Reference Only
Spec. No. JENF243D-0009C-01
P 1/ 9
Chip EMIFIL LC Combined Monolithic
NFL15ST□□7X0J3□
Reference Specification
1. Scope
This reference specification applies to Chip EMIFIL LC Combined Monolithic Type NFL15ST Series.
2. Part Numbering
NF
L
Product ID
Structure
15
ST
Dimension
(L×W)
Features
157
X
Cut-off Frequency
Characteristics
0J
3
Rated Voltage
D
Electrode
Packaging Code
(D: Taping / B: Bulk)
3. Rating
Customer
Part Number
Cut-off
Frequency
[MHz]
MURATA
Part Number
NFL15ST157X0J3D
NFL15ST157X0J3B
NFL15ST207X0J3D
NFL15ST207X0J3B
NFL15ST307X0J3D
NFL15ST307X0J3B
Insertion Loss (I.L.)(dB )
6 max.
150
(0 to 150MHz)
6 max.
200
(0 to 200MHz)
6 max.
300
(0 to 300MHz)
25 min.
(400 to
1000MHz)
25 min.
(600 to
1000MHz)
25 min.
(800 to
1000MHz)
DC
Insulation Rated Withstanding
Rated
Resistance Current Resistance Voltage
Voltage
[mA(DC)] [MΩ min.] [V(DC)]
[V(DC)]
[Ω]
20±30%
18±30%
50
1000
6.3
18.9
17±30%
NFL15ST507X0J3D
25 min.
6 max.
14±30%
500
(0 to 500MHz) (1000MHz)
NFL15ST507X0J3B
NFL15ST157X0J3□: 22pF (typ.)
NFL15ST157X0J3□: 115nH (typ.)
NFL15ST207X0J3□: 17pF (typ.)
NFL15ST207X0J3□: 105nH (typ.)
NFL15ST307X0J3□: 12pF (typ.)
NFL15ST307X0J3□: 95nH (typ.)
NFL15ST507X0J3□: 60nH (typ.)
NFL15ST507X0J3□: 7pF (typ.)
• Operating Temperature: -40°C to +85°C
• Storage Temperature: -40°C to +85°C
4. Standard Testing Condition
< Unless otherwise specified >
Temperature: Ordinary Temp. / 15 °C to 35 °C
Humidity: Ordinary Humidity / 25 %(RH) to 85 %(RH)
5. Style and Dimensions
(Top view)
■ Equivalent Circuits
④
①
NC
④
②
0.5±0.15
(Bottom View)
①Input(Output)
③
0.35±0.15
0.3±0.05
(Side View)
< In case of doubt >
Temperature: 20 °C ± 2 °C
Humidity: 60 %(RH) to 70 %(RH)
Atmospheric pressure: 86 kPa to 106 kPa
0.5±0.05
1.0±0.05
0.15±0.10
②
GND
■ Unit Mass(Typical value)
0.5mg
: Polarity Marking
:Electrode
(in mm)
0.15±0.10
MURATA MFG.CO., LTD.
③Output(Input)
Reference Only
Spec. No. JENF243D-0009C-01
P 2/ 9
■ NC (Non-Contact) Terminal
Don't connect NC terminal with any signal lines/GND lines on the circuit board.
■Insertion Loss Characteristics (I.L.) (Typ.)
(50Ω system)
0
Insertion Loss (dB)
10
20
NFL15ST157X0J3
30
NFL15ST207X0J3
40
NFL15ST307X0J3
50
NFL15ST507X0J3
60
70
80
1
10
100
Frequency (MHz)
1000
10000
6. Marking
Polarity marking is on the upper surface of a product.
7. Electrical Performance
No.
Item
Specification
7.1 Insertion Loss
Meet item 3.
(I.L.)
Test Method
50Ω
10dB
Attenuator
Specimen
50Ω
10dB
Attenuator
E
50Ω
50Ω
~
SG
∗ Method of measurement based on MIL-STD-220
7.2
7.3
7.4
DC Resistance
(Rdc)
Insulation
Resistance(I.R.)
Withstanding
Voltage
Products shall not be damaged.
8. Mechanical Performance
No.
Item
Specification
8.1 Appearance and Meet item 5.
Dimensions
8.2 Solderability
Electrodes shall be at least 90%
covered with new solder coating.
Insertion Loss = 20 log (E0 / E1)
E0 : Level without FILTER (short)
E1 : Level with FILTER
Measured with 10mA max.
Measured between terminal ①-③. (ref. Item5)
· Voltage : Rated Voltage
· Time : 1 minutes max.
· Test Voltage : Rated Voltage × 300%
· Time : 1 to 5s
· Charge Current : 50 mA max.
Test Method
Visual Inspection and measured with Slide
Calipers.
· Flux : Ethanol solution of rosin, 25(wt)%
· Pre-heat : 150 ± 10°C, 60 to 90s
· Solder : Sn-3.0Ag-0.5Cu
· Solder Temperature : 240 ± 3°C
· Immersion Time : 3±1 s
· Immersion and emersion rates : 25mm / s
MURATA MFG.CO., LTD.
Reference Only
Spec. No. JENF243D-0009C-01
No.
8.3
Item
Resistance to
soldering heat
Specification
Meet Table 1.
Table 1
Appearance
Cap. Change
L Change
I.R.
8.4
Bending
Strength
P 3/ 9
No damaged
Within ± 10%
Within ± 10%
Meet item 3
Meet Table 1.
Test Method
· Flux : Ethanol solution of rosin, 25(wt)%
· Pre-heat : 150 ± 10°C, 60 to 90s
· Solder : Sn-3.0Ag-0.5Cu
· Solder Temperature : 270 ± 5°C
· Immersion Time : 10 ± 1 s
· Immersion and emersion rates : 25mm / s
· Then measured after exposure in the room
condition for 24±2 hours.
It shall be soldered on the glass-epoxy substrate
(t = 1.0mm).
· Deflection : 2 mm
· Keeping Time : 30 s
Pressure jig
R230
F
Deflection
45
8.5
Drop
Products shall be no failure after
tested.
8.6
Bonding
Strength
The electrodes shall be no failure after
tested.
8.7
Vibration
Meet Table 1.
Humidity
Product
(in mm)
It shall be dropped on concrete or steel board.
· Method : Free fall
· Height : 1m
· Attitude from which the product is dropped
: 3 directions
· The Number of Time : 3 times for each direction
(Total 9 times)
It shall be soldered on the glass-epoxy substrate.
· Applying Force (F) : 5 N
· Applying Time : 30 s
(in mm)
It shall be soldered on the glass-epoxy substrate.
· Oscillation Frequency : 10 to 2000 to 10Hz for 15
min
· Total amplitude 3.0mm or Acceleration amplitude
196m/s2 whichever is smaller.
· Time: A period of 2 hours in each of 3 mutually
perpendicular directions. (Total 6 hours)
9. Environment Performance
It shall be soldered on the glass-epoxy substrate.
No.
Item
Specification
9.1 Temperature
Meet Table 1.
Cycling
9.2
45
Test Method
· 1 Cycle
1 step : -40 ± 03 °C / 30 ± 30 min
2 step : Room Temperature / within 3 min
3 step : +85 ± 30 °C / 30 ± 30 min
4 step : Room Temperature / within 3 min
· Total of 100 cycles
· Then measured after exposure in the room
condition for 24±2 hours.
· Temperature : 40 ± 2 °C
· Humidity : 90 to 95%(RH)
· Time : 1000± 240 hours
· Then measured after exposure in the room
condition for 24±2 hours.
MURATA MFG.CO., LTD.
Reference Only
Spec. No. JENF243D-0009C-01
Specification
Meet Table 1.
Test Method
· Temperature : 85 ± 2 °C
· Test Voltage : Rated Voltage × 200%
· Charge Current : 50 mA max.
· Time : 1000 ± 480 hours
· Then measured after exposure in the room
condition for 24±2 hours.
10. Specification of Packaging
10.1. Appearance and Dimensions (8mm-wide paper tape)
4.00±0.10
3.50±0.05
Φ1.55+0.10/-0
1.12±0.05
2.00±0.05
0.62±0.05
8.00±0.30
Item
Heat Life
1.75±0.10
No.
9.3
P 4/ 9
2.00±0.05
Direction of feed
0.80 max.
(in mm)
10.2. Specification of Taping
(1) Packing quantity (standard quantity)
10,000 pcs. / reel
(2) Packing Method
Products shall be packaged in the cavity of the base tape and sealed by cover tape.
(3) Sprocket Hole
The sprocket holes are to the right as the tape is pulled toward the user.
(4) Base tape and Cover tape
The base tape and cover tape have no spliced point.
(5) Cavity
There shall not be burr in the cavity.
(6) Missing components number
Missing components number within 0.1% of the number per reel or 1 pc., whichever is greater, and are not
continuous. The specified quantity per reel is kept.
10.3. Pull Strength of Cover tape
Cover tape
5N min.
10.4. Peeling off force of Cover tape
0.1N to 0.6N (minimum value is typical)
Speed of Peeling off : 300 mm / min
165 to 180 degree
Cover tape
F
Base tape
10.5. Dimensions of Leader-tape, Trailer and Reel
There shall be leader-tape (cover tape and empty tape) and trailer-tape (empty tape) as follows.
Leader
Trailer
2.0±0.5
160 min.
190 min.
210 min.
Empty tape
Top
Covertape
tape
Label
φ 13.0±0.2
1
φ 60± 0
φ 21.0±0.8
9± 10
Direction of feed
13±1.4
(in mm)
0
φ 180± 3
MURATA MFG.CO., LTD.
Reference Only
Spec. No. JENF243D-0009C-01
P 5/ 9
10.6. Marking for reel
Customer part number , MURATA part number , Inspection number(∗1) , RoHS marking(∗2) , Quantity , etc
∗1) « Expression of Inspection No. »
□□ OOOO ×××
(1)
(1) Factory Code
(2) Date
(2)
(3)
First digit
: Year / Last digit of year
Second digit
: Month / Jan. to Sep. → 1 to 9, Oct. to Dec. → O, N, D
Third, Fourth digit : Day
(3) Serial No.
∗2) « Expression of RoHS marking »
ROHS – Y (△)
(1) (2)
(1) RoHS regulation conformity parts.
(2) MURATA classification number
10.7. Marking for Outside package (corrugated paper box)
Customer name , Purchasing Order Number , Customer Part Number , MURATA part number ,
RoHS marking (∗2) , Quantity , etc
10.8. Specification of Outer Case
Label
H
D
W
Outer Case Dimensions
Standard Reel Quantity in Outer Case
(mm)
(Reel)
W
D
H
186
186
93
5
∗ Above Outer Case size is typical. It depends on a quantity of an order.
11. Standard Land Dimensions
The chip EMI filter suppresses noise by conducting the high-frequency noise element to ground.
Therefore, to get enough noise reduction, feed through holes which is connected to ground-plane should be arranged
according to the figure to reinforce the ground-pattern.
< Standard land dimensions for reflow >
・Side on which chips are mounted
④
①
③
②
0.75
0.25 0.25
Filled Viaφ0.15
Land Pattern
+Solder Resist
Land Pattern
Solder Resist
0.25
0.70
1.30
(in mm)
12. ! Caution
12.1. Mounting Direction
Mount products in right direction, because products have a direction.
Wrong direction which is 180° rotated from right direction cause fuming or partial dispersion, because input or output
signal terminals short-circuit to ground.
right direction
wrong direction
NC
④
Input ①
(output)
②
GND
NC
②
③
Output
(input)
Input ③
(output)
④
GND
MURATA MFG.CO., LTD.
①
Output
(input)
Reference Only
Spec. No. JENF243D-0009C-01
P 6/ 9
12.2. Connection to NC(Non-Contact) Terminal
Please don't connect NC terminal with any signal lines or GND lines on the circuit board.
When NC terminal is connected to GND, it causes fuming or partial dispersion because input or output signal
terminals short-circuit to ground.
12.3. Limitation of Applications
Please contact us before using our products for the applications listed below which require especially high reliability for
the prevention of defects which might directly cause damage to the third party’s life, body or property.
(1) Aircraft equipment
(2) Aerospace equipment (3) Undersea equipment (4) Power plant control equipment
(5) Medical equipment (6) Transportation equipment(automobiles, trains, ships, etc.) (7) Traffic signal equipment
(8) Disaster prevention / crime prevention equipment (9) Data-processing equipment
(10) Applications of similar complexity or with reliability requirements comparable to the applications listed in the above
13. Notice
Products can only be soldered with reflow.
This product is designed for solder mounting.
Please consult us in advance for applying other mounting method such as conductive adhesive.
13.1. Flux and Solder
Flux
Use rosin-based flux, Do not use highly acidic flux (with chlorine content exceeding 0.2(wt)%).
Do not use water-soluble flux.
Solder
Use Sn-3.0Ag-0.5Cu solder
Other flux (except above) Please contact us for details, then use.
13.2. Note for Assembling
< Thermal Shock >
Pre-heating should be in such a way that the temperature difference between solder and products surface is limited
to 100°C max. Also cooling into solvent after soldering should be in such a way that the temperature difference is
limited to 100°C max.
Please solder the NC terminal on floated pattern, in order to secure the fixing strength of the part and to prevent
displacement of the part during reflow soldering.
13.3. Attention Regarding P.C.B. Bending
The following shall be considered when designing P.C.B.'s and laying out products.
(1) P.C.B. shall be designed so that products are not subject to the mechanical stress for board warpage.
[Products direction]
a
Products shall be located in the
sideways direction (Length:a< b) to the
mechanical stress.
b
〈 Poor example 〉
〈 Good example〉
(2) Components location on P.C.B. separation.
It is effective to implement the following measures, to reduce stress in separating the board.
It is best to implement all of the following three measures; however, implement as many measures as possible
to reduce stress.
Contents of Measures
(1) Turn the mounting direction of the component parallel to the board separation surface.
(2) Add slits in the board separation part.
(3) Keep the mounting position of the component away from the board separation surface.
Stress Level
A > D *1
A > B
A > C
*1 A > D is valid when stress is added vertically to the perforation as
with Hand Separation.If a Cutting Disc is used, stress will be
diagonal to the PCB, therefore A > D is invalid.
MURATA MFG.CO., LTD.
Reference Only
Spec. No. JENF243D-0009C-01
P 7/ 9
(3) Mounting Components Near Screw Holes
When a component is mounted near a screw hole, it may be affected by the board deflection that occurs during
the tightening of the screw. Mount the component in a position as far away from the screw holes as possible.
13.4. Pre-heating Temperature
Soldering shall be handled so that the difference between pre-heating temperature and solder temperature shall be
limited to 100°C max. to avoid the heat stress for the products.
0.75
0.25
• Standard printing pattern of solder paste.
0.25
13.5. Reflow Soldering
1) Soldering paste printing for reflow
· Standard thickness of solder paste: 100µm to 150µm.
· Use the solder paste printing pattern of the right pattern.
· For the resist and copper foil pattern, use standard land
dimensions.
0.25
0.70
1.30
(in mm)
2) Soldering Conditions
Standard soldering profile and the limit soldering profile is as follows.
The excessive limit soldering conditions may cause leaching of the electrode and / or resulting in the
deterioration of product quality.
Temp.
(°C)
260°C
245°C±3°C
220°C
230°C
Limit Profile
180
150
30s~60s
Standard Profile
60s max.
90s±30s
Pre-heating
Heating
Peak temperature
Cycle of reflow
Time.(s)
Standard Profile
Limit Profile
150°C ~ 180°C , 90s ± 30s
above 220°C , 30s ~ 60s
above 230°C , 60s max.
245°C ± 3°C
260°C , 10s
2 times
2 times
13.6. Reworking with Soldering iron
The following conditions shall be strictly followed when using a soldering iron.
• Pre-heating : 150°C, 1 min
• Soldering iron output : 30W max.
• Tip temperature : 350°C max.
• Tip diameter : φ3mm max.
• Soldering time : 3(+1,-0) s
• Times : 2times max.
Note: Do not directly touch the products with the tip of the soldering iron in order to prevent the crack on the ceramic
material due to the thermal shock.
MURATA MFG.CO., LTD.
Reference Only
Spec. No. JENF243D-0009C-01
P 8/ 9
13.7. Solder Volume
Solder shall be used not to be exceeded as shown below.
Upper Limit
Upper Limit
Recommendable
Recommendable
t
1/3T ≤ t ≤T(T:Chip thickness)
Accordingly increasing the solder volume, the mechanical stress to product is also increased.
Excessive solder volume may cause the failure of mechanical or electrical performance.
13.8. Cleaning Conditions
Products shall be cleaned on the following conditions.
(1) Cleaning temperature shall be limited to 60°C max. (40°C max. for Isopropyl alcohol (IPA))
(2) Ultrasonic cleaning shall comply with the following conditions, with avoiding the resonance phenomenon at the
mounted products and P.C.B.
Power: 20W / l max.
Frequency: 28kHz to 40kHz
Time: 5 minutes max.
(3) Cleaner
1. Cleaner
· Isopropyl alcohol (IPA)
2. Aqueous agent
· PINE ALPHA ST-100S
(4) There shall be no residual flux and residual cleaner after cleaning.
In the case of using aqueous agent, products shall be dried completely after rinse with de-ionized water in order to
remove the cleaner.
(5) Other cleaning
Please contact us.
13.9. Operating Environment
Do not use this product under the following environmental conditions, on deterioration of the performance, such as
insulation resistance may result from the use.
(1) in the corrodible atmosphere (acidic gases, alkaline gases, chlorine, sulfur gases, organic gases and etc.)
(2) in the atmosphere where liquid such as organic solvent, may splash on the products.
(3) in the atmosphere where the temperature / humidity changes rapidly and it is easy to dew.
13.10. Resin coating
The capacitance and inductance value may change and/or it may affect on the product's performance due to high curestress of resin to be used for coating / molding products. So please pay your careful attention when you select resin.
In prior to use, please make the reliability evaluation with the product mounted in your application set.
13.11. Handling of a substrate
After mounting products on a substrate, do not apply any stress to the product caused by bending or twisting to the
substrate when cropping the substrate, inserting and removing a connector from the substrate or tightening screw to
the substrate.
Excessive mechanical stress may cause cracking in the product.
Bending
Twisting
13.12. Storage condition
(1) Storage period
Use the products within 12 months after delivered.
Solderability should be checked if this period is exceeded.
(2) Storage environment condition
· Products should be stored in the warehouse on the following conditions.
Temperature
: -10 to +40°C
Humidity
: 15 to 85% relative humidity
No rapid change on temperature and humidity
· Don’t keep products in corrosive gases such as sulfur, chlorine gas or acid, or it may cause oxidization of
electrode, resulting in poor solderability.
· Products should be stored on the palette for the prevention of the influence from humidity, dust and so on.
· Products should be stored in the warehouse without heat shock, vibration, direct sunlight and so on.
· Products should be stored under the airtight packaged condition.
(3) Delivery
Care should be taken when transporting or handling product to avoid excessive vibration or mechanical shock.
MURATA MFG.CO., LTD.
Reference Only
Spec. No. JENF243D-0009C-01
14.
P 9/ 9
! Notes
(1) Please make sure that your product has been evaluated in view of your specifications with our product being
mounted to your product.
(2) You are requested not to use our product deviating from the reference specifications.
(3) The contents of this reference specification are subject to change without advance notice. Please approve our
product specifications or transact the approval sheet for product specifications before ordering.
MURATA MFG.CO., LTD.