LQW2BAS12NJ00L

Spec No.: JELF243A_0084Q-01 P1/13 CHIP COILS (CHIP INDUCTORS) LQW2BAS□□□□00□ REFERENCE SPECIFICATION 1. Scope This reference specification applies to chip coils (chip inductors) LQW2BAS_00 series for general electronic equipment. 2. Part Numbering (Ex.) LQ W 2B A S 2N8 J 0 0 L Product Structure Dimension ID (L × W) Application Category Inductance Tolerance Performance Electrode Packaging and specification L: taping characteristic *B: bulk *B: Bulk packing is also available (taping condition: however, products without reels are put in plastic bags). 3. Part Number and Rating Operating temperature range -55°C to +125°C Storage temperature range -55°C to +125°C Inductance Customer Part number Tolerance Q (Min.) DC resistance (Ω max.) Self-resonant frequency (MHz min.) Rated current (mA) 2.7 J: ±5% 80 0.03 15000 910 2.8 J: ±5% 80 0.06 12200 800 LQW2BAS3N0J00L 3.0 J: ±5% 65 0.06 12200 800 LQW2BAS5N6J00L 5.6 J: ±5% 65 0.08 5900 600 LQW2BAS6N0J00L 6.0 J: ±5% 70 0.03 4500 600 LQW2BAS6N8J00L 6.8 J: ±5% 50 0.11 5600 600 Murata Part number Nominal value (nH) LQW2BAS2N7J00L LQW2BAS2N8J00L LQW2BAS7N5J00L 7.5 J: ±5% 50 0.14 4800 600 LQW2BAS8N2G00L 8.2 G: ±2% 50 0.12 4400 600 LQW2BAS8N2J00L 8.2 J: ±5% 50 0.12 4400 600 LQW2BAS10NG00L 10 G: ±2% 60 0.10 4300 600 LQW2BAS10NJ00L 10 J: ±5% 60 0.10 4300 600 LQW2BAS12NG00L 12 G: ±2% 50 0.15 4000 600 LQW2BAS12NJ00L 12 J: ±5% 50 0.15 4000 600 LQW2BAS15NG00L 15 G: ±2% 50 0.17 3200 600 LQW2BAS15NJ00L 15 J: ±5% 50 0.17 3200 600 LQW2BAS18NG00L 18 G: ±2% 50 0.20 3100 600 LQW2BAS18NJ00L 18 J: ±5% 50 0.20 3100 600 LQW2BAS22NG00L 22 G: ±2% 55 0.22 2600 500 LQW2BAS22NJ00L 22 J: ±5% 55 0.22 2600 500 LQW2BAS24NG00L 24 G: ±2% 50 0.22 2400 500 LQW2BAS24NJ00L 24 J: ±5% 50 0.22 2400 500 LQW2BAS27NG00L 27 G: ±2% 55 0.25 2580 500 LQW2BAS27NJ00L 27 J: ±5% 55 0.25 2580 500 LQW2BAS33NG00L 33 G: ±2% 60 0.27 2150 500 LQW2BAS33NJ00L 33 J: ±5% 60 0.27 2150 500 LQW2BAS36NG00L 36 G: ±2% 55 0.27 1900 500 LQW2BAS36NJ00L 36 J: ±5% 55 0.27 1900 500 LQW2BAS39NG00L 39 G: ±2% 60 0.29 2000 500 LQW2BAS39NJ00L 39 J: ±5% 60 0.29 2000 500 LQW2BAS43NG00L 43 G: ±2% 60 0.34 1800 500 MURATA MFG CO., LTD Spec No.: JELF243A_0084Q-01 P2/13 Inductance Customer Part number Tolerance Q (Min.) DC resistance (Ω max.) Self-resonant frequency (MHz min.) Rated current (mA) 43 J: ±5% 60 0.34 1800 500 47 G: ±2% 60 0.31 1700 500 Murata Part number Nominal value (nH) LQW2BAS43NJ00L LQW2BAS47NG00L LQW2BAS47NJ00L 47 J: ±5% 60 0.31 1700 500 LQW2BAS56NG00L 56 G: ±2% 60 0.34 1600 500 LQW2BAS56NJ00L 56 J: ±5% 60 0.34 1600 500 LQW2BAS68NG00L 68 G: ±2% 60 0.38 1500 500 LQW2BAS68NJ00L 68 J: ±5% 60 0.38 1500 500 LQW2BAS82NG00L 82 G: ±2% 65 0.42 1330 400 LQW2BAS82NJ00L 82 J: ±5% 65 0.42 1330 400 LQW2BAS91NG00L 91 G: ±2% 65 0.48 1330 400 LQW2BAS91NJ00L 91 J: ±5% 65 0.48 1330 400 LQW2BASR10G00L 100 G: ±2% 65 0.46 1250 400 LQW2BASR10J00L 100 J: ±5% 65 0.46 1250 400 LQW2BASR11G00L 110 G: ±2% 50 0.48 1100 400 LQW2BASR11J00L 110 J: ±5% 50 0.48 1100 400 LQW2BASR12G00L 120 G: ±2% 50 0.51 1100 400 LQW2BASR12J00L 120 J: ±5% 50 0.51 1100 400 LQW2BASR15G00L 150 G: ±2% 50 0.56 920 400 LQW2BASR15J00L 150 J: ±5% 50 0.56 920 400 LQW2BASR18G00L 180 G: ±2% 50 0.64 920 400 LQW2BASR18J00L 180 J: ±5% 50 0.64 920 400 LQW2BASR22G00L 220 G: ±2% 50 0.70 820 400 LQW2BASR22J00L 220 J: ±5% 50 0.70 820 400 LQW2BASR24G00L 240 G: ±2% 44 1.00 770 350 LQW2BASR24J00L 240 J: ±5% 44 1.00 770 350 LQW2BASR27G00L 270 G: ±2% 48 1.00 730 350 LQW2BASR27J00L 270 J: ±5% 48 1.00 730 350 LQW2BASR33G00L 330 G: ±2% 48 1.40 650 310 LQW2BASR33J00L 330 J: ±5% 48 1.40 650 310 LQW2BASR39J00L 390 J: ±5% 48 1.50 600 290 LQW2BASR47J00L 470 J: ±5% 33 1.76 300 250 LQW2BASR56J00L 560 J: ±5% 23 1.90 270 230 LQW2BASR68J00L 680 J: ±5% 23 2.20 250 190 LQW2BASR82J00L 820 J: ±5% 23 2.35 230 180 LQW2BAS1R0J00L 1000 J: ±5% 23 2.40 200 170 4. Testing Conditions Unless otherwise specified Temperature: ordinary temperature (15°C to 35°C) Humidity: ordinary humidity [25% to 85% (RH)] In case of doubt Temperature: 20°C±2°C Humidity: 60% to 70% (RH) Atmospheric pressure: 86 kPa to 106 kPa MURATA MFG CO., LTD Spec No.: JELF243A_0084Q-01 P3/13 5. Appearance and Dimensions Unit mass (typical value): 0.014 g 6. Marking No marking. MURATA MFG CO., LTD Spec No.: JELF243A_0084Q-01 P4/13 7. Electrical Performance No. Item 7.1 Inductance Specification Meet chapter 3 ratings. Test method Measuring equipment: Keysight E4991A or the equivalent Measuring frequency: Inductance 250 MHz 2.7 nH to 39 nH Q 200 MHz 43 nH to 68 nH 150 MHz 82 nH to 120 nH 100 MHz 150 nH to 390 nH 50 MHz 470 nH 25 MHz 560 nH to 1000 nH 1500 MHz 2.7 nH to 3.0 nH 1000 MHz 5.6 nH to 8.2 nH 7.2 Q 500 MHz 10 nH to 100 nH 250 MHz 110 nH to 390 nH 100 MHz 470 nH 50 MHz 560 nH to 1000 nH Measuring conditions: Measurement signal level: Approx. 0 dBm Measurement terminal distance: 1.5 mm Electrical length: 10.0 mm Weight: Approx. 1 N to 3 N Measuring fixture: Keysight 16197A Position the chip coil under test as shown in the measuring example below and connect it to the electrode by applying weight. Measurement example: Meet chapter 3 ratings. Measuring method: see "Electrical performance: Measuring method for inductance/Q" in the chapter "16. Appendix". 7.3 DC resistance Meet chapter 3 ratings. Measuring equipment: digital multimeter 7.4 Self-resonant frequency Meet chapter 3 ratings. Measuring equipment: Keysight N5230A or the equivalent 7.5 Rated current Product temperature rise: 40°C max. Apply the rated current specified in chapter 3. 8. Mechanical Performance No. 8.1 Item Shear test Specification Test method No significant mechanical damage or no Test substrate: glass-epoxy substrate sign of electrode peeling off shall be Force application direction: observed. Applying force: 10 N Holding time: 5 s±1 s MURATA MFG CO., LTD Spec No.: JELF243A_0084Q-01 No. P5/13 Item Specification Test method 8.2 Bending test No significant mechanical damage or no Test substrate: glass-epoxy substrate (100 mm × 40 sign of electrode peeling off shall be mm × 1.0 mm) observed. Pressurizing speed: 1 mm/s Deflection: 3 mm Holding time: 5 s 8.3 Vibration Appearance shall have no significant mechanical damage. 8.4 Solderability 90% or more of the outer electrode shall Flux: immersed in ethanol solution [including an be covered with new solder seamlessly. activator with a chlorine conversion value of 0.06(wt)%] with a rosin content of 25(wt)% for 5 s to 10 s. Solder: Sn-3.0Ag-0.5Cu solder Pre-heating: 150°C±10°C/60 s to 90 s Solder temperature: 240°C±5°C Immersion time: 3 s±1 s 8.5 Resistance to soldering heat Appearance: No significant mechanical damage shall be observed. Inductance change rate: within ±5% Oscillation frequency: 10 Hz to 2000 Hz to 10 Hz, for approx. 15 min Total amplitude: total amplitude of 3.0 mm or acceleration amplitude of 196 m/s2, whichever is smaller Test time: 3 directions perpendicular to each other, 2 h for each direction (6 h in total) Flux: immersed in ethanol solution [including an activator with a chlorine conversion value of 0.06(wt)%] with a rosin content of 25(wt)% for 5 s to 10 s. Solder: Sn-3.0Ag-0.5Cu solder Pre-heating: 150°C±10°C/60 s to 90 s Solder temperature: 270°C±5°C Immersion time: 10 s±1 s Post-treatment: left at a room condition for 24 h±2 h 9. Environmental Performance The product is soldered on a substrate for test. No. Item Specification Test method 9.1 Heat resistance Appearance: No significant mechanical damage shall be observed. Inductance change rate: within ±5% Q change rate: within ±20% Temperature: 125°C±2°C Test time: 1000 h (+48 h, -0 h) Post-treatment: left at a room condition for 24 h±2 h 9.2 Cold resistance Appearance: No significant mechanical damage shall be observed. Inductance change rate: within ±5% Q change rate: within ±20% Temperature: -55°C±2°C Test time: 1000 h (+48 h, -0 h) Post-treatment: left at a room condition for 24 h±2 h 9.3 Humidity Appearance: No significant mechanical damage shall be observed. Inductance change rate: within ±5% Q change rate: within ±20% Temperature: 85°C±2°C Humidity: 85% (RH) Test time: 1000 h (+48 h, -0 h) Post-treatment: left at a room condition for 24 h±2 h 9.4 Temperature cycle Appearance: No significant mechanical damage shall be observed. Inductance change rate: within ±5% Q change rate: within ±20% Single cycle conditions: Step 1: -55°C±2°C/30 min±3 min Step 2: ordinary temperature/10 min to 15 min Step 3: +125°C±2°C/30 min±3 min Step 4: ordinary temperature/10 min to 15 min Number of testing: 10 cycles Post-treatment: left at a room condition for 24 h±2 h MURATA MFG CO., LTD Spec No.: JELF243A_0084Q-01 P6/13 10. Specification of Packaging 10.1 Appearance and dimensions of tape (8 mm width/plastic tape) A 1.8±0.1 B 2.3±0.1 t 1.65±0.1 t' 0.25±0.05 (in mm) * The dimensions of the cavity are measured at its bottom. 10.2 Taping specifications Packing quantity (Standard quantity) 2000 pcs/reel Packing method The products are placed in embossed cavities of a plastic tape and sealed by a cover tape. Feed hole position The feed holes on the plastic tape are on the right side when the cover tape is pulled toward the user. Joint The plastic tape and the cover tape are seamless. Number of missing products Number of missing products within 0.025% of the number per reel or 1 pc., whichever is greater, and are not continuous. The specified quantity per reel is kept. 10.3 Break down force of tape Break down force of cover tape 10 N min. 10.4 Peeling off force of cover tape Speed of peeling off 300 mm/min Peeling off force 165 to 180 degree 0.1 N to 0.6 N (The lower limit is for typical value.) F Cover tape Plastic tape 10.5 Dimensions of leader section, trailer section and reel A vacant section is provided in the leader (start) section and trailer (end) section of the tape for the product. The leader section is further provided with an area consisting only of the cover tape (or top tape). (See the diagram below.) MURATA MFG CO., LTD Spec No.: JELF243A_0084Q-01 P7/13 10.6 Marking for reel Customer part number, Murata part number, inspection number (*1), RoHS marking (*2), quantity, etc. *1 Expression of inspection No.: (1) Factory code  □□ ○○○○ (2) Date First digit: year/last digit of year (1) (2) (3) Second digit: month/Jan. to Sep.→1 to 9, Oct. to Dec.→O, N, D Third, Fourth digit: day (3) Serial No. *2 Expression of RoHS marking: (1) RoHS regulation conformity ROHSY () (2) Murata classification number (1) (2) 10.7 Marking on outer box (corrugated box) Customer name, purchasing order number, customer part number, Murata part number, RoHS marking (*2), quantity, etc. 10.8 Specification of outer box Label H D W 11. Dimensions of outer box (mm) W D H 186 186 93 Standard reel quantity in outer box (reel) 5 * Above outer box size is typical. It depends on a quantity of an order. Caution 11.1 Restricted applications Please contact us before using our products for the applications listed below which require especially high reliability for the prevention of defects which might directly cause damage to the third party's life, body or property. (1) Aircraft equipment (2) Aerospace equipment (3) Undersea equipment (4) Power plant control equipment (5) Medical equipment (6) Transportation equipment (7) Traffic signal equipment (8) Disaster/crime (vehicles, trains, ships, etc.) prevention equipment (9) Data-processing (10) Applications of similar complexity and/or reliability equipment requirements to the applications listed in the above 11.2 Precautions on rating Avoid using in exceeded the rated temperature range, rated voltage, or rated current. Usage when the ratings are exceeded could lead to wire breakage, burning, or other serious fault. 11.3 Inrush current If an inrush current (or pulse current or rush current) that significantly exceeds the rated current is applied to the product, overheating could occur, resulting in wire breakage, burning, or other serious fault. 11.4 Corrosive gas Please refrain from use since contact with environments with corrosive gases (sulfur gas [hydrogen sulfide, sulfur dioxide, etc.], chlorine, ammonia, etc.) or oils (cutting oil, silicone oil, etc.) that have come into contact with the previously stated corrosive gas environment will result in deterioration of product quality or an open from deterioration due to corrosion of product electrode, etc. We will not bear any responsibility for use under these environments. MURATA MFG CO., LTD Spec No.: JELF243A_0084Q-01 P8/13 12. Precautions for Use This product is for use only with reflow soldering. It is designed to be mounted by soldering. If you want to use other mounting method, for example, using a conductive adhesive, please consult us beforehand. Also, if repeatedly subjected to temperature cycles or other thermal stress, due to the difference in the coefficient of thermal expansion with the mounting substrate, the solder (solder fillet part) in the mounting part may crack. The occurrence of cracks due to thermal stress is affected by the size of the land where mounted, the solder volume, and the heat dissipation of the mounting substrate. Carefully design it when a large change in ambient temperature is assumed. 12.1 Land dimensions The following diagram shows the recommended land dimensions for reflow soldering. The land dimensions are designed in consideration of electrical characteristics and mountability. Use of other land dimensions may preclude achievement of performance. In some cases, it may result in poor solderability, including positional shift. If you use other land pattern, consider it adequately. (in mm) 12.2 Flux and solder used Flux • Use a rosin-based flux that includes an activator with a chlorine conversion value of 0.06(wt)% to 0.1(wt)%. • Do not use a highly acidic flux with a halide content exceeding 0.2(wt)% (chlorine conversion value). • Do not use a water-soluble flux. Solder • Use Sn-3.0Ag-0.5Cu solder. • Standard thickness of solder paste: 100 μm to 150 μm If you want to use a flux other than the above, please consult our technical department. 12.3 Soldering conditions (reflow) • Pre-heating should be in such a way that the temperature difference between solder and product surface is limited to 150°C max. Cooling into solvent after soldering also should be in such a way that the temperature difference is limited to 100°C max. Insufficient pre-heating may cause cracks on the product, resulting in the deterioration of product quality. • Standard soldering profile and the limit soldering profile is as follows. The excessive limit soldering conditions may cause leaching of the electrode and/or resulting in the deterioration of product quality. Temp. (℃) 260℃ 245℃±3℃ 220℃ 230℃ Limit Profile 180 150 Standard Profile 30s～60s 60s max. 90s±30s Time. (s) Standard profile Limit profile Pre-heating 150°C to 180°C/90 s±30 s 150°C to 180°C/90 s±30 s Heating Above 220°C/30 s to 60 s Above 230°C/60 s max. 245°C±3°C 260°C/10 s 2 times 2 times Peak temperature Number of reflow cycles MURATA MFG CO., LTD Spec No.: JELF243A_0084Q-01 P9/13 12.4 Reworking with soldering iron The following requirements must be met to rework a soldered product using a soldering iron. Item Requirement Pre-heating 150°C/approx. 1 min Tip temperature of soldering iron 350°C max. Power consumption of soldering iron 80 W max. Tip diameter of soldering iron ø3 mm max. Soldering time 3 s (+1 s, -0 s) Number of reworking operations 2 times max. * Avoid a direct contact of the tip of the soldering iron with the product. Such a direction contact may cause cracks in the ceramic body due to thermal shock. 12.5 Solder volume Solder shall be used not to increase the volume too much. An increased solder volume increases mechanical stress on the product. Exceeding solder volume may cause the failure of mechanical or electrical performance. 12.6 Product's location The following shall be considered when designing and laying out PCBs. (1) PCB shall be designed so that products are not subject to mechanical stress due to warping the board. [Products direction] Products shall be located in the sideways direction (length: a < b) to the mechanical stress. a b 〈 Poor example〉 〈 Good example〉 (2) Components location on PCB separation It is effective to implement the following measures, to reduce stress in separating the board. It is best to implement all of the following three measures; however, implement as many measures as possible to reduce stress. Contents of measures Stress level (1) Turn the mounting direction of the component parallel to the board separation surface. A > D*1 (2) Add slits in the board separation part. A>B (3) Keep the mounting position of the component away from the board separation surface. A>C *1 A > D is valid when stress is added vertically to the perforation as with hand separation. If a cutting disc is used, stress will be diagonal to the PCB, therefore A > D is invalid. MURATA MFG CO., LTD Spec No.: JELF243A_0084Q-01 P10/13 (3) Mounting components near screw holes When a component is mounted near a screw hole, it may be affected by the board deflection that occurs during the tightening of the screw. Mount the component in a position as far away from the screw holes as possible. 12.7 Handling of substrate After mounting products on a substrate, do not apply any stress to the product caused by bending or twisting to the substrate when cropping the substrate, inserting and removing a connector from the substrate or tightening screw to the substrate. Excessive mechanical stress may cause cracking in the product. Bending Twisting 12.8 Cleaning The product shall be cleaned under the following conditions. (1) The cleaning temperature shall be 60°C max. If isopropyl alcohol (IPA) is used, the cleaning temperature shall be 40°C max. (2) Perform ultrasonic cleaning under the following conditions. Exercise caution to prevent resonance phenomenon in mounted products and the PCB. Item Requirement Power Time 20 W/L max. 5 min max. Frequency 28 kHz to 40 kHz (3) Cleaner Alcohol-based cleaner: IPA Aqueous agent: PINE ALPHA ST-100S (4) There shall be no residual flux or residual cleaner. When using aqueous agent, rinse the product with deionized water adequately and completely dry it so that no cleaner is left. * For other cleaning, consult our technical department. 12.9 Storage and transportation Storage period Use the product within 12 months after delivery. If you do not use the product for more than 12 months, check solderability before using it. Storage conditions • The products shall be stored in a room not subject to rapid changes in temperature and humidity. The recommended temperature range is -10°C to +40°C. The recommended relative humidity range is 15% to 85%. Keeping the product in corrosive gases, such as sulfur, chlorine gas or acid, oxidizes the electrode, resulting in poor solderability or corrosion of the coil wire of the product. • Do not keep products in bulk packaging. Doing so may cause collision between the products or between the products and other products, resulting in core chipping or wire breakage. • Do not place the products directly on the floor; they should be placed on a palette so that they are not affected by humidity or dust. • Avoid keeping the products in a place exposed to direct sunlight, heat or vibration. Transportation Excessive vibration and impact reduces the reliability of the products. Exercise caution when handling the products. MURATA MFG CO., LTD Spec No.: JELF243A_0084Q-01 P11/13 12.10 Resin coating The inductance value may change due to high cure-stress of resin to be used for coating/molding products. A wire breakage issue may occur by mechanical stress caused by the resin, amount/cured shape of resin, or operating condition etc. Some resin contains some impurities or chloride possible to generate chlorine by hydrolysis under some operating condition may cause corrosion of wire of coil, leading to wire breakage. So, please pay your careful attention when you select resin in case of coating/molding the products with the resin. Prior to use the coating resin, please make sure no reliability issue is observed by evaluating products mounted on your board. 12.11 Handling of product • Sharp material such as a pair of tweezers or other material such as bristles of cleaning brush, shall not be touched to the winding portion to prevent the breaking of wire. • Mechanical shock should not be applied to the products mounted on the board to prevent the breaking of the core. 12.12 Handling with mounting equipment With some types of mounting equipment, a support pin pushes up the product from the bottom of the base (paper) tape when the product is sucked with the pick-up nozzle. When using this type of equipment, detach the support pin to prevent the breaking of wire on the product. 13. Note (1) Please make sure that your product has been evaluated in view of your specifications with our product being mounted to your product. (2) You are requested not to use our product deviating from the reference specifications. (3) The contents of this reference specification are subject to change without advance notice. Please approve our product specifications or transact the approval sheet for product specifications before ordering. MURATA MFG CO., LTD Spec No.: JELF243A_0084Q-01 P12/13 14. Appendix Electrical performance: Measuring method for inductance/Q (Q measurement is applicable only when the Q value is included in the rating table.) Perform measurement using the method described below. (Perform correction to ensure that the inductance value is compatible with inductors of other manufacturers.) (1) Residual elements and stray elements of the measuring terminal can be expressed by the F parameter for the 2-pole terminal as shown in the figure below. (2) The product's impedance value (Zx) and measured impedance value (Zm) can be expressed as shown below, by using the respective current and voltage for input/output. Zm= V1 I1 Zx= V2 I2 (3) Thus, the relationship between the product's impedance value (Zx) and measured impedance value (Zm) is as follows. Zx=α Zm-β 1-ZmΓ Here, α = D/A = 1 β = B/D = Zsm - (1 - Yom Zsm) Zss Γ = C/A = Yom Zsm: measured impedance when measuring terminal is shorted Zss: residual impedance of short chip (= Equivalent series inductance X*1) Yom: measured admittance when measuring terminal is open *1 Important X: In consideration of compatibility with other venders' products, Zss is defined as the correction value to fit nominal inductance of other venders' products. When calibrating the measurement, please input X value instead of the equivalent series inductance (ShortL) for each L value. Perform measurement of Q using the residual impedance 0.771 nH obtained through our conventional standard measurement method. (4) Calculate inductance Lx and Qx using the equations shown below. Im (Zx) Lx: inductance of chip coil Lx= 2πf Qx: Q of chip coil Im (Zx) f: measuring frequency Qx= Re (Zx) MURATA MFG CO., LTD Spec No.: JELF243A_0084Q-01 P13/13 Table: Equivalent series inductance to fit nominal inductance of other venders' products Inductance LQW2BAS2N7_00 X (nH) Equivalent series inductance 0.121 LQW2BAS2N8_00 0.171 Part number Measuring frequency (MHz) 250 250 LQW2BAS3N0_00 0.131 250 LQW2BAS5N6_00 -0.009 250 LQW2BAS6N0_00 0.031 250 LQW2BAS6N8_00 0.301 250 LQW2BAS7N5_00 -0.299 250 LQW2BAS8N2_00 0.271 250 LQW2BAS10N_00 -0.229 250 LQW2BAS12N_00 0.371 250 LQW2BAS15N_00 0.051 250 LQW2BAS18N_00 -0.029 250 LQW2BAS22N_00 0.491 250 LQW2BAS24N_00 -0.389 250 LQW2BAS27N_00 0.931 250 LQW2BAS33N_00 0.481 250 LQW2BAS36N_00 0.531 250 LQW2BAS39N_00 0.771 250 LQW2BAS43N_00 -0.689 200 LQW2BAS47N_00 1.091 200 LQW2BAS56N_00 0.331 200 LQW2BAS68N_00 0.811 200 LQW2BAS82N_00 -0.839 150 LQW2BAS91N_00 -1.339 150 LQW2BASR10_00 0.171 150 LQW2BASR11_00 1.371 150 LQW2BASR12_00 -1.629 150 LQW2BASR15_00 -0.029 100 LQW2BASR18_00 4.071 100 LQW2BASR22_00 0.771 100 LQW2BASR24_00 3.071 100 LQW2BASR27_00 -1.429 100 LQW2BASR33_00 4.071 100 LQW2BASR39_00 0.971 100 LQW2BASR47_00 -8.829 50 LQW2BASR56_00 -8.229 25 LQW2BASR68_00 -2.229 25 LQW2BASR82_00 -8.029 25 LQW2BAS1R0_00 -6.329 25 MURATA MFG CO., LTD