: ±0.2 nH 35 0.082 6000 750 6 LQW18AN6N8D0ZD 6.8 D: ±0.5 nH 35 0.082 6000 750 6 LQW18AN7N5C0ZD 7.5 C: ±0.2 nH 35 0.082 6000 750 6 LQW18AN7N5D0ZD 7.5 D: ±0.5 nH 35 0.082 6000 750 6 LQW18AN8N2C0ZD 8.2 C: ±0.2 nH 35 0.11 6000 650 6 LQW18AN8N2D0ZD 8.2 D: ±0.5 nH 35 0.11 6000 650 6 LQW18AN8N7C0ZD 8.7 C: ±0.2 nH 35 0.11 6000 650 6 LQW18AN8N7D0ZD 8.7 D: ±0.5 nH 35 0.11 6000 650 6 LQW18AN9N1C0ZD 9.1 C: ±0.2 nH 35 0.11 6000 650 6 LQW18AN9N1D0ZD 9.1 D: ±0.5 nH 35 0.11 6000 650 6 Murata Part number Nominal value (nH) Tolerance LQW18AN2N2D0ZD 2.2 D: ±0.5 nH 16 0.042 LQW18AN3N6C0ZD 3.6 C: ±0.2 nH 25 LQW18AN3N6D0ZD 3.6 D: ±0.5 nH 25 LQW18AN3N9C0ZD 3.9 C: ±0.2 nH LQW18AN3N9D0ZD 3.9 D: ±0.5 nH LQW18AN4N3C0ZD 4.3 LQW18AN4N3D0ZD 4.3 LQW18AN4N7D0ZD LQW18AN5N6C0ZD LQW18AN9N5D0ZD 9.5 D: ±0.5 nH 35 0.11 6000 650 6 LQW18AN10NG0ZD 10 G: ±2% 35 0.11 6000 650 6 LQW18AN10NJ0ZD 10 J: ±5% 35 0.11 6000 650 6 LQW18AN11NG0ZD 11 G: ±2% 35 0.11 6000 650 6 LQW18AN11NJ0ZD 11 J: ±5% 35 0.11 6000 650 6 LQW18AN12NG0ZD 12 G: ±2% 35 0.13 6000 600 6 LQW18AN12NJ0ZD 12 J: ±5% 35 0.13 6000 600 6 MURATA MFG CO., LTD Spec No.: JELF243A_9116E-01 P2/12 Inductance Customer Part number DC Self-resonant Q resistance frequency (Min.) (Ω max.) (MHz min.) Rated current (mA) ESD Rank 6: 25 kV 6000 600 6 6000 600 6 Murata Part number Nominal value (nH) Tolerance LQW18AN13NG0ZD 13 G: ±2% 35 0.13 LQW18AN13NJ0ZD 13 J: ±5% 35 0.13 LQW18AN15NG0ZD 15 G: ±2% 40 0.13 6000 600 6 LQW18AN15NJ0ZD 15 J: ±5% 40 0.13 6000 600 6 LQW18AN16NG0ZD 16 G: ±2% 40 0.16 5500 550 6 LQW18AN16NJ0ZD 16 J: ±5% 40 0.16 5500 550 6 LQW18AN18NG0ZD 18 G: ±2% 40 0.16 5500 550 6 LQW18AN18NJ0ZD 18 J: ±5% 40 0.16 5500 550 6 LQW18AN20NG0ZD 20 G: ±2% 40 0.16 4900 550 6 LQW18AN20NJ0ZD 20 J: ±5% 40 0.16 4900 550 6 LQW18AN22NG0ZD 22 G: ±2% 40 0.17 4600 500 6 LQW18AN22NJ0ZD 22 J: ±5% 40 0.17 4600 500 6 LQW18AN24NG0ZD 24 G: ±2% 40 0.21 3800 500 6 LQW18AN24NJ0ZD 24 J: ±5% 40 0.21 3800 500 6 LQW18AN27NG0ZD 27 G: ±2% 40 0.21 3700 440 6 LQW18AN27NJ0ZD 27 J: ±5% 40 0.21 3700 440 6 LQW18AN30NG0ZD 30 G: ±2% 40 0.23 3300 420 6 LQW18AN30NJ0ZD 30 J: ±5% 40 0.23 3300 420 6 LQW18AN33NG0ZD 33 G: ±2% 40 0.23 3200 420 6 LQW18AN33NJ0ZD 33 J: ±5% 40 0.23 3200 420 6 LQW18AN36NG0ZD 36 G: ±2% 40 0.26 2900 400 6 LQW18AN36NJ0ZD 36 J: ±5% 40 0.26 2900 400 6 LQW18AN39NG0ZD 39 G: ±2% 40 0.26 2800 400 6 LQW18AN39NJ0ZD 39 J: ±5% 40 0.26 2800 400 6 LQW18AN43NG0ZD 43 G: ±2% 40 0.29 2700 380 6 LQW18AN43NJ0ZD 43 J: ±5% 40 0.29 2700 380 6 LQW18AN47NG0ZD 47 G: ±2% 38 0.29 2600 380 6 LQW18AN47NJ0ZD 47 J: ±5% 38 0.29 2600 380 6 LQW18AN51NG0ZD 51 G: ±2% 38 0.33 2500 370 6 LQW18AN51NJ0ZD 51 J: ±5% 38 0.33 2500 370 6 LQW18AN56NG0ZD 56 G: ±2% 38 0.35 2400 360 6 LQW18AN56NJ0ZD 56 J: ±5% 38 0.35 2400 360 6 LQW18AN62NG0ZD 62 G: ±2% 38 0.51 2300 280 6 LQW18AN62NJ0ZD 62 J: ±5% 38 0.51 2300 280 6 LQW18AN68NG0ZD 68 G: ±2% 38 0.38 2200 340 6 LQW18AN68NJ0ZD 68 J: ±5% 38 0.38 2200 340 6 LQW18AN72NG0ZD 72 G: ±2% 34 0.56 2100 270 6 LQW18AN72NJ0ZD 72 J: ±5% 34 0.56 2100 270 6 LQW18AN75NG0ZD 75 G: ±2% 34 0.56 2050 270 6 LQW18AN75NJ0ZD 75 J: ±5% 34 0.56 2050 270 6 LQW18AN82NG0ZD 82 G: ±2% 34 0.60 2000 250 6 LQW18AN82NJ0ZD 82 J: ±5% 34 0.60 2000 250 6 LQW18AN91NG0ZD 91 G: ±2% 34 0.64 1900 230 6 LQW18AN91NJ0ZD 91 J: ±5% 34 0.64 1900 230 6 LQW18ANR10G0ZD 100 G: ±2% 34 0.68 1800 220 6 LQW18ANR10J0ZD 100 J: ±5% 34 0.68 1800 220 6 MURATA MFG CO., LTD Spec No.: JELF243A_9116E-01 P3/12 Inductance Customer Part number DC Self-resonant Q resistance frequency (Min.) (Ω max.) (MHz min.) Rated current (mA) ESD Rank 6: 25 kV 1700 200 6 1700 200 6 Murata Part number Nominal value (nH) Tolerance LQW18ANR11G0ZD 110 G: ±2% 32 1.2 LQW18ANR11J0ZD 110 J: ±5% 32 1.2 LQW18ANR12G0ZD 120 G: ±2% 32 1.3 1600 180 6 LQW18ANR12J0ZD 120 J: ±5% 32 1.3 1600 180 6 LQW18ANR13G0ZD 130 G: ±2% 32 1.4 1450 170 6 LQW18ANR13J0ZD 130 J: ±5% 32 1.4 1450 170 6 LQW18ANR15G0ZD 150 G: ±2% 32 1.5 1400 160 6 LQW18ANR15J0ZD 150 J: ±5% 32 1.5 1400 160 6 LQW18ANR16G0ZD 160 G: ±2% 32 2.1 1350 150 6 LQW18ANR16J0ZD 160 J: ±5% 32 2.1 1350 150 6 LQW18ANR18G0ZD 180 G: ±2% 25 2.2 1300 140 6 LQW18ANR18J0ZD 180 J: ±5% 25 2.2 1300 140 6 LQW18ANR20G0ZD 200 G: ±2% 25 2.4 1250 120 6 LQW18ANR20J0ZD 200 J: ±5% 25 2.4 1250 120 6 LQW18ANR22G0ZD 220 G: ±2% 25 2.5 1200 120 6 LQW18ANR22J0ZD 220 J: ±5% 25 2.5 1200 120 6 LQW18ANR27G0ZD 270 G: ±2% 30 3.4 960 110 6 LQW18ANR27J0ZD 270 J: ±5% 30 3.4 960 110 6 LQW18ANR33G0ZD 330 G: ±2% 30 5.5 800 85 6 LQW18ANR33J0ZD 330 J: ±5% 30 5.5 800 85 6 LQW18ANR39G0ZD 390 G: ±2% 30 6.2 800 80 6 LQW18ANR39J0ZD 390 J: ±5% 30 6.2 800 80 6 LQW18ANR47G0ZD 470 G: ±2% 30 7.0 700 75 6 LQW18ANR47J0ZD 470 J: ±5% 30 7.0 700 75 6 4. Testing Conditions Unless otherwise specified Temperature: ordinary temperature (15°C to 35°C) Humidity: ordinary humidity [25% to 85% (RH)] In case of doubt Temperature: 20°C±2°C Humidity: 60% to 70% (RH) Atmospheric pressure: 86 kPa to 106 kPa MURATA MFG CO., LTD Spec No.: JELF243A_9116E-01 P4/12 5. Appearance and Dimensions Unit mass (typical value): 0.003 g 6. Marking No marking. 7. Electrical Performance No. Item 7.1 Inductance Specification Meet chapter 3 ratings. Test method Measuring equipment: Keysight E4991A or the equivalent Measuring frequency: Inductance 100 MHz Q 250 MHz 2.2 nH to 39 nH 200 MHz 43 nH to 68 nH 150 MHz 72 nH to 160 nH 7.2 Q Meet chapter 3 ratings. 100 MHz 180 nH to 470 nH Measuring conditions: Measurement signal level: Approx. 0 dBm Measurement terminal distance: 1.0 mm Electrical length: 10.0 mm Measuring fixture: Keysight 16197A Position the chip coil under test as shown in the measuring example below and connect it to the electrode by applying weight. Measurement example: Measuring method: see "Electrical performance: Measuring method for inductance/Q" in the chapter "15. Appendix". 7.3 DC resistance Meet chapter 3 ratings. Measuring equipment: digital multimeter MURATA MFG CO., LTD Spec No.: JELF243A_9116E-01 No. P5/12 Item Specification Test method 7.4 Self-resonant frequency Meet chapter 3 ratings. Measuring equipment: Keysight N5230A or the equivalent 7.5 Rated current Product temperature rise: 20°C max. Inductance change rate: within ±10% Apply the rated current specified in chapter 3. 8. AEC-Q200 Requirement 8.1 Performance [based on table 5 for magnetics (inductors/transformer) AEC-Q200 Rev. D issued June 1, 2010] AEC-Q200 No. 3 Stress High temperature exposure Murata specification/deviation Test method 1000 h at 125°C Set for 24 h at room condition, then measured. Meet table A after testing. Table A Appearance No damage Inductance change rate (at 100 MHz) 1000 cycles -40°C to +125°C Set for 24 h at room condition, then measured. Within ±5% 4 Temperature cycling 7 Biased humidity 1000 h at 85°C, 85% (RH). Unpowered. Set for 24 h at room condition, then measured. Meet table A after testing. 8 Operational life Apply rated current 125°C 1000 h Set for 24 h at room condition, then measured. Meet table A after testing. 9 External visual Visual inspection No abnormalities 10 Physical dimension Meet chapter 5, "Appearance and Dimensions". No defects 12 Resistance to solvents Per MIL-STD-202 Method 215 Not applicable 13 Mechanical shock Meet table A after testing. Per MIL-STD-202 Method 213 Condition C: 100 g’s (0.98 N), 6 ms, half sine, 12.3 ft/s 14 Vibration 5 g's (0.049 N) for 20 min, 12 cycles each Meet table A after testing. of 3 orientations Test from 10 Hz to 2000 Hz 15 Resistance to soldering heat No-heating Solder temperature 260°C±5°C Immersion time 10 s Pre-heating: 150°C±10°C, 60 s to 90 s Meet table A after testing. 17 ESD Per AEC-Q200-002 ESD rank: Refer to chapter 3 ratings. Meet table A after testing. 18 Solderbility Per J-STD-002 Method b: not applicable 95% of the terminations is to be soldered (except exposed wire). 19 Electrical Measured: inductance characterization No defects 20 Flammability Per UL-94 Not applicable 21 Board flex Epoxy-PCB (1.6 mm) Deflection 2 mm (min.) Holding time 60 s Meet table B after testing. Table B Appearance Meet table A after testing. DC resistance change rate 22 Terminal strength Per AEC-Q200-006 A force of 17.7 N for 60 s No damage Within ±10% Murata deviation request: 10 N for 5 s No defect MURATA MFG CO., LTD Spec No.: JELF243A_9116E-01 P6/12 9. Specification of Packaging 9.1 Appearance and dimensions of tape (8 mm width/paper tape) A 1.0±0.05 B 1.8±0.05 t 1.1 max. (in mm) 9.2 Taping specifications Packing quantity (Standard quantity) 4000 pcs/reel Packing method The products are placed in embossed cavities of a base tape and sealed by a top tape and a bottom tape. Feed hole position The feed holes on the base tape are on the right side when the top tape is pulled toward the user. Joint The base tape and the top tape are seamless. Number of missing products Number of missing products within 0.025% of the number per reel or 1 pc., whichever is greater, and are not continuous. The specified quantity per reel is kept. 9.3 Break down force of tape Break down force of top tape 5 N min. Break down force of bottom tape 5 N min. 9.4 Peeling off force of top tape Speed of peeling off Peeling off force 165 to 180 degree Bottom tape 300 mm/min 0.1 N to 0.6 N (The lower limit is for typical value.) F Top tape Base tape 9.5 Dimensions of leader section, trailer section and reel A vacant section is provided in the leader (start) section and trailer (end) section of the tape for the product. The leader section is further provided with an area consisting only of the cover tape (or top tape). (See the diagram below.) MURATA MFG CO., LTD Spec No.: JELF243A_9116E-01 P7/12 9.6 Marking for reel Customer part number, Murata part number, inspection number (*1), RoHS marking (*2), quantity, etc. *1 Expression of inspection No.: (1) Factory code  □□ ○○○○ (2) Date First digit: year/last digit of year (1) (2) (3) Second digit: month/Jan. to Sep.→1 to 9, Oct. to Dec.→O, N, D Third, Fourth digit: day (3) Serial No. *2 Expression of RoHS marking: (1) RoHS regulation conformity ROHSY () (2) Murata classification number (1) (2) 9.7 Marking on outer box (corrugated box) Customer name, purchasing order number, customer part number, Murata part number, RoHS marking (*2), quantity, etc. 9.8 Specification of outer box Label H D W 10. Dimensions of outer box (mm) W D H 186 186 93 Standard reel quantity in outer box (reel) 5 * Above outer box size is typical. It depends on a quantity of an order. Caution 10.1 Restricted applications Please contact us before using our products for the applications listed below which require especially high reliability for the prevention of defects which might directly cause damage to the third party's life, body or property. (1) Aircraft equipment (6) Disaster/crime prevention equipment (2) Aerospace equipment (7) Traffic signal equipment (3) Undersea equipment (8) Transportation equipment (trains, ships, etc.) (4) Power plant control equipment (9) Data-processing equipment (5) Medical equipment (10) Applications of similar complexity and/or reliability requirements to the applications listed in the above 10.2 Precautions on rating Do not use the products in excess of their rated current. Doing so may cause the product to generate heat, resulting in short circuit between wires, wire breakage, or melted solder, which may cause dropping of parts. 10.3 Fail-safe Be sure to provide an appropriate fail-safe function on your product to prevent a second damage that may be caused by the abnormal function or the failure of our product. 10.4 Corrosive gas Please refrain from use since contact with environments with corrosive gases (sulfur gas [hydrogen sulfide, sulfur dioxide, etc.], chlorine, ammonia, etc.) or oils (cutting oil, silicone oil, etc.) that have come into contact with the previously stated corrosive gas environment will result in deterioration of product quality or an open from deterioration due to corrosion of product electrode, etc. We will not bear any responsibility for use under these environments. MURATA MFG CO., LTD Spec No.: JELF243A_9116E-01 P8/12 11. Precautions for Use This product is for use only with reflow soldering. It is designed to be mounted by soldering. If you want to use other mounting method, for example, using a conductive adhesive, please consult us beforehand. Also, if repeatedly subjected to temperature cycles or other thermal stress, due to the difference in the coefficient of thermal expansion with the mounting substrate, the solder (solder fillet part) in the mounting part may crack. The occurrence of cracks due to thermal stress is affected by the size of the land where mounted, the solder volume, and the heat dissipation of the mounting substrate. Carefully design it when a large change in ambient temperature is assumed. 11.1 Land dimensions The following diagram shows the recommended land dimensions for reflow soldering. The land dimensions are designed in consideration of electrical characteristics and mountability. Use of other land dimensions may preclude achievement of performance. In some cases, it may result in poor solderability, including positional shift. If you use other land pattern, consider it adequately. a 0.6 to 0.8 b 1.9 to 2.0 c 0.7 to 1.0 (in mm) 11.2 Flux and solder used Flux • Use a rosin-based flux that includes an activator with a chlorine conversion value of 0.06(wt)% to 0.1(wt)%. • Do not use a highly acidic flux with a halide content exceeding 0.2(wt)% (chlorine conversion value). • Do not use a water-soluble flux. Solder • Use Sn-3.0Ag-0.5Cu solder. • Standard thickness of solder paste: 100 μm to 150 μm If you want to use a flux other than the above, please consult our technical department. 11.3 Soldering conditions (reflow) • Pre-heating should be in such a way that the temperature difference between solder and product surface is limited to 150°C max. Cooling into solvent after soldering also should be in such a way that the temperature difference is limited to 100°C max. Insufficient pre-heating may cause cracks on the product, resulting in the deterioration of product quality. • Standard soldering profile and the limit soldering profile is as follows. The excessive limit soldering conditions may cause leaching of the electrode and/or resulting in the deterioration of product quality. Temp. (℃) 260℃ 245℃±3℃ 220℃ 230℃ Limit Profile 180 150 Standard Profile 30s～60s 60s max. 90s±30s Time. (s) Standard profile Limit profile Pre-heating 150°C to 180°C/90 s±30 s 150°C to 180°C/90 s±30 s Heating Above 220°C/30 s to 60 s Above 230°C/60 s max. 245°C±3°C 260°C/10 s 2 times 2 times Peak temperature Number of reflow cycles MURATA MFG CO., LTD Spec No.: JELF243A_9116E-01 P9/12 11.4 Reworking with soldering iron The following requirements must be met to rework a soldered product using a soldering iron. Item Requirement Pre-heating 150°C/approx. 1 min Tip temperature of soldering iron 350°C max. Power consumption of soldering iron 80 W max. Tip diameter of soldering iron ø3 mm max. Soldering time 3 s (+1 s, -0 s) Number of reworking operations 2 times max. * Avoid a direct contact of the tip of the soldering iron with the product. Such a direction contact may cause cracks in the ceramic body due to thermal shock. 11.5 Solder volume Solder shall be used not to increase the volume too much. An increased solder volume increases mechanical stress on the product. Exceeding solder volume may cause the failure of mechanical or electrical performance. 11.6 Product's location The following shall be considered when designing and laying out PCBs. (1) PCB shall be designed so that products are not subject to mechanical stress due to warping the board. [Products direction] Products shall be located in the sideways direction (length: a < b) to the mechanical stress. a b 〈 Poor example〉 〈 Good example〉 (2) Components location on PCB separation It is effective to implement the following measures, to reduce stress in separating the board. It is best to implement all of the following three measures; however, implement as many measures as possible to reduce stress. Contents of measures Stress level (1) Turn the mounting direction of the component parallel to the board separation surface. A > D*1 (2) Add slits in the board separation part. A>B (3) Keep the mounting position of the component away from the board separation surface. A>C *1 A > D is valid when stress is added vertically to the perforation as with hand separation. If a cutting disc is used, stress will be diagonal to the PCB, therefore A > D is invalid. MURATA MFG CO., LTD Spec No.: JELF243A_9116E-01 P10/12 (3) Mounting components near screw holes When a component is mounted near a screw hole, it may be affected by the board deflection that occurs during the tightening of the screw. Mount the component in a position as far away from the screw holes as possible. 11.7 Handling of substrate After mounting products on a substrate, do not apply any stress to the product caused by bending or twisting to the substrate when cropping the substrate, inserting and removing a connector from the substrate or tightening screw to the substrate. Excessive mechanical stress may cause cracking in the product. Bending Twisting 11.8 Cleaning The product shall be cleaned under the following conditions. (1) The cleaning temperature shall be 60°C max. If isopropyl alcohol (IPA) is used, the cleaning temperature shall be 40°C max. (2) Perform ultrasonic cleaning under the following conditions. Exercise caution to prevent resonance phenomenon in mounted products and the PCB. Item Requirement Power Time 20 W/L max. 5 min max. Frequency 28 kHz to 40 kHz (3) Cleaner Alcohol-based cleaner: IPA Aqueous agent: PINE ALPHA ST-100S (4) There shall be no residual flux or residual cleaner. When using aqueous agent, rinse the product with deionized water adequately and completely dry it so that no cleaner is left. * For other cleaning, consult our technical department. 11.9 Storage and transportation Storage period Use the product within 12 months after delivery. If you do not use the product for more than 12 months, check solderability before using it. Storage conditions • The products shall be stored in a room not subject to rapid changes in temperature and humidity. The recommended temperature range is -10°C to +40°C. The recommended relative humidity range is 15% to 85%. Keeping the product in corrosive gases, such as sulfur, chlorine gas or acid, oxidizes the electrode, resulting in poor solderability or corrosion of the coil wire of the product. • Do not keep products in bulk packaging. Doing so may cause collision between the products or between the products and other products, resulting in core chipping or wire breakage. • Do not place the products directly on the floor; they should be placed on a palette so that they are not affected by humidity or dust. • Avoid keeping the products in a place exposed to direct sunlight, heat or vibration. Transportation Excessive vibration and impact reduces the reliability of the products. Exercise caution when handling the products. MURATA MFG CO., LTD Spec No.: JELF243A_9116E-01 P11/12 11.10 Resin coating The inductance value may change due to high cure-stress of resin to be used for coating/molding products. A wire breakage issue may occur by mechanical stress caused by the resin, amount/cured shape of resin, or operating condition etc. Some resin contains some impurities or chloride possible to generate chlorine by hydrolysis under some operating condition may cause corrosion of wire of coil, leading to wire breakage. So, please pay your careful attention when you select resin in case of coating/molding the products with the resin. Prior to use the coating resin, please make sure no reliability issue is observed by evaluating products mounted on your board. 11.11 Handling of product • Sharp material such as a pair of tweezers or other material such as bristles of cleaning brush, shall not be touched to the winding portion to prevent the breaking of wire. • Mechanical shock should not be applied to the products mounted on the board to prevent the breaking of the core. 11.12 Handling with mounting equipment • With some types of mounting equipment, a support pin pushes up the product from the bottom of the base (paper) tape when the product is sucked with the pick-up nozzle. When using this type of equipment, detach the support pin to prevent the breaking of wire on the product. • In some cases, the laser recognition function of the mounting equipment may not recognize this product correctly. Please contact us when using laser recognition. (There is no problem with the permeation and reflection type.) 12. Note (1) Please make sure that your product has been evaluated in view of your specifications with our product being mounted to your product. (2) You are requested not to use our product deviating from the reference specifications. (3) The contents of this reference specification are subject to change without advance notice. Please approve our product specifications or transact the approval sheet for product specifications before ordering. 13. Appendix Electrical performance: Measuring method for inductance/Q (Q measurement is applicable only when the Q value is included in the rating table.) Perform measurement using the method described below. (Perform correction for the error deriving from the measuring terminal.) (1) Residual elements and stray elements of the measuring terminal can be expressed by the F parameter for the 2-pole terminal as shown in the figure below. (2) The product's impedance value (Zx) and measured impedance value (Zm) can be expressed as shown below, by using the respective current and voltage for input/output. Zm= V1 I1 Zx= V2 I2 (3) Thus, the relationship between the product's impedance value (Zx) and measured impedance value (Zm) is as follows. Zx=α Zm-β 1-ZmΓ Here, α = D/A = 1 β = B/D = Zsm - (1 - Yom Zsm) Zss Γ = C/A = Yom Zsm: measured impedance of short chip Zss: residual impedance of short chip (0.771 nH) Yom: measured admittance when measuring terminal is open (4) Calculate inductance Lx and Qx using the equations shown below. MURATA MFG CO., LTD Spec No.: JELF243A_9116E-01 Im (Zx) 2πf Im (Zx) Qx= Re (Zx) Lx= P12/12 Lx: inductance of chip coil Qx: Q of chip coil f: measuring frequency MURATA MFG CO., LTD