NFE31PT222Z1E9L

Reference Only Spec. No. JENF243E-0002P-01 P1/8 Chip EMIFIL ® LC Combined Type for Large Current NFE31PT□□□□1E9□ Reference Specification 1. Scope This reference specification applies to Chip EMIFIL ® LC Combined Type for Large Current NFE31P Series. 2. Part Numbering NF E Product ID Structure 31 PT Dimension Features (L  W) 3. Rating Customer Part Number Murata Part Number NFE31PT220R1E9L NFE31PT220R1E9B NFE31PT470C1E9L NFE31PT470C1E9B NFE31PT101C1E9L NFE31PT101C1E9B NFE31PT221D1E9L NFE31PT221D1E9B NFE31PT471F1E9L NFE31PT471F1E9B NFE31PT152Z1E9L NFE31PT152Z1E9B NFE31PT222Z1E9L NFE31PT222Z1E9B 220 Capacitance R 1E Characteristics Rated Voltage Capacitance 9 Electrode L Packaging Code (L: Taping / B: Bulk) Rated Voltage Withstanding Voltage Rated Current Insulation Resistance 25 V (DC) 62.5 V (DC) 6A (DC) 1000 M min. 22pF ± 30% 47pF ± ５０ ２０ % 100pF ± ８０ ２０ % 220pF ± ５０ ２０ % 470pF ± ５０ ２０ % 1500pF ± ５０ ２０ % 2200pF ± 50%  Operating Temperature: - 40 °C to + 85 °C 4. Standard Testing Condition Temperature: Ordinary Temp. 15 °C to 35 °C Humidity: Ordinary Humidity 25 %(RH) to 85 %(RH)  Storage Temperature: - 55 °C to + 125 °C Temperature: 20 °C ± 2 °C Humidity: 60 %(RH) to 70 %(RH) Atmospheric pressure: 86kPa to 106kPa 5. Style and Dimensions 0.7±0.2 1.0±0.2 (1) 0.7±0.2 1 .6 ±0 .1 5 1.6±0.15 ■ Equivalent Circuit (3) 1 .6 ±0 .1 5 (2) Input Output (1) (3) GND (2) 3.2±0.35 (in mm)  (1),(3):No Polarity ■ Unit Mass (Typical value) 0.034g Note : Gap and bend between ceramic capacitor(1) and ferrite bead(2) may come out as illustrated below, however, these are not affect the performance, mounting and reliability of the products. 0.3 max. 1 2 1 0.1max. MURATA MFG. CO., LTD. 2 (in mm) Reference Only Spec. No. JENF243E-0002P-01 P2/8 ■ Insertion Loss Characteristics (I.L.) (Typ.) 6. Marking No marking 7. Electrical Performance No. 7.1 Item Capacitance Specification Test Method Table 1 Meet item 3. Capacitance 22 (pF) 47,100,220,470 1500 (pF) 2200 (pF) 7.2 7.3 Insulation Resistance(I.R.) Withstanding Voltage Products shall not be damaged. Voltage 1 to 5 V(rms) Frequency 1MHz ± 10% 1±0.2 V(rms) 1kHz ± 10% 0.1 V(rms) max. 1kHz ± 10% Voltage : 25 V(DC) Time : 60±5 seconds Test Voltage : 62.5 V(DC) Testing Time : 1 to 5 seconds Limit the charging current: 10mA max. 8. Mechanical Performance No. 8.1 8.2 8.3 Item Appearance and Dimensions Solderability Resistance to soldering heat Specification Meet item 5. The electrodes shall be at least 75% covered with new solder coating. Meet Table 2. Table 2 Appearance No damaged 22,47,100 within 220 (pF) ±15% Cap. Change 470,1500 within 2200 (pF) ±30% I.R. meet item 3 Withstanding No damaged Voltage Test Method Visual Inspection and measured with Slide Calipers Flux : Ethanol solution of rosin, 25(wt)% Pre-heat : 150 ± 10 °C, 60 ~ 90 s Solder : Sn-3.0Ag-0.5Cu Solder Temperature : 240 ± 3 °C Immersion Time : 3 ± 1 s Immersion and emersion rates : 25mm / s Flux : Ethanol solution of rosin, 25(wt)% Pre-heat : 150 ± 10 °C, 60 ~ 90 s Solder : Sn-3.0Ag-0.5Cu Solder Temperature : 270 ± 5 °C (for NFE31PT152Z1E9□ : 250±5°C) Immersion Time : 10 ± 1 s Immersion and emersion rates : 25mm / s Then measured after exposure the room condition for 4 to 48 hours. MURATA MFG. CO., LTD. Reference Only Spec. No. JENF243E-0002P-01 No. Item 8.4 Bending Strength Specification P3/8 Test Method It shall be soldered on the paper-phenol substrate. (t=1.6mm) Meet Table 3. Table 3 Pressure jig Appearance No damaged 22,47,100 within 220 (pF) ±15% Cap. Change 470,1500 within 2200 (pF) ±30% F R340 Deflection 45 45 Product (in mm) Deflection : 3 mm Keeping Time : 30 seconds 9. Environment Performance (It shall be soldered on the substrate.) No. Item Specification 9.1 Humidity Meet Table 4. Table 4 Appearance 9.2 Heat Life Cap. Change I.R. Withstanding Voltage 9.3 Temperature Cycling Test Method Temperature : 40 ± 2 °C Humidity : 90 to 95 %(RH) Time : 500 h (+ 24h , - 0h) Then measured after exposure in the room condition for 4 to 48 hours. No damaged 22,47,100 within 220 (pF) ±15% 470,1500 within 2200 (pF) ±30% 100 M min. Temperature : 85 ± 2 °C Test Voltage : 22,47,100,220(pF) : Rated Voltage  200 % 470,1500,2200(pF) : Rated Voltage  150 % Time : 1000 h (+ 48h , - 0h) Then measured after exposure in the room condition for 4 to 48 hours. 1 Cycle 1 step: -55 °C (+ 0°C , - 3°C) / 30 ± 3 min. 2 step: Room Temperature / within 5 min. 3 step: +125 °C (+ 3°C , - 0°C) / 30 ± 3 min. 4 step: Room Temperature / within 5 min. Total of 10 cycles Then measured after exposure in the room condition for 4 to 48 hours. No damaged Meet Table 2. 0.1 0 Embossed Cavity 3.6±0.05 0.1 1.8±0.05 1.8±0.1 4.0±0.1 2.0±0.05 0.2±0.1 8.0±0.2  1.5± 3.5±0.05 Sprocket Hole 1.75±0.1 10. Specification of Packaging 10.1. Appearance and Dimensions (8mm-wide plastic tape) 4.0±0.1 Dimension of the Cavity is measured at the bottom side. 1.85±0.1 Direction of feed MURATA MFG. CO., LTD. (in mm) Reference Only Spec. No. JENF243E-0002P-01 P4/8 10.2. Specification of Taping (1) Packing quantity (standard quantity) 2000 pcs. / reel (2) Packing Method Products shall be packaged in the cavity of the plastic tape and sealed with cover tape. (3) Sprocket Hole The sprocket holes are to the right as the tape is pulled toward the user. (4) Spliced point The cover tape have no spliced point. (5) Missing components number Missing components number within 0.1% of the number per reel or 1 pc., whichever is greater, and are not continuous. The specified quantity per reel is kept. 10.3. Pull Strength of Plastic Tape and Cover Tape Plastic tape 5N min. Cover tape 10N min. 165 to 180 degree 10.4. Peeling off force of cover tape 0.2N to 0.7N (minimum value is typical)  Speed of Peeling off : 300 mm / min F Cover tape Plastic tape 10.5. Dimensions of Leader-tape, Trailer and Reel There shall be leader-tape (cover tape only and empty tape) and trailer-tape (empty tape) as follows. Leader Trailer 2.0±0.5 160 min. Label 190 min. 210 min. Empty tape Cover tape  13.0±0.2 1  60± 0  21.0±0.8 9± 10 Direction of feed 13±1.4 0  180± 3 (in: mm) 10.6. Marking for reel Customer part number , MURATA part number , Inspection number(1) , RoHS marking(2) , Quantity , etc 1) « Expression of Inspection No. » □□ OOOO  (1) (2) (3) (1) Factory Code (2) Date First digit : Year / Last digit of year Second digit : Month / Jan. to Sep.  1 to 9, Oct. to Dec.  O, N, D Third, Fourth digit : Day (3) Serial No. 2) « Expression of RoHS marking » ROHS – Y (△) (1) (2) (1) RoHS regulation conformity parts. (2) MURATA classification number 10.7. Marking for Outside package (corrugated paper box) Customer name , Purchasing Order Number , Customer Part Number , MURATA part number , RoHS marking(2) , Quantity , etc MURATA MFG. CO., LTD. Reference Only Spec. No. JENF243E-0002P-01 P5/8 10.8. Specification of Outer Case Label H D W Outer Case Dimensions Standard Reel Quantity in Outer Case (mm) (Reel) W D H 186 186 93 5 Above Outer Case size is typical. It depends on a quantity of an order. 11. Standard Land Dimensions The chip EMI filter suppresses noise by conducting the high-frequency noise element to ground. Therefore, to get enough noise reduction, feed through holes which is connected to ground-plane should be arranged according to figure to reinforce the ground-pattern. (Standard land dimensions for reflow) ･Side on which chips are mounted 12. 2.6 3.0 1.0 Small diamenter thru hole ( 0.4) 0.6 1.2 2.2 4.2 Resist Copper foil pattern No pattern (in mm) ! Caution Limitation of Applications Please contact us before using our products for the applications listed below which require especially high reliability for the prevention of defects which might directly cause damage to the third party’s life, body or property. (1)Aircraft equipment (2)Aerospace equipment (3)Undersea equipment (4)Power plant control equipment (5)Medical equipment (6)Transportation equipment(automobiles, trains, ships, etc.) (7)Traffic signal equipment (8)Disaster prevention / crime prevention equipment (9)Data-processing equipment (10)Applications of similar complexity or with reliability requirements comparable to the applications listed in the above 13. Notice Products can only be soldered with reflow. If it were soldered with flow, cracks might be caused in the ceramic body. This product is designed for solder mounting. Please consult us in advance for applying other mounting method such as conductive adhesive. 13.1. Flux and Solder Flux Solder Use rosin-based flux, Do not use highly acidic flux (with chlorine content exceeding 0.2(wt)%). Do not use water-soluble flux. Use Sn-3.0Ag-0.5Cu solder 13.2. Note for Assembling < Thermal Shock > Pre-heating should be in such a way that the temperature difference between solder and products surface is limited to 100 °C max. Also cooling into solvent after soldering should be in such a way that the temperature difference is limited to 100°C max. MURATA MFG. CO., LTD. Reference Only Spec. No. JENF243E-0002P-01 P6/8 13.3. Attention Regarding P.C.B. Bending The following shall be considered when designing P.C.B.'s and laying out products. (1) P.C.B. shall be designed so that products are not subject to the mechanical stress for board warpage. 〔Products direction〕 a Products shall be located in the sideways direction (Length:ab) to the mechanical stress. b 〈 Poor example 〉 〉 〈 Good (2) Products location on P.C.B. near seam forexample separation. Products (A,B,C,D) shall be located carefully so that products are not subject to the mechanical stress due to warping the board. Because they may be subjected the mechanical stress in order of ACB  D. Seam b A C B D Slit Lengh:a