Reference Only
SpecNo.JELF243A-9145A-01
P.1/9
CHIP COIL (CHIP INDUCTORS) LQW18CN□□□□0ZD
Murata Standard Reference Specification 【AEC-Q200】
1. Scope
This reference specification applies to LQW18CN_0Z series, Chip coil (Chip Inductors) for automotive Electronics based
on AEC-Q200 except for Power train and Safety.
2. Part Numbering
(ex)
LQ
W
18
C
N
4N9
D
0
Z
D
Product ID Structure Dimension Applications Category Inductance Tolerance Features Application
(L×W)
and
Z:Automotive
Characteristics
Packaging
D:Taping
3. Rating
・Operating Temperature Range
(Ambient temperature;Self-temperature rise is not included)
・Storage Temperature Range.
–40°C to +125°C
Customer
Part Number
Tolerance
DC
Resistance
(Ω max.)
Self Resonant
Frequency
(MHz min.)
Rated
Current
(mA)
D:±0.5nH
0.015
2300
2600
0.025
2000
2200
0.035
1800
1700
0.045
1600
1500
Inductance
MURATA
Part Number
(nH)
LQW18CN4N9D0ZD
4.9
LQW18CN15NJ0ZD
15
LQW18CN33NJ0ZD
33
LQW18CN55NJ0ZD
55
LQW18CN85NJ0ZD
85
LQW18CNR10K0ZD
100
LQW18CNR12J0ZD
–40°C to +125°C (∗)
J:±5%
0.060
1380
1400
0.10
1260
1000
120
0.085
1200
1100
LQW18CNR16J0ZD
160
0.10
900
1000
LQW18CNR21J0ZD
210
0.15
720
800
LQW18CNR27J0ZD
270
0.16
660
750
LQW18CNR33J0ZD
330
0.25
600
630
LQW18CNR39J0ZD
390
0.28
570
620
LQW18CNR47J0ZD
470
0.45
555
500
LQW18CNR56J0ZD
560
0.48
540
450
LQW18CNR65J0ZD
650
0.52
510
430
K:±10%
J:±5%
(∗) As for LQW type, Rated Current is derated as following figure depending on the operating temperature.
Current derating (%)
Derating of Rated Current depend on Operating Temperature
100
50
0
0
85
Temperature
(℃)
.
MURATA MFG.CO.,LTD
125
ESD
Rank
5A:8kV
5A
Reference Only
SpecNo.JELF243A-9145A-01
P.2/9
4. Testing Conditions
《Unless otherwise specified》
Temperature :Ordinary Temperature / 15°C to 35°C
Humidity
:Ordinary Humidity / 25%(RH) to 85%(RH)
《In case of doubt》
Temperature
:20°C±2°C
Humidity
:60%(RH) to 70%(RH)
Atmospheric Pressure :86kPa to 106 kPa
5. Appearance and Dimensions
■Unit Mass (Typical value)
0.004g
6. Electrical Performance
No.
6.1
Item
Inductance
Specification
Inductance shall meet item 3.
Test Method
Measuring Equipment:KEYSIGHT 4991A or equivalent
Measuring Frequency:
10MHz
Frequency when L value is 0μH
Measuring Condition:Test signal level / about 0dBm
Electrode spaces / 1.0mm
Electrical length / 10mm
Measuring Fixture:KEYSIGHT 16197A
Position coil under test as shown in below and contact coil
with each terminal by adding weight.
6.2
Self Resonant
Frequency
(S.R.F)
1.0mm
Measuring Method:See the endnote.
6.3
DC Resistance
DC Resistance shall meet item 3.
Measuring Equipment:Digital multi meter
6.4
Rated Current
Self temperature rise shall be
limited to 40°C max.
The rated current is applied.
MURATA MFG.CO.,LTD
Reference Only
SpecNo.JELF243A-9145A-01
7. Q200 Requirement
7.1.Performance (based on Table 5 for Magnetics(Inductors / Transformer)
AEC-Q200 Rev.D issued June 1. 2010
AEC-Q200
Murata Specification / Deviation
No
Stress
Test Method
3 High
1000hours at 125 deg C
Meet Table A after testing.
Temperature
Set for 24hours at room
Table A
Exposure
temperature, then measured.
Appearance
No damage
Inductance change
Within ±5%
4
Temperature
Cycling
1000cycles
-40 deg C to +125 deg C
Set for 24hours at room
temperature, then measured.
Meet Table A after testing.
7
Biased Humidity
1000hours at 85 deg C,
85%R.H.
unpowered.
Meet Table A after testing.
8
Operational Life
Apply 125 deg C 1000hours
Set for 24hours at room
temperature, then measured
Meet Table A after testing.
Apply derating of rated current.
9
External Visual
Visual inspection
No abnormalities
10 Physical
Dimension
Meet ITEM 5
(Style and Dimensions)
No defects
12 Resistance to
Solvents
Per MIL-STD-202
Method 215
Not Applicable
13 Mechanical Shock
Per MIL-STD-202
Method 213
Condition C:100g’s (0.98N),
6ms, Half sine, 12.3ft / s
Meet Table A after testing.
14 Vibration
5g's (0.049N) for 20 minutes,
12cycles each of 3 orientations
Test from 10-2000Hz.
Meet Table A after testing.
15 Resistance to
Soldering Heat
No-heating
Solder temperature
260C+/-5 deg C
Immersion time 10s
Pre-heating:150C + / -10 deg C, 60s to 90s
270C + / - 5 deg C
Immersion time 5s
Meet Table A after testing.
17 ESD
Per AEC-Q200-002
ESD Rank:Refer to Item 3. Rating.
Meet Table A after testing
18 Solderbility
Per J-STD-002
Method b:Not Applicable
95% of the terminations is to be soldered.
(Except exposed wire)
19 Electrical
Characterization
Measured:Inductance
No defects
20 Flammability
Per UL-94
Not Applicable
21 Board Flex
Epoxy-PCB (1.6mm)
Deflection 2mm (min)
Holding time 60s
Meet Table A after testing.
22 Terminal Strength
Per AEC-Q200-006
A force of 17.7N
for 60s
Appearance No damage
Murata Deviation Request:8N / 5s
MURATA MFG.CO.,LTD
P.3/9
Reference Only
SpecNo.JELF243A-9145A-01
P.4/9
8. Specification of Packaging
8.1 Appearance and Dimensions of paper tape (8mm-wide, 2mm pitch)
0.1
1 .8 ±0 .0 6
8 .0 ±0 .2
1.75±0.1
φ 1.5± 0
3 .5 ±0 .0 5
4.0±0.1
2.0±0.05
4.0±0.1
(in mm)
1.0±0.06
Direction of feed
1.1 max.
8.2 Specification of Taping
(1) Packing quantity (standard quantity)
4,000 pcs. / reel
(2) Packing Method
Products shall be packed in the cavity of the base tape and sealed by Cover tape.
(3) Sprocket hole
The sprocket holes are to the right as the tape is pulled toward the user.
(4) Spliced point
Base tape and Cover tape has no spliced point.
(5) Missing components number
Missing components number within 0.1% of the number per reel or 1 pc., whichever is greater, and are not
continuous. The Specified quantity per reel is kept.
8.3 Pull Strength
Cover tape
5N min.
8.4 Peeling off force of cover tape
Speed of Peeling off
Peeling off force
300mm/min
0.1N to 0.6N
(minimum value is typical)
F
165°to 180゜
Cover tape
Base tape
8.5 Dimensions of Leader-tape,Trailer and Reel
There shall be leader-tape (cover tape and empty tape) and trailer-tape (empty tape) as follows.
2.0±0.5
Trailer
160 min.
Leader
Label
190 min.
210 min.
Empty tape
Cover tape
φ 13.0±0.2
+1
φ 60 -0
φ 21.0±0.8
9.0 +1
-0
Direction of feed
(in mm)
13.0±1.4
+0
φ 180 -3
MURATA MFG.CO.,LTD
Reference Only
SpecNo.JELF243A-9145A-01
P.5/9
8.6 Marking for reel
Customer part number, MURATA part number, Inspection number(∗1), RoHS marking(∗2), Quantity etc ・・・
∗1)
□□ OOOO XXX
(1)
(2)
(3)
(1) Factory Code
(2) Date
First digit
:Year / Last digit of year
Second digit
:Month / Jan. to Sep. → 1 to 9, Oct. to Dec. → O, N, D
Third, Fourth digit :Day
(3) Serial No.
∗2)
ROHS – Y (△)
(1) (2)
(1) RoHS regulation conformity
(2) MURATA classification number
8.7 Marking for Outside package (corrugated paper box)
Customer name, Purchasing order number, Customer part number, MURATA part number, RoHS Marking (∗2) ,
Quantity, etc ・・・
8.8. Specification of Outer Case
Outer Case Dimensions (mm)
Label
H
D
W
9.
W
D
H
Standard Reel Quantity
in Outer Case (Reel)
186
186
93
5
∗ Above Outer Case size is typical. It depends on a quantity
of an order.
Caution
9.1 Limitation of Applications
Please contact us before using our products for the applications listed below which require especially high reliability
for the prevention of defects which might directly cause damage to the third party's life, body or property.
(1) Aircraft equipment
(2) Aerospace equipment
(3) Undersea equipment
(4) Power plant control equipment
(5) Medical equipment
(6) Transportation equipment (trains, ships, etc.)
(7) Traffic signal equipment
(8) Disaster prevention / crime prevention equipment
(9) Data-processing equipment
(10) Applications of similar complexity and /or reliability
requirements to the applications listed in the above
9.2 Caution(Rating)
Do not exceed maximum rated current of the product. Thermal stress may be transmitted to the product and short /
open circuit of the product or falling off the product may be occurred.
9.3 Fail-safe
Be sure to provide an appropriate fail-safe function on your product to prevent a second damage that may be caused
by the abnormal function or the failure of our product.
MURATA MFG.CO.,LTD
Reference Only
SpecNo.JELF243A-9145A-01
P.6/9
10. Notice
Products can only be soldered with reflow.
This product is designed for solder mounting.
Please consult us in advance for applying other mounting method such as conductive adhesive.
10.1 Land pattern designing
Recommended land patterns for reflow soldering are as follows:
These have been designed for Electric characteristics and solderability.
Please follow the recommended patterns. Otherwise, their performance which includes electrical performance or
solderability may be affected, or result to "position shift" in soldering process.
2.2
Chip Coil
Pattern
Solder resist
Substrate
1.0
0.75 0.70
(in mm)
10.2 Flux, Solder
・Use rosin-based flux.
Includes middle activator equivalent to 0.06(wt)% to 0.1(wt) % Chlorine.
Don’t use highly acidic flux with halide content exceeding 0.2(wt) % (chlorine conversion value).
Don’t use water-soluble flux.
・Use Sn-3.0Ag-0.5Cu solder.
・Standard thickness of solder paste:50μm to 100μm.
・Please pay attention to solder paste's penetrating in order to avoid short circuit between the lines.
10.3 Reflow soldering conditions
・Pre-heating should be in such a way that the temperature difference between solder and product surface is limited to
100°C max. Cooling into solvent after soldering also should be in such a way that the temperature difference is limited
to 100°C max.
Insufficient pre-heating may cause cracks on the product, resulting in the deterioration of products quality.
・Standard soldering profile and the limit soldering profile is as follows.
The excessive limit soldering conditions may cause leaching of the electrode and / or resulting in the deterioration of
product quality.
・Reflow soldering profile
Temp.
(℃)
260℃
245℃±3℃
220℃
230℃
Limit Profile
180
150
Standard Profile
30s~60s
60s max.
90s±30s
Time. (s)
Standard Profile
Pre-heating
Heating
Peak temperature
Cycle of reflow
Limit Profile
150°C~180°C 、90s±30s
above 220°C、30s~60s
above 230°C、60s max.
245°C±3°C
260°C,10s
2 times
2 times
MURATA MFG.CO.,LTD
Reference Only
SpecNo.JELF243A-9145A-01
P.7/9
10.4 Reworking with soldering iron
The following conditions must be strictly followed when using a soldering iron.
Pre-heating
150°C,1 min
Tip temperature
350°C max.
Soldering iron output
80W max.
Tip diameter
φ3mm max.
Soldering time
3 (+1,-0)s
Time
2 times
Note:Do not directly touch the products with the tip of the soldering iron in order to prevent the crack on the products
due to the thermal shock.
10.5 Solder Volume
・Solder shall be used not to be exceeded the upper limits as shown below.
・Accordingly increasing the solder volume, the mechanical stress to Chip is also increased.
Exceeding solder volume may cause the failure of mechanical or electrical performance.
Upper Limit
Recommendable(t)
T
1/3T≦t≦T
T:thickness of product
10.6 Product’s location
The following shall be considered when designing and laying out P.C.B.'s.
(1) P.C.B. shall be designed so that products are not subject to the mechanical stress due to warping the board.
[Products direction]
a
Products shall be located in the sideways
direction (Length:a<b) to the mechanical
stress.
b
〈 Poor example〉
〈 Good example〉
(2) Components location on P.C.B. separation.
It is effective to implement the following measures, to reduce stress in separating the board.
It is best to implement all of the following three measures; however, implement as many measures
as possible to reduce stress.
Contents of Measures
Stress Level
(1) Turn the mounting direction of the component parallel to
the board separation surface.
A > D ∗1
(2) Add slits in the board separation part.
A > B
(3) Keep the mounting position of the component away from
the board separation surface.
A > C
Seam
b
A
C
B
D
Slit
∗1 A > D is valid when stress is added vertically to
the perforation as with Hand Separation.
If a Cutting Disc is used, stress will be diagonal to
the PCB, therefore A > D is invalid.
Length:a< b
a
(3) Mounting Components Near Screw Holes
When a component is mounted near a screw hole,
it may be affected by the board deflection that occurs
during the tightening of the screw. Mount the component
in a position as far away from the screw holes as possible.
MURATA MFG.CO.,LTD
Screw Hole
Recommended
SpecNo.JELF243A-9145A-01
Reference Only
P.8/9
10.7 Cleaning Conditions
Products shall be cleaned on the following conditions.
(1) Cleaning temperature shall be limited to 60°C max.(40°C max for IPA)
(2) Ultrasonic cleaning shall comply with the following conditions with avoiding the resonance phenomenon at
the mounted products and P.C.B.
Power:20 W / l max.
Frequency:28kHz to 40kHz
Time:5 min max.
(3) Cleaner
1. Alcohol type cleaner
Isopropyl alcohol (IPA)
2. Aqueous agent
PINE ALPHA ST-100S
(4) There shall be no residual flux and residual cleaner after cleaning.
In the case of using aqueous agent, products shall be dried completely after rinse with de-ionized water in
order to remove the cleaner.
(5) Other cleaning
Please contact us.
10.8 Resin coating
The inductance value may change due to high cure-stress of resin to be used for coating/molding products.
An open circuit issue may occur by mechanical stress caused by the resin, amount/cured shape of resin, or operating
condition etc. Some resin contains some impurities or chloride possible to generate chlorine by hydrolysis under some
operating condition may cause corrosion of wire of coil, leading to open circuit. So, please pay your careful attention
when you select resin in case of coating/molding the products with the resin.
Prior to use the coating resin, please make sure no reliability issue is observed by evaluating products mounted on your
board.
10.9 Caution for use
・Sharp material such as a pair of tweezers or other material such as bristles of cleaning brush , shall not be touched
to the winding portion to prevent the breaking of wire.
・Mechanical shock should not be applied to the products mounted on the board to prevent the breaking of the core.
10.10 Notice of product handling at mounting
In some mounting machines,when picking up components support pin pushes up the components from the bottom of base
tape. In this case, please remove the support pin. The support pin may damage the components and break wire.
In rare case ,the laser recognition can not recognize this component. Please contact us when you use laser recognition.
(There is no problem with the permeation and reflection type.)
10.11 Handling of a substrate
After mounting products on a substrate, do not apply any stress to the product caused by bending or twisting to the
substrate when cropping the substrate, inserting and removing a connector from the substrate or tightening screw to
the substrate.
Excessive mechanical stress may cause cracking in the product.
Bending
Twisting
10.12 Storage and Handing Requirements
(1) Storage period
Use the products within 12 months after delivered.
Solderability should be checked if this period is exceeded.
(2) Storage conditions
・Products should be stored in the warehouse on the following conditions.
Temperature : -10°C to 40°C
: 15% to 85% relative humidity No rapid change on temperature and humidity
Humidity
・Don't keep products in corrosive gases such as sulfur,chlorine gas or acid, or it may cause oxidization of
electrode, resulting in poor solderability.
・Products should not be stored on bulk packaging condition to prevent the chipping of the core and the breaking
of winding wire caused by the collision between the products.
・Products should be stored on the palette for the prevention of the influence from humidity, dust and so on.
・Products should be stored in the warehouse without heat shock, vibration, direct sunlight and so on.
(3) Handling Condition
Care should be taken when transporting or handling product to avoid excessive vibration or mechanical shock.
MURATA MFG.CO.,LTD
Reference Only
SpecNo.JELF243A-9145A-01
11.
P.9/9
Note
(1) Please make sure that your product has been evaluated in view of your specifications with our product being mounted
to your product.
(2) You are requested not to use our product deviating from the reference specifications.
(3) The contents of this reference specification are subject to change without advance notice.
Please approve our product specifications or transact the approval sheet for product specifications before ordering.
< Electrical Performance:Measuring Method of Inductance/Q >
(1) Residual elements and stray elements of test fixture can be described by F-parameter shown in following.
I2
I1
A
Zm
V1
Test Head
B
D
C
Test fixture
V2
Zx
V1
I1
=
A B
C D
V2
I2
Product
(2) The impedance of chip coil Zx and measured value Zm can be described by input/output current/voltage.
Zm=
V1
I1
,
Zx=
V2
I2
(3) Thus,the relation between Zx and Zm is following;
Zx= α
Zm-β
1-ZmΓ
where, α= D / A =1
β= B / D =Zsm-(1-Yom Zsm)Zss
Γ= C / A =Yom
Zsm : measured impedance of short chip
Zss : residual impedance of short chip (0.771nH)
Yom: measured admittance when opening the fixture
(4) Lx shall be calculated with the following equation.
Lx=
Im(Zx)
2πf
Lx: Inductance of chip coil
f : Measuring frequency
MURATA MFG.CO.,LTD