MC33275, NCV33275
300 mA, Low Dropout
Voltage Regulator
The MC33275 series are micropower low dropout voltage
regulators available in a wide variety of output voltages as well as
packages, SOT−223, SOP−8, DPAK, and DFN 4x4 surface mount
packages. These devices feature a very low quiescent current and are
capable of supplying output currents up to 300 mA. Internal current
and thermal limiting protection are provided by the presence of a short
circuit at the output and an internal thermal shutdown circuit.
Due to the low input−to−output voltage differential and bias current
specifications, these devices are ideally suited for battery powered
computer, consumer, and industrial equipment where an extension of
useful battery life is desirable.
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LOW DROPOUT
MICROPOWER VOLTAGE
REGULATOR
MARKING
DIAGRAMS
Features
• Low Input−to−Output Voltage Differential of 25 mV at IO = 10 mA,
•
•
•
•
•
and 260 mV at IO = 300 mA
Extremely Tight Line and Load Regulation
Stable with Output Capacitance of only 0.33 F for 2.5 V Output
Voltage
Internal Current and Thermal Limiting
NCV Prefix for Automotive and Other Applications Requiring
Unique Site and Control Change Requirements; AEC−Q100
Qualified and PPAP Capable
These are Pb−Free Devices
4
1
3
1
8
SOIC−8
D SUFFIX
CASE 751
8
1
Applications
4
• Battery Powered Consumer Products
• Hand−Held Instruments
• Camcorders and Cameras
1 2
Vin
3
Vout
1
Thermal &
Anti−sat
Protection
275xx
ALYWG G
1
275xxG
ALYWW
DPAK
DT SUFFIX
CASE 369C
DFN−8, 4x4
MN SUFFIX
CASE 488AF
1
275xx
ALYWG
G
xx
= Voltage Version
A
= Assembly Location
L
= Wafer Lot
Y
= Year
W, WW = Work Week
G or G = Pb−Free Device
(Note: Microdot may be in either location)
Rint
1.23 V
V. Ref.
54 K
AYW
275xxG
G
SOT−223
ST SUFFIX
CASE 318E
GND
ORDERING INFORMATION
This device contains 41 active transistors
See detailed ordering and shipping information on page 10
of this data sheet.
Figure 1. Simplified Block Diagram
© Semiconductor Components Industries, LLC, 2015
March, 2015 − Rev. 20
1
Publication Order Number:
MC33275/D
MC33275, NCV33275
PIN CONNECTIONS
GND
GND
4
4
Input
GND
1
2
3
Vin GND Vout
MC33275ST
GND
1
2
3
VinGND Vout
MC33275DT
N/C
1
ÇÇ
ÇÇ
ÇÇ
8
Output
7
GND
6
GND
5
N/C
2
3
4
Input
Input
Input
N/C
Pins 4 and 5 Not Connected
MC33275D
1
2
3
4
Ç
Ç
Ç
8
7
6
5
Output
N/C
GND
N/C
MC33275MN
MAXIMUM RATINGS
Rating
Symbol
Value
Unit
VCC
13
Vdc
PD
Internally Limited
W
RJA
RJC
160
25
°C/W
°C/W
RJA
RJC
245
15
°C/W
°C/W
RJA
RJC
92
6.0
°C/W
°C/W
RJA
RJA
psi−JC*
183
93
9.0
°C/W
°C/W
°C/W
Output Current
IO
300
mA
Maximum Junction Temperature
TJ
150
°C
Operating Ambient Temperature Range
TA
− 40 to +125
°C
Storage Temperature Range
Tstg
− 65 to +150
°C
Electrostatic Discharge Sensitivity (ESD)
Human Body Model (HBM)
Machine Model (MM)
ESD
Input Voltage
Power Dissipation and Thermal Characteristics
TA = 25°C
Maximum Power Dissipation
Case 751 (SOIC−8) D Suffix
Thermal Resistance, Junction−to−Ambient
Thermal Resistance, Junction−to−Case
Case 318E (SOT−223) ST Suffix
Thermal Resistance, Junction−to−Air
Thermal Resistance, Junction−to−Case
Case 369A (DPAK−3) DT Suffix
Thermal Resistance, Junction−to−Air
Thermal Resistance, Junction−to−Case
Case 488AF (DFN−8, 4x4) MN Suffix
Thermal Resistance, Junction−to−Air (with 1.0 oz PCB cu area)
Thermal Resistance, Junction−to−Air (with 1.8 oz PCB cu area)
Thermal Resistance, Junction−to−Case
4000
400
V
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
*“C’’ (“case’’) is defined as the solder−attach interface between the center of the exposed pad on the bottom of the package, and the board to
which it is attached.
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2
MC33275, NCV33275
ELECTRICAL CHARACTERISTICS (CL = 1.0F, TA = 25°C, for min/max values TJ = −40°C to +125°C, Note 1)
Symbol
Characteristic
Output Voltage
2.5 V Suffix
3.0 V Suffix
3.3 V Suffix
5.0 V Suffix
IO = 0 mA to 250 mA
TA = 25°C, Vin = [VO + 1] V
VO
Min
Typ
Max
2.475
2.970
3.267
4.950
2.50
3.00
3.30
5.00
2.525
3.030
3.333
5.05
2.450
2.940
3.234
4.900
−
−
−
−
2.550
3.060
3.366
5.100
Unit
Vdc
2.5 V Suffix
3.0 V Suffix
3.3 V Suffix
5.0 V Suffix
Vin = [VO + 1] V, 0 < IO < 100 mA
2% Tolerance from TJ = −40 to +125°C
Line Regulation
Vin = [VO + 1] V to 12 V, IO = 250 mA,
All Suffixes TA = 25°C
Regline
−
2.0
10
mV
Load Regulation
Vin = [VO + 1] V, IO = 0 mA to 250 mA,
All Suffixes TA = 25°C
Regload
−
5.0
25
mV
−
−
−
−
25
115
220
260
100
200
400
500
65
75
−
−
−
160
46
−
−
−
125
200
−
−
−
1500
1500
1500
2000
2000
2000
Dropout Voltage
IO = 10 mA
IO = 100 mA
IO = 250 mA
IO = 300 mA
Vin − VO
TJ = −40°C to +125°C
Ripple Rejection (120 Hz)
Vin(peak−peak) = [VO + 1.5] V to [VO + 5.5] V
Output Noise Voltage
CL = 1.0 F
IO = 50 mA (10 Hz to 100 kHz)
CL = 200 F
−
Vn
mV
dB
Vrms
CURRENT PARAMETERS
Quiescent Current ON Mode
Vin = [VO + 1] V, IO = 0 mA
IQOn
Quiescent Current ON Mode SAT
3.0 V Suffix
3.3 V Suffix
5.0 V Suffix
Vin = [VO − 0.5] V, IO = 0 mA (Notes 2, 3)
IQSAT
Current Limit
Vin = [VO + 1] V, VO Shorted
ILIMIT
−
450
−
mA
−
−
150
−
°C
A
A
THERMAL SHUTDOWN
Thermal Shutdown
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
1. Low duty pulse techniques are used during test to maintain junction temperature as close to ambient as possible.
2. Quiescent Current is measured where the PNP pass transistor is in saturation. Vin = [VO − 0.5] V guarantees this condition.
3. For 2.5 V version, IQSAT is constrained by the minimum input voltage of 2.5 V.
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3
MC33275, NCV33275
DEFINITIONS
Load Regulation − The change in output voltage for a
change in load current at constant chip temperature.
Dropout Voltage − The input/output differential at which
the regulator output no longer maintains regulation against
further reductions in input voltage. Measured when the
output drops 100 mV below its nominal value (which is
measured at 1.0 V differential), dropout voltage is affected
by junction temperature, load current and minimum input
supply requirements.
Output Noise Voltage − The RMS AC voltage at the
output with a constant load and no input ripple, measured
over a specified frequency range.
Maximum Power Dissipation − The maximum total
dissipation for which the regulator will operate within
specifications.
Quiescent Current − Current which is used to operate the
regulator chip and is not delivered to the load.
Line Regulation − The change in output voltage for a
change in the input voltage. The measurement is made under
conditions of low dissipation or by using pulse techniques
such that the average chip temperature is not significantly
affected.
Maximum Package Power Dissipation − The maximum
package power dissipation is the power dissipation level at
which the junction temperature reaches its maximum value
i.e. 150°C. The junction temperature is rising while the
difference between the input power (VCC X ICC) and the
output power (Vout X Iout) is increasing.
Depending on ambient temperature, it is possible to
calculate the maximum power dissipation and so the
maximum current as following:
T * T
A
Pd + J
R
JA
The maximum operating junction temperature TJ is
specified at 150°C, if TA = 25°C, then PD can be found. By
neglecting the quiescent current, the maximum power
dissipation can be expressed as:
I out +
P
D
V
* Vout
CC
The thermal resistance of the whole circuit can be
evaluated by deliberately activating the thermal shutdown
of the circuit (by increasing the output current or raising the
input voltage for example).
Then you can calculate the power dissipation by
subtracting the output power from the input power. All
variables are then well known: power dissipation, thermal
shutdown temperature and ambient temperature.
R
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4
JA
T * T
A
+ J
P
D
MC33275, NCV33275
7
150
TA = 25° C
6 CL = 33 F
IL = 10 mA
5 Vout = 3.3 V
100
4
50
3
0
2
Vout
-50
1
0
0
20
40
60
80
100
120
140
160
70
60
Vin
Vin , INPUT VOLTAGE (V)
Vin
200
40
4
30
3
20
10
2
0
Vout
1
0
50
100
Figure 3. Line Transient Response
1.0
300
0
-300
Vout
CHANGE
-400 CL = 1.0 F
Vout = 3.3 V
-500 TA = 25° C
-600 Vin = 4.3 V
0
50
-0.2
-0.4
-0.6
-0.8
100
150
200
300
250
350
LOAD CURRENT (mA)
LOAD CURRENT (mA)
0.2
LOAD CURRENT
150
-50
0.04
-150
-0.01
-250
-350
CL = 33.0 F
Vout = 3.3 V
TA = 25° C
Vin = 4.3 V
Vout
CHANGE
-450
-550
-0.06
-0.11
-650
-750
-1.0
400
-0.16
0
50
TIME (S)
100
150
200
250
300
TIME (S)
Figure 5. Load Transient Response
Figure 4. Load Transient Response
300
3.5
3.0
IL = 1 mA
2.5
DROPOUT VOLTAGE (mV)
OUTPUT VOLTAGE (V)
0.09
50
OUTPUT VOLTAGE CHANGE (V)
0.4
-200
0.14
250
0.6
OUTPUT VOLTAGE CHANGE (V)
LOAD
CURRENT
-100
-700
350
0.8
0
-20
200
150
TIME (S)
Figure 2. Line Transient Response
100
-10
0
-100
180 200
TIME (S)
200
50
OUTPUT VOLTAGE CHANGE (mV)
TA = 25° C
6 CL = 0.47 F
IL = 10 mA
5 Vout = 3.3 V
OUTPUT VOLTAGE CHANGE (mV)
Vin , INPUT VOLTAGE (V)
7
IL = 250 mA
2.0
1.5
1.0
250
200
150
100
50
0.5
0
0
0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
1
4.5 5.0
10
100
1000
INPUT VOLTAGE (V)
IO, OUTPUT CURRENT (mA)
Figure 6. Output Voltage versus Input Voltage
Figure 7. Dropout Voltage versus Output Current
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5
MC33275, NCV33275
12
250
10
IL = 300 mA
8
200
Ignd (mA)
DROPOUT VOLTAGE (mV)
300
IL = 250 mA
150
IL = 100 mA
100
50
4
0
IL = 100 mA
2
IL = 10 mA
0
-40
IL = 300 mA
6
IL = 50 mA
25
0
85
0
1
2
3
TEMPERATURE (°C)
4
5
6
7
8
Vin (VOLTS)
Figure 9. Ground Pin Current versus
Input Voltage
Figure 8. Dropout Voltage versus Temperature
2.5
8
7
IL = 250 mA
IO = 0
2.495
Vout (VOLTS)
Ignd (mA)
6
5
4
3
IL = 100 mA
2.49
IO = 250 mA
2.485
2.48
2
IL = 50 mA
1
0
-40
-20
0
20
40
60
80
100
120
2.475
2.47
-40
140
0
25
TA (°C)
TEMPERATURE (°C)
Figure 10. Ground Pin Current versus
Ambient Temperature
Figure 11. Output Voltage versus Ambient
Temperature (Vin = Vout + 1V)
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6
85
MC33275, NCV33275
2.5
IO = 0
2.495
Vout (VOLTS)
2.49
IO = 250 mA
2.485
2.48
2.475
2.47
2.465
-40
0
25
85
TEMPERATURE (°C)
Figure 12. Output Voltage versus Ambient
Temperature (Vin = 12 V)
70
60
IL = 10 mA
dB
50
IL = 1 mA
40
30
20
10
0
0.1
1
10
100
FREQUENCY (kHz)
Figure 13. Ripple Rejection
70
60
IL = 100 mA
dB
50
IL = 250 mA
40
30
20
10
0
0.1
1
10
FREQUENCY (kHz)
Figure 14. Ripple Rejection
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7
100
MC33275, NCV33275
APPLICATIONS INFORMATION
Vout
Vin
Cin
Cout
LOAD
GND
Figure 15. Typical Application Circuit
The MC33275 regulators are designed with internal
current limiting and thermal shutdown making them
user−friendly. Figure 15 is a typical application circuit. The
output capability of the regulator is in excess of 300 mA,
with a typical dropout voltage of less than 260 mV. Internal
protective features include current and thermal limiting.
ESR (ohm)
100
EXTERNAL CAPACITORS
Vout = 3.0 V
Cout = 1.0 F
Cin = 1.0 F
10
Stable Region
1.0
These regulators require only a 0.33 F (or greater)
capacitance between the output and ground for stability for
1.8 V, 2.5 V, 3.0 V, and 3.3 V output voltage options. Output
voltage options of 5.0 V require only 0.22 F for stability.
The output capacitor must be mounted as close as possible
to the MC33275. If the output capacitor must be mounted
further than two centimeters away, then a larger value of
output capacitor may be required for stability. A value of
0.68 F or larger is recommended. Most type of aluminum,
tantalum, or multilayer ceramic will perform adequately.
Solid tantalums or appropriate multilayer ceramic
capacitors are recommended for operation below 25°C. An
input bypass capacitor is recommended to improve transient
response or if the regulator is connected to the supply input
filter with long wire lengths, more than 4 inches. This will
reduce the circuit’s sensitivity to the input line impedance at
high frequencies. A 0.33 F or larger tantalum, mylar,
ceramic, or other capacitor having low internal impedance
at high frequencies should be chosen. The bypass capacitor
should be mounted with shortest possible lead or track
length directly across the regulator’s input terminals.
Figure 16 shows the ESR that allows the LDO to remain
stable for various load currents.
0.1
0
50
100
150
200
250
300
LOAD CURRENT (mA)
Figure 16. ESR for Vout = 3.0V
Applications should be tested over all operating
conditions to insure stability.
THERMAL PROTECTION
Internal thermal limiting circuitry is provided to protect
the integrated circuit in the event that the maximum junction
temperature is exceeded. When activated, typically at
150°C, the output is disabled. There is no hysteresis built
into the thermal protection. As a result the output will appear
to be oscillating during thermal limit. The output will turn
off until the temperature drops below the 150°C then the
output turns on again. The process will repeat if the junction
increases above the threshold. This will continue until the
existing conditions allow the junction to operate below the
temperature threshold.
Thermal limit is not a substitute for proper
heatsinking.
The internal current limit will typically limit current to
450 mA. If during current limit the junction exceeds 150°C,
the thermal protection will protect the device also. Current
limit is not a substitute for proper heatsinking.
OUTPUT NOISE
In many applications it is desirable to reduce the noise
present at the output. Reducing the regulator bandwidth by
increasing the size of the output capacitor will reduce the noise.
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8
RJA, THERMAL RESISTANCE,
JUNCTION−TO−AIR (°CW)
180
1.6
160
1.4
PD(max) for TA = 50°C
140
ÎÎÎ
ÎÎÎ
ÎÎÎ
ÎÎÎ
2.0 oz. Copper
L
Minimum
Size Pad
120
L
100
80
60
RJA
0
5.0
10
15
20
25
L, LENGTH OF COPPER (mm)
1.2
1.0
0.8
0.6
0.4
30
PD, MAXIMUM POWER DISSIPATION (W)
MC33275, NCV33275
RJA, THERMAL RESISTANCE,
JUNCTION−TO−AIR (°CW)
100
1.6
PD(max) for TA = 50°C
1.4
90
2.0 oz. Copper
L
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
80
Minimum
Size Pad
70
1.0
L
60
0.8
50
0.6
RJA
40
1.2
0
5.0
10
15
20
0.4
30
25
PD, MAXIMUM POWER DISSIPATION (W)
Figure 17. SOT−223 Thermal Resistance and Maximum
Power Dissipation versus P.C.B. Copper Length
L, LENGTH OF COPPER (mm)
3.2
170
150
PD(max) for TA = 50°C
2.8
130
2.4
110
Graph Represents Symmetrical Layout 2.0
ÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎ
90
70
30
0
10
3.0
mm
L
RJA
50
1.6
2.0 oz.
Copper
L
20
30
40
1.2
0.8
0.4
50
L, LENGTH OF COPPER (mm)
Figure 19. SOP−8 Thermal Resistance and Maximum
Power Dissipation versus P.C.B. Copper Length
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9
PD, MAXIMUM POWER DISSIPATION (W)
RJA, THERMAL RESISTANCE,
JUNCTION−TO−AIR (°CW)
Figure 18. DPAK Thermal Resistance and Maximum
Power Dissipation versus P.C.B. Copper Length
MC33275, NCV33275
ORDERING INFORMATION
Operating Temperature
Range, Tolerance
Case
Package
Marking
Shipping†
MC33275D−2.5G
751
SOIC−8
(Pb−Free)
27525
98 Units/Rail
MC33275D−2.5R2G
751
SOIC−8
(Pb−Free)
27525
2500/Tape & Reel
369A
DPAK
(Pb−Free)
27525G
75 Units/Rail
369A
DPAK
(Pb−Free)
27525G
2500/Tape & Reel
488AF
DFN8
(Pb−Free)
27525
3000/Tape & Reel
318E
SOT−223
(Pb−Free)
27525
4000/Tape & Reel
751
SOIC−8
(Pb−Free)
27530
98 Units/Rail
751
SOIC−8
(Pb−Free)
27530
2500/Tape & Reel
369A
DPAK
(Pb−Free)
27530G
75 Units/Rail
369A
DPAK
(Pb−Free)
27530G
2500/Tape & Reel
MC33275MN−3.0R2G
488AF
DFN8
(Pb−Free)
27530
3000/Tape & Reel
MC33275ST−3.0T3G
318E
SOT−223
(Pb−Free)
27530
4000/Tape & Reel
751
SOIC−8
(Pb−Free)
27533
98 Units/Rail
751
SOIC−8
(Pb−Free)
27533
2500/Tape & Reel
369A
DPAK
(Pb−Free)
27533G
75 Units/Rail
369A
DPAK
(Pb−Free)
27533G
2500/Tape & Reel
318E
SOT−223
(Pb−Free)
27533
4000/Tape & Reel
318E
SOT−223
(Pb−Free)
27533
4000/Tape & Reel
488AF
DFN−8
(Pb−Free)
27330
3000/Tape & Reel
751
SOIC−8
(Pb−Free)
27550
98 Units/Rail
751
SOIC−8
(Pb−Free)
27550
2500/Tape & Reel
369A
DPAK
(Pb−Free)
27550G
75 Units/Rail
369A
DPAK
(Pb−Free)
27550G
2500/Tape & Reel
488AF
DFN−8
(Pb−Free)
27550
3000/Tape & Reel
MC33275ST−5.0T3G
318E
SOT−223
(Pb−Free)
27550
4000/Tape & Reel
NCV33275ST−5.0T3G*
318E
SOT−223
(Pb−Free)
27550
4000/Tape & Reel
Device
VO Typ (V)
MC33275DT−2.5G
MC33275DT−2.5RKG
2.5 V
(Fixed Voltage)
1% Tolerance
at TA = 25°C
MC33275MN−2.5R2G
MC33275ST−2.5T3G
MC33275D−3.0G
MC33275D−3.0R2G
2% Tolerance at
TJ from −40°C to +125°C
MC33275DT−3.0G
MC33275DT−3.0RKG
3.0 V
(Fixed Voltage)
MC33275D−3.3G
MC33275D−3.3R2G
1% Tolerance
at TA = 25°C
MC33275DT−3.3G
MC33275DT−3.3RKG
3.3 V
(Fixed Voltage)
MC33275ST−3.3T3G
2% Tolerance at
TJ from −40°C to +125°C
1% Tolerance
at TA = 25°C
NCV33275ST3.3T3G*
MC33275MN−3.3R2G
MC33275D−5.0G
1% Tolerance
at TA = 25°C
MC33275D−5.0R2G
MC33275DT−5.0G
MC33275DT−5.0RKG
MC33275MN−5.0R2G
5.0 V
(Fixed Voltage)
2% Tolerance at
TJ from −40°C to +125°C
1% Tolerance
at TA = 25°C
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
*NCV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q100 Qualified and PPAP
Capable
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10
MC33275, NCV33275
PACKAGE DIMENSIONS
SOT−223 (TO−261)
ST SUFFIX
CASE 318E−04
ISSUE N
D
b1
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: INCH.
4
HE
E
1
2
3
b
e1
e
0.08 (0003)
A1
C
q
A
DIM
A
A1
b
b1
c
D
E
e
e1
L
L1
HE
q
L
MIN
1.50
0.02
0.60
2.90
0.24
6.30
3.30
2.20
0.85
0.20
1.50
6.70
0°
MILLIMETERS
NOM
MAX
1.63
1.75
0.06
0.10
0.75
0.89
3.06
3.20
0.29
0.35
6.50
6.70
3.50
3.70
2.30
2.40
0.94
1.05
−−−
−−−
1.75
2.00
7.00
7.30
10°
−
L1
SOLDERING FOOTPRINT*
3.8
0.15
2.0
0.079
2.3
0.091
2.3
0.091
6.3
0.248
2.0
0.079
mm Ǔ
1.5
ǒinches
SCALE 6:1
0.059
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
www.onsemi.com
11
MIN
0.060
0.001
0.024
0.115
0.009
0.249
0.130
0.087
0.033
0.008
0.060
0.264
0°
INCHES
NOM
0.064
0.002
0.030
0.121
0.012
0.256
0.138
0.091
0.037
−−−
0.069
0.276
−
MAX
0.068
0.004
0.035
0.126
0.014
0.263
0.145
0.094
0.041
−−−
0.078
0.287
10°
MC33275, NCV33275
PACKAGE DIMENSIONS
SOIC−8 NB
D SUFFIX
CASE 751−07
ISSUE AK
−X−
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 (0.005) TOTAL
IN EXCESS OF THE D DIMENSION AT
MAXIMUM MATERIAL CONDITION.
6. 751−01 THRU 751−06 ARE OBSOLETE. NEW
STANDARD IS 751−07.
A
8
5
S
B
0.25 (0.010)
M
Y
M
1
4
−Y−
K
G
C
N
DIM
A
B
C
D
G
H
J
K
M
N
S
X 45 _
SEATING
PLANE
−Z−
0.10 (0.004)
H
D
0.25 (0.010)
M
Z Y
S
X
M
J
S
SOLDERING FOOTPRINT*
1.52
0.060
7.0
0.275
4.0
0.155
0.6
0.024
1.270
0.050
SCALE 6:1
mm Ǔ
ǒinches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
www.onsemi.com
12
MILLIMETERS
MIN
MAX
4.80
5.00
3.80
4.00
1.35
1.75
0.33
0.51
1.27 BSC
0.10
0.25
0.19
0.25
0.40
1.27
0_
8_
0.25
0.50
5.80
6.20
INCHES
MIN
MAX
0.189
0.197
0.150
0.157
0.053
0.069
0.013
0.020
0.050 BSC
0.004
0.010
0.007
0.010
0.016
0.050
0 _
8 _
0.010
0.020
0.228
0.244
MC33275, NCV33275
PACKAGE DIMENSIONS
8 PIN DFN, 4x4
MN SUFFIX
CASE 488AF
ISSUE C
A
B
D
PIN ONE
REFERENCE
2X
0.15 C
2X
0.15 C
0.10 C
8X
0.08 C
NOTE 4
ÉÉ
ÉÉ
ÉÉ
L
L1
DETAIL A
E
OPTIONAL
CONSTRUCTIONS
EXPOSED Cu
DETAIL B
ÇÇÇÇ
(A3)
A
A1
ÇÇÇÇ
1
ÉÉ
ÉÉ
ÇÇ
A1
C
8X
SEATING
PLANE
ALTERNATE
CONSTRUCTIONS
5
DIM
A
A1
A3
b
D
D2
E
E2
e
K
L
L1
MILLIMETERS
MIN
MAX
0.80
1.00
0.00
0.05
0.20 REF
0.25
0.35
4.00 BSC
1.91
2.21
4.00 BSC
2.09
2.39
0.80 BSC
0.20
−−−
0.30
0.50
−−−
0.15
SOLDERING FOOTPRINT*
L
2.21
4
ÇÇÇÇ
8
e
MOLD CMPD
A3
DETAIL B
D2
K
ÇÇÇ
ÉÉÉ
TOP VIEW
SIDE VIEW
DETAIL A
NOTES:
1. DIMENSIONS AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED
TERMINAL AND IS MEASURED BETWEEN
0.15 AND 0.30MM FROM TERMINAL TIP.
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
5. DETAILS A AND B SHOW OPTIONAL
CONSTRUCTIONS FOR TERMINALS.
L
8X
0.63
E2
8X
4.30 2.39
b
0.10 C A B
0.05 C
PACKAGE
OUTLINE
NOTE 3
BOTTOM VIEW
8X
0.80
PITCH
0.35
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
www.onsemi.com
13
MC33275, NCV33275
PACKAGE DIMENSIONS
DPAK (SINGLE GAUGE)
CASE 369C
ISSUE E
A
E
b3
B
c2
4
L3
D
1
L4
C
A
2
3
NOTE 7
b2
e
b
TOP VIEW
Z
Z
H
DETAIL A
c
SIDE VIEW
0.005 (0.13)
M
BOTTOM VIEW
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: INCHES.
3. THERMAL PAD CONTOUR OPTIONAL WITHIN DIMENSIONS b3, L3 and Z.
4. DIMENSIONS D AND E DO NOT INCLUDE MOLD
FLASH, PROTRUSIONS, OR BURRS. MOLD
FLASH, PROTRUSIONS, OR GATE BURRS SHALL
NOT EXCEED 0.006 INCHES PER SIDE.
5. DIMENSIONS D AND E ARE DETERMINED AT THE
OUTERMOST EXTREMES OF THE PLASTIC BODY.
6. DATUMS A AND B ARE DETERMINED AT DATUM
PLANE H.
7. OPTIONAL MOLD FEATURE.
DIM
A
A1
b
b2
b3
c
c2
D
E
e
H
L
L1
L2
L3
L4
Z
BOTTOM VIEW
ALTERNATE
CONSTRUCTION
H
C
L2
GAUGE
PLANE
C
L
L1
DETAIL A
SEATING
PLANE
A1
ROTATED 905 CW
INCHES
MIN
MAX
0.086 0.094
0.000 0.005
0.025 0.035
0.028 0.045
0.180 0.215
0.018 0.024
0.018 0.024
0.235 0.245
0.250 0.265
0.090 BSC
0.370 0.410
0.055 0.070
0.114 REF
0.020 BSC
0.035 0.050
−−− 0.040
0.155
−−−
MILLIMETERS
MIN
MAX
2.18
2.38
0.00
0.13
0.63
0.89
0.72
1.14
4.57
5.46
0.46
0.61
0.46
0.61
5.97
6.22
6.35
6.73
2.29 BSC
9.40 10.41
1.40
1.78
2.90 REF
0.51 BSC
0.89
1.27
−−−
1.01
3.93
−−−
SOLDERING FOOTPRINT*
6.20
0.244
2.58
0.102
5.80
0.228
3.00
0.118
1.60
0.063
6.17
0.243
SCALE 3:1
mm Ǔ
ǒinches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor and the
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC) or its subsidiaries in the United States and/or other countries.
SCILLC owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of SCILLC’s product/patent coverage may be accessed
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