Silicon ESD protection device LXESxxT series
Document No. LX–1-1463
Rev1.3
p1/18
1. Application
This specification shall be applied to the ESD Protection Device.
LXES03TBB1-141
LXES03TAA1-142
LXES02TAA1-144
LXES02TAA1-145
LXES1UTAA1-157
LXES03TAA1-199
2. Part Number Configuration
(e.g.) LXES 1U T AA 1 – 157
①
② ③ ④ ⑤ ⑥
① Product ID （LXES = ESD Protection device）
② Dimension Code
Code
02
03
1U
Dimension
0.4 x 0.2
0.6 x 0.3
1.0 x 0.6
③
④
⑤
⑥
Unit : mm
package (serial number)
CSP (144/145)
CSP (141/142/199)
DFN (157)
Type(T:Silicon ESD)
Control Code
Number of channel
Serial Number
※RoHS Compliant
Halogen free
T/R only.
MURATA MFG. CO., LTD.
p2/18
3. CHARACTERISTICS
3-1 Ratings
Parameter
Package
Operating
Temperature
Storage
Temperature
TOP
TSTO
Symbol
0
Unit
0
C
C
LXES03TBB1-141
-40 to +85
-40 to +125
LXES03TAA1-142
-40 to +85
-40 to +125
-40 to +85
-40 to +125
-40 to +85
-40 to +125
LXES02TAA1-144
CSP
LXES02TAA1-145
LXES1UTAA1-157
DFN
-40 to +85
-40 to +125
LXES03TAA1-199
CSP
-40 to +85
-40 to +125
3-2 Electrical Characteristics (T=25℃)
Symbol
Reverse
Working
Voltage
VRWM
Channel
Leakage
Current
Ileak
Break
down
voltage
Vbr
ESD per IEC
61000-4-2
(air)
Vesd
ESD per IEC
61000-4-2
(contact)
Vesd
ESD per IEC
61000-4-5 (Surge)
(8/20μs)
Ipp
Unit
V
nA
V
kV
kV
A
VPin1=5V,
VPin2=0V
Ibr=1mA,
Pin1 to Pin2
Parameter
Condition
Ta=25℃
Capacitance
C
pF
VPin1,2=0V, f = 1MHz,
Between Channel pins
Ta=25℃
LXES03TBB1-141
+/-5.5
50 (max)
7(min)
+/- 25
+/- 8
1.5
0.45
LXES03TAA1-142
+/-5.5
50 (max)
7(min)
+/- 15
+/- 8
3
5
LXES02TAA1-144
+/-5.5
50 (max)
7(min)
+/- 15
+/- 8
3
5
LXES02TAA1-145
+/-5.5
50 (max)
7(min)
+/- 15
+/- 8
1
0.35
Symbol
Reverse
Working
Voltage
VRWM
Channel
Leakage
Current
Ileak
Break
down
voltage
Vbr
ESD per IEC
61000-4-2
(air)
Vesd
ESD per IEC
61000-4-2
(contact)
Vesd
ESD per IEC
61000-4-5 (Surge)
(8/20μs)
Ipp
Unit
V
kV
kV
A
Parameter
uA
V
VPin1=5V,
VPin2=0V
Ibr=1mA,
Pin1 to Pin2
+/-6.0
1.0 (max)
7 (min)
+/- 15
+/- 8
1.5
Symbol
Reverse
Working
Voltage
VRWM
Channel
Leakage
Current
Ileak
Break
down
voltage
Vbr
ESD per IEC
61000-4-2
(air)
Vesd
ESD per IEC
61000-4-2
(contact)
Vesd
ESD per IEC
61000-4-5 (Surge)
(8/20μs)
Ipp
Unit
V
nA
V
kV
kV
A
VPin1=5.5V,
VPin2=0V
Ibr=1mA,
Pin1 to Pin2
100 (max)
7 (min)
Condition
LXES1UTAA1-157
Parameter
Condition
LXES03TAA1-199
+/-5.5
Ta=25℃
Ta=25℃
+/- 30
pF
0.5
Capacitance
C
pF
VPin1,2=0V, f = 1MHz,
Between Channel pins
Ta=25℃
MURATA MFG. CO., LTD.
C
VPin1,2=0V, f = 1MHz,
Between Channel pins
Ta=25℃
+/- 30
Capacitance
1.5
1.0
p3/18
3-3
Typical Characteristics
LXES03TBB1-141
100
Voltage [V]
80
60
40
20
0
-10
0
10
20
30
40
50
Time [nsec]
ESD Waveform(IEC61000-4-2：8kV Contact)
LXES03TAA1-142
100
Voltage [V]
80
60
40
20
0
-10
0
10
20
30
40
50
Time [nsec]
ESD Waveform(IEC61000-4-2：8kV Contact)
LXES02TAA1-144
ESD Waveform(IEC61000-4-2：8kV Contact)
MURATA MFG. CO., LTD.
p4/18
LXES02TAA1-145
ESD Waveform(IEC61000-4-2：8kV Contact)
LXES1UTAA1-157
100
Voltage [V]
80
60
40
20
0
-10
0
10
20
30
40
50
Time [nsec]
ESD Waveform(IEC61000-4-2：8kV Contact)
LXES03TAA1-199
120
Voltage [V]
100
80
60
40
20
0
-10
0
10
20
30
40
50
time[nsec]
ESD Waveform(IEC61000-4-2：8kV Contact)
MURATA MFG. CO., LTD.
p5/18
4. CONSTRUCTION, DIMENSIONS
(1)CSP
4 - 1 -1 DIMENSIONS
Top View
Bottom View
L
a
a
W
b
c
d
Side View
T
Unit : mm
Size
L
W
T
a
b
c
d
0402
0.40+/-0.015
0.20+/-0.015
0.15 +/-0.01
0.10 +/- 0.015
0.15 +/- 0.015
(0.15)
(0.25)
0603
0.60+/-0.03
0.30+/-0.03
0.20 +/-0.03
0.135 +/- 0.02
0.25 +/- 0.02
(0.28)
(0.415)
4 - 1 - 2 Pin Configuration
No.
Terminal Name
1
Line-1/GND
2
GND/Line-1
4 - 1 - 3 Circuit Diagram
MURATA MFG. CO., LTD.
p6/18
(2) DFN
4 - 2 -1 DIMENSIONS
Top View
Bottom View
Marking
Side View
Ｔ
Unit : mm
symbol
size
symbol
size
L
1.0+/-0.05
b
0.5+/-0.05
W
0.6+/-0.05
c
0.25+/-0.05
T
0.4 max
d
(0.125)
a
(0.65)
4 - 2 - 2 Pin Configuration
No.
Terminal Name
1
Line-1/GND
2
GND/Line-1
4 - 2 - 3 Circuit Diagram
MURATA MFG. CO., LTD.
p7/18
5. Reliability Test
No.
Items
Specifications
Test Methods
No severe damages
Solder specimens on the testing jig (glass fluorine
boards) shown in appended Fig.1 by a Pb free solder.
The soldering shall be done either by iron or reflow and
be conducted with care so that the soldering is uniform
and free of defect such as by heat shock.
Satisfy
dimension
specifications
1
Frequency : 10~2000 Hz(4min)
Amplitude : 1.5mm
Acceleration : 196 m/s2
Vibration Resistance
Direction
Period
Number
Result
(Fail)
22
G
(0)
22
G
(0)
22
G
(0)
22
G
(0)
22
G
(0)
22
G
(0)
: X,Y,Z 3 axis
: 2.5 h on each direction Total 7.5 h.
Solder specimens on the testing jig (glass fluorine
boards) shown in appended Fig.1 by a Pb free solder.
The soldering shall be done either by iron or reflow and
be conducted with care so that the soldering is uniform
and free of defect such as by heat shock
2
3
Shock
pulse waveform: sine-wave
Acceleration : 14,700 m/s2
Period
: 0.3 ms.
Cycle
: 3 times
Solder specimens on the testing jig (glass epoxy
boards) shown in appended Fig.2 by a Pb free solder.
The soldering shall be done either by iron or reflow and
be conducted with care so that the soldering is uniform
and free of defect such as by heat shock.
Deflection
No damage with 1.6mm deflection
Solder specimens onto test jig shown below. Apply
pushing force at 0.5mm/s until electrode pads are
peeled off or product is broken. Pushing force is applied
to longitudinal direction.
CSP(Only 0603 size)
2N Minimum
4
5
Soldering strength
(Push Strength)
Solderability of Termination
Appearance
Resistance
to Soldering
Heat
6
(Reflow)
Electrical
specifications
DFN
3N Minimum
95% of the
terminations is to be
soldered evenly and
continuously.
No
severe damages
Satisfy specifications
listed in paragraph 32 over operational
temperature range
Pushing Direction
Specimen
Jig
Immerse specimens first an ethanol solution of rosin,
then in a Pb free solder solution for 3±0.5 sec. at
245±5 °C.
Preheat
: 100-120 °C, 60 sec.
Solder Paste : Sn-3.0Ag-0.5Cu
Flux : Solution of ethanol and rosin
(25 % rosin in weight proportion)
Preheat Temperature : 150-200 °C
Preheat Period
: 120+/-60 s
High Temperature
: 217℃
High Temp. Period
: 105+/-45 s
Peak Temperature
: 260+0/-5 °C
Specimens are soldered twice with the above condition,
and then kept in room condition for 24 h before
measurements.
MURATA MFG. CO., LTD.
p8/18
No.
7
8
9
10
Items
High Temp.
Exposure
Temperature
Cycle
Humidity
(Steady State)
Low Temp.
Exposure
Number
Result
(Fail)
22
G
(0)
22
G
(0)
Temperature：85±2 ℃
Humidity：80～90 %RH
Period：1000+48/-0 h
Room Condition：2 ～ 24 h
22
G
(0)
Temperature：-40±2 ℃
Period：1000+48/-0 h
Room Condition：2 ～ 24 h
22
G
(0)
Specifications
Appeara
nce
Electrical
Specifica
tions
No severe damages
Test Methods
Temperature
: 85±2℃
Period
: 1000+48/-0 h
Room Condition : 2 ~ 24 h
Satisfy specifications listed in
paragraph 3-2 over operational
temperature range
Set the specimens to the supporting
jig in the same manner and under the
same conditions as Fig.1 and conduct
the 100 cycles according to the
temperatures and time shown in the
following table. Set it for 2 to 24 h at
room temperature, then measure.
Step
Temp(°C)
1
Min.
Operating
Temp.+0/-3
30±3
2
Max.
Operating
Temp.+3/-0
30±3
MURATA MFG. CO., LTD.
Time(min)
p9/18
Fig. 1
Land Pattern
Package : CSP(0402 size)
Unit : mm
※Reference purpose only.
Package : CSP(0603 size)
Unit : mm
0.615
0.135
※Reference purpose only.
Package : DFN
Unit : mm
※Reference purpose only.
MURATA MFG. CO., LTD.
p10/18
Fig. 2 Testing board
(Unit : mm)
100
40
Mounted situation
Land
Land pattern is same as figure1
Glass-fluorine board t＝1.6ｍｍ
Copper thickness over 35 mm
(Unit : mm)
CHIP
45
45
Test method
(Unit : mm)
20
Notes ： The ingredient of pressure jig and specimen
holder is basically hardened steel(Hardness HB183 ～
255) or superhard (Hardness over HRA90)
50
R230
deflection
MURATA MFG. CO., LTD.
p11/18
6.Tape and Reel Packing
(1) Dimensions of Tape
Not in scale
Unit : mm
package
L
CSP
(0402 size)
(0.46)
CSP
(0603 size)
(0.67)
DFN
(1.18)
W
(0.26)
(0.37)
(0.79)
T
(0.205)
(0.27)
(0.45)
a
2.00+/-0.05
2.00+/-0.05
2.00+/-0.05
b
4.00+/-0.10
4.00+/-0.10
4.00+/-0.10
c
(3.50)
(3.50)
(3.50)
d
1.75+/-0.1
1.75+/-0.1
1.75+/-0.1
e
8.00+/-0.20
8.00+/-0.20
8.00+0.30/-0.10
f
φ1.50+0.1/-0
φ1.50+/-0.1
φ1.50+/-0.1
MURATA MFG. CO., LTD.
p12/18
(2) Dimensions of Reel
Not in scale
a
d
b
c
Unit : mm
a
CSP
(0402 size)
1.5 min
CSP
(0603 size)
1.5 min
1.5 min
b
φ13.0+/-0.2
φ13.0+/-0.2
φ13.0+/-0.2
c
9.0+/-0.3
9.0+/-0.3
9.0+/-0.3
package
DFN
d
φ60
φ60
φ60
e
φ180
φ180
φ180
MURATA MFG. CO., LTD.
e
p13/18
(4) Taping Diagrams
[1] Feeding Hole : As specified in (1),(2)
[2] Hole for chip : As specified in (1),(2)
[3] Cover tape
: 50 m m in thickness
[4] Base tape
: As specified in (1),(2)
[3]
[1]
[2]
[3]
[4]
Feeding hole
A
Feeding Direction
A
Marking
Chip
Marking Direction
LXES02TAA1-144/145
LXES03TAA1-142/199
LXES1UTAA1-157
T 2
LXES03TBB1-141
MURATA MFG. CO., LTD.
p14/18
(5) Leader and Tail tape
Tail tape
(No components) Components
No components
Leader tape
(Cover tape alone)
Over100mm
Over160mm
Over400mm
Feeding direction
(6) The tape for chips are wound clockwise, the feeding holes to the right side as the tape is pulled
toward the user.
(7) Packaging unit:
package
quantity
CSP
(0402 size)
20000
Unit : pcs / reel
CSP
DFN
(0603 size)
20000
10000
(8) Material : Base tape ...... Plastic
Reel
......Plastic
Base tape, Reel and Top tape have an anti-ESD function.
(9) Peeling of force : 0.1～1.0 N in the direction of peeling as shown below.
0.1~1.0N
0.7 N max.
165 ~ 180 °
Cover tape
Base tape
MURATA MFG. CO., LTD.
p15/18
NOTICE
１．Storage Conditions:
To avoid damaging the solderability of the external electrodes, be sure to observe the following points.
- Store products where the ambient temperature is 15 to 35 °C and humidity 45 to 75% RH.
(Packing materials, In particular, may be deformed at the temperature over 40 °C.).
- Store products in non corrosive gas (Cl2, NH3,SO2, Nox, etc.).
- Stored products should be used within 6 months of receipt.
is exceeded.
Solderability should be verified if this period
This product is applicable to MSL1 (Based on IPC/JEDEC J-STD-020)
2. Handling Conditions:
Be careful in handling or transporting products because excessive stress or mechanical shock may break
products.
Handle with care if products may have cracks or damages on their terminals, the characteristics of products
may change. Do not touch products with bear hands that may result in poor solderability.
3. Standard PCB Design (Land Pattern and Dimensions):
All the ground terminals should be connected to the ground patterns. Furthermore, the ground pattern
should be provided between IN and OUT terminals. Please refer to the specifications for the standard
land dimensions.
The recommended land pattern and dimensions is as Murata's standard. The characteristics of products
may vary depending on the pattern drawing method, grounding method, land dimensions, land forming
method of the NC terminals and the PCB material and thickness. Therefore, be sure to verify the
characteristics in the actual set. When using non-standard lands, contact Murata beforehand.
4. Notice for Chip Placer:
When placing products on the PCB, products may be stressed and broken by uneven forces from a worn-out
chucking locating claw or a suction nozzle. To prevent products from damages, be sure to follow the
specifications for the maintenance of the chip placer being used. For the positioning of products on the PCB, be
aware that mechanical chucking may damage products.
MURATA MFG. CO., LTD.
p16/18
5. Soldering Conditions:
Carefully perform preheating so that the temperature difference (DT) between the solder and products surface
should be in the following range. When products are immersed in solvent after mounting, pay special attention
to maintain the temperature difference within 100 °C. Soldering must be carried out by the above mentioned
conditions to prevent products from damage. Contact Murata before use if concerning other soldering
conditions.
Soldering method
Reflow method
Temperature
DT
