LQW31HN33NJ03L

Spec No.: JELF243A_0033P-01 P1/10 CHIP COILS (CHIP INDUCTORS) LQW31HN□□□□03□ REFERENCE SPECIFICATION 1. Scope This reference specification applies to chip coils (chip inductors) LQW31HN_03 series for general electronic equipment. 2. Part Numbering (Ex.) LQ W 31 Product Structure Dimension ID (L × W) H N 8N8 Application Category and characteristic J Inductance 0 3 Tolerance Performance L Electrode Packaging specification L: taping 3. Part Number and Rating Operating temperature range -40°C to +85°C Storage temperature range -40°C to +85°C Inductance Customer Part number Tolerance Q (Min.) DC resistance (Ω) Self-resonant frequency (MHz min.) Rated current (mA) 8.8 J: ±5% 50 0.029±40% 1000 750 LQW31HN8N8K03L 8.8 K: ±10% 50 0.029±40% 1000 750 LQW31HN15NJ03L 14.7 J: ±5% 60 0.035±40% 1000 680 LQW31HN15NK03L 14.7 K: ±10% 60 0.035±40% 1000 680 Murata Part number Nominal value (nH) LQW31HN8N8J03L LQW31HN17NJ03L 17 J: ±5% 60 0.037±40% 1000 650 LQW31HN17NK03L 17 K: ±10% 60 0.037±40% 1000 650 LQW31HN23NJ03L 23 J: ±5% 60 0.046±40% 1000 590 LQW31HN23NK03L 23 K: ±10% 60 0.046±40% 1000 590 LQW31HN27NJ03L 27 J: ±5% 60 0.051±40% 1000 560 LQW31HN27NK03L 27 K: ±10% 60 0.051±40% 1000 560 LQW31HN33NJ03L 33 J: ±5% 60 0.057±40% 1000 530 LQW31HN33NK03L 33 K: ±10% 60 0.057±40% 1000 530 LQW31HN39NJ03L 39 J: ±5% 60 0.067±40% 1000 490 LQW31HN39NK03L 39 K: ±10% 60 0.067±40% 1000 490 LQW31HN47NJ03L 47 J: ±5% 60 0.11±40% 1000 380 LQW31HN47NK03L 47 K: ±10% 60 0.11±40% 1000 380 LQW31HN56NJ03L 56 J: ±5% 60 0.14±40% 1000 330 LQW31HN56NK03L 56 K: ±10% 60 0.14±40% 1000 330 LQW31HN64NJ03L 64 J: ±5% 60 0.18±40% 1000 290 LQW31HN64NK03L 64 K: ±10% 60 0.18±40% 1000 290 LQW31HN84NJ03L 84 J: ±5% 60 0.28±40% 1000 240 LQW31HN84NK03L 84 K: ±10% 60 0.28±40% 1000 240 LQW31HNR10J03L 100 J: ±5% 60 0.30±40% 900 230 LQW31HNR10K03L 100 K: ±10% 60 0.30±40% 900 230 4. Testing Conditions Unless otherwise specified Temperature: ordinary temperature (15°C to 35°C) Humidity: ordinary humidity [25% to 85% (RH)] In case of doubt Temperature: 20°C±2°C Humidity: 60% to 70% (RH) Atmospheric pressure: 86 kPa to 106 kPa MURATA MFG CO., LTD Spec No.: JELF243A_0033P-01 P2/10 5. Appearance and Dimensions Unit mass (typical value): 0.020 g 6. Marking No marking. 7. Electrical Performance No. Item 7.1 Inductance Meet chapter 3 ratings. Specification Measuring equipment: Keysight E4991A or the equivalent Measuring frequency: 100 MHz Measuring method: see "Electrical performance: Measuring method for inductance/Q" in the chapter "14. Appendix". Test method 7.2 Q Meet chapter 3 ratings. Measuring equipment: Keysight E4991A or the equivalent Measuring frequency: 436 MHz 7.3 DC resistance Meet chapter 3 ratings. Measuring equipment: digital multimeter 7.4 Self-resonant frequency Meet chapter 3 ratings. Measuring equipment: Keysight N5230A or the equivalent 7.5 Rated current Product temperature rise: 20°C max. Inductance change rate: within ±10% Apply the rated current specified in chapter 3. 8. Mechanical Performance No. 8.1 Item Shear test Specification No significant mechanical damage or no sign of electrode peeling off shall be observed. Test method Test substrate: glass-epoxy substrate Force application direction: Applying force: 10 N Holding time: 5 s±1 s MURATA MFG CO., LTD Spec No.: JELF243A_0033P-01 No. P3/10 Item Specification Test method 8.2 Bending test No significant mechanical damage or no sign of electrode peeling off shall be observed. Test substrate: glass-epoxy substrate (100 mm × 40 mm × 1.6 mm) Pressurizing speed: 1 mm/s Deflection: 2 mm Holding time: 30 s 8.3 Vibration Appearance shall have no significant mechanical damage. Oscillation frequency: 10 Hz to 55 Hz to 10 Hz, for approx. 1 min Total amplitude: 1.5 mm Test time: 3 directions perpendicular to each other, 2 h for each direction (6 h in total) 8.4 Solderability 90% or more of the outer electrode shall be covered with new solder seamlessly. Flux: immersed in ethanol solution with a rosin content of 25(wt)% for 5 s to 10 s Solder: Sn-3.0Ag-0.5Cu solder Pre-heating: 150°C±10°C/60 s to 90 s Solder temperature: 240°C±5°C Immersion time: 3 s±1 s 8.5 Resistance to soldering heat Appearance: No significant mechanical damage shall be observed. Inductance change rate: within ±5% Flux: immersed in ethanol solution with a rosin content of 25(wt)% for 5 s to 10 s Solder: Sn-3.0Ag-0.5Cu solder Pre-heating: 150°C±10°C/60 s to 90 s Solder temperature: 270°C±5°C Immersion time: 10 s±1 s Post-treatment: left at a room condition for 24 h±2 h 9. Environmental Performance The product is soldered on a substrate for test. No. Item Specification Test method 9.1 Heat resistance Appearance: No significant mechanical damage shall be observed. Inductance change rate: within ±5% Q change rate: within ±20% Temperature: 85°C±2°C Test time: 1000 h (+48 h, -0 h) Post-treatment: left at a room condition for 24 h±2 h 9.2 Cold resistance Appearance: No significant mechanical damage shall be observed. Inductance change rate: within ±5% Q change rate: within ±20% Temperature: -40°C±2°C Test time: 1000 h (+48 h, -0 h) Post-treatment: left at a room condition for 24 h±2 h 9.3 Humidity Appearance: No significant mechanical damage shall be observed. Inductance change rate: within ±5% Q change rate: within ±20% Temperature: 40°C±2°C Humidity: 90% (RH) to 95% (RH) Test time: 1000 h (+48 h, -0 h) Post-treatment: left at a room condition for 24 h±2 h 9.4 Temperature cycle Appearance: No significant mechanical damage shall be observed. Inductance change rate: within ±5% Q change rate: within ±20% Single cycle conditions: Step 1: -40°C±2°C/30 min±3 min Step 2: ordinary temperature/10 min to 15 min Step 3: +85°C±2°C/30 min±3 min Step 4: ordinary temperature/10 min to 15 min Number of testing: 10 cycles Post-treatment: left at a room condition for 24 h±2 h MURATA MFG CO., LTD Spec No.: JELF243A_0033P-01 P4/10 10. Specification of Packaging 10.1 Appearance and dimensions of tape (8 mm width/plastic tape) A 1.9±0.1 B 3.6±0.1 t 2.0±0.1 t' 0.2 (in mm) * The dimensions of the cavity are measured at its bottom. 10.2 Taping specifications Packing quantity (Standard quantity) 2000 pcs/reel Packing method The products are placed in embossed cavities of a plastic tape and sealed by a cover tape. Feed hole position The feed holes on the plastic tape are on the right side when the cover tape is pulled toward the user. Joint The plastic tape and the cover tape are seamless. Number of missing products Number of missing products within 0.1% of the number per reel or 1 pc., whichever is greater, and are not continuous. The specified quantity per reel is kept. 10.3 Break down force of tape Break down force of cover tape 10 N min. 10.4 Peeling off force of cover tape Speed of peeling off 300 mm/min Peeling off force 165 to 180 degree 0.2 N to 0.7 N (The lower limit is for typical value.) F Cover tape Plastic tape MURATA MFG CO., LTD Spec No.: JELF243A_0033P-01 P5/10 10.5 Dimensions of leader section, trailer section and reel A vacant section is provided in the leader (start) section and trailer (end) section of the tape for the product. The leader section is further provided with an area consisting only of the cover tape. (See the diagram below.) 10.6 Marking for reel Customer part number, Murata part number, inspection number (*1), RoHS marking (*2), quantity, etc. *1 Expression of inspection No.: (1) Factory code  (2) Date □□ ○○○○ First digit: year/last digit of year (1) (2) (3) Second digit: month/Jan. to Sep.→1 to 9, Oct. to Dec.→O, N, D Third, Fourth digit: day (3) Serial No. *2 Expression of RoHS marking: (1) RoHS regulation conformity ROHSY () (2) Murata classification number (1) (2) 10.7 Marking on outer box (corrugated box) Customer name, purchasing order number, customer part number, Murata part number, RoHS marking (*2), quantity, etc. 10.8 Specification of outer box Label H D W 11. Dimensions of outer box (mm) W D H 186 186 93 Standard reel quantity in outer box (reel) 5 * Above outer box size is typical. It depends on a quantity of an order. Caution Restricted applications Please contact us before using our products for the applications listed below which require especially high reliability for the prevention of defects which might directly cause damage to the third party's life, body or property. (1) Aircraft equipment (2) Aerospace equipment (3) Undersea equipment (4) Power plant control equipment (5) Medical equipment (6) Transportation equipment (vehicles, trains, ships, etc.) (7) Traffic signal equipment (8) Disaster/crime prevention equipment (9) Data-processing equipment (10) Applications of similar complexity and/or reliability requirements to the applications listed in the above MURATA MFG CO., LTD Spec No.: JELF243A_0033P-01 P6/10 12. Precautions for Use This product is designed to be mounted by soldering. If you want to use other mounting method, for example, using a conductive adhesive, please consult us beforehand. 12.1 Land dimensions The following diagram shows the recommended land dimensions for flow and reflow soldering. The land dimensions are designed in consideration of electrical characteristics and mountability. Use of other land dimensions may preclude achievement of performance. In some cases, it may result in poor solderability, including positional shift. If you use other land pattern, consider it adequately. a 1.0 b 4.5 c 1.5 (in mm) 12.2 Flux and solder used Flux • Use a rosin-based flux. • Do not use a highly acidic flux with a halide content exceeding 0.2(wt)% (chlorine conversion value). • Do not use a water-soluble flux. Solder • Use Sn-3.0Ag-0.5Cu solder. • Standard thickness of solder paste: 200 μm to 300 μm 12.3 Soldering conditions (flow, reflow) • Pre-heating should be in such a way that the temperature difference between solder and product surface is limited to 150°C max. Cooling into solvent after soldering also should be in such a way that the temperature difference is limited to 100°C max. Insufficient pre-heating may cause cracks on the product, resulting in the deterioration of product quality. • Standard soldering profile and the limit soldering profile is as follows. The excessive limit soldering conditions may cause leaching of the electrode and/or resulting in the deterioration of product quality. (1) Flow Temp. (℃) 265℃±3℃ 250℃ Limit Profile 150 Heating Time 60s min. Standard Profile Time. (s) Standard profile Limit profile Pre-heating 150°C/60 s min. 150°C/60 s min. Heating 250°C/4 s to 6 s 265°C±3°C/5 s 2 times 2 times Number of flow cycles MURATA MFG CO., LTD Spec No.: JELF243A_0033P-01 P7/10 (2) Reflow Temp. (℃) 260℃ 245℃±3℃ 230℃ 220℃ Limit Profile 180 150 Standard Profile 30s～60s 60s max. 90s±30s Time. (s) Standard profile Limit profile Pre-heating 150°C to 180°C/90 s±30 s 150°C to 180°C/90 s±30 s Heating Above 220°C/30 s to 60 s Above 230°C/60 s max. 245°C±3°C 260°C/10 s 2 times 2 times Peak temperature Number of reflow cycles 12.4 Reworking with soldering iron The following requirements must be met to rework a soldered product using a soldering iron. Item Requirement Pre-heating Tip temperature of soldering iron Power consumption of soldering iron Tip diameter of soldering iron Soldering time Number of reworking operations 150°C/approx. 1 min 350°C max. 80 W max. ø3 mm max. 3 s (+1 s, -0 s) 2 times max. * Avoid a direct contact of the tip of the soldering iron with the product. Such a direction contact may cause cracks in the ceramic body due to thermal shock. 12.5 Solder volume Solder shall be used not to increase the volume too much. An increased solder volume increases mechanical stress on the product. Exceeding solder volume may cause the failure of mechanical or electrical performance. MURATA MFG CO., LTD Spec No.: JELF243A_0033P-01 P8/10 12.6 Product's location The following shall be considered when designing and laying out PCBs. (1) PCB shall be designed so that products are not subject to mechanical stress due to warping the board. [Products direction] Products shall be located in the sideways direction (length: a < b) to the mechanical stress. a b 〈 Poor example〉 〈 Good example〉 (2) Components location on PCB separation It is effective to implement the following measures, to reduce stress in separating the board. It is best to implement all of the following three measures; however, implement as many measures as possible to reduce stress. Contents of measures Stress level (1) Turn the mounting direction of the component parallel to the board separation surface. A > D*1 (2) Add slits in the board separation part. A>B (3) Keep the mounting position of the component away from the board separation surface. A>C *1 A > D is valid when stress is added vertically to the perforation as with hand separation. If a cutting disc is used, stress will be diagonal to the PCB, therefore A > D is invalid. (3) Mounting components near screw holes When a component is mounted near a screw hole, it may be affected by the board deflection that occurs during the tightening of the screw. Mount the component in a position as far away from the screw holes as possible. 12.7 Handling of substrate After mounting products on a substrate, do not apply any stress to the product caused by bending or twisting to the substrate when cropping the substrate, inserting and removing a connector from the substrate or tightening screw to the substrate. Excessive mechanical stress may cause cracking in the product. Bending Twisting MURATA MFG CO., LTD Spec No.: JELF243A_0033P-01 P9/10 12.8 Cleaning The product shall be cleaned under the following conditions. (1) The cleaning temperature shall be 60°C max. If isopropyl alcohol (IPA) is used, the cleaning temperature shall be 40°C max. (2) Perform ultrasonic cleaning under the following conditions. Exercise caution to prevent resonance phenomenon in mounted products and the PCB. Item Requirement Power Time 20 W/L max. 5 min max. Frequency 28 kHz to 40 kHz (3) Cleaner Alcohol-based cleaner: IPA Aqueous agent: PINE ALPHA ST-100S (4) There shall be no residual flux or residual cleaner. When using aqueous agent, rinse the product with deionized water adequately and completely dry it so that no cleaner is left. * For other cleaning, consult our technical department. 12.9 Storage and transportation Storage period Use the product within 12 months after delivery. If you do not use the product for more than 12 months, check solderability before using it. Storage conditions • The products shall be stored in a room not subject to rapid changes in temperature and humidity. The recommended temperature range is -10°C to +40°C. The recommended relative humidity range is 15% to 85%. Keeping the product in corrosive gases, such as sulfur, chlorine gas or acid, oxidizes the electrode, resulting in poor solderability or corrosion of the coil wire of the product. • Do not keep products in bulk packaging. Doing so may cause collision between the products or between the products and other products, resulting in core chipping or wire breakage. • Do not place the products directly on the floor; they should be placed on a palette so that they are not affected by humidity or dust. • Avoid keeping the products in a place exposed to direct sunlight, heat or vibration. Transportation Excessive vibration and impact reduces the reliability of the products. Exercise caution when handling the products. 12.10 Resin coating The inductance value may change due to high cure-stress of resin to be used for coating/molding products. A wire breakage issue may occur by mechanical stress caused by the resin, amount/cured shape of resin, or operating condition etc. Some resin contains some impurities or chloride possible to generate chlorine by hydrolysis under some operating condition may cause corrosion of wire of coil, leading to wire breakage. So, please pay your careful attention when you select resin in case of coating/molding the products with the resin. Prior to use the coating resin, please make sure no reliability issue is observed by evaluating products mounted on your board. 12.11 Handling of product • Sharp material such as a pair of tweezers or other material such as bristles of cleaning brush, shall not be touched to the winding portion to prevent the breaking of wire. • Mechanical shock should not be applied to the products mounted on the board to prevent the breaking of the core. 13. Note (1) Please make sure that your product has been evaluated in view of your specifications with our product being mounted to your product. (2) You are requested not to use our product deviating from the reference specifications. (3) The contents of this reference specification are subject to change without advance notice. Please approve our product specifications or transact the approval sheet for product specifications before ordering. MURATA MFG CO., LTD Spec No.: JELF243A_0033P-01 P10/10 14. Appendix Electrical performance: Measuring method for inductance/Q (Q measurement is applicable only when the Q value is included in the rating table.) Perform measurement using the method described below. (Perform correction for the error deriving from the measuring terminal.) (1) Residual elements and stray elements of the measuring terminal can be expressed by the F parameter for the 2-pole terminal as shown in the figure below. (2) The product's impedance value (Zx) and measured impedance value (Zm) can be expressed as shown below, by using the respective current and voltage for input/output. Zm= V1 I1 Zx= V2 I2 (3) Thus, the relationship between the product's impedance value (Zx) and measured impedance value (Zm) is as follows. Zx=α Zm-β 1-ZmΓ Here, α = D/A = 1 β = B/D = Zsm - (1 - Yom Zsm) Zss Γ = C/A = Yom Zsm: measured impedance of short chip Zss: residual impedance of short chip (0.771 nH) Yom: measured admittance when measuring terminal is open (4) Calculate inductance Lx and Qx using the equations shown below. Im (Zx) Lx: inductance of chip coil Lx= 2πf Qx: Q of chip coil Im (Zx) Qx= f: measuring frequency Re (Zx) MURATA MFG CO., LTD