Reference Only
Spec. No. JENF243E-0003S-01
P 1 /9
Chip EMIFIL LC Combined Type for Large Current
NFE61PT□□□□1H9□ Reference Specification
1. Scope
This reference specification applies to Chip EMIFIL LC Combined Type for Large Current NFE61P Series.
2. Part Numbering
NF
Product ID
E
61
Structure Dimension
(LW)
PT
Features
101
Capacitance
Z
1H
9
L
Characteristics Rated Electrode Packaging
Voltage
Code
(L: Taping / B: Bulk)
3. Rating
Customer
Part Number
Murata
Part Number
NFE61PT330B1H9L
NFE61PT330B1H9B
NFE61PT680B1H9L
NFE61PT680B1H9B
NFE61PT101Z1H9L
NFE61PT101Z1H9B
NFE61PT181B1H9L
NFE61PT181B1H9B
NFE61PT361B1H9L
NFE61PT361B1H9B
NFE61PT681B1H9L
NFE61PT681B1H9B
NFE61PT102E1H9L
NFE61PT102E1H9B
Capacitance
Rated
Voltage
Withstanding
Voltage
Rated
Current
Insulation
Resistance
50 V(DC)
125 V(DC)
2 A(DC)
1000 M
min.
33pF ± 30%
68pF ± 30%
100pF ± 30%
180pF ± 30%
360pF ± 20%
680pF ± 30%
1000pF ±
NFE61PT472C1H9L
4700pF ±
NFE61PT472C1H9B
Operating Temperature : - 40 °C to + 85 °C
80
20
%
80
20
%
Storage Temperature : - 55 °C to + 125 °C
4. Standard Testing Condition
Temperature: Ordinary Temp. 15°C to 35°C
Humidity: Ordinary Humidity 25 %(RH) to 85 %(RH)
Temperature: 20°C ± 2°C
Humidity: 60 %(RH) to 70 %(RH)
Atmospheric pressure: 86kPa to 106kPa
5. Style and Dimensions
Equivalent Circuit
2.6±0.3
0.7±0.2
(1)
(2)
(3)
Output
Input
(3)
(1)
1 .6 ±0 .3
1 .6 ±0 .3
0.7±0.2
1.6±0.3
6.8±0.5
(in mm)
GND
(2)
(1),(3):No Polarity
■ Unit Mass (Typical value)
0.062g
Note : Gap and bend between ceramic capacitor() and ferrite bead(1) may come out as illustrated below, however,
these are not affect the performance, mounting and reliability of the products.
0.5 max.
1
1
0.1 max.
(in mm)
MURATA MFG. CO., LTD.
Reference Only
Spec. No. JENF243E-0003S-01
■
P 2 /9
Insertion Loss Characteristics (I.L.) (Typ.)
6. Marking
No marking.
7. Electrical Performance
No.
7.1
Item
Capacitance
Specification
Test Method
Table 1
Meet item 3.
Capacitance
33,68,100 (pF)
180,360,680
1000 (pF)
4700 (pF)
7.2
7.3
Insulation
Resistance(I.R.)
Withstanding
Voltage
Meet item 3.
Products shall not be damaged.
Voltage
1 to 5 V(rms)
Frequency
1MHz±10%
1±0.2 V(rms)
1kHz±10%
0.1 max.V(rms)
1kHz±10%
Voltage : 50 V(DC)
Time : 60 ± 5 seconds
Test Voltage : 125 V(DC)
Testing Time : 1 to 5 seconds
Limit the charging current: 10mA max.
8. Mechanical Performance
No.
8.1
8.2
8.3
Item
Appearance and
Dimensions
Solderability
Resistance to
soldering heat
Specification
Meet item 5.
The electrodes shall be at least 75%
covered with new solder coating.
Meet Table 2.
Table 2
Appearance
Cap. Change
No damaged
33,68,100
Within
180,360
±15%
680 (pF)
I.R.
1000
Within
4700(pF)
±30%
1000 M min.
Withstanding
Voltage
Test Method
Visual Inspection and measured with Slide
Calipers
Flux : Ethanol solution of rosin, 25(wt)%
Pre-heat : 150 ± 10 °C, 60 ~ 90 s
Solder : Sn-3.0Ag-0.5Cu
Solder Temperature : 240 ± 3 °C
Immersion Time : 3 ± 1 s
Immersion and emersion rates : 25mm / s
Flux : Ethanol solution of rosin, 25(wt)%
Pre-heat : 150 ± 10 °C, 60 ~ 90 s
Solder : Sn-3.0Ag-0.5Cu
Solder Temperature : 270 ± 5 °C
Immersion Time : 10 ± 1 s
Immersion and emersion rates : 25mm / s
Then measured after exposure the room
condition for 4 to 48 hours.
No damaged
MURATA MFG. CO., LTD.
Reference Only
Spec. No. JENF243E-0003S-01
No.
8.4
P 3 /9
Item
Bending
Strength
Specification
Test Method
Meet Table 2.
It shall be soldered on the paper-phenol
substrate. (t=1.6mm)
Table 2
Appearance
Pressure jig
No damaged
Cap. Change
33,68,100
180,360
680 (pF)
1000
4700(pF)
R340
Within
±15%
F
Deflection
Within
±30%
45
45
Product
(in mm)
Deflection : 3 mm
Keeping Time : 30 seconds
9. Environment Performance (It shall be soldered on the substrate.)
No.
Item
9.1
Humidity
Specification
Test Method
Temperature : 40 ± 2 °C
Humidity
: 90 to 95 %(RH)
Time : 500 h (+ 24 h , - 0 h)
Then measured after exposure in the room
condition for 4 to 48 hours.
Meet Table 4.
Table 4
Appearance
9.2
Heat Life
No damaged
33,68,100
180,360
680 (pF)
Cap. Change
Temperature
Cycling
Temperature : 85 ± 2 °C
Test Voltage :
33,68,100,180,360,680 (pF) :
Rated Voltage 200%
1000,4700 (pF)
: Rated Voltage 150%
Time : 1000 h (+ 48h , - 0h)
Then measured after exposure in the room
condition for 4 to 48 hours.
1 Cycle
1step : - 55°C (+ 0°C, - 3°C) / 30±3 min
2step : Room Temperature / within 5 min
3step : +125°C (+ 3°C, - 0°C) / 30±3 min
4step : Room Temperature / within 5 min
Total of 10 cycles
Then measured after exposure in the room
condition for 4 to 48 hours.
1000
Within
4700 (pF)
±30%
100 Mmin.
I.R.
Withstanding
Voltage
9.3
Within
±15%
No damaged
Meet Table 2.
10. Specification of Packaging
10.1. Appearance and Dimensions (12mm-wide plastic tape)
Embossed Cavity
4.0±0.1
4.0±0.1
2.0±0.05
0.3±0.1
1 2 .0 ± 0 .3
5 .5 ±0 .0 5 1 .7 5
±0 .1
+0.1
1.5 - 0
7 .2 ±0 .1
Sprocket Hole
1.9±0.1
Dimension of the Cavity is
measured at the bottom side.
1.75±0.1
Direction of feed
MURATA MFG. CO., LTD.
(in mm)
Reference Only
Spec. No. JENF243E-0003S-01
P 4 /9
10.2. Specification of Taping
(1) Packing quantity (standard quantity)
2500 pcs. / reel
(2) Packing Method
Products shall be packaged in the cavity of the plastic tape and sealed with cover tape.
(3) Sprocket Hole
The sprocket holes are to the right as the tape is pulled toward the user.
(4) Spliced point
The cover tape have no spliced point.
(5) Missing components number
Missing components number within 0.1% of the number per reel or 1 pc., whichever is greater,
and are not continuous. The specified quantity per reel is kept.
10.3. Pull Strength of Plastic Tape and Cover Tape
Plastic tape
5N min.
Cover tape
10N min.
165° ~ 180°
10.4. Peeling off force of cover tape
Cover Tape
F
0.2N to 0.7N (minimum value is typical)
Speed of Peeling off : 300 mm / min
Plastic Tape
10.5. Dimensions of Leader-tape, Trailer and Reel
There shall be leader-tape (cover tape only and empty tape) and trailer-tape (empty tape) as follows.
2.0±0.5
Leader
Trailer
160 min.
190 min.
Label
Empty tape
210 min.
Cover tape
13.0±0.2
1
60± 0
21.0±0.8
13± 10
Direction of feed
17±1.4
0
180± 3
(in: mm)
10.6. Marking for reel
Customer part number , MURATA part number , Inspection number(1) , RoHS marking(2) , Quantity , etc
1) « Expression of Inspection No. »
□□ OOOO
(1)
(2)
(3)
(1) Factory Code
(2) Date
First digit
: Year / Last digit of year
Second digit
: Month / Jan. to Sep. 1 to 9, Oct. to Dec. O, N, D
Third, Fourth digit : Day
(3) Serial No.
2) « Expression of RoHS marking »
ROHS – Y (△)
(1) (2)
(1) RoHS regulation conformity parts.
(2) MURATA classification number
10.7. Marking for Outside package (corrugated paper box)
Customer name , Purchasing Order Number , Customer Part Number , MURATA part number ,
RoHS marking (2) , Quantity , etc
MURATA MFG. CO., LTD.
Reference Only
Spec. No. JENF243E-0003S-01
P 5 /9
10.8. Specification of Outer Case
Label
H
D
W
Outer Case Dimensions
Standard Reel Quantity in Outer Case
(mm)
(Reel)
W
D
H
186
186
93
4
Above Outer Case size is typical. It depends on a quantity of an order.
11. Standard Land Dimensions
The chip EMI filter suppresses noise by conducting the high-frequency noise element to ground.
Therefore, to get enough noise reduction, feed through holes which is connected to ground-plane should be arranged
according to the figure to reinforce the ground-pattern.
(a) Standard land dimensions for reflow
(b) Standard land dimensions for flow
・Side on which chips are mounted
Small diameter thru hole 0.4
2.0
4.8
8.8
12. !
Resist
Copper foil pattern
No pattern
0.6
1.2
1.6
2.6
3.0
Small diameter thru hole 0.4
1.5
3.8
4.8
9.0
3.2
3.6
・Side on which chips are mounted
Resist
Copper foil pattern
No pattern
(in mm)
Caution
12.1. Limitation of Applications
Please contact us before using our products for the applications listed below which require especially high
reliability for the prevention of defects which might directly cause damage to the third party’s life, body or property.
(1)Aircraft equipment
(2)Aerospace equipment (3)Undersea equipment (4)Power plant control equipment
(5)Medical equipment (6)Transportation equipment(automobiles, trains, ships, etc.) (7)Traffic signal equipment
(8)Disaster prevention / crime prevention equipment (9)Data-processing equipment
(10)Applications of similar complexity or with reliability requirements comparable to the applications listed in the above
12.2. Corrosive gas
Please refrain from use since contact with environments with corrosive gases (sulfur gas [hydrogen sulfide, sulfur dioxide,
etc.], chlorine, ammonia, etc.) or oils (cutting oil, silicone oil, etc.) that have come into contact with the previously stated
corrosive gas environment will result in deterioration of product quality or an open from deterioration due to corrosion of
product electrode, etc. We will not bear any responsibility for use under these environments.
13. Notice
This product is designed for solder mounting.
Please consult us in advance for applying other mounting method such as conductive adhesive.
13.1. Flux and Solder
Flux
Solder
Use rosin-based flux, Do not use highly acidic flux (with chlorine content
exceeding 0.2(wt)%).
Do not use water-soluble flux.
Use Sn-3.0Ag-0.5Cu solder
13.2. Note for Assembling
< Thermal Shock >
Pre-heating should be in such a way that the temperature difference between solder and products
surface is limited to 100°C max. Also cooling into solvent after soldering should be in such a way
that the temperature difference is limited to 100°C max.
The mounting of 2.5mm pitch should be prevented on flow soldering to avoid an excess of solder volume.
MURATA MFG. CO., LTD.
Reference Only
Spec. No. JENF243E-0003S-01
P 6 /9
13.3. Attention Regarding P.C.B. Bending
The following shall be considered when designing P.C.B.'s and laying out products.
(1) P.C.B. shall be designed so that products are not subject to the mechanical stress for board warpage.
〔Products direction〕
a
Products shall be located in the sideways
direction (Length:ab) to the mechanical
stress.
b
〈 Poor example〉
〈 Good example 〉
(2) Components location on P.C.B. separation.
It is effective to implement the following measures, to reduce stress in separating the board.
It is best to implement all of the following three measures; however, implement as many measures as possible
to reduce stress.
Contents of Measures
(1) Turn the mounting direction of the component parallel to the board separation surface.
(2) Add slits in the board separation part.
(3) Keep the mounting position of the component away from the board separation surface.
Stress Level
A > D *1
A > B
A > C
*1 A > D is valid when stress is added vertically to the perforation as
with Hand Separation.If a Cutting Disc is used, stress will be diagonal
to the PCB, therefore A > D is invalid.
(3) Mounting Components Near Screw Holes
When a component is mounted near a screw hole, it may be affected by the board deflection that occurs during
the tightening of the screw. Mount the component in a position as far away from the screw holes as possible.
13.4. Standard Soldering Conditions
On flow soldering (e.g. double wave soldering), use the product in consideration of the conditions of solder, solder
temperature and immersion time (melting time) because longer soldering time may cause the corrosion of the
electrode.
On dipping soldering, use the product in consideration of the conditions of solder, solder temperature, flux, preheat
and so on because de-wetting may be caused.
Standard soldering profile and the limit soldering profile is as follows.
The excessive soldering conditions may cause leaching of the electrode and/or resulting in the deterioration of product
quality.
MURATA MFG. CO., LTD.
Reference Only
Spec. No. JENF243E-0003S-01
P 7 /9
< Flow Soldering Profile >
Temp.
(°C)
265°C±3°C
250°C
Limit Profile
150
Heating Time
Standard Profile
Time.(s)
60s min.
Standard Profile
150°C , 60s min.
250°C , 4s ~ 6s
2 times
Pre-heating
Heating
Cycle of flow
Limit Profile
265°C ± 3°C , 5s max.
2 times
< Reflow Soldering Profile >
Temp.
(°C)
260°C
245°C±3°C
220°C
230°C
Limit Profile
180
150
Standard Profile
30s~60s
60s max.
90s±30s
Pre-heating
Heating
Peak temperature
Cycle of reflow
Time.(s)
Standard Profile
Limit Profile
150°C ~ 180°C , 90s ± 30s
above 220°C , 30s ~ 60s
above 230°C , 60s max.
245°C ± 3°C
260°C , 10s
2 times
2 times
3 .2
1 .2
0 .6
13.5. Printing of Adhesive (Flow Soldering)
Adhesive amount shall be about 0.5mg for one position to obtain enough adhesive strength.
The adhesive position is as follows.
1.5
4.8
Adhesive
9.0
(in mm)
1.6
13.6. Solder paste printing for reflow
Standard printing pattern of solder paste.
· Standard thickness of the solder paste should be
150m to 200µm.
· Use the solder paste printing pattern of the right pattern.
· For the resist and copper foil pattern, use standard land
dimensions.
1.5
2 .6
Position of adhesive
4.8
8.8
MURATA MFG. CO., LTD.
(in mm)
Reference Only
Spec. No. JENF243E-0003S-01
P 8 /9
13.7. Reworking with Soldering iron
The following conditions shall be strictly followed when using a soldering iron.
Pre-heating : 150°C, 1 min
Soldering iron output : 30W max.
Tip temperature : 350°C max.
Tip diameter : φ3mm max.
Soldering time : 3(+1,-0) s
Times : 2times max.
Note: Do not directly touch the products with the tip of the soldering iron in order to prevent the crack on the ceramic
material due to the thermal shock.
13.8. Cleaning Conditions
Products shall be cleaned on the following conditions.
(1) Cleaning temperature shall be limited to 60°C max. (40°C max. for IPA.)
(2) Ultrasonic cleaning shall comply with the following conditions, with avoiding the resonance phenomenon at the
mounted products and P.C.B.
Power: 20W / l max.
Frequency: 28kHz to 40kHz
Time: 5 minutes max.
(3) Cleaner
1. Cleaner
· Isopropyl alcohol (IPA)
2. Aqueous agent
· PINE ALPHA ST-100S
(4) There shall be no residual flux and residual cleaner after cleaning.
In the case of using aqueous agent, products shall be dried completely after rinse with de-ionized water in order to
remove the cleaner.
(5) Other cleaning
Please contact us.
13.9. Operating Environment
Do not use this product under the following environmental conditions, on deterioration of the performance,
such as insulation resistance may result from the use.
(1) in the corrodible atmosphere (acidic gases, alkaline gases, chlorine, sulfur gases, organic gases and etc.)
(2) in the atmosphere where liquid such as organic solvent, may splash on the products.
13.10. Resin coating
It may affect on the product's performance when using resin for coating / molding products. So please pay your
careful attention when you select resin. In prior to use, please make the reliability evaluation with the product mounted
in your application set.
13.11. Handling of a substrate
After mounting products on a substrate, do not apply any stress to the product caused by bending or twisting to the
substrate when cropping the substrate, inserting and removing a connector from the substrate or tightening screw to
the substrate.
Excessive mechanical stress may cause cracking in the product.
Bending
Twisting
13.12. Storage condition
(1) Storage period
Use the products within 12 months after delivered.
Solderability should be checked if this period is exceeded.
(2) Storage environment condition
· Products should be stored in the warehouse on the following conditions.
Temperature : - 10 °C to + 40 °C
Humidity
: 15 % to 85% relative humidity
No rapid change on temperature and humidity
· Don't keep products in corrosive gases such as sulfur, chlorine gas or acid, or it may cause oxidization of
electrode, resulting in poor solderability.
·Products should be stored on the palette for the prevention of the influence from humidity, dust and so on.
·Products should be stored in the warehouse without heat shock, vibration, direct sunlight and so on.
·Avoid storing the product by itself bare (i.e.exposed directly to air).
(3) Delivery
Care should be taken when transporting or handling product to avoid excessive vibration or mechanical shock.
MURATA MFG. CO., LTD.
Reference Only
Spec. No. JENF243E-0003S-01
14. !
P 9 /9
Notes
(1) Please make sure that your product has been evaluated in view of your specifications with our product being mounted
to your product.
(2) You are requested not to use our product deviating from the reference specifications.
(3) The contents of this reference specification are subject to change without advance notice. Please approve our product
specifications or transact the approval sheet for product specifications before ordering.
MURATA MFG. CO., LTD.