LXES15AAA1-133

Ceramic ESD Protection Device LXES**A series Document No. LX–1-1111 Rev1.2 p1/18 1. This specification shall be applied to the ESD Protection Device. LXES15AAA1-133 LXES03AAA1-134 LXES15AAA1-153 LXES03AAA1-154 2. Part Number Configuration LXES 15 A AA 1 – 133 ① ② ③ ④ ⑤ ⑥ ① Product ID （LXES = ESD Protection device） ② Dimension Code Unit : mm Code Dimension 03 0.6 x 0.3 15 1.0 x 0.5 ③ ④ ⑤ ⑥ Type (A:Ceramic ESD) Control Code Number of channel Serial Number ※RoHS Compliant Halogen free T/R only. MSL 1 MURATA MFG. CO., LTD. p2/18 3. CONSTRUCTION, DIMENSIONS 3 - 1 DIMENSIONS Size 0603 1005 L 0.60±0.03 1.00±0.05 W 0.30±0.03 0.50±0.05 T 0.33 max 0.33 max a 0.15±0.05 0.20±0.10 Unit : mm b 0.20 min 0.40 min 3 - 2 Circuit Diagram TERMINAL CONFIGURATION This device is bi-directional. 3 - 3 Product Weight P/N LXES03AAA1-154 LXES03AAA1-134 LXES15AAA1-133 LXES15AAA1-153 Weight [mg] 0.2 0.5 MURATA MFG. CO., LTD. p3/18 4. CHARACTERISTICS 4 - 1 - 1 Ratings (LXES15AAA1-133) Parameter Rated Voltage Operating Temperature Storage Temperature ※Frequency : >1MHz Symbol VDC VAC TOP TSTO Ratings 15 0±40※ -40 to +85 -40 to +85 Units V V o C o C Symbol VDC VAC TOP TSTO Ratings 6.3 0±40※ -40 to +85 -40 to +85 Units V V o C o C 4 - 1 - 2 Ratings (LXES03AAA1-134) Parameter Rated Voltage Operating Temperature Storage Temperature ※Frequency : >1MHz 4 - 1 - 3 Ratings (LXES15AAA1-153/ LXES03AAA1-154) Parameter Rated Voltage Operating Temperature Storage Temperature ※Frequency : >1MHz Symbol VDC VAC TOP TSTO Ratings 4 0±25※ -40 to +85 -40 to +85 Units V V o C o C 4 - 2 Electrical Characteristics (T=25 deg.C) Chip size [ mm ] Part No. Capacitance Symbol Unit C [pF] 1MHz Vbias=0V 0.05 typ Test condition LXES03AAA1-154 0603 1005 ESD IEC 61000-4-2 (Air) kV ESD IEC 61000-4-2 (Contact) kV ±15 ±15 LXES03AAA1134 0.035typ ±15 ±15 LXES15AAA1-133 LXES15AAA1-153 0.05 typ 0.05 typ ±15 ±15 ±15 ±15 MURATA MFG. CO., LTD. p4/18 4 - 3 Typical Characteristic LXES03AAA1-134 ESD Waveform (IEC61000-4-2：8kV Contact) Voltage – Capacitance Characteristic LXES03AAA1-154 250 Voltage [V] 200 150 100 50 0 -10.0 0.0 10.0 20.0 30.0 40.0 50.0 Tine [nsec] ESD Waveform (IEC61000-4-2：8kV Contact) Voltage – Capacitance Characteristic LXES15AAA1-133 400 350 Voltage [V] 300 250 200 150 100 50 0 -10 0 10 20 30 40 50 Time [nsec] ESD Waveform (IEC61000-4-2：8kV Contact) MURATA MFG. CO., LTD. Voltage – Capacitance Characteristic p5/18 LXES15AAA1-153 300 Voltage [V] 250 200 150 100 50 0 -10 0 10 20 Time [nsec] 30 40 50 ESD Waveform (IEC61000-4-2：8kV Contact) Voltage – Capacitance Characteristic MURATA MFG. CO., LTD. p6/18 5. Reliability Test No. Items Specifications Test Methods No severe damages Solder specimens on the testing jig (glass fluorine boards) shown in appended Fig.1 by a Pb free solder. The soldering shall be done either by iron or reflow and be conducted with care so that the soldering is uniform and free of defect such as by heat shock. Satisfy dimension specifications 1 2 Vibration Resistance Frequency : 10~2000 Hz Acceleration : 196 m/s2 Direction : X,Y,Z 3 axis Period : 2 h on each directionTotal 6 h. Solder specimens on the testing jig (glass fluorine boards) shown in appended Fig.1 by a Pb free solder. The soldering shall be done either by iron or reflow and be conducted with care so that the soldering is uniform and free of defect such as by heat shock Shock Number Result (Fail) 22 G (0) 22 G (0) 22 G (0) 22 G (0) 22 G (0) 22 G (0) Acceleration : 14,700 m/s2 Period : 0.3 ms. Cycle : 3 times 3 Solder specimens on the testing jig (glass epoxy boards) shown in appended Fig.2 by a Pb free solder. The soldering shall be done either by iron or reflow and be conducted with care so that the soldering is uniform and free of defect such as by heat shock. Deflection No damage with 1.6mm deflection Solder specimens onto test jig shown below. Apply pushing force at 0.5mm/s until electrode pads are peeled off or ceramics are broken. Pushing force is applied to longitudinal direction. 4 5 Soldering strength (Push Strength) Solderability of Termination Appearance Resistance to Soldering Heat 6 (Reflow) Electrical specifications Pushing Direction LXES03A series 2N Minimum LXES15A series 3N Minimum 95% of the terminations is to be soldered evenly and continuously. No severe damages Satisfy specifications listed in paragraph 42 over operational temperature range Specimen Jig Immerse specimens first an ethanol solution of rosin, then in a Pb free solder solution for 3±0.5 sec. at 245±5 °C. Preheat : 100-120 °C, 60 sec. Solder Paste : Sn-3.0Ag-0.5Cu Flux : Solution of ethanol and rosin (25 % rosin in weight proportion) Preheat Temperature : 150-200 °C Preheat Period : 120+/-60 s High Temperature : 217℃ High Temp. Period : 105+/-45 s Peak Temperature : 260+0/-5 °C Specimens are soldered twice with the above condition, and then kept in room condition for 24 h before measurements. MURATA MFG. CO., LTD. No. 7 8 9 10 Items Specifications Appeara nce High Temp. Exposure Temperature Cycle Electrical Specifica tions No severe damages Satisfy specifications listed in paragraph 4-2 over operational temperature range Number Test Methods Temperature : 85+2/-0 °C Period : 1000+48/-0 h Room Condition : 2 ~ 24 h Step Temp(°C) Time(min) 1 Min. Operating Temp.+0/-3 30±3 2 Max. Operating Temp.+3/-0 30±3 Temperature：85±2 ℃ Humidity：80～90 %RH Period：1000+48/-0 h Room Condition：2 ～ 24 h Low Temp. Exposure Temperature：-40±2 ℃ Period：1000+48/-0 h Room Condition：2 ～ 24 h Fig. 1 Reference Land Pattern a 0.25 0.4 b 0.8 1.2 22 G (0) 22 G (0) 22 G (0) 22 G (0) Set the specimens to the supporting jig in the same manner and under the same conditions as Fig.1 and conduct the 100 cycles according to the temperatures and time shown in the following table. Set it for 2 to 24 h at room temperature, then measure. Humidity (Steady State) Size 0603 1005 p7/18 Result (Fail) Unit : mm c 0.3 0.5 Notes : this land layout is for reference purpose only. MURATA MFG. CO., LTD. p8/18 Fig. 2 Testing board (Unit : mm) Land Land pattern is same as figure1 Glass-fluorine board t＝1.6mm Copper thickness over 35 mm Mounted situation (Unit : mm) CHIP 45 45 Test method (Unit : mm) 20 50 R230 deflection MURATA MFG. CO., LTD. p9/18 6. Tape and Reel Packing (1) LXES03A 1）Dimensions of Tape Unit : mm Symbol L W T a b c d e f Size (0.67) (0.37) 0.5 max 2.00+/-0.05 4.00+/-0.10 3.50+/-0.05 1.75+/-0.1 8.00+/-0.30 φ1.55+/-0.05 (2) LXES15A series 2） Dimensions of Reel f d c e Ｌ a Ｗ b Ｔ Feeding direction Unit : mm Symbol L W T a b c d e f Size (1.12) (0.62) 0.5 max 2.00+/-0.05 4.00+/-0.10 3.50+/-0.05 1.75+/-0.1 8.00+/-0.30 φ1.55+/-0.05 MURATA MFG. CO., LTD. p10/18 (3) Dimensions of Reel a d b c Unit : mm Symbol a Size 2.0+/-0.5 b φ13.0+/0.2 c 9.0+1.0/0 d φ60+1.0/0 e φ180+0/1.5 (4) Packaging P/N LXES03AAA1-154 LXES03AAA1-134 LXES15AAA1-133 LXES15AAA1-153 pcs / reel 15,000 10,000 MURATA MFG. CO., LTD. e p11/18 (5) Taping Diagrams 1) LXES03A series [1] Feeding Hole : As specified in (1) (2) [2] Hole for chip : As specified in (1) (2) [3] Cover tape : 50 m m in thickness [4] Base tape : As specified in (1) (2) [3] [1] [2] [3] [4] Feeding Hole Feeding Direction Chip MURATA MFG. CO., LTD. p12/18 2) LXES15A series [1] Feeding Hole : As specified in (1) [2] Hole for chip : As specified in (1) [3] Cover tape : 50 m m in thickness [4] Base tape : As specified in (1) [5] Bottom tape : 50 m m in thickness [3] [1] [2] [3] [4] [5] Feeding Hole Feeding Direction Chip MURATA MFG. CO., LTD. p13/18 (6) Leader and Tail tape Tail tape (No components) Components No components Leader tape (Cover tape alone) Over100mm Over160mm Over400mm Feeding direction (7) The tape for chips are wound clockwise, the feeding holes to the right side as the tape is pulled toward the user. (8) Material : Base tape Reel ...... Paper ...... Plastic Base tape, Reel and Top tape have an anti-ESD function. (9) Peeling of force : 0.1~1.0 N in the direction of peeling as shown below. 0.1～1.0N 165 to 180 ° Cover tape Base tape MURATA MFG. CO., LTD. p14/18 NOTICE 1. Storage Conditions: To avoid damaging the solderability of the external electrodes, be sure to observe the following points. - Store products where the ambient temperature is 15 to 35 °C and humidity 45 to 75% RH. (Packing materials, In particular, may be deformed at the temperature over 40 °C.). - Store products in non corrosive gas (Cl2, NH3,SO2, Nox, etc.). - Stored products should be used within 6 months of receipt. is exceeded. Solderability should be verified if this period This product is applicable to MSL1 (Based on IPC/JEDEC J-STD-020) 2. Handling Conditions: Be careful in handling or transporting products because excessive stress or mechanical shock may break products due to the nature of ceramics structure. Handle with care if products may have cracks or damages on their terminals, the characteristics of products may change. Do not touch products with bear hands that may result in poor solderability. 3. Standard PCB Design (Land Pattern and Dimensions): All the ground terminals should be connected to the ground patterns. Furthermore, the ground pattern should be provided between IN and OUT terminals. Please refer to the specifications for the standard land dimensions. The recommended land pattern and dimensions is as Murata's standard. The characteristics of products may vary depending on the pattern drawing method, grounding method, land dimensions, land forming method of the NC terminals and the PCB material and thickness. Therefore, be sure to verify the characteristics in the actual set. When using non-standard lands, contact Murata beforehand. 4. Notice for Chip Placer: When placing products on the PCB, products may be stressed and broken by uneven forces from a worn-out chucking locating claw or a suction nozzle. To prevent products from damages, be sure to follow the specifications for the maintenance of the chip placer being used. For the positioning of products on the PCB, be aware that mechanical chucking may damage products. MURATA MFG. CO., LTD. p15/18 5. Soldering Conditions: Carefully perform preheating so that the temperature difference (DT) between the solder and products surface should be in the following range. When products are immersed in solvent after mounting, pay special attention to maintain the temperature difference within 100 °C. Soldering must be carried out by the above mentioned conditions to prevent products from damage. Contact Murata before use if concerning other soldering conditions. Soldering method Soldering iron method Reflow method Temperature DT