Spec No.: JELF243A-9162-01
P1/10
CHIP COIL (CHIP INDUCTOR) for Automotive powertrain/safety equipment
LQW32FT□□□□8H□ Murata Standard REFERENCE Specification [AEC-Q200]
1. Scope
This reference specification applies to chip coils (chip inductors) LQW32FT_8H series based on AEC-Q200.
1.1 Specific applications:
• Automotive powertrain/safety equipment: Products that can be used for automotive equipment related to running, turning,
stopping, safety devices, etc., or equipment whose structure, equipment, and performance are legally required to meet
technical standards for safety assurance or environmental protection.
• Automotive infotainment/comfort equipment: Products that can be used for automotive equipment such as car navigation
systems and car audio systems that do not directly relate to human life and whose structure, equipment, and performance
are not specifically required by law to meet technical standards for safety assurance or environmental protection.
1.2 Unsuitable application:
Applications listed in “Limitation of applications” in this reference specification.
2. Part Numbering
(Ex.)
LQ
Product ID
W
32
FT
1R6
Type
Dimension
(L × W)
Application and
characteristic
M
Inductance Tolerance
8H
L
Category
(H: for automotive
electronics)
Packaging
L: taping
3. Part Number and Rating
Operating temperature range
-40°C to +125°C
Storage temperature range
-40°C to +125°C
Inductance
Customer
Part number
Murata
Part number
Rated current (mA)
SelfDC
resonant
Nominal
resistance
value Tolerance (Ω max.) frequency
(MHz min.)
(μH)
Based on
inductance
change*1
Based on
temperature rise
Ambient
Ambient
temperature temperature
105°C
125°C
ESD
Rank
LQW32FT1R6M8HL
1.6
±20%
0.06
270
1500
1400
1000
5A
LQW32FT2R2M8HL
2.2
±20%
0.07
200
1200
1370
960
5A
LQW32FT3R6M8HL
3.6
±20%
0.12
150
1000
1000
700
5A
LQW32FT4R7M8HL
4.7
±20%
0.14
100
900
900
630
5A
LQW32FT6R8M8HL
6.8
±20%
0.16
80
700
850
600
5A
LQW32FT100M8HL
10
±20%
0.24
65
600
650
460
5A
* As shown in the diagram below, derating is applied to the rated current based on the operating temperature
ESD Rank
Maximum Withstand Voltage
5A
8000 V (DC) to < 12,000 V (AD)
MURATA MFG CO., LTD
Spec No.: JELF243A-9162-01
P2/10
4. Testing Conditions
Unless otherwise specified
Temperature: ordinary temperature (15°C to 35°C)
Humidity: ordinary humidity [25% to 85% (RH)]
In case of doubt
Temperature: 20°C±2°C
Humidity: 60% to 70% (RH)
Atmospheric pressure: 86 kPa to 106 kPa
5. Appearance and Dimensions
■ Equivalent Circuit
Unit mass (typical value): 0.071g
6. Marking
No marking.
MURATA MFG CO., LTD
Spec No.: JELF243A-9162-01
P3/10
7. Electrical Performance
No.
Item
7.1 Inductance
Specification
Test method
Meet chapter 3 ratings.
Measuring equipment: Keysight E4990 or the
equivalent
Measuring frequency: 1 MHz
Position the chip coil under test as shown in the
measuring example below and connect it to the
electrode by applying weight.
Measurement example:
7.2 DC resistance
Meet chapter 3 ratings.
Measuring equipment: digital multimeter
7.3 Self-resonant
frequency
Meet chapter 3 ratings.
Measuring equipment: Keysight E4991B or the
equivalent
7.4 Rated current
(Based on
inductance
change)
When rated current is applied to the
Apply the rated current specified in chapter 3 at
products, inductance will be within ±30% ordinary temperature.
of nominal inductance value.
7.5 Rated current
(Based on
temperature rise)
Temperature rise caused by selfgenerated heat shall be limited to 40°C
max.
Apply the rated current specified in chapter 3 at
ordinary temperature.
8. AEC-Q200 Requirement
Performance(based on Table 5 for Magnetics Inductors/Transformer)
AEC-Q200 Rev.D issued June 1. 2010
AEC-Q200
No.
Stress
Test Method
3 High temperature
1000 h at 125°C
exposure
Set for 24 h at room condition,
then measured.
4 Temperature cycling 1000 cycles
-40°C to +125°C
Set for 24 h at room condition,
then measured.
7 Biased humidity
1000 h at 85°C, 85% (RH).
Unpowered.
Set for 24 h at room condition,
then measured.
8 Operational life
Apply 125°C 1000 h
Set for 24 h at room condition,
then measured.
9 External visual
Visual inspection
10 Physical dimension
12 Resistance to
solvents
Meet chapter 5, "Appearance
and Dimensions".
Per MIL-STD-202
Method 215
Murata Specification / Deviation
Appearance: No damage
Inductance change rate: within ±10%
Appearance: No damage
Inductance change rate: within ±10%
Appearance: No damage
Inductance change rate: within ±10%
Appearance: No damage
Inductance change rate: within ±10%
No abnormalities
No defects
Not applicable
MURATA MFG CO., LTD
Spec No.: JELF243A-9162-01
P4/10
AEC-Q200
No.
Stress
13 Mechanical shock
Test Method
Per MIL-STD-202
Method 213
Condition C:
100 g's/6 ms/half sine
14 Vibration
5 g's for 20 min, 12 cycles each
of 3 orientations
Test from 10 Hz to 2000 Hz
No-heating
Solder temperature
260°C±5°C
Immersion time 10 s
15 Resistance
to Soldering Heat
17 ESD
Per AEC-Q200-002
18 Solderability
Per J-STD-002
19 Electrical
Characterization
20 Flammability
21 Board Flex
22 Terminal Strength
Murata Specification / Deviation
Appearance: No damage
Inductance change rate: within ±10%
Appearance: No damage
Inductance change rate: within ±10%
Appearance: No damage
Inductance change rate: within ±10%
Deviation for AEC-Q200
Pre-heating: 150°C/60s
ESD Rank: Refer to chapter 3, "Part Number and Rating".
Appearance: No damage
Inductance change rate: within ±10%
95% or more of the outer electrode shall be covered
with new solder seamlessly.
(except exposed wire)
Measured: inductance
Deviation for AEC-Q200
Method b: Not applicable
Pre-heating: 150°C/60s
No defects
Per UL-94
Not applicable
Epoxy-PCB (1.6 mm)
Deflection 2 mm (min.)
60 s minimum holding time
Per AEC-Q200-006
A force of 17.7 N for 60 s
Appearance:No damage
Inductance change rate: within ±10%
Appearance: No damage
9. Specification of Packaging
9.1 Appearance and dimensions of tape (12 mm width/plastic tape)
A
(2.9)
B
(3.6)
t
(2.7)
t'
(0.3)
(in mm)
* The dimensions of the cavity are measured at its bottom.
MURATA MFG CO., LTD
Spec No.: JELF243A-9162-01
P5/10
9.2 Taping specifications
Packing quantity
(Standard quantity)
1500 pcs/reel
Packing method
The products are placed in cavities of a carrier tape and sealed by a cover tape (top tape and
bottom tape when the cavities of the carrier tape are punched type).
Feed hole position
The feed holes on the carrier tape are on the right side when the cover tape (top tape when the
cavities of the carrier tape are punched type) is pulled toward the user.
Joint
The carrier tape and cover tape (top tape when the cavities of the carrier tape are punched type)
are seamless.
Number of missing
products
Number of missing products within 0.025% of the number per reel or 1 pc., whichever is greater,
and are not continuous. The specified quantity per reel is kept.
9.3 Break down force of tape
Cover tape (or top tape)
5 N min.
Bottom tape (only when the cavities of the carrier tape are punched type)
5 N min.
9.4 Peeling off force of tape
Speed of peeling off
Peeling off force
300 mm/min
0.1 N to 0.7 N (The lower limit is for typical value.)
9.5 Dimensions of leader section, trailer section and reel
A vacant section is provided in the leader (start) section and trailer (end) section of the tape for the product. The leader
section is further provided with an area consisting only of the cover tape (or top tape). (See the diagram below.)
9.6 Marking for reel
Customer part number, Murata part number, inspection number (*1), RoHS marking (*2), quantity, etc.
*1 Expression of inspection No.: (1) Factory code
(2) Date
□□
○○○○
First digit: year/last digit of year
(1)
(2)
(3)
Second digit: month/Jan. to Sep.→1 to 9, Oct. to Dec.→O, N, D
Third, Fourth digit: day
(3) Serial No.
*2 Expression of RoHS marking: (1) RoHS regulation conformity
ROHSY
()
(2) Murata classification number
(1)
(2)
MURATA MFG CO., LTD
Spec No.: JELF243A-9162-01
P6/10
9.7 Marking on outer box (corrugated box)
Customer name, purchasing order number, customer part number, Murata part number, RoHS marking (*2), quantity, etc.
9.8 Specification of outer box
Label
H
D
W
10.
Dimensions of outer box
(mm)
W
D
H
186
186
93
Standard reel quantity
in outer box (reel)
4
* Above outer box size is typical. It depends on a
quantity of an order.
Caution
10.1 Limitation of applications
The products listed in the reference specification (hereinafter the product(s) is called as the “Product(s)”) are designed and
manufactured for applications specified in the reference specification (hereinafter called as the “Specific Application”).
We shall not warrant anything in connection with the Products including fitness, performance, adequateness, safety, or
quality, in the case of applications listed in from (1) to (11) written at the end of this precautions, which may generally require
high performance, function, quality, management of production or safety. Therefore, the Product shall be applied in
compliance with the specific application.
WE DISCLAIM ANY LOSS AND DAMAGES ARISING FROM OR IN CONNECTION WITH THE PRODUCTS INCLUDING
BUT NOT LIMITED TO THE CASE SUCH LOSS AND DAMAGES CAUSED BY THE UNEXPECTED ACCIDENT, IN EVENT
THAT (i) THE PRODUCT IS APPLIED FOR THE PURPOSE WHICH IS NOT SPECIFIED AS THE SPECIFIC APPLICATION
FOR THE PRODUCT, AND/OR (ii) THE PRODUCT IS APPLIED FOR ANY FOLLOWING APPLICATION PURPOSES
FROM (1) TO (11) (EXCEPT THAT SUCH APPLICATION PURPOSE IS UNAMBIGUOUSLY SPECIFIED AS SPECIFIC
APPLICATION FOR THE PRODUCT IN OUR CATALOG SPECIFICATION FORMS, DATASHEETS, OR OTHER
DOCUMENTS OFFICIALLY ISSUED BY US*).
(1) Aircraft equipment
(2) Aerospace equipment
(3) Undersea equipment
(4) Power plant control equipment
(5) Medical equipment
(6) Transportation equipment
(7) Traffic control equipment
(8) Disaster prevention/security equipment
(9) Industrial data-processing equipment
(10) Combustion/explosion control equipment
(11) Equipment with complexity and/or required reliability equivalent to the applications listed in the above.
For exploring information of the Products which will be compatible with the particular purpose other than those specified in
the reference specification, please contact our sales offices, distribution agents, or trading companies with which you make a
deal, or via our web contact form.
Contact form: https://www.murata.com/contactform
* We may design and manufacture particular Products for applications listed in (1) to (11). Provided that, in such case we
shall unambiguously specify such Specific Application in the reference specification without any exception. Therefore, any
other documents and/or performances, whether exist or non-exist, shall not be deemed as the evidence to imply that we
accept the applications listed in (1) to (11).
10.2 Precautions on rating
Avoid using in exceeded the rated temperature range, rated voltage, or rated current.
Usage when the ratings are exceeded could lead to wire breakage, burning, or other serious fault.
10.3 Inrush current
If an inrush current (or pulse current or rush current) that significantly exceeds the rated current is applied to the product,
overheating could occur, resulting in wire breakage, burning, or other serious fault.
10.4 Fail-safe
Be sure to provide an appropriate fail-safe function on your product to prevent a second damage that may be caused by the
abnormal function or the failure of our product.
MURATA MFG CO., LTD
Spec No.: JELF243A-9162-01
P7/10
10.5 Corrosive gas
Please refrain from use since contact with environments with corrosive gases (sulfur gas [hydrogen sulfide, sulfur dioxide,
etc.], chlorine, ammonia, etc.) or oils (cutting oil, silicone oil, etc.) that have come into contact with the previously stated
corrosive gas environment will result in deterioration of product quality or an open from deterioration due to corrosion of
product electrode, etc. We will not bear any responsibility for use under these environments.
11. Precautions for Use
This product is for use only with reflow soldering. It is designed to be mounted by soldering. If you want to use other
mounting method, for example, using a conductive adhesive, please consult us beforehand.
Also, if repeatedly subjected to temperature cycles or other thermal stress, due to the difference in the coefficient of thermal
expansion with the mounting substrate, the solder (solder fillet part) in the mounting part may crack.
The occurrence of cracks due to thermal stress is affected by the size of the land where mounted, the solder volume, and
the heat dissipation of the mounting substrate. Carefully design it when a large change in ambient temperature is assumed.
11.1 Land dimensions
The following diagram shows the recommended land dimensions for reflow soldering.
(Do not use gilded pattern. A copper wire may cause open by dissolution of metallization.)
a
2.18
b
3.62
c
2.5
(in mm)
11.2 Flux and solder used
Flux
• Use a rosin-based flux.
• Do not use a highly acidic flux with a halide content exceeding mass% (chlorine conversion value).
• Do not use a water-soluble flux.
Solder
• Use Sn-3.0Ag-0.5Cu solder.
• Standard thickness of solder paste: 150 μm
If you want to use a flux other than the above, please consult our technical department.
MURATA MFG CO., LTD
Spec No.: JELF243A-9162-01
P8/10
11.3 Soldering conditions (reflow)
• Pre-heating should be in such a way that the temperature difference between solder and product surface is limited to
100°C max.
Cooling into solvent after soldering also should be in such a way that the temperature difference is limited to 100°C max.
Insufficient pre-heating may cause cracks on the product, resulting in the deterioration of product quality.
• Standard soldering profile and the limit soldering profile is as follows.
The excessive limit soldering conditions may cause leaching of the electrode and/or resulting in the deterioration of product
quality.
Temp.
(℃)
260℃
245℃±3℃
220℃
230℃
Limit Profile
180
150
Standard Profile
30s～60s
60s max.
90s±30s
Time. (s)
Standard profile
Limit profile
Pre-heating
150°C to 180°C/90 s±30 s
150°C to 180°C/90 s±30 s
Heating
Above 220°C/30 s to 60 s
Above 230°C/60 s max.
245°C±3°C
260°C/10 s
2 times
2 times
Peak temperature
Number of reflow cycles
11.4 Reworking with soldering iron
The following requirements must be met to rework a soldered product using a soldering iron.
Item
Requirement
Pre-heating
150°C/approx. 1 min
Tip temperature of soldering iron
350°C max.
Power consumption of soldering iron
60 W max.
Tip diameter of soldering iron
Soldering time
Number of reworking operations
ø3 mm max.
3 s (+1 s, -0 s)
2 times max.
* Avoid a direct contact of the tip of the soldering iron with the product. Such a
direction contact may cause cracks in the ceramic body due to thermal shock.
11.5 Solder volume
Solder shall be used not to increase the volume too much.
An increased solder volume increases mechanical stress on the product. Exceeding solder volume may cause the failure of
mechanical or electrical performance.
MURATA MFG CO., LTD
Spec No.: JELF243A-9162-01
P9/10
11.6 Product's location
The following shall be considered when designing and laying out PCBs.
(1) PCB shall be designed so that products are not subject to mechanical stress due to warping the board.
[Products direction]
Products shall be located in the sideways direction (length: a < b) to the mechanical stress.
a
b
〈 Poor example〉
〈 Good example〉
(2) Components location on PCB separation
It is effective to implement the following measures, to reduce stress in separating the board.
It is best to implement all of the following three measures; however, implement as many measures as possible to reduce
stress.
Contents of measures
Stress level
(1) Turn the mounting direction of the component parallel to the
board separation surface.
A > D*1
(2) Add slits in the board separation part.
A>B
(3) Keep the mounting position of the component away from the
board separation surface.
A>C
*1 A > D is valid when stress is added vertically to the perforation as with hand separation.
If a cutting disc is used, stress will be diagonal to the PCB, therefore A > D is invalid.
(3) Mounting components near screw holes
When a component is mounted near a screw hole, it may be affected by the board deflection that occurs during the
tightening of the screw.
Mount the component in a position as far away from the screw holes as possible.
11.7 Handling of substrate
After mounting products on a substrate, do not apply any stress to the product caused by bending or twisting to the substrate
when cropping the substrate, inserting and removing a connector from the substrate or tightening screw to the substrate.
Excessive mechanical stress may cause cracking in the product.
Bending
Twisting
MURATA MFG CO., LTD
Spec No.: JELF243A-9162-01
P10/10
11.8 Cleaning
Excessive ultrasonic oscillation during cleaning can cause the PCBs to resonate, resulting in cracked chips or broken solder
joints. Before starting your production process, test your cleaning equipment / process to insure it does not degrade this
product.
11.9 Storage and transportation
Storage period
Use the product within 12 months after delivery.
If you do not use the product for more than 12 months, check solderability before using it.
Storage conditions
• The products shall be stored in a room not subject to rapid changes in temperature and
humidity. The recommended temperature range is -10°C to +40°C. The recommended relative
humidity range is 15% to 85%.
Keeping the product in corrosive gases, such as sulfur, chlorine gas or acid may cause the
poor solderability.
• Do not place the products directly on the floor; they should be placed on a palette so that they
are not affected by humidity or dust.
• Avoid keeping the products in a place exposed to direct sunlight, heat or vibration.
• Do not keep products in bulk packaging. Bulk storage could result in collisions between the
products or between the products and other parts, resulting in chipping or wire breakage.
• Avoid storing the product by itself bare (i.e. exposed directly to air).
Transportation
Excessive vibration and impact reduces the reliability of the products. Exercise caution when
handling the products.
11.10 Resin coating (including moisture-proof coating)
When the product is coated/molded with resin, its electrical characteristics may change.
A wire breakage issue may occur by mechanical stress caused by the resin, amount/cured shape of resin, or operating
condition etc.
Some resins contain impurities or hydrolyzable chlorine, which could result in corrosion of the conducting materials, leading
to wire breakage.
So, please pay your careful attention when you select resin in case of coating/molding the products with the resin.
Prior to use the coating resin, please make sure no reliability issue is observed by evaluating products mounted on your board.
11.11 Mounting conditions
Check the mounting condition before using.
Using mounting conditions (nozzles, equipment conditions, etc.) that are not suitable for products may lead to pick up errors,
misalignment, or damage to the product.
In some cases, the laser recognition function of the mounting equipment may not recognize this product correctly.
Please contact us when using laser recognition. (There is no problem with the permeation and reflection type.)
11.12 Operating environment
Do not use this product under the following environmental conditions as it may cause deterioration of product quality.
(1) In the corrodible atmosphere such as acidic gases, alkaline gases, chlorine, sulfur gases, organic gases and etc.
(the sea breeze, Cl2, H2S, NH3, SO2, NO2, etc)
(2) In the atmosphere where liquid such as organic solvent, may splash on the products.
(3) In the atmosphere where the temperature/humidity changes rapidly and it is easy to dew.
11.13 Mounting density
If this product is placed near heat-generating products, be sure to implement sufficient heat-dissipating measures.
If this product is subjected to a significant amount of heat from other products, this could adversely affect product quality,
resulting in a circuit malfunction or failure of the mounted section. Also, be sure that the product is used in a manner so that
the heat that the product is subjected to from other products does not exceed the upper limit of the rated operating
temperature for the product.
11.14 Handling of product
・Sharp material such as a pair of tweezers or other material such as bristles of cleaning brush , shall not be touched to the
winding portion and electrode to prevent the breaking of wire.
・Mechanical shock should not be applied to the products mounted on the board to prevent the breaking of the core.
12.
Note
(1) Please make sure that your product has been evaluated in view of your specifications with our product being mounted to
your product.
(2) You are requested not to use our product deviating from the reference specifications.
(3) The contents of this reference specification are subject to change without advance notice. Please approve our product
specifications or transact the approval sheet for product specifications before ordering.
MURATA MFG CO., LTD
