NFA21SL207X1A48L

Reference Only Spec. No. JENF243D-0004R-01 P 1/10 Chip EMIFIL LC Combined Array Type Reference Specification NFA21SL□□□□1A4□□ 1. Scope This reference specification applies to Chip EMIFIL LC Combined Array Type NFA21S Series. 2. Part Numbering NF A 21 SL 207 X 1A 4 8 L Product ID Structure Dimension Features Cut-off Frequency Characteristics Rated Voltage Electrode Dimension Packaging Code (L : Taping / B : Bulk) (LW) (T) 1：06dB 2：27dB 3. Rating Customer Part Number MURATA Part Number NFA21SL506X1A48L NFA21SL506X1A48B NFA21SL806X1A48L NFA21SL806X1A48B NFA21SL207X1A45L NFA21SL207X1A45B NFA21SL207X1A48L NFA21SL207X1A48B NFA21SL307X1A45L NFA21SL307X1A45B NFA21SL307X1A48L Cut-off Insertion Loss (I.L.)(dB min.) Insulation Rated Frequen 50 80 200 300 500 800 1000 Resistance Voltage cy [M min.] [V(DC)] [MHz] MHz MHz MHz MHz MHz MHz MHz 1 － － － 30 － 20 1000 10 20 30 80  2 - - 25 - 25 1000 10 20 30 200   2 - 13 25 25 1000 10 100 30 - 2 7 20 25 1000 10 100 30 300 NFA21SL506X1A4□□：140nH(typ.) NFA21SL806X1A4□□：79 nH (typ.) NFA21SL207X1A4□□：29 nH (typ.) NFA21SL307X1A4□□：29 nH (typ.)  MURATA Part Number Withstanding Voltage [V(DC)] 50 NFA21SL307X1A48B NFA21SL506X1A4□□：80pF (typ.) NFA21SL806X1A4□□：75pF (typ.) NFA21SL207X1A4□□：42pF (typ.) NFA21SL307X1A4□□：22pF (typ.) Customer Part Number Rated Current [mA(DC)] Cut-off Frequency [MHz] 280 MHz NFA21SL287V1A45L NFA21SL287V1A45B 6 280 max. NFA21SL287V1A48L NFA21SL287V1A48B NFA21SL317V1A45L NFA21SL317V1A45B 310 NFA21SL317V1A48L NFA21SL317V1A48B NFA21SL337V1A45L NFA21SL337V1A45B 330 NFA21SL337V1A48L NFA21SL337V1A48B NFA21SL287V1A4□□ : 15pF (typ.) NFA21SL317V1A4□□ : 8pF (typ.) NFA21SL337V1A4□□ : 4pF (typ.) Insertion Loss (I.L.)(dB ) Insulation Rated Rated Withstanding Voltage 310 330 800 900 Resistance Voltage Current [V(DC)] MHz MHz MHz MHz [M min.] [V(DC)] [mA(DC)] - - 25 min. 25 min. 1000 10 100 30 6 max. - 20 min. 20 min. 1000 10 100 30 - 6 max. 15 min. 20 min. 15 min. 20 min. 1000 10 100 30 NFA21SL□□□V1A48□ : 47nH (typ.) NFA21SL□□□V1A45□ : 37nH (typ.)   Operating Temperature: -55°C to +125°C (Includes self-heating.)  Storage Temperature: -55°C to +125°C 4. Standard Testing Condition < Unless otherwise specified > Temperature : Ordinary Temp. / 15 °C to 35 °C Humidity: Ordinary Humidity / 25 %(RH) to 85 %(RH) < In case of doubt > Temperature: 20 °C ± 2 °C Humidity: 60 %(RH) to 70 %(RH) Atmospheric pressure: 86 kPa to 106 kPa MURATA MFG.CO., LTD. Reference Only Spec. No. JENF243D-0004R-01 P 2/10 5. Style and Dimensions 2.0±0.1 ④ ⑤ ⑥ 1.25±0.1 ③ （Top View） Polarity Marking GND ② ①GND 0.2±0.15 ⑦ ⑧ ⑨ ③④⑤⑥： IN（OUT） ⑦⑧⑨⑩： OUT（IN） ⑩ 0.2±0.15 0.25±0.1 0.15 min. 0.25±0.1 T NFA21SL□□□□1A45□ NFA21SL□□□□1A48□ T(mm) 0.5 ±0.1 0.85±0.1 0.5±0.05 （Bottom View） Electrode (in mm) ■ Equivalent Circuits ③ ④ ⑤ ■ Unit Mass(Typical value) NFA21SL□□□□1A45□：0.007g NFA21SL□□□□1A48□：0.012g ⑥ GND② ① GND ⑦ ⑧ ⑨ ⑩ ■Insertion Loss Characteristics: 50ΩSystem (Typ.) NFA21SL□□□V1A48 0 10 10 Insertion Loss (dB) Insertion Loss (dB) NFA21SL□□□X1A48 0 20 30 NFA21SL806X1A48 40 NFA21SL207X1A48 20 30 NFA21SL287V1A48 40 NFA21SL317V1A48 NFA21SL337V1A48 NFA21SL307X1A48 50 50 60 60 10 100 1000 10000 10 1000 10000 1000 10000 NFA21SL□□□V1A45 0 10 10 Insertion Loss (dB) Insertion Loss (dB) NFA21SL□□□X1A45 0 20 30 40 100 Frequency(MHz) Frequency(MHz) NFA21SL207X1A45 20 30 NFA21SL287V1A45 40 NFA21SL317V1A45 NFA21SL307X1A45 NFA21SL337V1A45 50 50 60 60 10 100 1000 10000 Frequency(MHz) 10 100 Frequency(MHz) MURATA MFG.CO., LTD. Reference Only Spec. No. JENF243D-0004R-01 P 3/10 NFA21SL506X1A48 0 10 I.L.(dB) 20 30 40 50 60 10 100 1000 Frequency(MHz) 10000 6. Marking Polarity Marking on capacitor side 7. Electrical Performance No. Item Specification 7.1 Insertion Loss Meet item 3. (I.L.) Test Method 50 10dB Attenuator 50 10dB Specimen Attenuator E 50 50 ～ SG  Method of measurement based on MIL-STD-220 7.2 7.3 Insulation Resistance(I.R.) Withstanding Voltage Products shall not be damaged. 8. Mechanical Performance No. Item Specification 8.1 Appearance and Meet item 5. Dimensions 8.2 Solderability Electrodes shall be at least 90% covered with new solder coating. 8.3 8.4 Resistance to soldering heat Resistance to soldering heat (Reflow) Meet Table 1. Table 1 Appearance No damaged Insertion Loss Insulation Resistance Meet item 3 Meet Table 1. Insertion Loss = 20 log (E0 / E1) E0 : Level without FILTER (short) E1 : Level with FILTER · Voltage : Rated Voltage · Time : 1 minutes · Test Voltage : 30V(DC) · Time : 1 to 5 s · Charge Current : 50 mA max. Test Method Visual Inspection and measured with Micrometer caliper and Microscope. · Flux : Ethanol solution of rosin, 25(wt)% · Pre-heat : 150°C, 60 s · Solder : Sn-3.0Ag-0.5Cu · Solder Temperature : 245 ± 3°C · Immersion Time : 3±1 s · Immersion and emersion rates : 25mm / s · Flux : Ethanol solution of rosin, 25(wt)% · Pre-heat : 150°C, 60 s · Solder : Sn-3.0Ag-0.5Cu · Solder Temperature : 270 ± 5°C · Immersion Time : 10 ± 1 s · Immersion and emersion rates : 25mm / s · Pre-heat : 150~180°C, 90±30 s · Heating : 230 °C min., 60 s max. · Peak Temperature : 260 °C, 10 s max. · Solder : Sn-3.0Ag-0.5Cu · The number of Times : 2 times MURATA MFG.CO., LTD. Reference Only Spec. No. JENF243D-0004R-01 No. 8.5 8.6 Item P 4/10 Drop Specification Products shall be no failure after tested. Bonding Strength The electrodes shall be no failure after tested. Test Method It shall be dropped on concrete or steel board. · Method : Free fall · Height : 1m · Attitude from which the product is dropped : 3 directions · The Number of Time : 3 times for each direction (Total 9 times) It shall be soldered on the glass-epoxy substrate. · Applying Force (F) : 9.8 N · Applying Time : 30 s 0.5 0.25 1.6 0.25 (in mm) It shall be soldered on the glass-epoxy substrate. · Oscillation Frequency : 10 to 2000 to 10Hz for 20 minutes. · Total amplitude 1.5 mm or Acceleration amplitude 196m/s2 whichever is smaller. · Time : A period of 2 hours in each of 3 mutually perpendicular directions. (Total 6 hours) 8.7 Vibration Meet Table 1. 8.8 Bending Strength Products shall be no failure after tested. It shall be soldered on the glass-epoxy substrate (t = 1.0mm). · Deflection : 2.0 mm · Keeping Time : 30 s Pressure jig R230 F Deflection 45 45 Product (in mm) 9. Environment Performance It shall be soldered on the glass-epoxy substrate. No. Item Specification 9.1 Temperature Meet Table 1. Cycling 9.2 Humidity 9.3 Heat Life Test Method · 1 Cycle 1 step : -55 ± 03 °C / 30 ± 30 min 2 step : Room Temperature / within 3 min 3 step : +125 ± 30 °C / 30 ± 30 min 4 step : Room Temperature / within 3 min · Total of 100 cycles · Temperature : 40 ± 2 °C · Humidity : 90 to 95%(RH) · Time : 500± 240 hours · Temperature : 125 ± 2 °C · Test Voltage : Rated Voltage 200% · Charge Current : 50 mA max. · Time : 1000 ± 480 hours MURATA MFG.CO., LTD. Reference Only Spec. No. JENF243D-0004R-01 P 5/10 10. Specification of Packaging 10.1. Appearance and Dimensions (8mm-wide plastic tape) Embossed Cavity 2.30 ±0.1 1.55±0.1 4.0±0.1 2.0±0.05 0.25±0.05 8.0 ±0.2  1.5± 0.1 0 3.5 ±0.05 Sprocket Hole 1.75±0.1 Dimension of the Cavity is measured at the bottom side. 4.0±0.1 0.7±0.05 (in mm) Direction of feed Embossed Cavity  1.0± 0.2 0 1.45±0.1 4.0±0.1 2.0±0.05 0.25±0.05 8.0±0.2 0.1 0 2.25±0.1   1.5± 3.5±0.05 Sprocket Hole 1.75±0.1 Dimension of the Cavity is measured at the bottom side. 4.0±0.1 1.05±0.05 (in mm) Direction of feed 10.2.Specification of Taping (1) Packing quantity (standard quantity) 4000 pcs. / reel (2) Packing Method Products shall be packaged in the cavity of the plastic tape and sealed with cover tape. (3) Sprocket Hole The sprocket holes are to the right as the tape is pulled toward the user. (4) Spliced point The cover tape have no spliced point. (5) Missing components number Missing components number within 0.025% of the number per reel or 1 pc., whichever is greater, and are not continuous. The specified quantity per reel is kept. 10.3. Pull Strength of Plastic Tape and Cover Tape Plastic tape 5N min. Cover tape 10N min. 10.4. Peeling off force of cover tape 0.2N to 0.7N (minimum value is typical) Speed of Peeling off : 300 mm / min 165 to 180 degree F Cover tape Plastic tape MURATA MFG.CO., LTD. Reference Only Spec. No. JENF243D-0004R-01 P 6/10 10.5.Dimensions of Leader-tape, Trailer and Reel There shall be leader-tape (top tape and empty tape) and trailer-tape (empty tape) as follows. 10.6.Marking for reel Customer part number , MURATA part number , Inspection number(1) , RoHS marking(2) , Quantity , etc 1) « Expression of Inspection No. » □□ OOOO  (1) (1) Factory Code (2) Date (2) (3) First digit : Year / Last digit of year Second digit : Month / Jan. to Sep.  1 to 9, Oct. to Dec.  O,N,D Third, Fourth digit : Day (3) Serial No. 2) « Expression of RoHS marking » ROHS – Y (△) (1) (2) (1) RoHS regulation conformity parts. (2) MURATA classification number 10.7.Marking for Outside package (corrugated paper box) Customer name , Purchasing Order Number , Customer Part Number , MURATA part number , RoHS marking (2) , Quantity , etc 10.8. Specification of Outer Case Label H D W Outer Case Dimensions Standard Reel Quantity in Outer Case (mm) (Reel) W D H 186 186 93 5 Above Outer Case size is typical. It depends on a quantity of an order. 11. Standard Land Dimensions The chip EMI filter suppresses noise by conducting the high-frequency noise element to ground. Therefore, to get enough noise reduction, feed through holes which is connected to ground-plane should be arranged according to the figure to reinforce the ground-pattern. < Standard land dimensions for reflow > Side on which chips are mounted 2.5  Small diameter thru hole  0.2 0.25 0.25 0.5 0.25 0.25 1.75 0.25 0.5 1.5 Resist Copper foil pattern MURATA MFG.CO., LTD. (in mm) Reference Only Spec. No. JENF243D-0004R-01 P 7/10 12. ! Caution 12.1. Limitation of Applications Please contact us before using our products for the applications listed below which require especially high reliability for the prevention of defects which might directly cause damage to the third party’s life, body or property. (1) Aircraft equipment (2) Aerospace equipment (3) Undersea equipment (4) Power plant control equipment (5) Medical equipment (6) Transportation equipment(automobiles, trains, ships, etc.) (7) Traffic signal equipment (8) Disaster prevention / crime prevention equipment (9) Data-processing equipment (10) Applications of similar complexity or with reliability requirements comparable to the applications listed in the above 12.2. Corrosive gas Please refrain from use since contact with environments with corrosive gases (sulfur gas [hydrogen sulfide, sulfur dioxide, etc.], chlorine, ammonia, etc.) or oils (cutting oil, silicone oil, etc.) that have come into contact with the previously stated corrosive gas environment will result in deterioration of product quality or an open from deterioration due to corrosion of product electrode, etc. We will not bear any responsibility for use under these environments. 13. Notice Products can only be soldered with reflow. This product is designed for solder mounting. Please consult us in advance for applying other mounting method such as conductive adhesive. 13.1. Mounting direction of a product In the case of mounting, Polarity Marking should surely serve as the upper surface. When mounted upside down, since the Polarity Marking is formed with the conductor, it has a possibility that the shortcircuit between terminals may occur. 13.2.Flux and Solder Flux Use rosin-based flux, Do not use highly acidic flux (with chlorine content exceeding 0.2(wt)%). Do not use water soluble flux. Solder Use Sn-3.0Ag-0.5Cu solder Other flux (except above) Please contact us for details, then use. 13.3.Note for Assembling < Thermal Shock > Pre-heating should be in such a way that the temperature difference between solder and products surface is limited to 100°C max. Also cooling into solvent after soldering should be in such a way that the temperature difference is limited to 100°C max. 13.4.Attention Regarding P.C.B. Bending The following shall be considered when designing P.C.B.'s and laying out products. (1) P.C.B. shall be designed so that products are not subject to the mechanical stress for board warpage. [Products direction] a b 〈 Poor example 〉 Products shall be located in the sideways direction (Length:ab) to the mechanical stress. 〈 Good example〉 (2)Components location on P.C.B. separation. It is effective to implement the following measures, to reduce stress in separating the board. It is best to implement all of the following three measures; however, implement as many measures as possible to reduce stress. Contents of Measures (1) Turn the mounting direction of the component parallel to the board separation surface. (2) Add slits in the board separation part. (3) Keep the mounting position of the component away from the board separation surface. MURATA MFG.CO., LTD. Stress Level A > D *1 A > B A > C Reference Only Spec. No. JENF243D-0004R-01 P 8/10 *1 A > D is valid when stress is added vertically to the perforation as with Hand Separation.If a Cutting Disc is used, stress will be diagonal to the PCB, therefore A > D is invalid. (3) Mounting Components Near Screw Holes When a component is mounted near a screw hole, it may be affected by the board deflection that occurs during the tightening of the screw. Mount the component in a position as far away from the screw holes as possible. 13.5. Pre-heating Temperature Soldering shall be handled so that the difference between pre-heating temperature and solder temperature shall be limited to 100°C max. to avoid the heat stress for the products. 13.6. Reflow Soldering 1) Soldering paste printing for reflow · Standard thickness of solder paste: 100µm to 150µm. · Use the solder paste printing pattern of the below pattern. · For the resist and copper foil pattern, use standard land dimensions. Standard printing pattern of solder paste. 0.5 1.5 0.5 0.25 0.25 0.25 0.75 1.75 (in mm) MURATA MFG.CO., LTD. Reference Only Spec. No. JENF243D-0004R-01 P 9/10 2) Soldering Conditions Standard soldering profile and the limit soldering profile is as follows. The excessive limit soldering conditions may cause leaching of the electrode and / or resulting in the deterioration of product quality. Temp. (℃) 260℃ 245℃±3℃ 220℃ 230℃ Limit Profile 180 150 Standard Profile 30s～60s 60s max. 90s±30s Pre-heating Heating Peak temperature Cycle of reflow Time. (s) Standard Profile 150～180°C, 90s±30s above 220°C, 30s～60s 245±3°C 2 times Limit Profile above 230°C, 60s max. 260°C,10s 2 times 13.7. Reworking with Soldering iron The following conditions shall be strictly followed when using a soldering iron. Pre-heating : 150°C, 1 min Soldering iron output : 30W max. Tip temperature : 350°C max.  Tip diameter : φ3mm max. Soldering time : 3(+1,-0) s  Times : 2times max. Note: Do not directly touch the products with the tip of the soldering iron in order to prevent the crack on the ceramic material due to the thermal shock. 13.8. Solder Volume Solder shall be used not to be exceeded as shown below. Upper Limit Upper Limit Recommendable Recommendable t 1/3T  t T(T:Chip thickness) Accordingly increasing the solder volume, the mechanical stress to product is also increased. Excessive solder volume may cause the failure of mechanical or electrical performance. 13.9. Cleaning Conditions Products shall be cleaned on the following conditions. (1) Cleaning temperature shall be limited to 60°C max. (40°C max. for IPA.) (2) Ultrasonic cleaning shall comply with the following conditions, with avoiding the resonance phenomenon at the mounted products and P.C.B. Power: 20W / l max. Frequency: 28kHz to 40kHz Time: 5 minutes max. (3) Cleaner 1. Cleaner · Isopropyl alcohol (IPA) 2. Aqueous agent · PINE ALPHA ST-100S (4) There shall be no residual flux and residual cleaner after cleaning. In the case of using aqueous agent, products shall be dried completely after rinse with de-ionized water in order to remove the cleaner. (5) Other cleaning Please contact us. MURATA MFG.CO., LTD. Reference Only Spec. No. JENF243D-0004R-01 P 10/10 13.10. Operating Environment Do not use this product under the following environmental conditions, on deterioration of the Insulation Resistance o f the Ferrite material and/or corrosion of Inner Electrode may result from the use. (1) In the corrodible atmosphere such as acidic gases, alkaline gases, chlorine, sulfur gases, organic gases and etc. (the sea breeze, Cl2, H2S, NH3, SO2, NO2,etc) (2) in the atmosphere where liquid such as organic solvent, may splash on the products. (3) in the atmosphere where the temperature / humidity changes rapidly and it is easy to dew. 13.11. Resin coating The capacitance and inductance value may change and/or it may affect on the product's performance due to high curestress of resin to be used for coating / molding products. So please pay your careful attention when you select resin. In prior to use, please make the reliability evaluation with the product mounted in your application set. 13.12. Handling of a substrate After mounting products on a substrate, do not apply any stress to the product caused by bending or twisting to the substrate when cropping the substrate, inserting and removing a connector from the substrate or tightening screw to the substrate. Excessive mechanical stress may cause cracking in the product. 13.13. Storage condition (1) Storage period Use the products within 12 months after delivered. Solderability should be checked if this period is exceeded. (2) Storage environment condition · Products should be stored in the warehouse on the following conditions. Temperature: -10 to +40°C Humidity: 15 to 85% relative humidity No rapid change on temperature and humidity · Don’t keep products in corrosive gases such as sulfur, chlorine gas or acid, or it may cause oxidization of electrode, resulting in poor solderability. · Products should be stored on the palette for the prevention of the influence from humidity, dust and so on. · Products should be stored in the warehouse without heat shock, vibration, direct sunlight and so on. · Avoid storing the product by itself bare (i.e.exposed directly to air). (3) Delivery Care should be taken when transporting or handling product to avoid excessive vibration or mechanical shock. 14. ！ Note (1) Please make sure that your product has been evaluated in view of your specifications with our product being mounted to your product. (2) You are requested not to use our product deviating from the reference specifications. (3) The contents of this reference specification are subject to change without advance notice. Please approve our product specifications or transact the approval sheet for product specifications before ordering. MURATA MFG.CO., LTD.