Spec No.: JELF243A_0115D-01
P1/12
CHIP COILS (CHIP INDUCTORS) LQW2BAN□□□□00□ REFERENCE SPECIFICATION
1. Scope
This reference specification applies to chip coils (chip inductors) LQW2BAN_00 series for general electronic equipment.
2. Part Numbering
(Ex.)
LQ
W
2B
A
N
47N
G
0
0
L
Product Structure Dimension
ID
(L × W)
Application Category Inductance Tolerance Performance Electrode Packaging
and
specification L: taping
characteristic
*B: bulk
*B: Bulk packing is also available (taping condition: however, products without reels are put in plastic bags).
3. Part Number and Rating
Operating temperature range
-55°C to +125°C (including self-generated heat)
Storage temperature range
-55°C to +125°C
Inductance
Customer
Part number
Murata
Part number
Nominal
value
(nH)
LQW2BAN3N2J00L
3.2
Tolerance
Q
(Min.)
DC
resistance
(Ω max.)
Self-resonant
frequency
(MHz min.)
Rated
current
(mA)*1*2
J: ±5%
95
0.02
13800
3800
LQW2BAN3N6J00L
3.6
J: ±5%
75
0.05
11800
2000
LQW2BAN6N8J00L
6.8
J: ±5%
90
0.03
6200
3000
LQW2BAN7N5J00L
7.5
J: ±5%
85
0.04
3900
2400
LQW2BAN8N2G00L
8.2
G: ±2%
80
0.09
3200
1500
LQW2BAN8N2J00L
8.2
J: ±5%
80
0.09
3200
1500
LQW2BAN11NG00L
11
G: ±2%
80
0.04
4700
2400
LQW2BAN11NJ00L
11
J: ±5%
80
0.04
4700
2400
LQW2BAN12NG00L
12
G: ±2%
80
0.04
4300
2400
LQW2BAN12NJ00L
12
J: ±5%
80
0.04
4300
2400
LQW2BAN13NG00L
13
G: ±2%
80
0.04
3500
2400
LQW2BAN13NJ00L
13
J: ±5%
80
0.04
3500
2400
LQW2BAN15NG00L
15
G: ±2%
70
0.12
1940
1500
LQW2BAN15NJ00L
15
J: ±5%
70
0.12
1940
1500
LQW2BAN18NG00L
18
G: ±2%
85
0.05
3620
2200
LQW2BAN18NJ00L
18
J: ±5%
85
0.05
3620
2200
LQW2BAN20NG00L
20
G: ±2%
85
0.05
2960
2200
LQW2BAN20NJ00L
20
J: ±5%
85
0.05
2960
2200
LQW2BAN22NG00L
22
G: ±2%
85
0.07
1850
1900
LQW2BAN22NJ00L
22
J: ±5%
85
0.07
1850
1900
LQW2BAN24NG00L
24
G: ±2%
75
0.15
1970
1400
LQW2BAN24NJ00L
24
J: ±5%
75
0.15
1970
1400
LQW2BAN27NG00L
27
G: ±2%
85
0.07
2750
2000
LQW2BAN27NJ00L
27
J: ±5%
85
0.07
2750
2000
LQW2BAN30NG00L
30
G: ±2%
80
0.08
2000
2000
LQW2BAN30NJ00L
30
J: ±5%
80
0.08
2000
2000
LQW2BAN33NG00L
33
G: ±2%
75
0.12
1900
1500
LQW2BAN33NJ00L
33
J: ±5%
75
0.12
1900
1500
LQW2BAN36NG00L
36
G: ±2%
75
0.08
1900
1900
LQW2BAN36NJ00L
36
J: ±5%
75
0.08
1900
1900
MURATA MFG CO., LTD
Spec No.: JELF243A_0115D-01
P2/12
Inductance
Customer
Part number
Tolerance
Q
(Min.)
DC
resistance
(Ω max.)
Self-resonant
frequency
(MHz min.)
Rated
current
(mA)*1*2
39
G: ±2%
75
0.08
1900
1900
LQW2BAN39NJ00L
39
J: ±5%
75
0.08
1900
1900
LQW2BAN43NG00L
43
G: ±2%
75
0.12
1720
1550
LQW2BAN43NJ00L
43
J: ±5%
75
0.12
1720
1550
LQW2BAN47NG00L
47
G: ±2%
70
0.20
1500
1250
LQW2BAN47NJ00L
47
J: ±5%
70
0.20
1500
1250
LQW2BAN51NG00L
51
G: ±2%
75
0.11
1100
1800
LQW2BAN51NJ00L
51
J: ±5%
75
0.11
1100
1800
LQW2BAN56NG00L
56
G: ±2%
70
0.18
1600
1250
LQW2BAN56NJ00L
56
J: ±5%
70
0.18
1600
1250
LQW2BAN62NG00L
62
G: ±2%
70
0.12
1470
1650
LQW2BAN62NJ00L
62
J: ±5%
70
0.12
1470
1650
LQW2BAN68NG00L
68
G: ±2%
70
0.20
1470
1250
LQW2BAN68NJ00L
68
J: ±5%
70
0.20
1470
1250
LQW2BAN75NG00L
75
G: ±2%
68
0.28
1450
1100
LQW2BAN75NJ00L
75
J: ±5%
68
0.28
1450
1100
LQW2BAN82NG00L
82
G: ±2%
70
0.24
1330
1200
LQW2BAN82NJ00L
82
J: ±5%
70
0.24
1330
1200
LQW2BAN91NG00L
91
G: ±2%
70
0.21
1140
1300
LQW2BAN91NJ00L
91
J: ±5%
70
0.21
1140
1300
LQW2BANR10G00L
100
G: ±2%
66
0.35
1200
1050
LQW2BANR10J00L
100
J: ±5%
66
0.35
1200
1050
LQW2BANR11G00L
110
G: ±2%
57
0.38
1200
970
Murata
Part number
Nominal
value
(nH)
LQW2BAN39NG00L
LQW2BANR11J00L
110
J: ±5%
57
0.38
1200
970
LQW2BANR12G00L
120
G: ±2%
57
0.38
1200
970
LQW2BANR12J00L
120
J: ±5%
57
0.38
1200
970
LQW2BANR13G00L
130
G: ±2%
56
0.42
1000
950
LQW2BANR13J00L
130
J: ±5%
56
0.42
1000
950
LQW2BANR15G00L
150
G: ±2%
58
0.46
920
930
LQW2BANR15J00L
150
J: ±5%
58
0.46
920
930
LQW2BANR16G00L
160
G: ±2%
53
0.46
920
930
LQW2BANR16J00L
160
J: ±5%
53
0.46
920
930
LQW2BANR18G00L
180
G: ±2%
53
0.58
920
800
LQW2BANR18J00L
180
J: ±5%
53
0.58
920
800
LQW2BANR20G00L
200
G: ±2%
53
0.63
920
750
LQW2BANR20J00L
200
J: ±5%
53
0.63
920
750
MURATA MFG CO., LTD
Spec No.: JELF243A_0115D-01
P3/12
Inductance
Customer
Part number
Murata
Part number
Nominal
value
(nH)
Tolerance
Q
(Min.)
DC
resistance
(Ω max.)
Self-resonant
frequency
(MHz min.)
Rated
current
(mA)*1*2
*1 When rated current is applied to the products, temperature rise caused by self-generated heat shall be limited to 40°C
max.
*2 As shown in the diagram below, derating is applied to the rated current based on the operating temperature.
4. Testing Conditions
Unless otherwise specified
Temperature: ordinary temperature (15°C to 35°C)
Humidity: ordinary humidity [25% to 85% (RH)]
In case of doubt
Temperature: 20°C±2°C
Humidity: 60% to 70% (RH)
Atmospheric pressure: 86 kPa to 106 kPa
5. Appearance and Dimensions
Unit mass (typical value): 0.014 g
6. Marking
No marking.
MURATA MFG CO., LTD
Spec No.: JELF243A_0115D-01
P4/12
7. Electrical Performance
No.
Item
7.1
Inductance
Specification
Meet chapter 3 ratings.
Test method
Measuring equipment: Keysight E4991A or the
equivalent
Measuring frequency:
Inductance
250 MHz 3.2 nH to 39 nH
Q
200 MHz
43 nH to 75 nH
150 MHz
82 nH to 130 nH
100 MHz
150 nH to 200 nH
1500 MHz 3.2 nH, 3.6 nH
1000 MHz 6.8 nH to 8.2 nH
500 MHz
7.2
Q
11 nH to 100 nH
250 MHz 110 nH to 200 nH
Measuring conditions:
Measurement signal level: Approx. 0 dBm
Measurement terminal distance: 1.5 mm
Electrical length: 10.0 mm
Measuring fixture: Keysight 16197A
Position the chip coil under test as shown in the
measuring example below and connect it to the
electrode by applying weight.
Measurement example:
Meet chapter 3 ratings.
Measuring method: see "Electrical performance:
Measuring method for inductance/Q" in the chapter
"16. Appendix".
7.3
DC resistance
Meet chapter 3 ratings.
Measuring equipment: digital multimeter
7.4
Self-resonant
frequency
Meet chapter 3 ratings.
Measuring equipment: Keysight N5230A or the
equivalent
8. Mechanical Performance
No.
8.1
Item
Shear test
Specification
Test method
No significant mechanical damage or no Test substrate: glass-epoxy substrate
sign of electrode peeling off shall be
Force application direction:
observed.
Applying force: 10 N
Holding time: 5 s±1 s
MURATA MFG CO., LTD
Spec No.: JELF243A_0115D-01
No.
P5/12
Item
Specification
Test method
8.2
Bending test
No significant mechanical damage or no Test substrate: glass-epoxy substrate (100 mm × 40
sign of electrode peeling off shall be
mm × 1.0 mm)
observed.
Pressurizing speed: 1 mm/s
Deflection: 3 mm
Holding time: 5 s
8.3
Vibration
Appearance shall have no significant
mechanical damage.
8.4
Solderability
90% or more of the outer electrode shall Flux: immersed in ethanol solution [including an
be covered with new solder seamlessly. activator with a chlorine conversion value of 0.06(wt)%]
with a rosin content of 25(wt)% for 5 s to 10 s.
Solder: Sn-3.0Ag-0.5Cu solder
Pre-heating: 150°C±10°C/60 s to 90 s
Solder temperature: 240°C±5°C
Immersion time: 3 s±1 s
8.5
Resistance to
soldering heat
Appearance: No significant mechanical
damage shall be observed.
Inductance change rate: within ±5%
Oscillation frequency: 10 Hz to 2000 Hz to 10 Hz, for
approx. 15 min
Total amplitude: total amplitude of 3.0 mm or
acceleration amplitude of 196 m/s2, whichever is
smaller
Test time: 3 directions perpendicular to each other, 2 h
for each direction (6 h in total)
Flux: immersed in ethanol solution [including an
activator with a chlorine conversion value of 0.06(wt)%]
with a rosin content of 25(wt)% for 5 s to 10 s.
Solder: Sn-3.0Ag-0.5Cu solder
Pre-heating: 150°C±10°C/60 s to 90 s
Solder temperature: 270°C±5°C
Immersion time: 10 s±1 s
Post-treatment: left at a room condition for 24 h±2 h
9. Environmental Performance
The product is soldered on a substrate for test.
No.
Item
Specification
Test method
9.1
Heat resistance
Appearance: No significant mechanical
damage shall be observed.
Inductance change rate: within ±5%
Q change rate: within ±20%
Temperature: 125°C±2°C
Test time: 1000 h (+48 h, -0 h)
Post-treatment: left at a room condition for 24 h±2 h
9.2
Cold resistance
Appearance: No significant mechanical
damage shall be observed.
Inductance change rate: within ±5%
Q change rate: within ±20%
Temperature: -55°C±2°C
Test time: 1000 h (+48 h, -0 h)
Post-treatment: left at a room condition for 24 h±2 h
9.3
Humidity
Appearance: No significant mechanical
damage shall be observed.
Inductance change rate: within ±5%
Q change rate: within ±20%
Temperature: 85°C±2°C
Humidity: 85% (RH)
Test time: 1000 h (+48 h, -0 h)
Post-treatment: left at a room condition for 24 h±2 h
9.4
Temperature cycle Appearance: No significant mechanical
damage shall be observed.
Inductance change rate: within ±5%
Q change rate: within ±20%
Single cycle conditions:
Step 1: -55°C±2°C/30 min±3 min
Step 2: ordinary temperature/10 min to 15 min
Step 3: +125°C±2°C/30 min±3 min
Step 4: ordinary temperature/10 min to 15 min
Number of testing: 10 cycles
Post-treatment: left at a room condition for 24 h±2 h
MURATA MFG CO., LTD
Spec No.: JELF243A_0115D-01
P6/12
10. Specification of Packaging
10.1 Appearance and dimensions of tape (8 mm width/plastic tape)
A
1.8±0.1
B
2.3±0.1
t
1.65±0.1
t'
0.25±0.05
(in mm)
* The dimensions of the cavity are measured at its bottom.
10.2 Taping specifications
Packing quantity
(Standard quantity)
2000 pcs/reel
Packing method
The products are placed in embossed cavities of a plastic tape and sealed by a cover tape.
Feed hole position
The feed holes on the plastic tape are on the right side when the cover tape is pulled toward the user.
Joint
The plastic tape and the cover tape are seamless.
Number of missing
products
Number of missing products within 0.025% of the number per reel or 1 pc., whichever is greater, and
are not continuous. The specified quantity per reel is kept.
10.3 Break down force of tape
Break down force of cover tape
10 N min.
10.4 Peeling off force of cover tape
Speed of peeling off
300 mm/min
Peeling off force
165 to 180 degree
0.1 N to 0.6 N (The lower limit is for typical value.)
F
Cover tape
Plastic tape
10.5 Dimensions of leader section, trailer section and reel
A vacant section is provided in the leader (start) section and trailer (end) section of the tape for the product. The leader
section is further provided with an area consisting only of the cover tape (or top tape). (See the diagram below.)
MURATA MFG CO., LTD
Spec No.: JELF243A_0115D-01
P7/12
10.6 Marking for reel
Customer part number, Murata part number, inspection number (*1), RoHS marking (*2), quantity, etc.
*1 Expression of inspection No.: (1) Factory code
□□
○○○○
(2) Date
First digit: year/last digit of year
(1)
(2)
(3)
Second digit: month/Jan. to Sep.→1 to 9, Oct. to Dec.→O, N, D
Third, Fourth digit: day
(3) Serial No.
*2 Expression of RoHS marking: (1) RoHS regulation conformity
ROHSY
()
(2) Murata classification number
(1)
(2)
10.7 Marking on outer box (corrugated box)
Customer name, purchasing order number, customer part number, Murata part number, RoHS marking (*2), quantity, etc.
10.8 Specification of outer box
Label
H
D
W
11.
Dimensions of outer box
(mm)
W
D
H
186
186
93
Standard reel quantity
in outer box (reel)
5
* Above outer box size is typical. It depends on a
quantity of an order.
Caution
11.1 Restricted applications
Please contact us before using our products for the applications listed below which require especially high reliability for the
prevention of defects which might directly cause damage to the third party's life, body or property.
(1) Aircraft equipment
(2) Aerospace equipment
(3) Undersea equipment
(4) Power plant control
equipment
(5) Medical equipment
(6) Transportation equipment
(7) Traffic signal equipment
(8) Disaster/crime
(vehicles, trains, ships, etc.)
prevention equipment
(9) Data-processing
(10) Applications of similar complexity and/or reliability
equipment
requirements to the applications listed in the above
11.2 Precautions on rating
Avoid using in exceeded the rated temperature range, rated voltage, or rated current.
Usage when the ratings are exceeded could lead to wire breakage, burning, or other serious fault.
11.3 Inrush current
If an inrush current (or pulse current or rush current) that significantly exceeds the rated current is applied to the product,
overheating could occur, resulting in wire breakage, burning, or other serious fault.
11.4 Corrosive gas
Please refrain from use since contact with environments with corrosive gases (sulfur gas [hydrogen sulfide, sulfur dioxide,
etc.], chlorine, ammonia, etc.) or oils (cutting oil, silicone oil, etc.) that have come into contact with the previously stated
corrosive gas environment will result in deterioration of product quality or an open from deterioration due to corrosion of
product electrode, etc. We will not bear any responsibility for use under these environments.
MURATA MFG CO., LTD
Spec No.: JELF243A_0115D-01
P8/12
12. Precautions for Use
This product is for use only with reflow soldering. It is designed to be mounted by soldering. If you want to use other
mounting method, for example, using a conductive adhesive, please consult us beforehand.
Also, if repeatedly subjected to temperature cycles or other thermal stress, due to the difference in the coefficient of thermal
expansion with the mounting substrate, the solder (solder fillet part) in the mounting part may crack.
The occurrence of cracks due to thermal stress is affected by the size of the land where mounted, the solder volume, and
the heat dissipation of the mounting substrate. Carefully design it when a large change in ambient temperature is assumed.
12.1 Land dimensions
The following diagram shows the recommended land dimensions for reflow soldering.
The land dimensions are designed in consideration of electrical characteristics and mountability. Use of other land
dimensions may preclude achievement of performance. In some cases, it may result in poor solderability, including positional
shift. If you use other land pattern, consider it adequately.
(in mm)
12.2 Flux and solder used
Flux
• Use a rosin-based flux that includes an activator with a chlorine conversion value of 0.06(wt)% to 0.1(wt)%.
• Do not use a highly acidic flux with a halide content exceeding 0.2(wt)% (chlorine conversion value).
• Do not use a water-soluble flux.
Solder
• Use Sn-3.0Ag-0.5Cu solder.
• Standard thickness of solder paste: 100 μm to 150 μm
If you want to use a flux other than the above, please consult our technical department.
12.3 Soldering conditions (reflow)
• Pre-heating should be in such a way that the temperature difference between solder and product surface is limited to
150°C max.
Cooling into solvent after soldering also should be in such a way that the temperature difference is limited to 100°C max.
Insufficient pre-heating may cause cracks on the product, resulting in the deterioration of product quality.
• Standard soldering profile and the limit soldering profile is as follows.
The excessive limit soldering conditions may cause leaching of the electrode and/or resulting in the deterioration of product
quality.
Temp.
(℃)
260℃
245℃±3℃
220℃
230℃
Limit Profile
180
150
Standard Profile
30s～60s
60s max.
90s±30s
Time. (s)
Standard profile
Limit profile
Pre-heating
150°C to 180°C/90 s±30 s
150°C to 180°C/90 s±30 s
Heating
Above 220°C/30 s to 60 s
Above 230°C/60 s max.
245°C±3°C
260°C/10 s
2 times
2 times
Peak temperature
Number of reflow cycles
MURATA MFG CO., LTD
Spec No.: JELF243A_0115D-01
P9/12
12.4 Reworking with soldering iron
The following requirements must be met to rework a soldered product using a soldering iron.
Item
Requirement
Pre-heating
150°C/approx. 1 min
Tip temperature of soldering iron
350°C max.
Power consumption of soldering iron
80 W max.
Tip diameter of soldering iron
ø3 mm max.
Soldering time
3 s (+1 s, -0 s)
Number of reworking operations
2 times max.
* Avoid a direct contact of the tip of the soldering iron with the product. Such a
direction contact may cause cracks in the ceramic body due to thermal shock.
12.5 Solder volume
Solder shall be used not to increase the volume too much.
An increased solder volume increases mechanical stress on the product. Exceeding solder volume may cause the failure of
mechanical or electrical performance.
12.6 Product's location
The following shall be considered when designing and laying out PCBs.
(1) PCB shall be designed so that products are not subject to mechanical stress due to warping the board.
[Products direction]
Products shall be located in the sideways direction (length: a < b) to the mechanical stress.
a
b
〈 Poor example〉
〈 Good example〉
(2) Components location on PCB separation
It is effective to implement the following measures, to reduce stress in separating the board.
It is best to implement all of the following three measures; however, implement as many measures as possible to reduce
stress.
Contents of measures
Stress level
(1) Turn the mounting direction of the component parallel to the
board separation surface.
A > D*1
(2) Add slits in the board separation part.
A>B
(3) Keep the mounting position of the component away from the
board separation surface.
A>C
*1 A > D is valid when stress is added vertically to the perforation as with hand separation.
If a cutting disc is used, stress will be diagonal to the PCB, therefore A > D is invalid.
MURATA MFG CO., LTD
Spec No.: JELF243A_0115D-01
P10/12
(3) Mounting components near screw holes
When a component is mounted near a screw hole, it may be affected by the board deflection that occurs during the
tightening of the screw.
Mount the component in a position as far away from the screw holes as possible.
12.7 Handling of substrate
After mounting products on a substrate, do not apply any stress to the product caused by bending or twisting to the substrate
when cropping the substrate, inserting and removing a connector from the substrate or tightening screw to the substrate.
Excessive mechanical stress may cause cracking in the product.
Bending
Twisting
12.8 Cleaning
The product shall be cleaned under the following conditions.
(1) The cleaning temperature shall be 60°C max. If isopropyl alcohol (IPA) is used, the cleaning temperature shall be 40°C
max.
(2) Perform ultrasonic cleaning under the following conditions. Exercise caution to prevent resonance phenomenon in
mounted products and the PCB.
Item
Requirement
Power
Time
20 W/L max.
5 min max.
Frequency
28 kHz to 40 kHz
(3) Cleaner
Alcohol-based cleaner: IPA
Aqueous agent: PINE ALPHA ST-100S
(4) There shall be no residual flux or residual cleaner. When using aqueous agent, rinse the product with deionized water
adequately and completely dry it so that no cleaner is left.
* For other cleaning, consult our technical department.
12.9 Storage and transportation
Storage period
Use the product within 12 months after delivery.
If you do not use the product for more than 12 months, check solderability before using it.
Storage conditions
• The products shall be stored in a room not subject to rapid changes in temperature and humidity.
The recommended temperature range is -10°C to +40°C. The recommended relative humidity
range is 15% to 85%.
Keeping the product in corrosive gases, such as sulfur, chlorine gas or acid, oxidizes the
electrode, resulting in poor solderability or corrosion of the coil wire of the product.
• Do not keep products in bulk packaging. Doing so may cause collision between the products or
between the products and other products, resulting in core chipping or wire breakage.
• Do not place the products directly on the floor; they should be placed on a palette so that they are
not affected by humidity or dust.
• Avoid keeping the products in a place exposed to direct sunlight, heat or vibration.
Transportation
Excessive vibration and impact reduces the reliability of the products. Exercise caution when
handling the products.
MURATA MFG CO., LTD
Spec No.: JELF243A_0115D-01
P11/12
12.10 Resin coating
The inductance value may change due to high cure-stress of resin to be used for coating/molding products.
A wire breakage issue may occur by mechanical stress caused by the resin, amount/cured shape of resin, or operating
condition etc. Some resin contains some impurities or chloride possible to generate chlorine by hydrolysis under some
operating condition may cause corrosion of wire of coil, leading to wire breakage.
So, please pay your careful attention when you select resin in case of coating/molding the products with the resin.
Prior to use the coating resin, please make sure no reliability issue is observed by evaluating products mounted on your
board.
12.11 Handling of product
• Sharp material such as a pair of tweezers or other material such as bristles of cleaning brush, shall not be touched to the
winding portion to prevent the breaking of wire.
• Mechanical shock should not be applied to the products mounted on the board to prevent the breaking of the core.
12.12 Handling with mounting equipment
With some types of mounting equipment, a support pin pushes up the product from the bottom of the base (paper) tape
when the product is sucked with the pick-up nozzle.
When using this type of equipment, detach the support pin to prevent the breaking of wire on the product.
13.
Note
(1) Please make sure that your product has been evaluated in view of your specifications with our product being mounted to
your product.
(2) You are requested not to use our product deviating from the reference specifications.
(3) The contents of this reference specification are subject to change without advance notice. Please approve our product
specifications or transact the approval sheet for product specifications before ordering.
14. Appendix
Electrical performance: Measuring method for inductance/Q (Q measurement is applicable only when the Q value is
included in the rating table.)
Perform measurement using the method described below. (Perform correction for the error deriving from the measuring
terminal.)
(1) Residual elements and stray elements of the measuring terminal can be expressed by the F parameter for the 2-pole
terminal as shown in the figure below.
(2) The product's impedance value (Zx) and measured impedance value (Zm) can be expressed as shown below, by using
the respective current and voltage for input/output.
Zm=
V1
I1
Zx=
V2
I2
(3) Thus, the relationship between the product's impedance value (Zx) and measured impedance value (Zm) is as follows.
Zx=α
Zm-β
1-ZmΓ
Here,
α = D/A = 1
β = B/D = Zsm - (1 - Yom Zsm) Zss
Γ = C/A = Yom
Zsm: measured impedance of short chip
Zss: residual impedance of short chip (0.771 nH)
Yom: measured admittance when measuring terminal is open
MURATA MFG CO., LTD
Spec No.: JELF243A_0115D-01
P12/12
(4) Calculate inductance Lx and Qx using the equations shown below.
Im (Zx)
Lx: inductance of chip coil
Lx=
2πf
Qx: Q of chip coil
Im (Zx)
f: measuring frequency
Qx=
Re (Zx)
MURATA MFG CO., LTD
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