Silicon ESD protection device LXESxxB series
Document No. LX–1-1122
Rev1.0
p1/30
1. Application
This specification shall be applied to the ESD Protection Device.
LXES1UBAB1-007
LXES1UBAA1-096
LXES1TBCC2-004
LXES1TBBB2-013
LXES2SBAA4-016
LXES2SBBB4-026
LXES2SBAA4-114
LXES2TBCC4-028
LXES4XBAA6-027
2. Part Number Configuration
LXES
①
①
②
1U B AB 1 – 007
② ③ ④ ⑤
⑥
Product ID (LXES = ESD Protection device)
Dimension Code
Unit : mm
Code Dimension
1U
1.0 x 0.6
1T
1.6 x 1.6
2S
2.9 x 2.8
③
④
⑤
⑥
package (serial number)
DFN1006P2E (007)
DFN1006P2X (096)
QFN1616P6E (004/013)
SOT23-6L (016/026)
SOT23-5L (114)
Type(B:Silicon ESD)
Control Code
Number of channel
Serial Number
※RoHS Compliant
Halogen free
T/R only.
Code
Dimension
package (serial number)
2T
2.5 x 1.0
DFN2510P10E (028)
4X
4.9 x 3.0
MSOP-8L (027)
p2/30
3. CHARACTERISTICS
3-1 Ratings
Parameter
Package
Symbol
Operating
Temperature
Storage
Temperature
T OP
T STO
0
Unit
0
C
C
LXES1UBAB1-007
DFN1006P2E
-40 to +85
-40 to +125
LXES1UBAA1-096
DFN1006P2X
-40 to +85
-40 to +125
-40 to +85
-40 to +125
-40 to +85
-40 to +125
-40 to +85
-40 to +125
LXES1TBCC2-004
LXES1TBBB2-013
LXES2SBAA4-016
LXES2SBBB4-026
QFN1616P6E
SOT23-6L
-40 to +85
-40 to +125
LXES2SBAA4-114
SOT23-5L
-40 to +85
-40 to +125
LXES2TBCC4-028
DFN2510P10E
-40 to +85
-40 to +125
LXES4XBAA6-027
MSOP-8L
-40 to +85
-40 to +125
3-2 Electrical Characteristics (T=25℃)
Parameter
Reverse
W orking
Voltage
Channel Leakage
Current
Break down
voltage
ESD per IEC
61000-4-2(air)
ESD per IEC
61000-4-2
(contact)
Capacitance
Symbol
V RWM
Ileak
V br
V esd
Vesd
C
Unit
V
uA
V
kV
kV
VP in1=5V,
VP in2=0V
Ibr=1mA,
Pin1 to P in2
Condition
Ta=25℃
Ta=25℃
pF
VP in1,2=0V, f = 1MHz,
Between Channel pins
LXES1UBAB1-007
+/-17.5
1.0 (max)
18 (min)
+/- 15
+/- 8
0.5
LXES1UBAA1-096
+/-5.5
1.0 (max)
5.8 (min)
+/- 15
+/- 12
8
Parameter
Reverse
W orking
Voltage
Channel Leakage
Current
Break down
voltage
ESD per IEC
61000-4-2(air)
ESD per IEC
61000-4-2
(contact)
Symbol
V RWM
Ileak
V br
Vesd
V esd
C
Unit
V
uA
V
kV
kV
pF
V pin5=5V, V pin2=0V,
V CH=0-5V
Ibr=1mA
Ta=25℃
Ta=25℃
Vpin5 = 5V, V pin2 = 0V,
V IN = 2.5V, f = 1MHz,
Any I/O pin to Ground
Condition
Capacitance
LXES1TBCC2-004
+/-5.5
1.0 (max)
6 (min)
+/- 15
+/- 12
0.55
Parameter
Reverse
W orking
Voltage
Channel Leakage
Current
Break down
voltage
ESD per IEC
61000-4-2(air)
ESD per IEC
61000-4-2
(contact)
Capacitance
Symbol
V RWM
Ileak
V br
Vesd
V esd
C
Unit
V
uA
V
kV
kV
pF
V pin5=5V, V pin2=0V,
V CH=0-5V
Ibr=1mA
Ta=25℃
Ta=25℃
Vpin2 = 5V, V pin5 = 0V,
V IN = 2.5V, f = 1MHz,
Any I/O pin to Ground
1.0 (max)
6 (min)
+/- 15
+/- 12
0.55
Condition
LXES1TBBB2-013
+/-5.5
MURATA MFG. CO., LTD.
p3/30
Parameter
Reverse
W orking
Voltage
Channel Leakage
Current
Break down
voltage
ESD per IEC
61000-4-2(air)
ESD per IEC
61000-4-2
(contact)
Capacitance
Symbol
VRW M
Ileak
Vbr
Vesd
Vesd
C
Unit
V
uA
V
kV
kV
pF
Condition
Vpin5=5V, Vpin2=0V,
VCH=0-5V
Ibr=1mA
Ta=25℃
Ta=25℃
V pin5 = 5V, V pin2 = 0V,
VIN = 2.5V, f = 1MHz,
Any I/O pin to Ground
LXES2SBAA4-016
+/-5.5
1.0 (max)
6 (min)
+/- 15
+/- 10
0.55
LXES2SBBB4-026
+/-5.5
1.0 (max)
6 (min)
+/- 15
+/- 10
1.0
Parameter
Reverse
W orking
Voltage
Channel Leakage
Current
Break down
voltage
ESD per IEC
61000-4-2(air)
ESD per IEC
61000-4-2
(contact)
Capacitance
Symbol
V RWM
Ileak
V br
V esd
V esd
C
Unit
V
uA
V
kV
kV
pF
Vpin1,3,4,5=5V, V pin2=0V
Ibr=1mA
Ta=25℃
Ta=25℃
V R =0V, f=1MHz
+/- 22
+/- 15
12
Condition
LXES2SBAA4-114
+/-5.0
2.5 (max)
6.1 (min)
Parameter
Reverse
W orking
Voltage
Channel Leakage
Current
Break down
voltage
ESD per IEC
61000-4-2(air)
ESD per IEC
61000-4-2
(contact)
Capacitance
Symbol
V RWM
Ileak
V br
V esd
V esd
C
Unit
V
uA
V
kV
kV
pF
V pin3,8=0V,
V pin1,2,4,5=0-5V
Ibr=1mA
Ta=25℃
Ta=25℃
V pin3,8=0V, V in=2.5V,
f=1MHz
Condition
LXES2TBCC4-028
+/-5.5
1.5 (max)
6 (min)
+/- 15
+/- 10
0.5
Parameter
Reverse
W orking
Voltage
Channel Leakage
Current
Break down
voltage
ESD per IEC
61000-4-2(air)
ESD per IEC
61000-4-2
(contact)
Capacitance
Symbol
V RWM
Ileak
V br
V esd
V esd
C
Unit
V
uA
V
kV
kV
pF
V pin8=5V, V pin7=0V,
V CH=0-5V
Ibr=1mA
Ta=25℃
Ta=25℃
V pin8=5V, V pin7=0V,
V in=2.5V, f=1MHz
1.0 (max)
6 (min)
+/- 15
+/- 8
0.27
Condition
LXES4XBAA6-027
+/-5.5
MURATA MFG. CO., LTD.
p4/30
3-3
Typical Characteristics
1.0
80
0.8
Capacitan ce [pF]
Voltage [V]
LXES1UBAB1-007
100
60
40
20
0
10
20
30
40
0.4
0.2
0.0
0
-10
0.6
50
-5
Time [nsec]
-4
-3
-2
-1
0
1
2
3
4
5
Voltage [V]
ESD Waveform(IEC61000-4-2:8kV Contact)
Voltage-Capacitance Characteristic
LXES1UBAA1-096
100
10.0
C apacitan ce [pF]
Voltage [V]
80
60
40
20
8.0
6.0
4.0
2.0
0.0
0
-10
0
10
20
30
40
-5
50
-4
-3
-2
-1
0
1
2
3
4
5
Voltage [V]
Time [nsec]
ESD Waveform(IEC61000-4-2:8kV Contact)
Voltage-Capacitance Characteristic
1.0
80
0.8
Capacitan ce [pF]
Voltage [V]
LXES1TBCC2-004
100
60
40
20
0
-10
0
10
20
30
40
50
Time [nsec]
0.6
0.4
0.2
0.0
0
1
2
3
4
Voltage [V]
ESD Waveform(IEC61000-4-2:8kV Contact)
Voltage-Capacitance Characteristic
MURATA MFG. CO., LTD.
5
p5/30
100
1.0
80
0.8
Capacitan ce [pF]
Voltage [V]
LXES1TBBB2-013
60
40
20
0
10
20
30
40
0.4
0.2
0.0
0
-10
0.6
50
0
Time [nsec]
1
2
3
4
5
Voltage [V]
ESD Waveform(IEC61000-4-2:8kV Contact)
Voltage-Capacitance Characteristic
1.0
80
0.8
Capacitan ce [pF]
Voltage [V]
LXES2SBAA4-016
100
60
40
20
0
10
20
30
40
0.4
0.2
0.0
0
-10
0.6
50
0
Time [nsec]
1
2
3
4
5
Voltage [V]
ESD Waveform(IEC61000-4-2:8kV Contact)
Voltage-Capacitance Characteristic
2.0
80
1.6
Capacitance [pF]
Voltage [V]
LXES2SBBB4-026
100
60
40
20
1.2
0.8
0.4
0.0
0
-10
0
10
20
30
40
50
Time [nsec]
0
1
2
3
4
Voltage [V]
ESD Waveform(IEC61000-4-2:8kV Contact)
Voltage-Capacitance Characteristic
MURATA MFG. CO., LTD.
5
p6/30
100
15.0
80
12.0
Capacitan ce [pF]
Voltage [V]
LXES2SBAA4-114
60
40
20
0
-10
0
10
20
30
40
9.0
6.0
3.0
0.0
50
-5
Time [nsec]
-4
-3
-2
-1
0
1
2
3
4
5
Voltage [V]
ESD Waveform(IEC61000-4-2:8kV Contact)
Voltage-Capacitance Characteristic
100
1.0
80
0.8
Capacitance [pF]
Voltage [V]
LXES2TBCC4-028
60
40
20
0
10
20
30
40
0.4
0.2
0.0
0
-10
0.6
50
0
Time [n sec]
ESD Waveform(IEC61000-4-2:8kV Contact)
1
2
3
4
Voltage [V]
Voltage-Capacitance Characteristic
1
2
5
100
1.0
80
0.8
Capacitan ce [pF]
Voltage [V]
LXES4XBAA6-027
60
40
20
0
-10
0
10
20
30
40
Time [nsec]
50
0.6
0.4
0.2
0.0
0
3
4
Voltage [V]
ESD Waveform(IEC61000-4-2:8kV Contact)
MURATA MFG. CO., LTD.
Voltage-Capacitance Characteristic
5
p7/30
4. CONSTRUCTION, DIMENSIONS
(1) DFN1006P2E
4 - 1 -1 DIMENSIONS
Top View
Side View
T
Marking
Bottom View
Unit : mm
symbol
size
symbol
size
L
1.0+/-0.05
b
0.5+/-0.05
W
0.6+/-0.05
c
0.25+/-0.05
T
0.6 max
d
(0.125)
a
(0.65)
4 - 1 - 2 Pin Configuration
No.
Terminal Name
1
Line-1/GND
2
GND/Line-1
4 - 1 - 3 Circuit Diagram
MURATA MFG. CO., LTD.
p8/30
(2) DFN1006P2X
4 - 2 - 1 DIMENSIONS
Top View
Bottom View
Marking
Side View
T
symbol
size
symbol
size
L
1.0+/-0.05
b
0.25+/-0.05
W
0.6+/-0.05
c
0.50+/-0.05
T
0.5 max
d
(0.125)
a
(0.65)
4 - 2 - 2 Pin Configuration
No.
Terminal Name
1
Line-1/GND
2
GND/Line-1
4 - 2 - 3 Circuit Diagram
MURATA MFG. CO., LTD.
p9/30
(3) QFN1616P6E
4 - 3 - 1 DIMENSIONS
Top View
Bottom View
L
(6)
a
(4)
(4)
××
b
(5)
(6)
d
Device
code
e
(7)
W
f
c
(1)
(3)
(1)
(2)
(3)
Side View
Unit : mm
symbol
size
symbol
size
L
1.6+/-0.05
c
0.275+/-0.05
W
1.6+/-0.05
d
(1.0)
T
0.6 max
e
(0.6)
a
0.25+/-0.05
f
R0.2
b
(0.5)
4 - 3 - 2 Pin Configuration
LXES1TBCC2-004
No.
Terminal Name
No.
Terminal Name
1
I/O 1
5
VDD
2
GND
6
NC
3
I/O 2
7
NC
4
NC
LXES1TBBB2-013
No.
Terminal Name
No.
Terminal Name
1
I/O 1
5
GND
2
VDD
6
NC
3
I/O 2
7
NC
4
NC
4 - 3 - 3 Circuit Diagram
LXES1TBCC2-004
LXES1TBBB2-013
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p10/30
(4) SOT23-6L
4 - 4 - 1 DIMENSIONS
Top View
Bottom View
L
a
(6)
(5)
(4)
×× XY
W
Device Code
(1)
b
g
Trace Code
(2)
(3)
Unit : mm
c
Side View
symbol
size
symbol
size
L
2.9 typ
c
(1.9)
W
2.8 typ
d
1.3 max
T
1.45 max
e
0.15 max
a
0.4±0.10
f
0.14±0.06
b
(0.95)
g
(0.6)
4 - 4 - 2 Pin Configuration
No.
Terminal Name
No.
Terminal Name
1
I/O 1
4
I/O 3
2
GND
5
VDD
3
I/O 2
6
I/O 4
4 - 4 - 3 Circuit Diagram
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p11/30
(5) SOT23-5L
4 - 5 - 1 DIMENSIONS
Top View
Bottom View
Unit : mm
Side View
symbol
size
Terminal Name
No.
Terminal Name
1
I/O 1
4
I/O 3
2
GND
5
I/O 4
3
I/O 2
size
L
2.9±0.2
c
(1.9)
W
2.8±0.2
d
(0.45)
T
1.45 max
e
(0.6)
a
0.4±0.10
f
0.21 max
b
(0.95)
g
1.8 max
4 - 5 - 2 Pin Configuration
No.
symbol
4 - 5 - 3 Circuit Diagram
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p12/30
(6) DFN2510P10E
4 - 6 - 1 DIMENSIONS
Top View
Bottom View
Side View
a
×× XY
e
b
c
単位: mm
d
Unit : mm
symbol
size
symbol
size
L
2.5+/-0.05
c
(0.5)
W
1.0+/-0.05
d
0.40+/-0.05
T
0.60 max
e
(1.95)
a
0.20+/-0.05
f
0.05 max
b
0.40+/-0.05
4 - 6 - 2 Pin Configuration
No
Terminal Name
No
Terminal Name
1
Line-1
6
NC
2
Line-2
7
NC
3
GND
8
GND
4
Line-3
9
NC
5
Line-4
10
NC
4 - 6 - 3 Circuit Diagram
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p13/30
(7) MSOP-8L
4 - 7 - 1 DIMENSIONS
Top View
Side View 1
Unit : mm
symbol
size
symbol
size
L
4.9+/-0.15
d
0.95 max
W
3.0+/-0.10
e
0.15 max
T
1.1 max
f
0.15+0.08/-0.02
a
0.30+0.08/-0.02
g
(0.25)
b
(0.65)
h
(0.55)
c
3.0+/-0.10
4 - 7 - 2 Pin Configuration
No.
Terminal Name
No
Terminal Name
1
I/O 1
5
I/O 5
2
I/O 2
6
I/O 6
3
I/O 3
7
GND
4
I/O 4
8
VDD
4 - 7 - 3 Circuit Diagram
MURATA MFG. CO., LTD.
Side View 2
p14/30
5. Reliability Test
No.
Items
Specifications
No severe damages
Satisfy
dimension
specifications
1
2
Vibration Resistance
Test Methods
Result
(Fail)
22
G
(0)
22
G
(0)
22
G
(0)
22
G
(0)
22
G
(0)
22
G
(0)
Solder specimens on the testing jig (glass fluorine
boards) shown in appended Fig.1 by a Pb free solder.
The soldering shall be done either by iron or reflow and
be conducted with care so that the soldering is uniform
and free of defect such as by heat shock.
Frequency : 10~2000 Hz
Acceleration : 196 m/s2
Direction
: X,Y,Z 3 axis
Period
: 2 h on each directionTotal 6 h.
Solder specimens on the testing jig (glass fluorine
boards) shown in appended Fig.1 by a Pb free solder.
The soldering shall be done either by iron or reflow and
be conducted with care so that the soldering is uniform
and free of defect such as by heat shock
Shock
Number
Acceleration : 14,700 m/s2
Period
: 0.3 ms.
Cycle
: 3 times
3
Solder specimens on the testing jig (glass epoxy boards)
shown in appended Fig.2 by a Pb free solder. The
soldering shall be done either by iron or reflow and be
conducted with care so that the soldering is uniform and
free of defect such as by heat shock.
Deflection
DFN0603P2Y
2N Minimum
4
Soldering strength
(Push Strength)
DFN1006P2E ,
DFN1006P2X
3N Minimum
No damage with 1.6mm deflection
Solder specimens onto test jig shown below. Apply
pushing force at 0.5m m/s until electrode pads are peeled
off or product is broken. Pushing force is applied to
longitudinal direction.
Pushing Direction
Specimen
Jig
Others
5N Minimum
5
Solderability of Termination
Appearance
Resistance
to Soldering
Heat
6
(Reflow)
Electrical
specifications
75% of the
terminations is to be
soldered evenly and
continuously.
No
severe damages
Satisfy specifications
listed in paragraph
3-2 over operational
temperature range
Immerse specimens first an ethanol solution of rosin,
then in a Pb free solder solution for 3±0.5 sec. at
245±5 °C.
Preheat
: 150 °C, 60 sec.
Solder Paste : Sn-3.0Ag-0.5Cu
Flux : Solution of ethanol and rosin
(25 % rosin in weight proportion)
Preheat Temperature
Preheat Period
High Temperature
High Temp. Period
Peak Temperature
: 150-180 °C
: 90+/ -30 s
: 220 ℃
: 30+/ -10 s
: 260+5/ -0 °C
Specimens are soldered twice with the above condition,
and then kept in room condition for 24 h before
measurements.
MURATA MFG. CO., LTD.
p15/30
No.
7
8
9
10
Items
High Temp.
Exposure
Temperature
Cycle
Humidity
(Steady State)
Low Temp.
Exposure
Number
Result
(Fail)
22
G
(0)
22
G
(0)
Temperature:85±2 ℃
Humidity:80~90 %RH
Period:1000+48/-0 h
Room Condition:2 ~ 24 h
22
G
(0)
Temperature:-40±2 ℃
Period:1000+48/-0 h
Room Condition:2 ~ 24 h
22
G
(0)
Specifications
Appeara
nce
Electrical
Specifica
tions
No severe damages
Test Methods
Temperature
: 85+2/-0 °C
Period
: 1000+48/ -0 h
Room Condition : 2 ~ 24 h
Satisfy specifications listed in
paragraph 3-2 over operational
temperature range
Set the specimens to the supporting
jig in the same manner and under the
same conditions as Fig.1 and conduct
the 100 cycles according to the
temperatures and time shown in the
following table. Set it for 2 to 24 h at
room temperature, then measure.
Step
Temp(°C)
1
Min.
Operating
Temp.+0/-3
30±3
2
Max.
Operating
Temp.+3/-0
30±3
MURATA MFG. CO., LTD.
Time(min)
p16/30
Fig. 1 Land Pattern
Package : DFN1006P2E , DFN1006P2X
Unit : mm
※Reference purpose only.
Package : QFN1616P6E
Unit : mm
※Reference purpose only.
MURATA MFG. CO., LTD.
p17/30
Package : SOT23-6L
Unit : mm
0.95
3.6
2.5
1.4
1.1
0.6
※Reference purpose only.
Package : SOT23-5L
Unit : mm
※Reference purpose only.
Package : DFN2510P10E
Unit : mm
0.875
0.2
1.0
0.4
0.5
0.675
※Reference purpose only.
MURATA MFG. CO., LTD.
p18/30
Package : MSOP-8L
Unit : mm
4.80
0.41
0.65
1.02
※Reference purpose only.
MURATA MFG. CO., LTD.
p19/30
Fig. 2 Testing board
(Unit : mm)
100
40
Mounted situation
Land
Land pattern is same as figure1
Glass-fluorine board t=1.6mm
Copper thickness over 35 m
(Unit : mm)
CHIP
45
45
Test method
(Unit : mm)
20
50
R230
deflection
MURATA MFG. CO., LTD.
p20/30
6.Tape and Reel Packing
(1) Dimensions of Tape (Plastic tape)
Not in scale
Unit : mm
package
DFN1006P2E
DFN1006P2X
L
(1.10)
(1.15)
W
(0.70)
(0.70)
T
(0.65)
(0.52)
a
2.00+/-0.05
2.00+/-0.05
b
4.00+/-0.10
4.00+/-0.10
c
3.50+/-0.05
3.50+/-0.05
d
1.75+/-0.1
1.75+/-0.1
e
8.00+0.30/-0.10
8.00+/-0.10
f
φ1.55+/-0.05
φ1.55+/-0.05
MURATA MFG. CO., LTD.
p21/30
(2) Dimensions of Tape (Plastic tape)
Not in scale
Unit : mm
package
QFN1616P6E
SOT23-6L
SOT23-5L
DFN2510P10E
MSOP-8L
L
1.80+/-0.05
3.23+/-0.10
3.23+/-0.10
2.70+/-0.05
3.40+/-0.10
W
1.80+/-0.05
3.17+/-0.10
3.17+/-0.10
1.23+/-0.05
5.30+/-0.10
T
0.69+/-0.05
1.37+/-0.10
1.37+/-0.10
0.70+/-0.05
1.40+/-0.10
a
2.00+/-0.05
2.00+/-0.05
2.00+/-0.05
2.00+/-0.05
2.00+/-0.05
b
4.00+/-0.10
4.00+/-0.10
4.00+/-0.20
4.00+/-0.10
8.00+/-0.10
c
4.00+/-0.10
4.00+/-0.10
4.00+/-0.10
4.00+/-0.10
4.00+/-0.10
d
3.50+/-0.05
3.50+/-0.05
3.50+/-0.05
3.50+/-0.05
5.50+/-0.05
e
1.75+/-0.1
1.75+/-0.1
1.75+/-0.1
1.75+/-0.1
1.75+/-0.10
f
8.00+/-0.10
8.00+0.30/-0.10
8.00+0.30/-0.10
8.00+0.30/-0.20
12.0+/-0.30
g
φ1.55+/-0.05
φ1.55+/-0.05
φ1.55+/-0.05
φ1.55+/-0.05
φ1.55+/-0.05
MURATA MFG. CO., LTD.
p22/30
(3) Dimensions of Reel
Not in scale
a
d
e
b
c
Unit : mm
package
DFN1006P2E
DFN1006P2X
QFN1616P6E
SOT23-6L
a
1.5 min
1.5 min
2.3+/-0.1
2.3+/-0.1
b
φ13.0+/-0.2
φ13.0+/-0.2
φ13.0+/-0.2
φ13.0+/-0.2
c
9.2+2.0/-0
9.2+2.0/-0
9.5+/-1.0
9.5+/-1.0
d
φ60
φ60
φ54.4
φ60
e
φ180
φ180
φ180
φ180
package
SOT23-5L
DFN2510P10E
MSOP-8L
a
2.0+0.5/-0
2.3+/-0.1
2.0+/-0.5
b
φ13.0+0.5/-0.3
φ13.0+/-0.2
φ13.0+0.5/-0.2
c
8.6+1.0/-0
9.5+/-0.2
12.8+0.3/-0.2
d
φ54.4
φ60
φ100
e
φ180
φ180
φ330
(4) PACKAGE Diagrams (Humidity proof Packing)
Tape and reel must be sealed with the anti-humidity plastic bag. The bag contains the desiccant and the
humidity indicator.
Label
表示ラべル
Desiccant
乾燥剤
Humidity
湿度
Indicator
インジケ-タ
表示ラベル
Label
Anti-humidity
防湿梱包袋
Aluminum foil pack bag
MURATA MFG. CO., LTD.
p23/30
(5) Taping Diagrams
[1] Feeding Hole : As specified in (1),(2)
[2] Hole for chip : As specified in (1),(2)
[3] Cover tape
: 50 m in thickness
[4] Base tape
: As specified in (1),(2)
[3]
[1]
[2]
[3]
Feeding hole
[4]
A
Feedeng Direction
A
Marking
Chip
Marking Direction
LXES1UBAA1-096
2
LXES1UBAB1-007
LXES1TBCC2-004/LXES1TBBB2-013
PIN1
MURATA MFG. CO., LTD.
p24/30
LXES2SBAA4-016/LXES2SBBB4-026
LXES4XBAA6-027/ LXES2TBCC4-028/
PIN1
PIN1
LXES2SBAA4-114
PIN1
MURATA MFG. CO., LTD.
p25/30
(6) Leader and Tail tape
Tail tape
(No components) Component
No components
Leader tape
(Cover tape alone)
Over100mm
Over160m
Over400mm
Feeding direction
(7) The tape for chips are wound clockwise, the feeding holes to the right side as the tape is pulled
toward the user.
(8) Packaging unit:
Unit : pcs / reel
package
DFN1006P2E
DFN1006P2X
QFN1616P6E
SOT23-6L
quantity
3000
12000
3000
3000
package
SOT23-5L
DFN2510P10E
MSOP-8L
DFN4120P10E
quantity
3000
3000
3000
3000
(9) Material : Base tape ...... Plastic
Reel
......Plastic
Base tape, Reel and Top tape have an anti-ESD function.
(10) Peeling of force : 0.1~1.0 N in the direction of peeling as shown below.
0.1~1.0N
0.7 N max.
165 ~ 180 °
Cover tape
Base tape
MURATA MFG. CO., LTD.
p26/30
NOTICE
1.Storage Conditions:
・The product shall be stored without opening the packing under the ambient temperature from 5 to 35
deg.C and humidity from 20 to 70%RH.
(Packing materials, in particular, may be deformed at the temperature over 40 deg.C.)
・The product left more than 6 months after reception, it needs to be confirmed the solderbility before used.
- The product shall be stored in non corrosive gas (Cl2, NH3, SO2, Nox, etc.).
- Any excess mechanical shock including, but not limited to, sticking the packing materials by sharp object
and dropping the product, shall not be applied in order not to damage the packing materials.
・After the packing opened, the product shall be stored at < 30 deg.C / < 60 %RH and the product shall be
used within 168 hours.
When the color of the indicator in the packing changed, the product shall be baked before
soldering.
This product is applicable to MSL3 (Based on IPC/JEDEC J-STD-020)
2. Handling Conditions:
Be careful in handling or transporting products because excessive stress or mechanical shock may break
products.
Handle with care if products may have cracks or damages on their terminals, the characteristics of
products may change. Do not touch products with bear hands that may result in poor solderability.
3. Standard PCB Design (Land Pattern and Dimensions):
All the ground terminals should be connected to the ground patterns. Furthermore, the ground pattern
should be provided between IN and OUT terminals. Please refer to the specifications for the standard
land dimensions.
The recommended land pattern and dimensions is as Murata's standard. The characteristics of products
may vary depending on the pattern drawing method, grounding method, land dimensions, land forming
method of the NC terminals and the PCB material and thickness. Therefore, be sure to verify the
characteristics in the actual set. When using non-standard lands, contact Murata beforehand.
4. Notice for Chip Placer:
When placing products on the PCB, products may be stressed and broken by uneven forces from a worn-out
chucking locating claw or a suction nozzle. To prevent products from damages, be sure to follow the
specifications for the maintenance of the chip placer being used. For the positioning of products on the PCB, be
aware that mechanical chucking may damage products.
MURATA MFG. CO., LTD.
p27/30
5. Soldering Conditions:
Carefully perform preheating so that the temperature difference (T) between the solder and products surface
should be in the following range. When products are immersed in solvent after mounting, pay special attention
to maintain the temperature difference within 100 °C. Soldering must be carried out by the above mentioned
conditions to prevent products from damage. Contact Murata before use if concerning other soldering
conditions.
Soldering method
Soldering iron method
Reflow method
Temperature