NFL21SP106X1C3D

Reference Only Spec. No. JENF243D-0006K-01 P 1/ 8 Chip EMIFIL® LC Combined Monolithic Reference Specification NFL21SP□□□X1C□□ 1. Scope This reference specification applies to Chip EMIFIL® LC Combined Monolithic Type NFL21S Series. 2. Part Numbering L NF Product ID Structure 21 SP 106 Dimension (LW) Features Cut-off Frequency X 1C Characteristics 3 D Rated Electrode Voltage (3,7 : Sn plating) Packaging Code (D : Taping / B : Bulk) 3. Rating Customer Part Number Insulation Rated Withstanding Cut-off Rated Inductance DC Capacitance Resistance Current Resistance Voltage Voltage Frequency (L) [pF] [V(DC)] [MHz] [nH] [ max.] [mA(DC)] [M min.] [V(DC)] MURATA Part Number NFL21SP106X1C3D NFL21SP106X1C3B NFL21SP206X1C7D NFL21SP206X1C7B NFL21SP506X1C3D NFL21SP506X1C3B NFL21SP706X1C3D NFL21SP706X1C3B NFL21SP107X1C3D NFL21SP107X1C3B NFL21SP157X1C3D NFL21SP157X1C3B NFL21SP207X1C3D NFL21SP207X1C3B NFL21SP307X1C3D NFL21SP307X1C3B NFL21SP407X1C3D NFL21SP407X1C3B NFL21SP507X1C3D NFL21SP507X1C3B 10 670±20% 680±20% 20 240±20% 700±20% 50 84±20% 305±20% 3.5 70 76±20% 185±20% 3.0 100 44±20% 135±20% 150 28±20% 128±20% 200 22±20% 72±20% 300 19±10% 45±10% 400 16±10% 34±10% 500 12±10% 31±10% 8.5 100 150 2.0 200 1.5 250 1.2 300 1000 16 50  Operating Temperature : -55°C to +125°C (Includes self-heating.)  Storage Temperature : -55°C to +125°C 4. Standard Testing Condition < Unless otherwise specified > Temperature : Ordinary Temp. / 15 °C to 35 °C Humidity: Ordinary Humidity / 25 %(RH) to 85 %(RH) < In case of doubt > Temperature: 20 °C ± 2 °C Humidity : 60 %(RH) to 70 %(RH) Atmospheric pressure: 86 kPa to 106 kPa 5. Style and Dimensions 0.3±0.2 0.6±0.2 0.3±0.2 ■ Equivalent Circuit 0.85±0.1 1.25±0.1 0.4±0.2 2.0±0.2 (2) GND (2) (3) (2) 0.25±0.2 1.25±0.1 (1) Out put (3) Input (1)  No Polarity :Electrode (in mm) ■ Unit Mass (Typical value) 0.009g MURATA MFG.CO., LTD. Spec. No. JENF243D-0006K-01 ■ Reference Only P 2/ 8 Insertion Loss Characteristics (I.L.) (Typ.) 6. Marking No marking 7. Electrical Performance No. Item Specification 7.1 Capacitance Meet item 3. (Cap.) 7.2 Inductance (L) 7.3 7.4 7.5 DC Resistance (Rdc) Insulation Resistance(I.R.) Withstanding Voltage Products shall not be damaged. 8. Mechanical Performance No. Item Specification 8.1 Appearance and Meet item 5. Dimensions 8.2 Solderability Electrodes shall be at least 90% covered with new solder coating. 8.3 Resistance to soldering heat Meet Table 1. Table 1 Appearance Cap. Change L Change I.R. No damaged within ± 5% within ± 5% meet item 3 Test Method · Frequency : 1±0.1MHz · Voltage : 1±0.2V(rms) · Frequency Cut-off Frequency 20~500MHz : 10±1MHz Cut-off Frequency 10MHz : 1±0.1MHz · Voltage : 1±0.2V(rms) Measured with 10mA max. Measured between terminal (1)-(3). (ref. Item5) · Voltage : Rated Voltage · Time : 1 minutes max. · Test Voltage : 50V(DC) · Time : 1 to 5 s · Charge Current : 50 mA max. Test Method Visual Inspection and measured with Slide Calipers. · Flux : Ethanol solution of rosin, 25(wt)% · Pre-heat : 150 ± 10°C, 60 to 90s · Solder : Sn-3.0Ag-0.5Cu · Solder Temperature : 240 ± 3°C · Immersion Time : 3±1 s · Immersion and emersion rates : 25mm / s · Flux : Ethanol solution of rosin, 25(wt)% · Pre-heat : 150 ± 10°C, 60 to 90s · Solder : Sn-3.0Ag-0.5Cu · Solder Temperature : 270 ± 5°C · Immersion Time : 10 ± 1 s · Immersion and emersion rates : 25mm / s · Then measured after exposure in the room condition for 24±2 hours. MURATA MFG.CO., LTD. Spec. No. JENF243D-0006K-01 No. 8.4 Item Bending Strength Reference Only Specification Meet Table 2. Table 2 Appearance Cap. Change No damaged within ± 5% P 3/ 8 Test Method It shall be soldered on the glass-epoxy substrate (t = 1.0mm). · Deflection : 2 mm · Keeping Time : 30 s Pressure jig R230 F Deflection 45 8.5 Drop Products shall be no failure after tested. 8.6 Bonding Strength The electrodes shall be no failure after tested. 45 Product (in mm) It shall be dropped on concrete or steel board. · Method : Free fall · Height : 75 cm · Attitude from which the product is dropped : 3 directions · The Number of Time : 3 times for each direction (Total 9 times) It shall be soldered on the glass-epoxy substrate. · Applying Force (F) : 9.8 N · Applying Time : 30 s 1.0 0.8 8.7 Vibration 0.6 1.6 (in mm) It shall be soldered on the glass-epoxy substrate. · Oscillation Frequency : 10 to 55Hz for 1 minute · Double Amplitude : 1.5 mm · Time : A period of 2 hours in each of 3 mutually perpendicular directions. (Total 6 hours) Meet Table 1. 9. Environment Performance It shall be soldered on the glass-epoxy substrate. No. Item Specification 9.1 Temperature Meet Table 1. Cycling 9.2 Humidity 9.3 Heat Life Test Method · 1 Cycle 0 3 1 step: -55 ± 3 °C / 30 ± 0 min 2 step: Room Temperature / within. 3 min 3 3 3 step: +125 ± 0 °C / 30 ± 0 min 4 step: Room Temperature / within. 3 min · Total of 10 cycles · Then measured after exposure in the room condition for 24±2 hours. · Temperature : 40 ± 2 °C · Humidity : 90 to 95%(RH) 24 · Time : 500± 0 hours · Then measured after exposure in the room condition for 24±2 hours. · Temperature : 125 ± 2 °C · Test Voltage : Rated Voltage 200% · Charge Current : 50 mA max. 48 · Time : 1000 ± 0 hours · Then measured after exposure in the room condition for 24±2 hours. MURATA MFG.CO., LTD. Reference Only Spec. No. JENF243D-0006K-01 P 4/ 8 3.5±0.05 3.5±0.1 2.3± 0.2 0.1 8.0±0.3  1.5± 0.1 0 4.0±0.1 Sporocket Hole 1.75±0.1 10. Specification of Packaging 10.1. Appearance and Dimensions (8mm-wide paper tape)  4.0±0.1 1.55±0.2 2.0±0.05 2.0±0.1 1.1max. (in mm) Direction of feed 10.2. Specification of Taping (1) Packing quantity (standard quantity) 4000 pcs. / reel (2) Packing Method Products shall be packaged in the cavity of the base tape and sealed by top tape and bottom tape. (3) Sprocket Hole The sprocket holes are to the right as the tape is pulled toward the user. (4) Base tape and Top tape The base tape and top tape have no spliced point. (5) Cavity There shall not be burr in the cavity. (6) Missing components number Missing components number within 0.1% of the number per reel or 1 pc., whichever is greater,and are not continuous. The specified quantity per reel is kept. 10.3. Pull Strength of Top Tape and Bottom Tape Top tape 5N min. Bottom tape 10.4. Peeling off force of top tape 0.1N to 0.6N (minimum value is typical) Speed of Peeling off : 300 mm / min Top tape 165 to 180 degree F Bottom tape Base tape 10.5. Dimensions of Leader-tape, Trailer and Reel There shall be leader-tape (top tape and empty tape) and trailer-tape (empty tape) as follows. Leader Trailer 2.0±0.5 160 min. Label 190 min. 210 min. Empty tape Top tape  13.0±0.2 1  60± 0  21.0±0.8 9± 10 Direction of feed 13±1.4 0  180± 3 (in mm) MURATA MFG.CO., LTD. Reference Only Spec. No. JENF243D-0006K-01 P 5/ 8 10.6. Marking for reel Customer part number , MURATA part number , Inspection number(1) , RoHS marking(2) , Quantity , etc 1) « Expression of Inspection No. » □□ (1) (1) Factory Code (2) Date OOOO  (2) (3) First digit : Year / Last digit of year Second digit : Month / Jan. to Sep.  1 to 9, Oct. to Dec.  O, N, D Third, Fourth digit : Day (3) Serial No. 2) « Expression of RoHS marking » ROHS – Y (△) (1) (2) (1) RoHS regulation conformity parts. (2) MURATA classification number 10.7. Marking for Outside package (corrugated paper box) Customer name , Purchasing Order Number , Customer Part Number , MURATA part number , RoHS marking (2) , Quantity , etc 10.8. Specification of Outer Case Label H D W Outer Case Dimensions Standard Reel Quantity in Outer Case (mm) (Reel) W D H 186 186 93 5 Above Outer Case size is typical. It depends on a quantity of an order. 11. Standard Land Dimensions The chip EMI filter suppresses noise by conducting the high-frequency noise element to ground. Therefore, to get enough noise reduction, feed through holes which is connected to ground-plane should be arranged according to the figure to reinforce the ground-pattern. < Standard land dimensions for reflow > Side on which chips are mounted 12. 2.3 1.9 0.6 Small diameter thru hole  0.4 0.8  0.6 Resist 1.4 Copper foil pattern 2.6 No pattern (in mm) ! Caution Limitation of Applications Please contact us before using our products for the applications listed below which require especially high reliability for the prevention of defects which might directly cause damage to the third party’s life, body or property. (1) Aircraft equipment (2) Aerospace equipment (3) Undersea equipment (4) Power plant control equipment (5) Medical equipment (6) Transportation equipment(automobiles, trains, ships, etc.) (7) Traffic signal equipment (8) Disaster prevention / crime prevention equipment (9) Data-processing equipment (10) Applications of similar complexity or with reliability requirements comparable to the applications listed in the above MURATA MFG.CO., LTD. Reference Only Spec. No. JENF243D-0006K-01 P 6/ 8 13. Notice Products can only be soldered with reflow. This product is designed for solder mounting. Please consult us in advance for applying other mounting method such as conductive adhesive. 13.1. Flux and Solder Flux Use rosin-based flux, Do not use highly acidic flux (with chlorine content exceeding 0.2(wt)%). Do not use water-soluble flux. Solder Use Sn-3.0Ag-0.5Cu solder Other flux (except above) Please contact us for details, then use. 13.2. Note for Assembling < Thermal Shock > Pre-heating should be in such a way that the temperature difference between solder and products surface is limited to 100°C max. Also cooling into solvent after soldering should be in such a way that the temperature difference is limited to 100°C max. 13.3. Attention Regarding P.C.B. Bending The following shall be considered when designing P.C.B.'s and laying out products. (1) P.C.B. shall be designed so that products are not subject to the mechanical stress for board warpage. [Products direction] a Products shall be located in the sideways direction (Length:ab) to the mechanical stress. b 〈 Poor example〉 〈 Good example〉 (2) Products location on P.C.B. near seam for separation. Seam b A a C B D Slit Length:a b Products (A,B,C,D) shall be located carefully so that products are not subject to the mechanical stress due to warping the board. Because they may be subjected the mechanical stress in order of A C B  D. 13.4. Pre-heating Temperature Soldering shall be handled so that the difference between pre-heating temperature and solder temperature shall be limited to 100°C max. to avoid the heat stress for the products. 1.9 0.8  Standard printing pattern of solder paste. 0.6 13.5. Reflow Soldering 1) Soldering paste printing for reflow · Standard thickness of solder paste: 100µm to 150µm. · Use the solder paste printing pattern of the right pattern. · For the resist and copper foil pattern, use standard land dimensions. 0.6 1.4 2.6 MURATA MFG.CO., LTD. (in mm) Spec. No. JENF243D-0006K-01 Reference Only P 7/ 8 2) Soldering Conditions Standard soldering profile and the limit soldering profile is as follows. The excessive limit soldering conditions may cause leaching of the electrode and / or resulting in the deterioration of product quality. Temp. (°C) 260°C 245°C±3°C 220°C 230°C Limit Profile 180 150 30s～60s Standard Profile 60s max. 90s±30s Pre-heating Heating Peak temperature Cycle of reflow Time.(s) Standard Profile Limit Profile 150°C ~ 180°C , 90s ± 30s above 220°C , 30s ~ 60s above 230°C , 60s max. 245°C ± 3°C 260°C , 10s 2 times 2 times 13.6. Reworking with Soldering iron The following conditions shall be strictly followed when using a soldering iron. Pre-heating : 150°C, 1 min Soldering iron output : 30W max. Tip temperature : 350°C max.  Tip diameter : φ3mm max. Soldering time : 3(+1,-0) s  Times : 2times max. Note: Do not directly touch the products with the tip of the soldering iron in order to prevent the crack on the ceramic material due to the thermal shock. 13.7. Solder Volume Solder shall be used not to be exceed as shown below.  Upper Limit Upper Limit Recommendable Recommendable t 1/3T  t T(T:Chip thickness) Accordingly increasing the solder volume, the mechanical stress to product is also increased. Excessive solder volume may cause the failure of mechanical or electrical performance. 13.8. Cleaning Conditions Products shall be cleaned on the following conditions. (1) Cleaning temperature shall be limited to 60°C max. (40°C max. for Isopropyl alcohol (IPA)) (2) Ultrasonic cleaning shall comply with the following conditions, with avoiding the resonance phenomenon at the mounted products and P.C.B. Power : 20W / l max. Frequency : 28kHz to 40kHz Time : 5 minutes max. (3) Cleaner 1. Cleaner · Isopropyl alcohol (IPA) 2. Aqueous agent · PINE ALPHA ST-100S (4) There shall be no residual flux and residual cleaner after cleaning. In the case of using aqueous agent, products shall be dried completely after rinse with de-ionized water in order to remove the cleaner. (5) Other cleaning Please contact us. MURATA MFG.CO., LTD. Spec. No. JENF243D-0006K-01 Reference Only P 8/ 8 13.9. Operating Environment Do not use this product under the following environmental conditions, on deterioration of the performance, such as insulation resistance may result from the use. (1) in the corrodible atmosphere (acidic gases, alkaline gases, chlorine, sulfur gases, organic gases and etc.) (2) in the atmosphere where liquid such as organic solvent, may splash on the products. 13.10. Resin coating The capacitance value may change and/or it may affect on the product's performance due to high cure-stress of resin to be used for coating / molding products. So please pay your careful attention when you select resin. In prior to use, please make the reliability evaluation with the product mounted in your application set. 13.11. Handling of a substrate After mounting products on a substrate, do not apply any stress to the product caused by bending or twisting to the substrate when cropping the substrate, inserting and removing a connector from the substrate or tightening screw to the substrate. Excessive mechanical stress may cause cracking in the Product. Bending Twisting 13.12. Storage condition (1) Storage period Use the products within 12 months after delivered. Solderability should be checked if this period is exceeded. (2) Storage environment condition · Products should be stored in the warehouse on the following conditions. Temperature: -10 to +40°C, Humidity: 15 to 85% relative humidity No rapid change on temperature and humidity · Don’t keep products in corrosive gases such as sulfur, chlorine gas or acid, or it may cause oxidization of electrode, resulting in poor solderability. · Products should be stored on the palette for the prevention of the influence from humidity, dust and so on. · Products should be stored in the warehouse without heat shock, vibration, direct sunlight and so on. · Products should be stored under the airtight packaged condition. (3) Delivery Care should be taken when transporting or handling product to avoid excessive vibration or mechanical shock. 14. ! Note (1) Please make sure that your product has been evaluated in view of your specifications with our product being mounted to your product. (2) You are requested not to use our product deviating from the reference specifications. (3) The contents of this reference specification are subject to change without advance notice. Please approve our product specifications or transact the approval sheet for product specifications before ordering. MURATA MFG.CO., LTD.