LQW18AS22NJ0CD

Spec No.: JELF243A_0167B-01 P1/11 CHIP COILS (CHIP INDUCTORS) LQW18AS□□□□0C□ REFERENCE SPECIFICATION 1. Scope This reference specification applies to chip coils (chip inductors) LQW18AS_0C series for general electronic equipment. 2. Part Numbering (Ex.) LQ W 18 A S 1N6 J 0 C Product Structure Dimension ID (L × W) Application Category Inductance Tolerance Performance Electrode and specification characteristic C: Non-magnetic *B: Bulk packing is also available (taping condition: however, products without reels are put in plastic bags). D Packaging D: taping *B: bulk 3. Part Number and Rating Operating temperature range -40°C to +85°C (including self-generated heat) Storage temperature range -40°C to +85°C Inductance Customer Part number Tolerance Q (Min.) DC resistance (Ω max.) Self-resonant frequency (MHz min.) Rated current (mA) 1.6 J: ±5% 24 0.030 12500 700 LQW18AS3N3G0CD 3.3 G: ±2% 35 0.045 5900 700 LQW18AS4N3G0CD 4.3 G: ±2% 22 0.063 5900 700 Murata Part number Nominal value (nH) LQW18AS1N6J0CD LQW18AS4N3J0CD 4.3 J: ±5% 22 0.063 5900 700 LQW18AS5N6G0CD 5.6 G: ±2% 26 0.075 4760 700 LQW18AS5N6J0CD 5.6 J: ±5% 26 0.075 4760 700 LQW18AS8N2G0CD 8.2 G: ±2% 30 0.115 4200 700 LQW18AS8N2J0CD 8.2 J: ±5% 30 0.115 4200 700 LQW18AS10NG0CD 10 G: ±2% 31 0.130 4800 700 LQW18AS10NJ0CD 10 J: ±5% 31 0.130 4800 700 LQW18AS11NG0CD 11 G: ±2% 30 0.086 4000 700 LQW18AS11NJ0CD 11 J: ±5% 30 0.086 4000 700 LQW18AS15NG0CD 15 G: ±2% 35 0.170 4000 700 LQW18AS15NJ0CD 15 J: ±5% 35 0.170 4000 700 LQW18AS16NG0CD 16 G: ±2% 34 0.104 3300 700 LQW18AS16NJ0CD 16 J: ±5% 34 0.104 3300 700 LQW18AS18NG0CD 18 G: ±2% 35 0.170 3100 700 LQW18AS18NJ0CD 18 J: ±5% 35 0.170 3100 700 LQW18AS22NG0CD 22 G: ±2% 38 0.190 3000 700 LQW18AS22NJ0CD 22 J: ±5% 38 0.190 3000 700 LQW18AS24NG0CD 24 G: ±2% 36 0.135 2650 700 LQW18AS24NJ0CD 24 J: ±5% 36 0.135 2650 700 LQW18AS33NG0CD 33 G: ±2% 40 0.220 2300 600 LQW18AS33NJ0CD 33 J: ±5% 40 0.220 2300 600 LQW18AS47NG0CD 47 G: ±2% 38 0.280 2000 600 LQW18AS56NG0CD 56 G: ±2% 38 0.310 1900 600 LQW18AS56NJ0CD 56 J: ±5% 38 0.310 1900 600 LQW18AS68NG0CD 68 G: ±2% 37 0.340 1700 600 LQW18AS68NJ0CD 68 J: ±5% 37 0.340 1700 600 LQW18AS82NG0CD 82 G: ±2% 34 0.540 1700 400 MURATA MFG CO., LTD Spec No.: JELF243A_0167B-01 P2/11 Inductance Customer Part number Tolerance Q (Min.) DC resistance (Ω max.) Self-resonant frequency (MHz min.) Rated current (mA) 82 J: ±5% 34 0.540 1700 400 100 G: ±2% 34 0.580 1400 400 Murata Part number Nominal value (nH) LQW18AS82NJ0CD LQW18ASR10G0CD LQW18ASR10J0CD 100 J: ±5% 34 0.580 1400 400 LQW18ASR12G0CD 120 G: ±2% 32 0.650 1300 300 LQW18ASR12J0CD 120 J: ±5% 32 0.650 1300 300 LQW18ASR15G0CD 150 G: ±2% 28 0.920 990 280 LQW18ASR15J0CD 150 J: ±5% 28 0.920 990 280 LQW18ASR18G0CD 180 G: ±2% 25 1.400 990 240 LQW18ASR18J0CD 180 J: ±5% 25 1.400 990 240 LQW18ASR22G0CD 220 G: ±2% 25 2.100 900 200 LQW18ASR22J0CD 220 J: ±5% 25 2.100 900 200 LQW18ASR27G0CD 270 G: ±2% 24 2.500 900 130 LQW18ASR27J0CD 270 J: ±5% 24 2.500 900 130 LQW18ASR33G0CD 330 G: ±2% 25 3.890 900 100 LQW18ASR33J0CD 330 J: ±5% 25 3.890 900 100 LQW18ASR39G0CD 390 G: ±2% 25 4.350 900 100 LQW18ASR39J0CD 390 J: ±5% 25 4.350 900 100 4. Testing Conditions Unless otherwise specified Temperature: ordinary temperature (15°C to 35°C) Humidity: ordinary humidity [25% to 85% (RH)] In case of doubt Temperature: 20°C±2°C Humidity: 60% to 70% (RH) Atmospheric pressure: 86 kPa to 106 kPa 5. Appearance and Dimensions Unit mass (typical value): 0.003 g 6. Marking No marking. MURATA MFG CO., LTD Spec No.: JELF243A_0167B-01 P3/11 7. Electrical Performance No. Item 7.1 Inductance Specification Meet chapter 3 ratings. Test method Measuring equipment: Keysight E4991A or the equivalent Measuring frequency: Inductance 250 MHz 1.6 nH to 33 nH 200 MHz 47 nH to 68 nH 150 MHz 82 nH to 150 nH 100 MHz 180 nH to 390 nH Q 250 MHz 1.6 nH to 33 nH 200 MHz 47 nH to 68 nH 150 MHz 82 nH to 150 nH 7.2 Q 100 MHz 180 nH to 390 nH Measuring conditions: Measurement signal level: Approx. 0 dBm Measurement terminal distance: 1.0 mm Electrical length: 10.0 mm Measuring fixture: Keysight 16197A Position the chip coil under test as shown in the measuring example below and connect it to the electrode by applying weight. Measurement example: Meet chapter 3 ratings. Measuring method: see "Electrical performance: Measuring method for inductance/Q" in the chapter "14. Appendix". 7.3 DC resistance Meet chapter 3 ratings. Measuring equipment: digital multimeter 7.4 Self-resonant frequency Meet chapter 3 ratings. Measuring equipment: Keysight N5230A or the equivalent 8. Mechanical Performance No. 8.1 Item Shear test Specification No significant mechanical damage or no sign of electrode peeling off shall be observed. Test method Test substrate: glass-epoxy substrate Force application direction: Applying force: 5 N Holding time: 5 s MURATA MFG CO., LTD Spec No.: JELF243A_0167B-01 No. P4/11 Item Specification Test method 8.2 Bending test No significant mechanical damage or no sign of electrode peeling off shall be observed. Test substrate: glass-epoxy substrate (100 mm × 40 mm × 1.6 mm) Pressurizing speed: 1 mm/s Deflection: 2 mm Holding time: 20 s 8.3 Vibration Appearance shall have no significant mechanical damage. Oscillation frequency: 10 Hz to 2000 Hz to 10 Hz, for approx. 20 min Total amplitude: total amplitude of 3.0 mm or acceleration amplitude of 196 m/s2, whichever is smaller Test time: 3 directions perpendicular to each other, 2 h for each direction (6 h in total) 8.4 Solderability 95% or more of the outer electrode shall be covered with new solder seamlessly (except exposed wire). Flux: immersed in ethanol solution with a rosin content of 25(wt)% for 5 s to 10 s Solder: Sn-3.0Ag-0.5Cu solder Pre-heating: 150°C±10°C/60 s to 90 s Solder temperature: 240°C±5°C Immersion time: 3 s±1 s 8.5 Resistance to soldering heat Appearance: No significant mechanical damage shall be observed. Inductance change rate: within ±5% Flux: immersed in ethanol solution with a rosin content of 25(wt)% for 5 s to 10 s Solder: Sn-3.0Ag-0.5Cu solder Pre-heating: 150°C±10°C/60 s to 90 s Solder temperature: 260°C±5°C Immersion time: 5 s±1 s Post-treatment: left at a room condition for 24 h±2 h 9. Environmental Performance The product is soldered on a substrate for test. No. Item Specification Test method 9.1 Heat life Appearance: No significant mechanical damage shall be observed. Inductance change rate: within ±10% Temperature: 85°C±2°C Applied current: Rated current Test time: 1000 h (+48 h, -0 h) Post-treatment: left at a room condition for 24 h±2 h 9.2 Cold resistance Appearance: No significant mechanical damage shall be observed. Inductance change rate: within ±10% Temperature: -40°C±2°C Test time: 1000 h (+48 h, -0 h) Post-treatment: left at a room condition for 24 h±2 h 9.3 Humidity Appearance: No significant mechanical damage shall be observed. Inductance change rate: within ±10% Temperature: 40°C±2°C Humidity: 90% (RH) to 95% (RH) Test time: 1000 h (+48 h, -0 h) Post-treatment: left at a room condition for 24 h±2 h 9.4 Temperature cycle Appearance: No significant mechanical damage shall be observed. Inductance change rate: within ±10% Single cycle conditions: Step 1: -40°C±2°C/30 min±3 min Step 2: ordinary temperature/3 min Step 3: +85°C±2°C/30 min±3 min Step 4: ordinary temperature/3 min Number of testing: 100 cycles Post-treatment: left at a room condition for 24 h±2 h MURATA MFG CO., LTD Spec No.: JELF243A_0167B-01 P5/11 10. Specification of Packaging 10.1 Appearance and dimensions of tape (8 mm width/paper tape) A (1.06) B (1.86) t 1.1 max. (in mm) 10.2 Taping specifications Packing quantity (Standard quantity) 4000 pcs/reel Packing method The products are placed in embossed cavities of a base tape and sealed by a top tape and a bottom tape. Feed hole position The feed holes on the base tape are on the right side when the top tape is pulled toward the user. Joint The base tape and the top tape are seamless. Number of missing products Number of missing products within 0.1% of the number per reel or 1 pc., whichever is greater, and are not continuous. The specified quantity per reel is kept. 10.3 Break down force of tape Break down force of top tape 5 N min. Break down force of bottom tape 5 N min. 10.4 Peeling off force of top tape Speed of peeling off Peeling off force 165 to 180 degree Bottom tape 300 mm/min 0.1 N to 0.6 N (The lower limit is for typical value.) F Top tape Base tape 10.5 Dimensions of leader section, trailer section and reel A vacant section is provided in the leader (start) section and trailer (end) section of the tape for the product. The leader section is further provided with an area consisting only of the top tape. (See the diagram below.) MURATA MFG CO., LTD Spec No.: JELF243A_0167B-01 P6/11 10.6 Marking for reel Customer part number, Murata part number, inspection number (*1), RoHS marking (*2), quantity, etc. *1 Expression of inspection No.: (1) Factory code  □□ ○○○○ (2) Date First digit: year/last digit of year (1) (2) (3) Second digit: month/Jan. to Sep.→1 to 9, Oct. to Dec.→O, N, D Third, Fourth digit: day (3) Serial No. *2 Expression of RoHS marking: (1) RoHS regulation conformity ROHSY () (2) Murata classification number (1) (2) 10.7 Marking on outer box (corrugated box) Customer name, purchasing order number, customer part number, Murata part number, RoHS marking (*2), quantity, etc. 10.8 Specification of outer box Label H D W 11. Dimensions of outer box (mm) W D H 186 186 93 Standard reel quantity in outer box (reel) 5 * Above outer box size is typical. It depends on a quantity of an order. Caution Restricted applications Please contact us before using our products for the applications listed below which require especially high reliability for the prevention of defects which might directly cause damage to the third party's life, body or property. (1) Aircraft equipment (2) Aerospace equipment (3) Undersea equipment (4) Power plant control equipment (5) Medical equipment (6) Transportation equipment (vehicles, trains, ships, etc.) (7) Traffic signal equipment (8) Disaster/crime prevention equipment (9) Data-processing equipment (10) Applications of similar complexity and/or reliability requirements to the applications listed in the above 12. Precautions for Use This product is for use only with reflow soldering. It is designed to be mounted by soldering. If you want to use other mounting method, for example, using a conductive adhesive, please consult us beforehand. 12.1 Land dimensions The following diagram shows the recommended land dimensions for reflow soldering. The land dimensions are designed in consideration of electrical characteristics and mountability. Use of other land dimensions may preclude achievement of performance. In some cases, it may result in poor solderability, including positional shift. If you use other land pattern, consider it adequately. a 0.65 b 2.0 c 1.0 (in mm) MURATA MFG CO., LTD Spec No.: JELF243A_0167B-01 P7/11 12.2 Flux and solder used Flux • Use a rosin-based flux that includes an activator with a chlorine conversion value of 0.06(wt)% to 0.1(wt)%. • Do not use a highly acidic flux with a halide content exceeding 0.2(wt)% (chlorine conversion value). • Do not use a water-soluble flux. Solder • Use Sn-3.0Ag-0.5Cu solder. • Standard thickness of solder paste: 100 μm to 150 μm If you want to use a flux other than the above, please consult our technical department. 12.3 Soldering conditions (reflow) • Pre-heating should be in such a way that the temperature difference between solder and product surface is limited to 150°C max. Cooling into solvent after soldering also should be in such a way that the temperature difference is limited to 100°C max. Insufficient pre-heating may cause cracks on the product, resulting in the deterioration of product quality. • Standard soldering profile and the limit soldering profile is as follows. The excessive limit soldering conditions may cause leaching of the electrode and/or resulting in the deterioration of product quality. Temp. (℃) 260℃ 245℃±3℃ 220℃ 230℃ Limit Profile 180 150 Standard Profile 30s～60s 60s max. 90s±30s Time. (s) Standard profile Limit profile Pre-heating 150°C to 180°C/90 s±30 s 150°C to 180°C/90 s±30 s Heating Above 220°C/30 s to 60 s Above 230°C/60 s max. 245°C±3°C 260°C/10 s 2 times 2 times Peak temperature Number of reflow cycles 12.4 Reworking with soldering iron The following requirements must be met to rework a soldered product using a soldering iron. Item Requirement Pre-heating 150°C/approx. 1 min Tip temperature of soldering iron 350°C max. Power consumption of soldering iron 80 W max. Tip diameter of soldering iron Soldering time Number of reworking operations ø3 mm max. 3 s (+1 s, -0 s) 2 times max. * Avoid a direct contact of the tip of the soldering iron with the product. Such a direction contact may cause cracks in the ceramic body due to thermal shock. 12.5 Solder volume Solder shall be used not to increase the volume too much. An increased solder volume increases mechanical stress on the product. Exceeding solder volume may cause the failure of mechanical or electrical performance. MURATA MFG CO., LTD Spec No.: JELF243A_0167B-01 P8/11 12.6 Product's location The following shall be considered when designing and laying out PCBs. (1) PCB shall be designed so that products are not subject to mechanical stress due to warping the board. [Products direction] Products shall be located in the sideways direction (length: a < b) to the mechanical stress. a b 〈 Poor example〉 〈 Good example〉 (2) Components location on PCB separation It is effective to implement the following measures, to reduce stress in separating the board. It is best to implement all of the following three measures; however, implement as many measures as possible to reduce stress. Contents of measures Stress level (1) Turn the mounting direction of the component parallel to the board separation surface. A > D*1 (2) Add slits in the board separation part. A>B (3) Keep the mounting position of the component away from the board separation surface. A>C *1 A > D is valid when stress is added vertically to the perforation as with hand separation. If a cutting disc is used, stress will be diagonal to the PCB, therefore A > D is invalid. (3) Mounting components near screw holes When a component is mounted near a screw hole, it may be affected by the board deflection that occurs during the tightening of the screw. Mount the component in a position as far away from the screw holes as possible. 12.7 Handling of substrate After mounting products on a substrate, do not apply any stress to the product caused by bending or twisting to the substrate when cropping the substrate, inserting and removing a connector from the substrate or tightening screw to the substrate. Excessive mechanical stress may cause cracking in the product. Bending Twisting MURATA MFG CO., LTD Spec No.: JELF243A_0167B-01 P9/11 12.8 Cleaning The product shall be cleaned under the following conditions. (1) The cleaning temperature shall be 60°C max. If isopropyl alcohol (IPA) is used, the cleaning temperature shall be 40°C max. (2) Perform ultrasonic cleaning under the following conditions. Exercise caution to prevent resonance phenomenon in mounted products and the PCB. Item Requirement Power 20 W/L max. Time 5 min max. Frequency 28 kHz to 40 kHz (3) Cleaner Alcohol-based cleaner: IPA Aqueous agent: PINE ALPHA ST-100S (4) There shall be no residual flux or residual cleaner. When using aqueous agent, rinse the product with deionized water adequately and completely dry it so that no cleaner is left. * For other cleaning, consult our technical department. 12.9 Storage and transportation Storage period Use the product within 12 months after delivery. If you do not use the product for more than 12 months, check solderability before using it. Storage conditions • The products shall be stored in a room not subject to rapid changes in temperature and humidity. The recommended temperature range is -10°C to +40°C. The recommended relative humidity range is 15% to 85%. Keeping the product in corrosive gases, such as sulfur, chlorine gas or acid, oxidizes the electrode, resulting in poor solderability or corrosion of the coil wire of the product. • Do not keep products in bulk packaging. Doing so may cause collision between the products or between the products and other products, resulting in core chipping or wire breakage. • Do not place the products directly on the floor; they should be placed on a palette so that they are not affected by humidity or dust. • Avoid keeping the products in a place exposed to direct sunlight, heat or vibration. Transportation Excessive vibration and impact reduces the reliability of the products. Exercise caution when handling the products. 12.10 Resin coating The inductance value may change due to high cure-stress of resin to be used for coating/molding products. A wire breakage issue may occur by mechanical stress caused by the resin, amount/cured shape of resin, or operating condition etc. Some resin contains some impurities or chloride possible to generate chlorine by hydrolysis under some operating condition may cause corrosion of wire of coil, leading to wire breakage. So, please pay your careful attention when you select resin in case of coating/molding the products with the resin. Prior to use the coating resin, please make sure no reliability issue is observed by evaluating products mounted on your board. 12.11 Handling of product • Sharp material such as a pair of tweezers or other material such as bristles of cleaning brush, shall not be touched to the winding portion to prevent the breaking of wire. • Mechanical shock should not be applied to the products mounted on the board to prevent the breaking of the core. 12.12 Handling with mounting equipment • With some types of mounting equipment, a support pin pushes up the product from the bottom of the base (paper) tape when the product is sucked with the pick-up nozzle. When using this type of equipment, detach the support pin to prevent the breaking of wire on the product. • In some cases, the laser recognition function of the mounting equipment may not recognize this product correctly. Please contact us when using laser recognition. (There is no problem with the permeation and reflection type.) 13. Note (1) Please make sure that your product has been evaluated in view of your specifications with our product being mounted to your product. (2) You are requested not to use our product deviating from the reference specifications. (3) The contents of this reference specification are subject to change without advance notice. Please approve our product specifications or transact the approval sheet for product specifications before ordering. MURATA MFG CO., LTD Spec No.: JELF243A_0167B-01 P10/11 14. Appendix Electrical performance: Measuring method for inductance/Q (Q measurement is applicable only when the Q value is included in the rating table.) Perform measurement using the method described below. (Perform correction to ensure that the inductance value is compatible with inductors of other manufacturers.) (1) Residual elements and stray elements of the measuring terminal can be expressed by the F parameter for the 2-pole terminal as shown in the figure below. (2) The product's impedance value (Zx) and measured impedance value (Zm) can be expressed as shown below, by using the respective current and voltage for input/output. Zm= V1 I1 Zx= V2 I2 (3) Thus, the relationship between the product's impedance value (Zx) and measured impedance value (Zm) is as follows. Zx=α Zm-β 1-ZmΓ Here, α = D/A = 1 β = B/D = Zsm - (1 - Yom Zsm) Zss Γ = C/A = Yom Zsm: measured impedance when measuring terminal is shorted Zss: residual impedance of short chip (= Equivalent series inductance X*1) Yom: measured admittance when measuring terminal is open *1 Important X: In consideration of compatibility with other venders' products, Zss is defined as the correction value to fit nominal inductance of other venders' products. When calibrating the measurement, please input X value instead of the equivalent series inductance (ShortL) for each L value. Perform measurement of Q using the residual impedance 0.771 nH obtained through our conventional standard measurement method. (4) Calculate inductance Lx and Qx using the equations shown below. Im (Zx) Lx: inductance of chip coil Lx= 2πf Qx: Q of chip coil Im (Zx) Qx= f: measuring frequency Re (Zx) MURATA MFG CO., LTD Spec No.: JELF243A_0167B-01 P11/11 Table: Equivalent series inductance to fit nominal inductance of other venders' products Inductance Part number X (nH) Equivalent series inductance Measuring frequency (MHz) LQW18AS1N6_0C 0.131 250 LQW18AS3N3_0C 0.111 250 LQW18AS4N3_0C 0.251 250 LQW18AS5N6_0C -0.079 250 LQW18AS8N2_0C 0.281 250 LQW18AS10N_0C -0.089 250 LQW18AS11N_0C 0.321 250 LQW18AS15N_0C -0.369 250 LQW18AS16N_0C 0.271 250 LQW18AS18N_0C -0.429 250 LQW18AS22N_0C -0.419 250 LQW18AS24N_0C 0.401 250 LQW18AS33N_0C -0.589 250 LQW18AS47N_0C -0.769 200 LQW18AS56N_0C -1.299 200 LQW18AS68N_0C -1.739 200 LQW18AS82N_0C -1.909 150 LQW18ASR10_0C -1.729 150 LQW18ASR12_0C -3.429 150 LQW18ASR15_0C -4.429 150 LQW18ASR18_0C -5.129 100 LQW18ASR22_0C -5.229 100 LQW18ASR27_0C -4.329 100 LQW18ASR33_0C -8.329 100 LQW18ASR39_0C -13.329 100 MURATA MFG CO., LTD