Spec No.: JELF243A_0024AA-01
P1/12
CHIP COILS (CHIP INDUCTORS) LQW18AN□□□□00□ REFERENCE SPECIFICATION
1. Scope
This reference specification applies to chip coils (chip inductors) LQW18AN_00 series for general electronic equipment.
2. Part Numbering
(Ex.)
LQ
W
18
Product Structure Dimension
ID
(L × W)
A
N
2N2
D
0
0
D
Application Category Inductance Tolerance Performance
Electrode
Packaging
and
specification D: taping
characteristic
*B: bulk
*B: Bulk packing is also available (taping condition: however, products without reels are put in plastic bags).
3. Part Number and Rating
Operating temperature range
-55°C to +125°C
Storage temperature range
-55°C to +125°C
Customer
Part number
Murata
Part number
Inductance
DC
Self-resonant
resistance
frequency
(Ω max.)
(MHz min.)
Rated
current
(mA)
Nominal value
(nH)
Tolerance
Q
(Min.)
LQW18AN2N2D00D
2.2
D: ±0.5 nH
16
0.042
6000
700
LQW18AN3N6C00D
3.6
C: ±0.2 nH
25
0.059
6000
850
LQW18AN3N6D00D
3.6
D: ±0.5 nH
25
0.059
6000
850
LQW18AN3N9C00D
3.9
C: ±0.2 nH
35
0.059
6000
850
LQW18AN3N9D00D
3.9
D: ±0.5 nH
35
0.059
6000
850
LQW18AN4N3C00D
4.3
C: ±0.2 nH
35
0.059
6000
850
LQW18AN4N3D00D
4.3
D: ±0.5 nH
35
0.059
6000
850
LQW18AN4N7D00D
4.7
D: ±0.5 nH
35
0.059
6000
850
LQW18AN5N6C00D
5.6
C: ±0.2 nH
35
0.082
6000
750
LQW18AN5N6D00D
5.6
D: ±0.5 nH
35
0.082
6000
750
LQW18AN6N2C00D
6.2
C: ±0.2 nH
35
0.082
6000
750
LQW18AN6N2D00D
6.2
D: ±0.5 nH
35
0.082
6000
750
LQW18AN6N8C00D
6.8
C: ±0.2 nH
35
0.082
6000
750
LQW18AN6N8D00D
6.8
D: ±0.5 nH
35
0.082
6000
750
LQW18AN7N5C00D
7.5
C: ±0.2 nH
35
0.082
6000
750
LQW18AN7N5D00D
7.5
D: ±0.5 nH
35
0.082
6000
750
LQW18AN8N2C00D
8.2
C: ±0.2 nH
35
0.11
6000
650
LQW18AN8N2D00D
8.2
D: ±0.5 nH
35
0.11
6000
650
LQW18AN8N7C00D
8.7
C: ±0.2 nH
35
0.11
6000
650
LQW18AN8N7D00D
8.7
D: ±0.5 nH
35
0.11
6000
650
LQW18AN9N1C00D
9.1
C: ±0.2 nH
35
0.11
6000
650
LQW18AN9N1D00D
9.1
D: ±0.5 nH
35
0.11
6000
650
LQW18AN9N5D00D
9.5
D: ±0.5 nH
35
0.11
6000
650
LQW18AN10NG00D
10
G: ±2%
35
0.11
6000
650
LQW18AN10NJ00D
10
J: ±5%
35
0.11
6000
650
LQW18AN11NG00D
11
G: ±2%
35
0.11
6000
650
LQW18AN11NJ00D
11
J: ±5%
35
0.11
6000
650
LQW18AN12NG00D
12
G: ±2%
35
0.13
6000
600
LQW18AN12NJ00D
12
J: ±5%
35
0.13
6000
600
LQW18AN13NG00D
13
G: ±2%
35
0.13
6000
600
LQW18AN13NJ00D
13
J: ±5%
35
0.13
6000
600
MURATA MFG CO., LTD
Spec No.: JELF243A_0024AA-01
Customer
Part number
Murata
Part number
P2/12
Inductance
Q
(Min.)
DC
Self-resonant
resistance
frequency
(Ω max.)
(MHz min.)
Rated
current
(mA)
Nominal value
(nH)
Tolerance
LQW18AN15NG00D
15
G: ±2%
40
0.13
6000
600
LQW18AN15NJ00D
15
J: ±5%
40
0.13
6000
600
LQW18AN16NG00D
16
G: ±2%
40
0.16
5500
550
LQW18AN16NJ00D
16
J: ±5%
40
0.16
5500
550
LQW18AN18NG00D
18
G: ±2%
40
0.16
5500
550
LQW18AN18NJ00D
18
J: ±5%
40
0.16
5500
550
LQW18AN20NG00D
20
G: ±2%
40
0.16
4900
550
LQW18AN20NJ00D
20
J: ±5%
40
0.16
4900
550
LQW18AN22NG00D
22
G: ±2%
40
0.17
4600
500
LQW18AN22NJ00D
22
J: ±5%
40
0.17
4600
500
LQW18AN24NG00D
24
G: ±2%
40
0.21
3800
500
LQW18AN24NJ00D
24
J: ±5%
40
0.21
3800
500
LQW18AN27NG00D
27
G: ±2%
40
0.21
3700
440
LQW18AN27NJ00D
27
J: ±5%
40
0.21
3700
440
LQW18AN30NG00D
30
G: ±2%
40
0.23
3300
420
LQW18AN30NJ00D
30
J: ±5%
40
0.23
3300
420
LQW18AN33NG00D
33
G: ±2%
40
0.23
3200
420
LQW18AN33NJ00D
33
J: ±5%
40
0.23
3200
420
LQW18AN36NG00D
36
G: ±2%
40
0.26
2900
400
LQW18AN36NJ00D
36
J: ±5%
40
0.26
2900
400
LQW18AN39NG00D
39
G: ±2%
40
0.26
2800
400
LQW18AN39NJ00D
39
J: ±5%
40
0.26
2800
400
LQW18AN43NG00D
43
G: ±2%
40
0.29
2700
380
LQW18AN43NJ00D
43
J: ±5%
40
0.29
2700
380
LQW18AN47NG00D
47
G: ±2%
38
0.29
2600
380
LQW18AN47NJ00D
47
J: ±5%
38
0.29
2600
380
LQW18AN51NG00D
51
G: ±2%
38
0.33
2500
370
LQW18AN51NJ00D
51
J: ±5%
38
0.33
2500
370
LQW18AN56NG00D
56
G: ±2%
38
0.35
2400
360
LQW18AN56NJ00D
56
J: ±5%
38
0.35
2400
360
LQW18AN62NG00D
62
G: ±2%
38
0.51
2300
280
LQW18AN62NJ00D
62
J: ±5%
38
0.51
2300
280
LQW18AN68NG00D
68
G: ±2%
38
0.38
2200
340
LQW18AN68NJ00D
68
J: ±5%
38
0.38
2200
340
LQW18AN72NG00D
72
G: ±2%
34
0.56
2100
270
LQW18AN72NJ00D
72
J: ±5%
34
0.56
2100
270
LQW18AN75NG00D
75
G: ±2%
34
0.56
2050
270
LQW18AN75NJ00D
75
J: ±5%
34
0.56
2050
270
LQW18AN82NG00D
82
G: ±2%
34
0.60
2000
250
LQW18AN82NJ00D
82
J: ±5%
34
0.60
2000
250
LQW18AN91NG00D
91
G: ±2%
34
0.64
1900
230
LQW18AN91NJ00D
91
J: ±5%
34
0.64
1900
230
LQW18ANR10G00D
100
G: ±2%
34
0.68
1800
220
LQW18ANR10J00D
100
J: ±5%
34
0.68
1800
220
LQW18ANR11G00D
110
G: ±2%
32
1.2
1700
200
LQW18ANR11J00D
110
J: ±5%
32
1.2
1700
200
MURATA MFG CO., LTD
Spec No.: JELF243A_0024AA-01
Customer
Part number
P3/12
Murata
Part number
Inductance
Q
(Min.)
DC
Self-resonant
resistance
frequency
(Ω max.)
(MHz min.)
Rated
current
(mA)
Nominal value
(nH)
Tolerance
LQW18ANR12G00D
120
G: ±2%
32
1.3
1600
180
LQW18ANR12J00D
120
J: ±5%
32
1.3
1600
180
LQW18ANR13G00D
130
G: ±2%
32
1.4
1450
170
LQW18ANR13J00D
130
J: ±5%
32
1.4
1450
170
LQW18ANR15G00D
150
G: ±2%
32
1.5
1400
160
LQW18ANR15J00D
150
J: ±5%
32
1.5
1400
160
LQW18ANR16G00D
160
G: ±2%
32
2.1
1350
150
LQW18ANR16J00D
160
J: ±5%
32
2.1
1350
150
LQW18ANR18G00D
180
G: ±2%
25
2.2
1300
140
LQW18ANR18J00D
180
J: ±5%
25
2.2
1300
140
LQW18ANR20G00D
200
G: ±2%
25
2.4
1250
120
LQW18ANR20J00D
200
J: ±5%
25
2.4
1250
120
LQW18ANR22G00D
220
G: ±2%
25
2.5
1200
120
LQW18ANR22J00D
220
J: ±5%
25
2.5
1200
120
LQW18ANR27G00D
270
G: ±2%
30
3.4
960
110
LQW18ANR27J00D
270
J: ±5%
30
3.4
960
110
LQW18ANR33G00D
330
G: ±2%
30
5.5
800
85
LQW18ANR33J00D
330
J: ±5%
30
5.5
800
85
LQW18ANR39G00D
390
G: ±2%
30
6.2
800
80
LQW18ANR39J00D
390
J: ±5%
30
6.2
800
80
LQW18ANR47G00D
470
G: ±2%
30
7.0
700
75
LQW18ANR47J00D
470
J: ±5%
30
7.0
700
75
4. Testing Conditions
Unless otherwise specified
Temperature: ordinary temperature (15°C to 35°C)
Humidity: ordinary humidity [25% to 85% (RH)]
In case of doubt
Temperature: 20°C±2°C
Humidity: 60% to 70% (RH)
Atmospheric pressure: 86 kPa to 106 kPa
5. Appearance and Dimensions
Unit mass (typical value): 0.003 g
MURATA MFG CO., LTD
Spec No.: JELF243A_0024AA-01
P4/12
6. Marking
No marking.
7. Electrical Performance
No.
Item
7.1
Inductance
Specification
Meet chapter 3 ratings.
Test method
Measuring equipment: Keysight E4991A or the
equivalent
Measuring frequency:
Inductance
100 MHz
Q
250 MHz 2.2 nH to 39 nH
200 MHz 43 nH to 68 nH
150 MHz 72 nH to 160 nH
7.2
Q
100 MHz 180 nH to 470 nH
Measuring conditions:
Measurement signal level: Approx. 0 dBm
Measurement terminal distance: 1.0 mm
Electrical length: 10.0 mm
Measuring fixture: Keysight 16197A
Position the chip coil under test as shown in the
measuring example below and connect it to the
electrode by applying weight.
Measurement example:
Meet chapter 3 ratings.
Measuring method: see "Electrical performance:
Measuring method for inductance/Q" in the chapter
"16. Appendix".
7.3
DC resistance
Meet chapter 3 ratings.
Measuring equipment: digital multimeter
7.4
Self-resonant
frequency
Meet chapter 3 ratings.
Measuring equipment: Keysight N5230A or the
equivalent
7.5
Rated current
Product temperature rise: 20°C max.
Inductance change rate: within ±10%
Apply the rated current specified in chapter 3.
8. Mechanical Performance
No.
8.1
Item
Shear test
Specification
Test method
No significant mechanical damage or no Test substrate: glass-epoxy substrate
sign of electrode peeling off shall be
Force application direction:
observed.
Applying force: 5 N
Holding time: 5 s±1 s
MURATA MFG CO., LTD
Spec No.: JELF243A_0024AA-01
No.
P5/12
Item
Specification
Test method
8.2
Bending test
No significant mechanical damage or no Test substrate: glass-epoxy substrate (100mm × 40
sign of electrode peeling off shall be
mm × 1.6 mm)
observed.
Pressurizing speed: 1 mm/s
Deflection: 2 mm
Holding time: 30 s
8.3
Vibration
Appearance shall have no significant
mechanical damage.
8.4
Solderability
90% or more of the outer electrode shall Flux: immersed in ethanol solution [including an
be covered with new solder seamlessly. activator with a chlorine conversion value of 0.06(wt)%]
with a rosin content of 25(wt)% for 5 s to 10 s.
Solder: Sn-3.0Ag-0.5Cu solder
Pre-heating: 150°C±10°C/60 s to 90 s
Solder temperature: 240°C±5°C
Immersion time: 3 s±1 s
8.5
Resistance to
soldering heat
Appearance: No significant mechanical
damage shall be observed.
Inductance change rate: within ±5%
Oscillation frequency: 10 Hz to 55 Hz to 10 Hz, for
approx. 1 min
Total amplitude: 1.5 mm
Test time: 3 directions perpendicular to each other, 2 h
for each direction (6 h in total)
Flux: immersed in ethanol solution [including an
activator with a chlorine conversion value of 0.06(wt)%]
with a rosin content of 25(wt)% for 5 s to 10 s.
Solder: Sn-3.0Ag-0.5Cu solder
Pre-heating: 150°C±10°C/60 s to 90 s
Solder temperature: 270°C±5°C
Immersion time: 10 s±1 s
Post-treatment: left at a room condition for 24 h±2 h
9. Environmental Performance
The product is soldered on a substrate for test.
No.
Item
Specification
Test method
9.1
Heat resistance
Appearance: No significant mechanical
damage shall be observed.
Inductance change rate: within ±5%
Q change rate: within ±20%
Temperature: 125°C±2°C
Test time: 1000 h (+48 h, -0 h)
Post-treatment: left at a room condition for 24 h±2 h
9.2
Cold resistance
Appearance: No significant mechanical
damage shall be observed.
Inductance change rate: within ±5%
Q change rate: within ±20%
Temperature: -55°C±2°C
Test time: 1000 h (+48 h, -0 h)
Post-treatment: left at a room condition for 24 h±2 h
9.3
Humidity
Appearance: No significant mechanical
damage shall be observed.
Inductance change rate: within ±5%
Q change rate: within ±20%
Temperature: 40°C±2°C
Humidity: 90% (RH) to 95% (RH)
Test time: 1000 h (+48 h, -0 h)
Post-treatment: left at a room condition for 24 h±2 h
9.4
Temperature cycle Appearance: No significant mechanical
damage shall be observed.
Inductance change rate: within ±5%
Q change rate: within ±20%
Single cycle conditions:
Step 1: -55°C±2°C/30 min±3 min
Step 2: ordinary temperature/10 min to 15 min
Step 3: +125°C±2°C/30 min±3 min
Step 4: ordinary temperature/10 min to 15 min
Number of testing: 10 cycles
Post-treatment: left at a room condition for 24 h±2 h
MURATA MFG CO., LTD
Spec No.: JELF243A_0024AA-01
P6/12
10. Specification of Packaging
10.1 Appearance and dimensions of tape (8 mm width/paper tape)
A
1.0±0.05
B
1.8±0.05
t
1.1 max.
(in mm)
10.2 Taping specifications
Packing quantity
(Standard quantity)
4000 pcs/reel
Packing method
The products are placed in embossed cavities of a base tape and sealed by a top tape and a bottom
tape.
Feed hole position
The feed holes on the base tape are on the right side when the top tape is pulled toward the user.
Joint
The base tape and the top tape are seamless.
Number of missing
products
Number of missing products within 0.025% of the number per reel or 1 pc., whichever is greater, and
are not continuous. The specified quantity per reel is kept.
10.3 Break down force of tape
Break down force of top tape
5 N min.
Break down force of bottom tape
5 N min.
10.4 Peeling off force of top tape
Speed of peeling off
Peeling off force
165 to 180 degree
Bottom tape
300 mm/min
0.1 N to 0.6 N (The lower limit is for typical value.)
F
Top tape
Base tape
10.5 Dimensions of leader section, trailer section and reel
A vacant section is provided in the leader (start) section and trailer (end) section of the tape for the product. The leader
section is further provided with an area consisting only of the cover tape (or top tape). (See the diagram below.)
MURATA MFG CO., LTD
Spec No.: JELF243A_0024AA-01
P7/12
10.6 Marking for reel
Customer part number, Murata part number, inspection number (*1), RoHS marking (*2), quantity, etc.
*1 Expression of inspection No.: (1) Factory code
□□
○○○○
(2) Date
First digit: year/last digit of year
(1)
(2)
(3)
Second digit: month/Jan. to Sep.→1 to 9, Oct. to Dec.→O, N, D
Third, Fourth digit: day
(3) Serial No.
*2 Expression of RoHS marking: (1) RoHS regulation conformity
ROHSY
()
(2) Murata classification number
(1)
(2)
10.7 Marking on outer box (corrugated box)
Customer name, purchasing order number, customer part number, Murata part number, RoHS marking (*2), quantity, etc.
10.8 Specification of outer box
Label
H
D
W
11.
Dimensions of outer box
(mm)
W
D
H
186
186
93
Standard reel quantity
in outer box (reel)
5
* Above outer box size is typical. It depends on a
quantity of an order.
Caution
11.1 Restricted applications
Please contact us before using our products for the applications listed below which require especially high reliability for the
prevention of defects which might directly cause damage to the third party's life, body or property.
(1) Aircraft equipment
(2) Aerospace equipment
(3) Undersea
(4) Power plant control
equipment
equipment
(5) Medical equipment
(6) Transportation equipment
(7) Traffic signal
(8) Disaster/crime prevention
(vehicles, trains, ships, etc.)
equipment
equipment
(9) Data-processing
(10) Applications of similar complexity and/or reliability
equipment
requirements to the applications listed in the above
11.2 Precautions on rating
Avoid using in exceeded the rated temperature range, rated voltage, or rated current.
Usage when the ratings are exceeded could lead to wire breakage, burning, or other serious fault.
11.3 Inrush current
If an inrush current (or pulse current or rush current) that significantly exceeds the rated current is applied to the product,
overheating could occur, resulting in wire breakage, burning, or other serious fault.
11.4 Corrosive gas
Please refrain from use since contact with environments with corrosive gases (sulfur gas [hydrogen sulfide, sulfur dioxide,
etc.], chlorine, ammonia, etc.) or oils (cutting oil, silicone oil, etc.) that have come into contact with the previously stated
corrosive gas environment will result in deterioration of product quality or an open from deterioration due to corrosion of
product electrode, etc. We will not bear any responsibility for use under these environments.
12. Precautions for Use
This product is for use only with reflow soldering. It is designed to be mounted by soldering. If you want to use other
mounting method, for example, using a conductive adhesive, please consult us beforehand.
Also, if repeatedly subjected to temperature cycles or other thermal stress, due to the difference in the coefficient of thermal
expansion with the mounting substrate, the solder (solder fillet part) in the mounting part may crack.
The occurrence of cracks due to thermal stress is affected by the size of the land where mounted, the solder volume, and
the heat dissipation of the mounting substrate. Carefully design it when a large change in ambient temperature is assumed.
MURATA MFG CO., LTD
Spec No.: JELF243A_0024AA-01
P8/12
12.1 Land dimensions
The following diagram shows the recommended land dimensions for reflow soldering.
The land dimensions are designed in consideration of electrical characteristics and mountability. Use of other land
dimensions may preclude achievement of performance. In some cases, it may result in poor solderability, including positional
shift. If you use other land pattern, consider it adequately.
a
0.6 to 0.8
b
1.9 to 2.0
c
0.7 to 1.0
(in mm)
12.2 Flux and solder used
Flux
• Use a rosin-based flux that includes an activator with a chlorine conversion value of 0.06(wt)% to 0.1(wt)%.
• Do not use a highly acidic flux with a halide content exceeding 0.2(wt)% (chlorine conversion value).
• Do not use a water-soluble flux.
Solder
• Use Sn-3.0Ag-0.5Cu solder.
• Standard thickness of solder paste: 100 μm to 150 μm
If you want to use a flux other than the above, please consult our technical department.
12.3 Soldering conditions (reflow)
• Pre-heating should be in such a way that the temperature difference between solder and product surface is limited to
150°C max.
Cooling into solvent after soldering also should be in such a way that the temperature difference is limited to 100°C max.
Insufficient pre-heating may cause cracks on the product, resulting in the deterioration of product quality.
• Standard soldering profile and the limit soldering profile is as follows.
The excessive limit soldering conditions may cause leaching of the electrode and/or resulting in the deterioration of product
quality.
Temp.
(℃)
260℃
245℃±3℃
220℃
230℃
Limit Profile
180
150
Standard Profile
30s～60s
60s max.
90s±30s
Time. (s)
Standard profile
Limit profile
Pre-heating
150°C to 180°C/90 s±30 s
150°C to 180°C/90 s±30 s
Heating
Above 220°C/30 s to 60 s
Above 230°C/60 s max.
245°C±3°C
260°C/10 s
2 times
2 times
Peak temperature
Number of reflow cycles
MURATA MFG CO., LTD
Spec No.: JELF243A_0024AA-01
P9/12
12.4 Reworking with soldering iron
The following requirements must be met to rework a soldered product using a soldering iron.
Item
Requirement
Pre-heating
150°C/approx. 1 min
Tip temperature of soldering iron
350°C max.
Power consumption of soldering iron
80 W max.
Tip diameter of soldering iron
ø3 mm max.
Soldering time
3 s (+1 s, -0 s)
Number of reworking operations
2 times max.
* Avoid a direct contact of the tip of the soldering iron with the product. Such a
direction contact may cause cracks in the ceramic body due to thermal shock.
12.5 Solder volume
Solder shall be used not to increase the volume too much.
An increased solder volume increases mechanical stress on the product. Exceeding solder volume may cause the failure of
mechanical or electrical performance.
12.6 Product's location
The following shall be considered when designing and laying out PCBs.
(1) PCB shall be designed so that products are not subject to mechanical stress due to warping the board.
[Products direction]
Products shall be located in the sideways direction (length: a < b) to the mechanical stress.
a
b
〈 Poor example〉
〈 Good example〉
(2) Components location on PCB separation
It is effective to implement the following measures, to reduce stress in separating the board.
It is best to implement all of the following three measures; however, implement as many measures as possible to reduce
stress.
Contents of measures
Stress level
(1) Turn the mounting direction of the component parallel to the
board separation surface.
A > D*1
(2) Add slits in the board separation part.
A>B
(3) Keep the mounting position of the component away from the
board separation surface.
A>C
*1 A > D is valid when stress is added vertically to the perforation as with hand separation.
If a cutting disc is used, stress will be diagonal to the PCB, therefore A > D is invalid.
MURATA MFG CO., LTD
Spec No.: JELF243A_0024AA-01
P10/12
(3) Mounting components near screw holes
When a component is mounted near a screw hole, it may be affected by the board deflection that occurs during the
tightening of the screw.
Mount the component in a position as far away from the screw holes as possible.
12.7 Handling of substrate
After mounting products on a substrate, do not apply any stress to the product caused by bending or twisting to the substrate
when cropping the substrate, inserting and removing a connector from the substrate or tightening screw to the substrate.
Excessive mechanical stress may cause cracking in the product.
Bending
Twisting
12.8 Cleaning
The product shall be cleaned under the following conditions.
(1) The cleaning temperature shall be 60°C max. If isopropyl alcohol (IPA) is used, the cleaning temperature shall be 40°C
max.
(2) Perform ultrasonic cleaning under the following conditions. Exercise caution to prevent resonance phenomenon in
mounted products and the PCB.
Item
Requirement
Power
Time
20 W/L max.
5 min max.
Frequency
28 kHz to 40 kHz
(3) Cleaner
Alcohol-based cleaner: IPA
Aqueous agent: PINE ALPHA ST-100S
(4) There shall be no residual flux or residual cleaner. When using aqueous agent, rinse the product with deionized water
adequately and completely dry it so that no cleaner is left.
* For other cleaning, consult our technical department.
12.9 Storage and transportation
Storage period
Use the product within 12 months after delivery.
If you do not use the product for more than 12 months, check solderability before using it.
Storage conditions
• The products shall be stored in a room not subject to rapid changes in temperature and humidity.
The recommended temperature range is -10°C to +40°C. The recommended relative humidity
range is 15% to 85%.
Keeping the product in corrosive gases, such as sulfur, chlorine gas or acid, oxidizes the
electrode, resulting in poor solderability or corrosion of the coil wire of the product.
• Do not keep products in bulk packaging. Doing so may cause collision between the products or
between the products and other products, resulting in core chipping or wire breakage.
• Do not place the products directly on the floor; they should be placed on a palette so that they are
not affected by humidity or dust.
• Avoid keeping the products in a place exposed to direct sunlight, heat or vibration.
Transportation
Excessive vibration and impact reduces the reliability of the products. Exercise caution when
handling the products.
MURATA MFG CO., LTD
Spec No.: JELF243A_0024AA-01
P11/12
12.10 Resin coating
The inductance value may change due to high cure-stress of resin to be used for coating/molding products.
A wire breakage issue may occur by mechanical stress caused by the resin, amount/cured shape of resin, or operating
condition etc. Some resin contains some impurities or chloride possible to generate chlorine by hydrolysis under some
operating condition may cause corrosion of wire of coil, leading to wire breakage.
So, please pay your careful attention when you select resin in case of coating/molding the products with the resin.
Prior to use the coating resin, please make sure no reliability issue is observed by evaluating products mounted on your
board.
12.11 Handling of product
• Sharp material such as a pair of tweezers or other material such as bristles of cleaning brush, shall not be touched to the
winding portion to prevent the breaking of wire.
• Mechanical shock should not be applied to the products mounted on the board to prevent the breaking of the core.
12.12 Handling with mounting equipment
• With some types of mounting equipment, a support pin pushes up the product from the bottom of the base (paper) tape
when the product is sucked with the pick-up nozzle.
When using this type of equipment, detach the support pin to prevent the breaking of wire on the product.
• In some cases, the laser recognition function of the mounting equipment may not recognize this product correctly.
Please contact us when using laser recognition. (There is no problem with the permeation and reflection type.)
13.
Note
(1) Please make sure that your product has been evaluated in view of your specifications with our product being mounted to
your product.
(2) You are requested not to use our product deviating from the reference specifications.
(3) The contents of this reference specification are subject to change without advance notice. Please approve our product
specifications or transact the approval sheet for product specifications before ordering.
14. Appendix
Electrical performance: Measuring method for inductance/Q (Q measurement is applicable only when the Q value is
included in the rating table.)
Perform measurement using the method described below. (Perform correction for the error deriving from the measuring
terminal.)
(1) Residual elements and stray elements of the measuring terminal can be expressed by the F parameter for the 2-pole
terminal as shown in the figure below.
(2) The product's impedance value (Zx) and measured impedance value (Zm) can be expressed as shown below, by using
the respective current and voltage for input/output.
Zm=
V1
I1
Zx=
V2
I2
(3) Thus, the relationship between the product's impedance value (Zx) and measured impedance value (Zm) is as follows.
Zx=α
Zm-β
1-ZmΓ
Here,
α = D/A = 1
β = B/D = Zsm - (1 - Yom Zsm) Zss
Γ = C/A = Yom
Zsm: measured impedance of short chip
Zss: residual impedance of short chip (0.771 nH)
Yom: measured admittance when measuring terminal is open
MURATA MFG CO., LTD
Spec No.: JELF243A_0024AA-01
P12/12
(4) Calculate inductance Lx and Qx using the equations shown below.
Im (Zx)
Lx: inductance of chip coil
Lx=
2πf
Qx: Q of chip coil
Im (Zx)
f: measuring frequency
Qx=
Re (Zx)
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