NFE61HT332Z2A9L

Reference Only Reference Spec. No. JENF243E-9101C-01 P 1 /9 Chip EMIFIL LC Combined Type for Large Current NFE61HT□□□□2A9□ Reference Specification [AEC-Q200] 1. Scope This reference specification applies to Chip EMIFIL LC Combined Type for Large Current NFE61H Series for Automotive Electronics based on AEC-Q200. 2. Part Numbering NF Product ID E 61 Structure Dimension (LW) HT Features 101 Capacitance Z 2A 9 L Characteristics Rated Electrode Packaging Voltage Code (L: Taping / B: Bulk) 3. Rating Customer Part Number Murata Part Number NFE61HT330U2A9L NFE61HT330U2A9B NFE61HT680R2A9L NFE61HT680R2A9B NFE61HT101Z2A9L NFE61HT101Z2A9B NFE61HT181C2A9L NFE61HT181C2A9B NFE61HT361C2A9L NFE61HT361C2A9B NFE61HT681D2A9L NFE61HT681D2A9B NFE61HT102F2A9L NFE61HT102F2A9B NFE61HT332Z2A9L NFE61HT332Z2A9B Capacitance Rated Voltage Withstanding Voltage Rated Current Insulation Resistance ESD Rank 2:2kV 100 V (DC) 250 V(DC) 2 A(DC) 1000 M min. 2 33pF ± 30% 68pF ± 30% 100pF ± 30% 180pF ± 30% 360pF ± 20% 680pF ± 30% 1000pF ± ８０ ２０ % 3300pF ± ８０ ２０ %  Operating Temperature: - 55 °C to + 125 °C  Storage Temperature: - 55 °C to + 125 °C 4. Standard Testing Condition Temperature : Ordinary Temp. 15°C to 35°C Humidity : Ordinary Humidity 25 %(RH) to 85 %(RH) Temperature: 20°C ± 2°C Humidity : 60 %(RH) to 70 %(RH) Atmospheric pressure : 86kPa to 106kPa 5. Style and Dimensions 2.6±0.3 0.7±0.2 (1) (2) (3) ■ Equivalent Circuit 1 .6 ±0 .3 1 .6 ±0 .3 0.7±0.2 Input Output (1) (3) GND (2) 6.8± 0.3 0.5 1.6±0.3  (1),(3):No Polarity ■ Unit Mass(Typical value) 0.062g Note : Gap and bend between ceramic capacitor() and ferrite bead(1) may come out as illustrated below, however, these are not affect the performance, mounting and reliability of the products. 0.5 max.  1  0.1 max. MURATA MFG. CO., LTD. 1 (in mm) Reference Only Reference Spec. No. JENF243E-9101C-01 ■ P 2 /9 Insertion Loss Characteristics (I.L.) (Typ.) (50Ωsystem) 6. Marking No marking. 7. Electrical Performance No. 7.1 Item Capacitance Specification Test Method Table 1 Meet item 3. Capacitance 33,68,100 (pF) 180,360,680 1000,3300 (pF) 7.2 7.3 7.4 Insulation Resistance(I.R.) Withstanding Voltage Meet item 3. Resistance to Surge Voltage Meet Table 2. Products shall not be damaged. Table 2 Appearance Cap. Change I.R. Withstanding Voltage No damaged 33,68,100 within 180,360 ±15% 680 (pF) 1000 within 3300 (pF) ±30% 1000 M min. No damaged Voltage 1 to 5 V(rms) Frequency 1MHz±10% 1±0.2 V(rms) 1kHz±10% Voltage : 100 V(DC) Time : 60 ± 5 seconds Test Voltage : 250 V(DC) Testing Time : 1 to 5 seconds Limit the charging current: 10mA max. Attenuating transient voltage of exponential function shall be applied to products on the condition. Relay 10 100 EB 0.47µF 1 Product 2 3 EB 400V Peak Voltage : 400 V Force Period : 1 s The number of Surges : 105 8. Q200 Requirement 8-1. Performance (based on Table 13 for Ferrite EMI SUPPRESSORS/FILTERS) AEC-Q200 Rev.D issued June. 1 2010 No. 3 AEC-Q200 Stress Test Method High Temperature 1000hours at 125C Exposure Set for 24hours (Storage) at room temperature, then measured. Murata Specification / Deviation Meet TABLE A after testing. Table A Appearance Capacitance Change 33pF to 680pF (33pF-100pF: 1MHz+/-10%) (180pF-3300pF: 1000pF to 3300pF 1kHz+/-10%) I.R. Withstanding Voltage MURATA MFG. CO., LTD. No damage Within +/-15% at 20C Within +/-30% at 20C 1000M ohm min. No damage Reference Only Reference Spec. No. JENF243E-9101C-01 P 3 /9 AEC-Q200 No. 4 5 7 Stress Temperature Cycling 9 10 12 Murata Specification / Deviation Meet Table B after testing. Table B Appearance Capacitance Change (33pF-100pF: 1MHz+/10%) (180pF-3300pF: 1kHz+/10%) I.R. Withstanding Voltage Destructive Per EIA469 Physical Analysis No electrical tests Biased 1000hours 85C/85%RH. Meet Table B after testing. Apply Maximum rated Voltage and current. Humidity 8 Test Method 1000cycles(-55C to 125C) Measurement at 24±2 hours after test conclusion. Operational Life No damage 33pF to 680pF Within +/-15% at 20C 1000pF to 3300pF Within +/-30% at 20C No defects Measurement at 24+/-2 hours after test conclusion. 1000hours at 125C Meet Table B after testing. Apply Maximum rated Current. External Visual Physical Dimension Measurement at 24+/-2 hours after test conclusion. Visual inspection No abnormalities Meet ITEM 4 No defects (Style and Dimensions) Resistance Per MIL-STD-202 Method 215 Not Applicable to Solvents 13 17 Mechanical Shock Per MIL-STD-202 Method 213 Figure 1 of Method 213. Condition F(1500g's/0.5ms/Half sine) Three times each 6 direction. Vibration 5g's for 20 minutes, 12cycles each of 3 oritentations Osscillation Frequency : 102000Hz. Resistance No heating. to Soldering Heat 260C +/- degree C Immersion time 10s ESD Per AEC-Q200-002 18 Solderbility Per J-STD-002 19 Electrical Characterization Measured :Capacitance 14 15 Meet Table A after testing. Meet Table A after testing. Pre-heating: 150C+/-5C, 60s+/-5s Meet Table A after testing. Meet Table C after testing. ESD Rank: Refer to Item 3. Rating. Table C Appearance No damage I.R. 1000M ohm min Withstanding Voltage No damage Method b : Not Applicable 75% of the terminations is to be soldered. No defects MURATA MFG. CO., LTD. 100M ohm min No damage Reference Only Reference Spec. No. JENF243E-9101C-01 P 4 /9 AEC-Q200 No. Stress 20 Flammability 21 Board Flex Murata Specification / Deviation Test Method Per UL-94 Epoxy-PCB(1.6mm) Deflection 2mm(min) 60s minimum holding time 22 Terminal Strength 30 Electrical Transient Conduction Not Applicable Meet Table D after testing. Table D Capacitance Change (33pF-100pF: 1MHz+/10%) (180pF-3300pF: 1kHz+/10%) Per AEC-Q200-006 A force of 17.7N for 60sec Per ISO-7637-2 33pF to 680pF Within +/-15% at 20C 1000pF to 3300pF Within +/-30% at 20C 17.7N for 60sec No defects Not Applicable 9. Specification of Packaging 9.1. Appearance and Dimensions (12mm-wide plastic tape) Embossed Cavity 4.0±0.1 4.0±0.1 2.0±0.05 0.3±0.1 1 2 .0 ±0 .3 5 .5 ±0 .0 5 1 .7 5 ±0 .1 +0.1  1.5 - 0 7 .2 ±0 .1 Sprocket Hole 1.9±0.1 Dimension of the Cavity is measured at the bottom side. 1.75±0.1 Direction of feed (in mm) 9.2. Specification of Taping (1) Packing quantity (standard quantity) 2500 pcs. / reel (2) Packing Method Products shall be packaged in the cavity of the plastic tape and sealed with cover tape. (3) Sprocket Hole The sprocket holes are to the right as the tape is pulled toward the user. (4) Spliced point The cover tape have no spliced point. (5) Missing components number Missing components number within 0.025% of the number per reel or 1 pc., whichever is greater, and are not continuous. The specified quantity per reel is kept. 9.3. Pull Strength of Plastic Tape and Cover Tape Plastic tape 5N min. Cover tape 10N min. 9.4. Peeling off force of cover tape 165° ~ 180° 0.2N to 0.7N (minimum value is typical)  Speed of Peeling off : 300 mm / min F Cover Tape Plastic Tape MURATA MFG. CO., LTD. Reference Only Reference Spec. No. JENF243E-9101C-01 P 5 /9 9.5. Dimensions of Leader-tape, Trailer and Reel There shall be leader-tape (cover tape only and empty tape) and trailer-tape (empty tape) as follows. 2.0±0.5 Leader Trailer 160 min. 190 min. Label Empty tape 210 min. Cover tape  13.0±0.2 1  60± 0  21.0±0.8 13± 10 Direction of feed 17±1.4 (in: mm) 0  180± 3 9.6. Marking for reel Customer part number , MURATA part number , Inspection number(1) , RoHS marking(2) , Quantity , etc 1) « Expression of Inspection No. » □□ OOOO  (1) (1) Factory Code (2) Date (2) (3) First digit : Year / Last digit of year Second digit : Month / Jan. to Sep.  1 to 9, Oct. to Dec.  O, N, D Third, Fourth digit : Day (3) Serial No. 2) « Expression of RoHS marking » ROHS – Y (△) (1) (2) (1) RoHS regulation conformity parts. (2) MURATA classification number 9.7. Marking for Outside package (corrugated paper box) Customer name , Purchasing Order Number , Customer Part Number , MURATA part number , RoHS marking (2) , Quantity , etc 9.8. Specification of Outer Case Label H D W Outer Case Dimensions Standard Reel Quantity in Outer Case (mm) (Reel) W D H 186 186 93 4 Above Outer Case size is typical. It depends on a quantity of an order. 10. Standard Land Dimensions The chip EMI filter suppresses noise by conducting the high-frequency noise element to ground. Therefore, to get enough noise reduction, feed through holes which is connected to ground-plane should be arranged according to the figure to reinforce the ground-pattern. (b) Standard land dimensions for flow (But, NFE61HT332Z2A9□ is not applicable.) ･Side on which chips are mounted ･Side on which chips are mounted Small diameter thru hole  0.4 2.0 4.8 8.8 Resist Copper foil pattern No pattern MURATA MFG. CO., LTD. 0.6 1.2 1.6 2.6 3.0 Small diameter thru hole  0.4 1.5 3.8 4.8 9.0 3.2 3.6 (a) Standard land dimensions for reflow Resist Copper foil pattern No pattern (in mm) Reference Only Reference Spec. No. JENF243E-9101C-01 11. ! P 6 /9 Caution 11.1. Limitation of Applications Please contact us before using our products for the applications listed below which require especially high reliability for the prevention of defects which might directly cause damage to the third party’s life, body or property. (1)Aircraft equipment (2)Aerospace equipment (3)Undersea equipment (4)Power plant control equipment (5)Medical equipment (6)Transportation equipment( trains, ships, etc.) (7)Traffic signal equipment (8)Disaster prevention / crime prevention equipment (9)Data-processing equipment (10)Applications of similar complexity or with reliability requirements comparable to the applications listed in the above 11.2. Fail Safe Be sure to provide an appropriate fail-safe function on your product to prevent from a second damage that may be caused by the abnormal function or the failure of our products. 11.3. Corrosive gas Please refrain from use since contact with environments with corrosive gases (sulfur gas [hydrogen sulfide, sulfur dioxide, etc.], chlorine, ammonia, etc.) or oils (cutting oil, silicone oil, etc.) that have come into contact with the previously stated corrosive gas environment will result in deterioration of product quality or an open from deterioration due to corrosion of product electrode, etc. We will not bear any responsibility for use under these environments. 12. Notice  This product is designed for solder mounting. Please consult us in advance for applying other mounting method such as conductive adhesive. 12.1. Flux and Solder Flux Solder Use rosin-based flux, Do not use highly acidic flux (with chlorine content exceeding 0.2(wt)%). Do not use water-soluble flux. Use Sn-3.0Ag-0.5Cu solder 12.2. Note for Assembling < Thermal Shock > Pre-heating should be in such a way that the temperature difference between solder and products surface is limited to 100°C max. Also cooling into solvent after soldering should be in such a way that the temperature difference is limited to 100°C max. The mounting of 2.5mm pitch should be prevented on flow soldering to avoid an excess of solder volume. < Exclusive Use of Reflow Soldering > NFE61HT332Z2A9□ can only be soldered with reflow. If it were soldered with flow, cracks might be caused in the ceramic body. So, reflow soldering shall be applied for products. 12.3. Attention Regarding P.C.B. Bending The following shall be considered when designing P.C.B.'s and laying out products. (1) P.C.B. shall be designed so that products are not subject to the mechanical stress for board warpage. 〔Products direction〕 a b 〈 Poor example〉 Products shall be located in the sideways direction (Length:ab) to the mechanical stress. 〈 Good example 〉 MURATA MFG. CO., LTD. Reference Only Reference Spec. No. JENF243E-9101C-01 P 7 /9 (2) Components location on P.C.B. separation. It is effective to implement the following measures, to reduce stress in separating the board. It is best to implement all of the following three measures; however, implement as many measures as possible to reduce stress. Contents of Measures (1) Turn the mounting direction of the component parallel to the board separation surface. (2) Add slits in the board separation part. (3) Keep the mounting position of the component away from the board separation surface. Stress Level A > D *1 A > B A > C *1 A > D is valid when stress is added vertically to the perforation as with Hand Separation.If a Cutting Disc is used, stress will be diagonal to the PCB, therefore A > D is invalid. (3) Mounting Components Near Screw Holes When a component is mounted near a screw hole, it may be affected by the board deflection that occurs during the tightening of the screw. Mount the component in a position as far away from the screw holes as possible. 12.4. Standard Soldering Conditions On flow soldering (e.g. double wave soldering), use the product in consideration of the conditions of solder, solder temperature and immersion time (melting time) because longer soldering time may cause the corrosion of the electrode. On dipping soldering, use the product in consideration of the conditions of solder, solder temperature, flux, preheat and so on because de-wetting may be caused. Standard soldering profile and the limit soldering profile is as follows. The excessive soldering conditions may cause leaching of the electrode and/or resulting in the deterioration of product quality. < Flow Soldering Profile > Temp. (°C) 265°C±3°C 250°C Limit Profile 150 Heating Time Standard Profile Time.(s) 60s min. Pre-heating Heating Cycle of flow Standard Profile 150°C , 60s min. 250°C , 4s ~ 6s 2 times MURATA MFG. CO., LTD. Limit Profile 265°C ± 3°C , 5s max. 2 times Reference Only Reference Spec. No. JENF243E-9101C-01 P 8 /9 < Reflow Soldering Profile > Temp. (°C) 260°C 245°C±3°C 220°C 230°C Limit Profile 180 150 Standard Profile 30s～60s 60s max. 90s±30s Pre-heating Heating Peak temperature Cycle of reflow Time.(s) Standard Profile Limit Profile 150°C ~ 180°C , 90s ± 30s above 220°C , 30s ~ 60s above 230°C , 60s max. 245°C ± 3°C 260°C , 10s 2 times 2 times 1.5 4.8 9.0 Position of adhesive (in mm) 1.6 12.6. Solder paste printing for reflow  Standard printing pattern of solder paste. · Standard thickness of the solder paste should be 150m to 200µm. · Use the solder paste printing pattern of the right pattern. · For the resist and copper foil pattern, use standard land dimensions. 1.5 2 .6 Adhesive 1 .2 3 .2 0 .6 12.5. Printing of Adhesive (Flow Soldering) Adhesive amount shall be about 0.5mg for one position to obtain enough adhesive strength. The adhesive position is as follows. 4.8 8.8 (in mm) 12.7. Reworking with Soldering iron The following conditions shall be strictly followed when using a soldering iron. Pre-heating : 150°C, 1 min Soldering iron output : 30W max. Tip temperature : 350°C max.  Tip diameter : φ3mm max. Soldering time : 3(+1,-0) s  Times : 2times max. Note: Do not directly touch the products with the tip of the soldering iron in order to prevent the crack on the ceramic material due to the thermal shock. MURATA MFG. CO., LTD. Reference Only Reference Spec. No. JENF243E-9101C-01 P 9 /9 12.8. Cleaning Conditions Products shall be cleaned on the following conditions. (1) Cleaning temperature shall be limited to 60°C max. (40°C max. for IPA.) (2) Ultrasonic cleaning shall comply with the following conditions, with avoiding the resonance phenomenon at the mounted products and P.C.B. Power: 20W / l max. Frequency: 28kHz to 40kHz Time: 5 minutes max. (3) Cleaner 1. Cleaner · Isopropyl alcohol (IPA) 2. Aqueous agent · PINE ALPHA ST-100S (4) There shall be no residual flux and residual cleaner after cleaning. In the case of using aqueous agent, products shall be dried completely after rinse with de-ionized water in order to remove the cleaner. (5) Other cleaning Please contact us. 12.9. Operating Environment Do not use this product under the following environmental conditions, on deterioration of the Insulation Resistance of the Ferrite material and/or corrosion of Inner Electrode may result from the use. (1) In the corrodible atmosphere such as acidic gases, alkaline gases, chlorine, sulfur gases, organic gases and etc. (the sea breeze, Cl2, H2S, NH3, SO2, NO2,etc) (2) in the atmosphere where liquid such as organic solvent, may splash on the products. (3) in the atmosphere where the temperature / humidity changes rapidly and it is easy to dew. 12.10. Resin coating It may affect on the product's performance when using resin for coating / molding products. So please pay your careful attention when you select resin. In prior to use, please make the reliability evaluation with the product mounted in your application set. 12.11. Handling of a substrate After mounting products on a substrate, do not apply any stress to the product caused by bending or twisting to the substrate when cropping the substrate, inserting and removing a connector from the substrate or tightening screw to the substrate. Excessive mechanical stress may cause cracking in the product. Bending Twisting 12.12. Storage condition (1) Storage period Use the products within 12 months after delivered. Solderability should be checked if this period is exceeded. (2) Storage environment condition · Products should be stored in the warehouse on the following conditions. Temperature : - 10 °C to + 40 °C Humidity : 15 % to 85% relative humidity No rapid change on temperature and humidity · Don't keep products in corrosive gases such as sulfur, chlorine gas or acid, or it may cause oxidization of electrode, resulting in poor solderability. ·Products should be stored on the palette for the prevention of the influence from humidity, dust and so on. ·Products should be stored in the warehouse without heat shock, vibration, direct sunlight and so on. ·Avoid storing the product by itself bare (i.e.exposed directly to air). (3) Delivery Care should be taken when transporting or handling product to avoid excessive vibration or mechanical shock. 13. ! Notes (1)Please make sure that your product has been evaluated in view of your specifications with our product being mounted to your product. (2)You are requested not to use our product deviating from the agreed specifications. (3)The contents of this reference specification are subject to change without advance notice. Please approve our product specifications or transact the approval sheet for product specifications before ordering. MURATA MFG. CO., LTD.