MC33269DTRK-3.3G

MC33269, NCV33269 800 mA, Adjustable Output, Low Dropout Voltage Regulator The MC33269/NCV33269 series are low dropout, medium current, fixed and adjustable, positive voltage regulators specifically designed for use in low input voltage applications. These devices offer the circuit designer an economical solution for precision voltage regulation, while keeping power losses to a minimum. The regulator consists of a 1.0 V dropout composite PNP−NPN pass transistor, current limiting, and thermal shutdown. http://onsemi.com 1 GND/Adj Features • 3.3 V, 3.5 V, 5.0 V, 12 V and Adjustable Versions • • • • • • • • Vout 2.85 V version available as MC34268 Space Saving DPAK, SO−8 and SOT−223 Power Packages 1.0 V Dropout Output Current in Excess of 800 mA Thermal Protection Short Circuit Protection Output Trimmed to 1.0% Tolerance NCV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q100 Qualified and PPAP Capable These are Pb−Free Devices SO−8 D SUFFIX CASE 751 8 Vin 1 8 2 7 3 6 4 5 NC Vout NC (Top View) DPAK DT SUFFIX CASE 369C 1 3 1. GND/Adj 2. Vout 3. Vin 1 3 SOT−223 ST SUFFIX CASE 318E 1 2 3 (Top View) 1 2 3 (Top View) DEVICE TYPE/NOMINAL OUTPUT VOLTAGE MC33269D NCV33269D* MC33269DT NCV33269DTRK* MC33269T MC33269D−3.3 MC33269DT−3.3 NCV33269DTRK−3.3* MC33269T−3.3 MC33269ST−3.3 Adj Adj Adj Adj Adj 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V MC33269T−3.5 MC33269D−5.0 MC33269DT−5.0 NCV33269DT−5.0* NCV33269DTRK−5.0* MC33269T−5.0 MC33269D−012 MC33269DT−012 NCV33269DTRK−012* MC33269T−012 3.5 V 5.0 V 5.0 V 5.0 V 5.0 V 5.0 V 12 V 12 V 12 V 12 V *NCV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q100 Qualified and PPAP Capable. Heatsink surface (shown as terminal 4 in case outline drawing) is connected to Pin 2. TO−220AB T SUFFIX CASE 221AB 1 2 3 1. GND/Adj 2. Vout 3. Vin 12 3 (Top View) Heatsink surface (shown as terminal 4 in case outline drawing) is connected to Pin 2. ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 7 of this data sheet. DEVICE MARKING INFORMATION See general marking information in the device marking section on page 8 of this data sheet. © Semiconductor Components Industries, LLC, 2014 August, 2014 − Rev. 28 1 Publication Order Number: MC33269/D MC33269, NCV33269 MAXIMUM RATINGS Rating Symbol Value Unit Vin 20 V PD qJA qJC PD qJA qJC PD qJA qJC PD qJA qJC Internally Limited 92 6.0 Internally Limited 160 25 Internally Limited 65 5.0 Internally Limited 156 15 W °C/W °C/W W °C/W °C/W W °C/W °C/W W °C/W °C/W TJ −40 to +150 °C TA −40 to +125 −40 to +125 °C Storage Temperature Tstg −55 to +150 °C Electrostatic Discharge Sensitivity (ESD) Human Body Model (HBM) Machine Model (MM) ESD 4000 400 V Power Supply Input Voltage Power Dissipation Case 369C (DPAK) Case 751 (SO−8) Case 221A (TO−220) Case 318E (SOT−223) TA = 25°C Thermal Resistance, Junction−to−Ambient Thermal Resistance, Junction−to−Case TA = 25°C Thermal Resistance, Junction−to−Ambient Thermal Resistance, Junction−to−Case TA = 25°C Thermal Resistance, Junction−to−Ambient Thermal Resistance, Junction−to−Case TA = 25°C Thermal Resistance, Junction−to−Ambient Thermal Resistance, Junction−to−Case Operating Die Junction Temperature Range Operating Ambient Temperature Range NCV33269 MC33269 Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. ELECTRICAL CHARACTERISTICS (CO = 10 mF, TA = 25°C, for min/max values TA = −40°C to +125°C, unless otherwise noted.) Characteristic Symbol Output Voltage (Iout = 10 mA, TA = 25°C) Min Typ Max 3.27 3.465 4.95 11.88 3.3 3.5 5.0 12 3.33 3.535 5.05 12.12 VO 3.3 Suffix (VCC = 5.3 V) 3.5 Suffix (VCC = 5.5 V) 5.0 Suffix (VCC = 7.0 V) 12 Suffix (VCC = 14 V) Output Voltage (Line, Load and Temperature) (Note 1) (1.25 V ≤ Vin − Vout ≤ 15 V, Iout = 500 mA) (1.35 V ≤ Vin − Vout ≤ 10 V, Iout = 800 mA) V VO 3.3 Suffix 3.5 Suffix 5.0 Suffix 12 Suffix Unit V 3.23 3.43 4.90 11.76 3.3 3.5 5.0 12 3.37 3.57 5.10 12.24 Reference Voltage for Adjustable Voltage (Iout = 10 mA, Vin − Vout = 2.0 V, TA = 25°C) Vref 1.235 1.25 1.265 V Reference Voltage (Line, Load and Temperature) (Note 1) for Adjustable Voltage (1.25 V ≤ Vin − Vout ≤ 15 V, Iout = 500 mA) (1.35 V ≤ Vin − Vout ≤ 10 V, Iout = 800 mA) Vref 1.225 1.25 1.275 V (Iout = 10 mA, Vin = [Vout + 1.5 V] to Vin = 20 V, TA = 25°C) Regline − − 0.3 % Load Regulation (Vin = Vout + 3.0 V, Iout = 10 mA to 800 mA, TA = 25°C) Regload − − 0.5 % Dropout Voltage (Iout = 500 mA) (Iout = 800 mA) Vin − Vout − − 1.0 1.1 1.25 1.35 V Ripple Rejection (10 Vpp, 120 Hz Sinewave; Iout = 500 mA) RR 55 − − dB (Vin − Vout = 10 V) ILimit 800 − − mA Line Regulation Current Limit Quiescent Current (Fixed Output) (1.5 V ≤ Vout ≤ 3.5 V) (5 V ≤ Vout ≤ 12 V) IQ − − 5.5 − 8.0 20 mA Minimum Required Load Current Fixed Output Voltage Adjustable Voltage ILoad − 8.0 − − 0 − mA IAdj − − 120 mA Adjustment Pin Current 1. The MC33269−12, Vin − Vout is limited to 8.0 V maximum, because of the 20 V maximum rating applied to Vin. http://onsemi.com 2 MC33269, NCV33269 Vin Vout Trim Links VAdj Gnd This device contains 38 active transistors. Figure 1. Internal Schematic http://onsemi.com 3 MC33269, NCV33269 Δ VO , OUTPUT VOLTAGE DEVIATION 1.3 TA = -40°C TA = 25°C 1.1 TA = 125°C 0.9 0.7 0.5 100 mV/Div Cin = 10 mF CO = 10 mF Tantalum Vin = VO + 3.0 V Preload = 0.1 A I O , OUTPUT CURRENT Vin -Vout , DROPOUT VOLTAGE (V) 1.5 0 200 400 600 800 0.5 A 0A 1000 20 ms/DIV IO, OUTPUT LOAD CURRENT (mA) Figure 3. Transient Load Regulation 1.6 1100 IO = 800 mA 1.4 1060 OUTPUT CURRENT (A) V FB(OV), OVERVOLTAGE INPUT THRESHOLD (%VFB ) Figure 2. Dropout Voltage versus Output Load Current 1020 980 1.0 TA = 25°C MC33269D-XX L = 25 mm Copper 0.8 0.6 0.4 940 0.2 900 -55 0 -25 0 25 50 75 TA, AMBIENT TEMPERATURE (°C) 100 4.0 6.0 8.0 10 12 14 16 Figure 5. MC33269−XX Output DC Current versus Input−Output Differential Voltage 70 RR, RIPPLE REJECTION RATIO (dB) VO = 3.3 V or 5.0 V 60 VO = 12 V 50 Vin = VO + 3.0 V IL = 800 mA TA = 25°C 30 20 0.1 2.0 INPUT-OUTPUT VOLTAGE DIFFERENTIAL (V) 70 40 0 125 Figure 4. Dropout Voltage versus Temperature RR, RIPPLE REJECTION RATIO (dB) 1.2 1.0 10 f, FREQUENCY (kHz) 60 50 40 30 20 0.1 100 Vin = 8.0 V Vout = 5.0 V IL = 800 mA CAdj = 22 mF TA = 25°C Figure 6. MC33269 Ripple Rejection versus Frequency 1.0 10 f, FREQUENCY (kHz) Figure 7. MC33269−ADJ Ripple Rejection versus Frequency http://onsemi.com 4 100 MC33269, NCV33269 170 3.2 2.8 JUNCTION-TO-AIR (° C/W) R θ JA, THERMAL RESISTANCE, 150 PD(max) for TA = 50°C 2.4 130 ÏÏÏ ÏÏÏ ÏÏÏÏÏÏÏÏÏ ÏÏÏ ÏÏÏ 110 90 L 70 50 10 20 1.2 3.0 mm RqJA 0 1.6 2.0 oz. Copper L 30 2.0 Graph represents symmetrical layout 30 0.8 0.4 50 40 L, LENGTH OF COPPER (mm) Figure 8. SOP−8 Thermal Resistance and Maximum Power Dissipation versus P.C.B. Copper Length 2.4 JUNCTION-TO-AIR (° C/W) R θ JA, THERMAL RESISTANCE, 100 PD(max) for TA = 50°C Free Air Mounted Vertically 90 ÏÏÏ ÏÏÏ ÏÏÏ ÏÏÏ 2.0 oz. Copper L 80 Minimum Size Pad 70 2.0 1.6 1.2 L 60 50 0.8 0.4 RqJA 40 0 0 5.0 10 15 20 25 30 L, LENGTH OF COPPER (mm) JUNCTION‐TO‐AIR (°C/W) R θ JA, THERMAL RESISTANCE 280 240 2.50 PD(max) for TA = 50°C Free Air Mounted Vertically 1.25 ÏÏÏÏ ÏÏÏÏ ÏÏÏÏ 200 Minimum Size Pad 160 120 2.0 oz. Copper L 0.83 L 0.63 0.50 80 0.42 RqJA 40 0 5.0 10 15 20 25 30 0.35 L, LENGTH OF COPPER (mm) Figure 10. SOT−223 Thermal Resistance and Maximum Power Dissipation versus P.C.B. Copper Length http://onsemi.com 5 PD, MAXIMUM POWER DISSIPATION (W) Figure 9. DPAK Thermal Resistance and Maximum Power Dissipation versus P.C.B. Copper Length MC33269, NCV33269 APPLICATIONS INFORMATION Figures 11 through 15 are typical application circuits. The output current capability of the regulator is in excess of 800 mA, with a typical dropout voltage of less than 1.0 V. Internal protective features include current and thermal limiting. * The MC33269 requires an external output capacitor for stability. The capacitor should be at least 10 mF with an equivalent series resistance (ESR) of less than 10 W but greater than 0.2 W over the anticipated operating temperature range. With economical electrolytic capacitors, cold temperature operation can pose a problem. As temperature decreases, the capacitance also decreases and the ESR increases, which could cause the circuit to oscillate. Also capacitance and ESR of a solid tantalum capacitor is more stable over temperature. The use of a low ESR ceramic capacitor placed within close proximity to the output of the device could cause instability. ** An input bypass capacitor is recommended to improve transient response or if the regulator is connected to the Vin supply input filter with long wire lengths. This will reduce the circuit’s sensitivity to the input line impedance at high frequencies. A 0.33 mF or larger tantalum, mylar, ceramic, or other capacitor having low internal impedance at high frequencies should be chosen. The bypass capacitor should be mounted with shortest possible lead or track length directly across the regulator’s input terminals. Applications should be tested over all operating conditions to insure stability. Internal thermal limiting circuitry is provided to protect the integrated circuit in the event that the maximum junction temperature is exceeded. When activated, typically at 170°C, the output is disabled. There is no hysteresis built into the thermal limiting circuit. As a result, if the device is overheating, the output will appear to be oscillating. This feature is provided to prevent catastrophic failures from accidental device overheating. It is not intended to be used as a substitute for proper heat−sinking. ** Cin Co * 10 mF ** Cin Vout Vin Vout MC33269-XX MC33269 R1 GND R2 An input capacitor is not necessary for stability, however it will improve the overall performance. CAdj*** ǒ Figure 11. Typical Fixed Output Application RS Vin Co * 10 mF Adj ***CAdj is optional, however it will improve the ripple rejection. The MC34269 develops a 1.25 V reference voltage between the output and the adjust terminal. Resistor R1, operates with constant current to flow through it and resistor R2. This current should be set such that the Adjust Pin current causes negligible drop across resistor R2. The total current with minimum load should be greater than 8.0 mA. Iout MC33269 Co * 10 mF ** Cin Adj Ǔ V out + 1.25 1 ) R2 ) I R2 Adj R1 I out + 1.25 R S Figure 13. Current Regulator Figure 12. Typical Adjustable Output Application Vout Vin MC33269-XX ** Cin Vout Vin GND ** Cin MC33269 R1 Adj R2 Co* 10 mF MC33269-XX Co * 10 mF ** Cin GND The Schottky diode in series with the ground leg of the upper regulator shifts its output voltage higher by the forward voltage drop of the diode. This will cause the lower device to remain off until the input voltage is removed. R2 sets the maximum output voltage. Each transistor reduces the output voltage when turned on. Figure 14. Battery Backed−Up Power Supply Figure 15. Digitally Controlled Voltage Regulator http://onsemi.com 6 MC33269, NCV33269 ORDERING INFORMATION Package Shipping Information† MC33269DG SO−8 (Pb−Free) 98 Units / Rail MC33269DR2G SO−8 (Pb−Free) 2500 Units / Tape & Reel MC33269DTG DPAK (Pb−Free) 75 Units / Rail MC33269DTRKG DPAK (Pb−Free) 2500 Units / Tape & Reel MC33269TG TO−220 (Pb−Free) 50 Units / Rail MC33269D−3.3G SO−8 (Pb−Free) 98 Units / Rail MC33269DR2−3.3G SO−8 (Pb−Free) 2500 Units / Tape & Reel MC33269DT−3.3G DPAK (Pb−Free) 75 Units / Rail MC33269DTRK−3.3G DPAK (Pb−Free) 2500 Units / Tape & Reel MC33269ST−3.3T3G SOT−223 (Pb−Free) 4000 Units / Tape & Reel MC33269T−3.3G TO−220 (Pb−Free) 50 Units / Rail MC33269T−3.5G TO−220 (Pb−Free) 50 Units / Rail MC33269D−5.0G SO−8 (Pb−Free) 98 Units / Rail MC33269DR2−5.0G SO−8 (Pb−Free) 2500 Units / Tape & Reel MC33269DT−5.0G DPAK (Pb−Free) 75 Units / Rail NCV33269DT−5.0G* DPAK (Pb−Free) 75 Units / Rail MC33269DTRK−5.0G DPAK (Pb−Free) 2500 Units / Tape & Reel MC33269T−5.0G TO−220 (Pb−Free) 50 Units / Rail MC33269D−012G SO−8 (Pb−Free) 98 Units / Rail MC33269DR2−012G SO−8 (Pb−Free) 2500 Units / Tape & Reel MC33269DT−012G DPAK (Pb−Free) 75 Units / Rail MC33269DTRK−012G DPAK (Pb−Free) 2500 Units / Tape & Reel MC33269T−012G TO−220 (Pb−Free) 50 Units / Rail NCV33269DR2G* SO−8 (Pb−Free) 2500 Units / Tape & Reel NCV33269DTRKG* DPAK (Pb−Free) 2500 Units / Tape & Reel NCV33269DTRK3.3G* DPAK (Pb−Free) 2500 Units / Tape & Reel NCV33269DTRK5.0G* DPAK (Pb−Free) 2500 Units / Tape & Reel NCV33269DTRK−12G* DPAK (Pb−Free) 2500 Units / Tape & Reel Device †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. *NCV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q100 Qualified and PPAP Capable. http://onsemi.com 7 MC33269, NCV33269 MARKING DIAGRAMS SO−8 D SUFFIX CASE 751 8 8 8 269AJ ALYW G 8 69−12 ALYW G 1 269−3 ALYW G 1 1 269−5 ALYW G 1 DPAK DT SUFFIX CASE 369C 269AJG ALYWW 69−12G ALYWW 2 1 269−3G ALYWW 2 3 1 SOT−223 ST SUFFIX CASE 318E 269−5G ALYWW 2 3 1 AYW 2693 G G 2 3 1 3 2 1 TO−220AB T SUFFIX CASE 221A MC 33269T AWLYWWG 1 2 3 MC 33269T−12 AWLYWWG 1 2 MC 33269T−33 AWLYWWG 3 1 2 3 A = Assembly Location L, WL = Wafer Lot Y = Year W, WW = Work Week G = Pb−Free Package G = Pb−Free Package (Note: Microdot may be in either location) http://onsemi.com 8 MC 33269T−5 AWLYWWG 1 2 3 3 MC33269, NCV33269 PACKAGE DIMENSIONS SO−8 D SUFFIX CASE 751−07 ISSUE AK NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE. 5. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.127 (0.005) TOTAL IN EXCESS OF THE D DIMENSION AT MAXIMUM MATERIAL CONDITION. 6. 751−01 THRU 751−06 ARE OBSOLETE. NEW STANDARD IS 751−07. −X− A 8 5 S B 0.25 (0.010) M Y M 1 4 K −Y− G C N DIM A B C D G H J K M N S X 45 _ SEATING PLANE −Z− 0.10 (0.004) H M D 0.25 (0.010) M Z Y S X J S SOLDERING FOOTPRINT* 1.52 0.060 7.0 0.275 4.0 0.155 0.6 0.024 1.270 0.050 SCALE 6:1 mm Ǔ ǒinches *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. http://onsemi.com 9 MILLIMETERS MIN MAX 4.80 5.00 3.80 4.00 1.35 1.75 0.33 0.51 1.27 BSC 0.10 0.25 0.19 0.25 0.40 1.27 0_ 8_ 0.25 0.50 5.80 6.20 INCHES MIN MAX 0.189 0.197 0.150 0.157 0.053 0.069 0.013 0.020 0.050 BSC 0.004 0.010 0.007 0.010 0.016 0.050 0 _ 8 _ 0.010 0.020 0.228 0.244 MC33269, NCV33269 PACKAGE DIMENSIONS DPAK DT SUFFIX CASE 369C ISSUE D NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: INCHES. 3. THERMAL PAD CONTOUR OPTIONAL WITHIN DIMENSIONS b3, L3 and Z. 4. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH, PROTRUSIONS, OR BURRS. MOLD FLASH, PROTRUSIONS, OR GATE BURRS SHALL NOT EXCEED 0.006 INCHES PER SIDE. 5. DIMENSIONS D AND E ARE DETERMINED AT THE OUTERMOST EXTREMES OF THE PLASTIC BODY. 6. DATUMS A AND B ARE DETERMINED AT DATUM PLANE H. C A A E b3 c2 B 4 L3 Z D 1 2 H DETAIL A 3 DIM A A1 b b2 b3 c c2 D E e H L L1 L2 L3 L4 Z L4 b2 e c b 0.005 (0.13) M C H L2 GAUGE PLANE C L SEATING PLANE A1 L1 DETAIL A ROTATED 905 CW INCHES MIN MAX 0.086 0.094 0.000 0.005 0.025 0.035 0.030 0.045 0.180 0.215 0.018 0.024 0.018 0.024 0.235 0.245 0.250 0.265 0.090 BSC 0.370 0.410 0.055 0.070 0.108 REF 0.020 BSC 0.035 0.050 −−− 0.040 0.155 −−− SOLDERING FOOTPRINT* 6.20 0.244 2.58 0.102 5.80 0.228 3.00 0.118 1.60 0.063 6.17 0.243 SCALE 3:1 mm Ǔ ǒinches *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. http://onsemi.com 10 MILLIMETERS MIN MAX 2.18 2.38 0.00 0.13 0.63 0.89 0.76 1.14 4.57 5.46 0.46 0.61 0.46 0.61 5.97 6.22 6.35 6.73 2.29 BSC 9.40 10.41 1.40 1.78 2.74 REF 0.51 BSC 0.89 1.27 −−− 1.01 3.93 −−− MC33269, NCV33269 PACKAGE DIMENSIONS SOT−223 ST SUFFIX CASE 318E−04 ISSUE N D b1 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. DIM A A1 b b1 c D E e e1 L L1 HE 4 HE E 1 2 3 b e1 e 0.08 (0003) A1 C q A L q MIN 1.50 0.02 0.60 2.90 0.24 6.30 3.30 2.20 0.85 0.20 1.50 6.70 0° MILLIMETERS NOM MAX 1.63 1.75 0.06 0.10 0.75 0.89 3.06 3.20 0.29 0.35 6.50 6.70 3.50 3.70 2.30 2.40 0.94 1.05 −−− −−− 1.75 2.00 7.00 7.30 − 10° L1 SOLDERING FOOTPRINT* 3.8 0.15 2.0 0.079 2.3 0.091 2.3 0.091 6.3 0.248 2.0 0.079 1.5 0.059 SCALE 6:1 mm Ǔ ǒinches *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. http://onsemi.com 11 MIN 0.060 0.001 0.024 0.115 0.009 0.249 0.130 0.087 0.033 0.008 0.060 0.264 0° INCHES NOM 0.064 0.002 0.030 0.121 0.012 0.256 0.138 0.091 0.037 −−− 0.069 0.276 − MAX 0.068 0.004 0.035 0.126 0.014 0.263 0.145 0.094 0.041 −−− 0.078 0.287 10° MC33269, NCV33269 PACKAGE DIMENSIONS TO−220, SINGLE GAUGE T SUFFIX CASE 221AB ISSUE A −T− B SEATING PLANE C F T S NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCHES. 3. DIMENSION Z DEFINES A ZONE WHERE ALL BODY AND LEAD IRREGULARITIES ARE ALLOWED. 4. PRODUCT SHIPPED PRIOR TO 2008 HAD DIMENSIONS S = 0.045 - 0.055 INCHES (1.143 - 1.397 MM) 4 DIM A B C D F G H J K L N Q R S T U V Z A Q 1 2 3 U H K Z L R V J G D N INCHES MIN MAX 0.570 0.620 0.380 0.405 0.160 0.190 0.025 0.035 0.142 0.147 0.095 0.105 0.110 0.155 0.018 0.025 0.500 0.562 0.045 0.060 0.190 0.210 0.100 0.120 0.080 0.110 0.020 0.024 0.235 0.255 0.000 0.050 0.045 ----0.080 MILLIMETERS MIN MAX 14.48 15.75 9.66 10.28 4.07 4.82 0.64 0.88 3.61 3.73 2.42 2.66 2.80 3.93 0.46 0.64 12.70 14.27 1.15 1.52 4.83 5.33 2.54 3.04 2.04 2.79 0.508 0.61 5.97 6.47 0.00 1.27 1.15 ----2.04 ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. 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