Reference Only
Reference Spec. No. JENF243E-9101C-01
P 1 /9
Chip EMIFIL LC Combined Type for Large Current
NFE61HT□□□□2A9□ Reference Specification [AEC-Q200]
1. Scope
This reference specification applies to Chip EMIFIL LC Combined Type for Large Current NFE61H Series for
Automotive Electronics based on AEC-Q200.
2. Part Numbering
NF
Product ID
E
61
Structure Dimension
(LW)
HT
Features
101
Capacitance
Z
2A
9
L
Characteristics Rated Electrode Packaging
Voltage
Code
(L: Taping / B: Bulk)
3. Rating
Customer
Part Number
Murata
Part Number
NFE61HT330U2A9L
NFE61HT330U2A9B
NFE61HT680R2A9L
NFE61HT680R2A9B
NFE61HT101Z2A9L
NFE61HT101Z2A9B
NFE61HT181C2A9L
NFE61HT181C2A9B
NFE61HT361C2A9L
NFE61HT361C2A9B
NFE61HT681D2A9L
NFE61HT681D2A9B
NFE61HT102F2A9L
NFE61HT102F2A9B
NFE61HT332Z2A9L
NFE61HT332Z2A9B
Capacitance
Rated
Voltage
Withstanding
Voltage
Rated
Current
Insulation
Resistance
ESD Rank
2:2kV
100 V
(DC)
250 V(DC)
2 A(DC)
1000 M
min.
2
33pF ± 30%
68pF ± 30%
100pF ± 30%
180pF ± 30%
360pF ± 20%
680pF ± 30%
1000pF ±
80
20
%
3300pF ±
80
20
%
Operating Temperature: - 55 °C to + 125 °C
Storage Temperature: - 55 °C to + 125 °C
4. Standard Testing Condition
Temperature : Ordinary Temp. 15°C to 35°C
Humidity : Ordinary Humidity 25 %(RH) to 85 %(RH)
Temperature: 20°C ± 2°C
Humidity : 60 %(RH) to 70 %(RH)
Atmospheric pressure : 86kPa to 106kPa
5. Style and Dimensions
2.6±0.3
0.7±0.2
(1)
(2)
(3)
■ Equivalent Circuit
1 .6 ±0 .3
1 .6 ±0 .3
0.7±0.2
Input
Output
(1)
(3)
GND
(2)
6.8± 0.3
0.5
1.6±0.3
(1),(3):No Polarity
■ Unit Mass(Typical value)
0.062g
Note : Gap and bend between ceramic capacitor() and ferrite bead(1) may come out as illustrated below, however,
these are not affect the performance, mounting and reliability of the products.
0.5 max.
1
0.1 max.
MURATA MFG. CO., LTD.
1
(in mm)
Reference Only
Reference Spec. No. JENF243E-9101C-01
■
P 2 /9
Insertion Loss Characteristics (I.L.) (Typ.)
(50Ωsystem)
6. Marking
No marking.
7. Electrical Performance
No.
7.1
Item
Capacitance
Specification
Test Method
Table 1
Meet item 3.
Capacitance
33,68,100 (pF)
180,360,680
1000,3300 (pF)
7.2
7.3
7.4
Insulation
Resistance(I.R.)
Withstanding
Voltage
Meet item 3.
Resistance to
Surge Voltage
Meet Table 2.
Products shall not be damaged.
Table 2
Appearance
Cap.
Change
I.R.
Withstanding
Voltage
No damaged
33,68,100
within
180,360
±15%
680 (pF)
1000
within
3300 (pF)
±30%
1000 M min.
No damaged
Voltage
1 to 5 V(rms)
Frequency
1MHz±10%
1±0.2 V(rms)
1kHz±10%
Voltage : 100 V(DC)
Time : 60 ± 5 seconds
Test Voltage : 250 V(DC)
Testing Time : 1 to 5 seconds
Limit the charging current: 10mA max.
Attenuating transient voltage of exponential
function shall be applied to products on the
condition.
Relay
10
100
EB
0.47µF
1
Product
2 3
EB 400V
Peak Voltage : 400 V
Force Period : 1 s
The number of Surges : 105
8. Q200 Requirement
8-1. Performance (based on Table 13 for Ferrite EMI SUPPRESSORS/FILTERS)
AEC-Q200 Rev.D issued June. 1 2010
No.
3
AEC-Q200
Stress
Test Method
High Temperature 1000hours at 125C
Exposure
Set for 24hours
(Storage)
at room temperature,
then measured.
Murata Specification / Deviation
Meet TABLE A after testing.
Table A
Appearance
Capacitance Change
33pF to 680pF
(33pF-100pF:
1MHz+/-10%)
(180pF-3300pF:
1000pF to 3300pF
1kHz+/-10%)
I.R.
Withstanding Voltage
MURATA MFG. CO., LTD.
No damage
Within +/-15% at 20C
Within +/-30% at 20C
1000M ohm min.
No damage
Reference Only
Reference Spec. No. JENF243E-9101C-01
P 3 /9
AEC-Q200
No.
4
5
7
Stress
Temperature
Cycling
9
10
12
Murata Specification / Deviation
Meet Table B after testing.
Table B
Appearance
Capacitance Change
(33pF-100pF: 1MHz+/10%)
(180pF-3300pF: 1kHz+/10%)
I.R.
Withstanding Voltage
Destructive
Per EIA469
Physical Analysis
No electrical tests
Biased
1000hours 85C/85%RH.
Meet Table B after testing.
Apply Maximum rated Voltage and
current.
Humidity
8
Test Method
1000cycles(-55C to 125C)
Measurement at 24±2 hours after
test conclusion.
Operational Life
No damage
33pF to 680pF
Within +/-15% at 20C
1000pF to 3300pF
Within +/-30% at 20C
No defects
Measurement at 24+/-2 hours after
test conclusion.
1000hours at 125C
Meet Table B after testing.
Apply Maximum rated Current.
External Visual
Physical
Dimension
Measurement at 24+/-2 hours after
test conclusion.
Visual inspection
No abnormalities
Meet ITEM 4
No defects
(Style and Dimensions)
Resistance
Per MIL-STD-202 Method 215
Not Applicable
to Solvents
13
17
Mechanical Shock Per MIL-STD-202 Method 213
Figure 1 of Method 213.
Condition F(1500g's/0.5ms/Half
sine)
Three times each 6 direction.
Vibration
5g's for 20 minutes, 12cycles each
of 3 oritentations
Osscillation Frequency : 102000Hz.
Resistance
No heating.
to Soldering Heat 260C +/- degree C
Immersion time 10s
ESD
Per AEC-Q200-002
18
Solderbility
Per J-STD-002
19
Electrical
Characterization
Measured :Capacitance
14
15
Meet Table A after testing.
Meet Table A after testing.
Pre-heating: 150C+/-5C, 60s+/-5s
Meet Table A after testing.
Meet Table C after testing.
ESD Rank: Refer to Item 3. Rating.
Table C
Appearance
No damage
I.R.
1000M ohm min
Withstanding Voltage
No damage
Method b : Not Applicable
75% of the terminations is to be soldered.
No defects
MURATA MFG. CO., LTD.
100M ohm min
No damage
Reference Only
Reference Spec. No. JENF243E-9101C-01
P 4 /9
AEC-Q200
No.
Stress
20
Flammability
21
Board Flex
Murata Specification / Deviation
Test Method
Per UL-94
Epoxy-PCB(1.6mm)
Deflection 2mm(min)
60s minimum holding time
22
Terminal Strength
30
Electrical
Transient
Conduction
Not Applicable
Meet Table D after testing.
Table D
Capacitance Change
(33pF-100pF: 1MHz+/10%)
(180pF-3300pF: 1kHz+/10%)
Per AEC-Q200-006
A force of 17.7N
for 60sec
Per ISO-7637-2
33pF to 680pF
Within +/-15% at 20C
1000pF to 3300pF
Within +/-30% at 20C
17.7N for 60sec
No defects
Not Applicable
9. Specification of Packaging
9.1. Appearance and Dimensions (12mm-wide plastic tape)
Embossed Cavity
4.0±0.1
4.0±0.1
2.0±0.05
0.3±0.1
1 2 .0 ±0 .3
5 .5 ±0 .0 5 1 .7 5
±0 .1
+0.1
1.5 - 0
7 .2 ±0 .1
Sprocket Hole
1.9±0.1
Dimension of the Cavity is
measured at the bottom side.
1.75±0.1
Direction of feed
(in mm)
9.2. Specification of Taping
(1) Packing quantity (standard quantity)
2500 pcs. / reel
(2) Packing Method
Products shall be packaged in the cavity of the plastic tape and sealed with cover tape.
(3) Sprocket Hole
The sprocket holes are to the right as the tape is pulled toward the user.
(4) Spliced point
The cover tape have no spliced point.
(5) Missing components number
Missing components number within 0.025% of the number per reel or 1 pc., whichever is greater,
and are not continuous. The specified quantity per reel is kept.
9.3. Pull Strength of Plastic Tape and Cover Tape
Plastic tape
5N min.
Cover tape
10N min.
9.4. Peeling off force of cover tape
165° ~ 180°
0.2N to 0.7N (minimum value is typical)
Speed of Peeling off : 300 mm / min
F
Cover Tape
Plastic Tape
MURATA MFG. CO., LTD.
Reference Only
Reference Spec. No. JENF243E-9101C-01
P 5 /9
9.5. Dimensions of Leader-tape, Trailer and Reel
There shall be leader-tape (cover tape only and empty tape) and trailer-tape (empty tape) as follows.
2.0±0.5
Leader
Trailer
160 min.
190 min.
Label
Empty tape
210 min.
Cover tape
13.0±0.2
1
60± 0
21.0±0.8
13± 10
Direction of feed
17±1.4
(in: mm)
0
180± 3
9.6. Marking for reel
Customer part number , MURATA part number , Inspection number(1) , RoHS marking(2) , Quantity , etc
1) « Expression of Inspection No. »
□□ OOOO
(1)
(1) Factory Code
(2) Date
(2)
(3)
First digit
: Year / Last digit of year
Second digit
: Month / Jan. to Sep. 1 to 9, Oct. to Dec. O, N, D
Third, Fourth digit : Day
(3) Serial No.
2) « Expression of RoHS marking »
ROHS – Y (△)
(1) (2)
(1) RoHS regulation conformity parts.
(2) MURATA classification number
9.7. Marking for Outside package (corrugated paper box)
Customer name , Purchasing Order Number , Customer Part Number , MURATA part number ,
RoHS marking (2) , Quantity , etc
9.8. Specification of Outer Case
Label
H
D
W
Outer Case Dimensions
Standard Reel Quantity in Outer Case
(mm)
(Reel)
W
D
H
186
186
93
4
Above Outer Case size is typical. It depends on a quantity of an order.
10. Standard Land Dimensions
The chip EMI filter suppresses noise by conducting the high-frequency noise element to ground.
Therefore, to get enough noise reduction, feed through holes which is connected to ground-plane should be arranged
according to the figure to reinforce the ground-pattern.
(b) Standard land dimensions for flow
(But, NFE61HT332Z2A9□ is not applicable.)
・Side on which chips are mounted
・Side on which chips are mounted
Small diameter thru hole 0.4
2.0
4.8
8.8
Resist
Copper foil pattern
No pattern
MURATA MFG. CO., LTD.
0.6
1.2
1.6
2.6
3.0
Small diameter thru hole 0.4
1.5
3.8
4.8
9.0
3.2
3.6
(a) Standard land dimensions for reflow
Resist
Copper foil pattern
No pattern
(in mm)
Reference Only
Reference Spec. No. JENF243E-9101C-01
11. !
P 6 /9
Caution
11.1. Limitation of Applications
Please contact us before using our products for the applications listed below which require especially high reliability for
the prevention of defects which might directly cause damage to the third party’s life, body or property.
(1)Aircraft equipment
(2)Aerospace equipment (3)Undersea equipment (4)Power plant control equipment
(5)Medical equipment (6)Transportation equipment( trains, ships, etc.) (7)Traffic signal equipment
(8)Disaster prevention / crime prevention equipment (9)Data-processing equipment
(10)Applications of similar complexity or with reliability requirements comparable to the applications listed in the above
11.2. Fail Safe
Be sure to provide an appropriate fail-safe function on your product to prevent from a second damage
that may be caused by the abnormal function or the failure of our products.
11.3. Corrosive gas
Please refrain from use since contact with environments with corrosive gases (sulfur gas [hydrogen sulfide, sulfur
dioxide, etc.], chlorine, ammonia, etc.) or oils (cutting oil, silicone oil, etc.) that have come into contact with the previously
stated corrosive gas environment will result in deterioration of product quality or an open from deterioration due to
corrosion of product electrode, etc. We will not bear any responsibility for use under these environments.
12. Notice
This product is designed for solder mounting.
Please consult us in advance for applying other mounting method such as conductive adhesive.
12.1. Flux and Solder
Flux
Solder
Use rosin-based flux, Do not use highly acidic flux (with chlorine content
exceeding 0.2(wt)%).
Do not use water-soluble flux.
Use Sn-3.0Ag-0.5Cu solder
12.2. Note for Assembling
< Thermal Shock >
Pre-heating should be in such a way that the temperature difference between solder and products surface is
limited to 100°C max. Also cooling into solvent after soldering should be in such a way that the temperature
difference is limited to 100°C max.
The mounting of 2.5mm pitch should be prevented on flow soldering to avoid an excess of solder volume.
< Exclusive Use of Reflow Soldering >
NFE61HT332Z2A9□ can only be soldered with reflow.
If it were soldered with flow, cracks might be caused in the ceramic body.
So, reflow soldering shall be applied for products.
12.3. Attention Regarding P.C.B. Bending
The following shall be considered when designing P.C.B.'s and laying out products.
(1) P.C.B. shall be designed so that products are not subject to the mechanical stress for board warpage.
〔Products direction〕
a
b
〈 Poor example〉
Products shall be located in the sideways direction
(Length:ab) to the mechanical stress.
〈 Good example 〉
MURATA MFG. CO., LTD.
Reference Only
Reference Spec. No. JENF243E-9101C-01
P 7 /9
(2) Components location on P.C.B. separation.
It is effective to implement the following measures, to reduce stress in separating the board.
It is best to implement all of the following three measures; however, implement as many measures as possible
to reduce stress.
Contents of Measures
(1) Turn the mounting direction of the component parallel to the board separation surface.
(2) Add slits in the board separation part.
(3) Keep the mounting position of the component away from the board separation surface.
Stress Level
A > D *1
A > B
A > C
*1 A > D is valid when stress is added vertically to the perforation as
with Hand Separation.If a Cutting Disc is used, stress will be diagonal
to the PCB, therefore A > D is invalid.
(3) Mounting Components Near Screw Holes
When a component is mounted near a screw hole, it may be affected by the board deflection that occurs during
the tightening of the screw. Mount the component in a position as far away from the screw holes as possible.
12.4. Standard Soldering Conditions
On flow soldering (e.g. double wave soldering), use the product in consideration of the conditions of solder, solder
temperature and immersion time (melting time) because longer soldering time may cause the corrosion of the
electrode.
On dipping soldering, use the product in consideration of the conditions of solder, solder temperature, flux, preheat
and so on because de-wetting may be caused.
Standard soldering profile and the limit soldering profile is as follows.
The excessive soldering conditions may cause leaching of the electrode and/or resulting in the deterioration of product
quality.
< Flow Soldering Profile >
Temp.
(°C)
265°C±3°C
250°C
Limit Profile
150
Heating Time
Standard Profile
Time.(s)
60s min.
Pre-heating
Heating
Cycle of flow
Standard Profile
150°C , 60s min.
250°C , 4s ~ 6s
2 times
MURATA MFG. CO., LTD.
Limit Profile
265°C ± 3°C , 5s max.
2 times
Reference Only
Reference Spec. No. JENF243E-9101C-01
P 8 /9
< Reflow Soldering Profile >
Temp.
(°C)
260°C
245°C±3°C
220°C
230°C
Limit Profile
180
150
Standard Profile
30s~60s
60s max.
90s±30s
Pre-heating
Heating
Peak temperature
Cycle of reflow
Time.(s)
Standard Profile
Limit Profile
150°C ~ 180°C , 90s ± 30s
above 220°C , 30s ~ 60s
above 230°C , 60s max.
245°C ± 3°C
260°C , 10s
2 times
2 times
1.5
4.8
9.0
Position of adhesive
(in mm)
1.6
12.6. Solder paste printing for reflow
Standard printing pattern of solder paste.
· Standard thickness of the solder paste should be
150m to 200µm.
· Use the solder paste printing pattern of the right pattern.
· For the resist and copper foil pattern, use standard
land dimensions.
1.5
2 .6
Adhesive
1 .2
3 .2
0 .6
12.5. Printing of Adhesive (Flow Soldering)
Adhesive amount shall be about 0.5mg for one position to obtain enough adhesive strength.
The adhesive position is as follows.
4.8
8.8
(in mm)
12.7. Reworking with Soldering iron
The following conditions shall be strictly followed when using a soldering iron.
Pre-heating : 150°C, 1 min
Soldering iron output : 30W max.
Tip temperature : 350°C max.
Tip diameter : φ3mm max.
Soldering time : 3(+1,-0) s
Times : 2times max.
Note: Do not directly touch the products with the tip of the soldering iron in order to prevent the crack on the ceramic
material due to the thermal shock.
MURATA MFG. CO., LTD.
Reference Only
Reference Spec. No. JENF243E-9101C-01
P 9 /9
12.8. Cleaning Conditions
Products shall be cleaned on the following conditions.
(1) Cleaning temperature shall be limited to 60°C max. (40°C max. for IPA.)
(2) Ultrasonic cleaning shall comply with the following conditions, with avoiding the resonance phenomenon at the
mounted products and P.C.B.
Power: 20W / l max.
Frequency: 28kHz to 40kHz
Time: 5 minutes max.
(3) Cleaner
1. Cleaner
· Isopropyl alcohol (IPA)
2. Aqueous agent
· PINE ALPHA ST-100S
(4) There shall be no residual flux and residual cleaner after cleaning.
In the case of using aqueous agent, products shall be dried completely after rinse with de-ionized water in order to
remove the cleaner.
(5) Other cleaning
Please contact us.
12.9. Operating Environment
Do not use this product under the following environmental conditions, on deterioration of the Insulation Resistance
of the Ferrite material and/or corrosion of Inner Electrode may result from the use.
(1) In the corrodible atmosphere such as acidic gases, alkaline gases, chlorine, sulfur gases, organic gases and
etc. (the sea breeze, Cl2, H2S, NH3, SO2, NO2,etc)
(2) in the atmosphere where liquid such as organic solvent, may splash on the products.
(3) in the atmosphere where the temperature / humidity changes rapidly and it is easy to dew.
12.10. Resin coating
It may affect on the product's performance when using resin for coating / molding products. So please pay your
careful attention when you select resin. In prior to use, please make the reliability evaluation with the product mounted
in your application set.
12.11. Handling of a substrate
After mounting products on a substrate, do not apply any stress to the product caused by bending or twisting to the
substrate when cropping the substrate, inserting and removing a connector from the substrate or tightening screw to
the substrate.
Excessive mechanical stress may cause cracking in the product.
Bending
Twisting
12.12. Storage condition
(1) Storage period
Use the products within 12 months after delivered.
Solderability should be checked if this period is exceeded.
(2) Storage environment condition
· Products should be stored in the warehouse on the following conditions.
Temperature : - 10 °C to + 40 °C
Humidity
: 15 % to 85% relative humidity
No rapid change on temperature and humidity
· Don't keep products in corrosive gases such as sulfur, chlorine gas or acid, or it may cause oxidization of
electrode, resulting in poor solderability.
·Products should be stored on the palette for the prevention of the influence from humidity, dust and so on.
·Products should be stored in the warehouse without heat shock, vibration, direct sunlight and so on.
·Avoid storing the product by itself bare (i.e.exposed directly to air).
(3) Delivery
Care should be taken when transporting or handling product to avoid excessive vibration or mechanical shock.
13. !
Notes
(1)Please make sure that your product has been evaluated in view of your specifications with our product being
mounted to your product.
(2)You are requested not to use our product deviating from the agreed specifications.
(3)The contents of this reference specification are subject to change without advance notice.
Please approve our product specifications or transact the approval sheet for product specifications before ordering.
MURATA MFG. CO., LTD.