NFW31SP106X1E4L

Spec. No. JENF243E-0009J-01 Reference Only Chip EMIFIL ® for Signal Line NFW31SP□□□X1E4L P1/ 10 Reference Specification 1. Scope This reference specification applies to Chip EMIFIL® for signal line NFW31S series. 2. Part Numbering NF Product ID W Structure 31 SP 106 X 1E 4 Dimension Features Cut-off Characteristics Rated Electrode (L × W) Frequency Voltage L Packaging Code [L: Taping] 3. Rating 3-1. Common Rating Rated Voltage Withstanding Voltage Rated Current Insulation Resistance Line Impedance 25 V(DC) 62.5 V(DC) 200 mA 1000 MΩ min. 50 Ω ∗ 6dB max. 3-2. Individual Rating Customer Part Number MURATA Part Number NFW31SP106X1E4L NFW31SP206X1E4L NFW31SP506X1E4L NFW31SP107X1E4L NFW31SP157X1E4L NFW31SP207X1E4L NFW31SP307X1E4L NFW31SP407X1E4L NFW31SP507X1E4L 10 MHz ∗ - 20 MHz 5 ∗ - 50 MHz 25 5 ∗ - Insertion Loss (dB min.) 100 150 200 300 MHz MHz MHz MHz 25 25 25 25 10 30 ∗ 5 ∗ 10 ∗ ∗ - • Operating Temperature : -40 to +85 °C 400 MHz 20 ∗ - 500 MHz 30 30 30 20 30 10 5 ∗ 1 GHz 30 30 30 30 30 30 15 10 10 • Storage Temperature : -55 to +85 °C 4. Standard Testing Condition < Unless otherwise specified > Temperature: Ordinary Temp 15 °C to 35 °C Humidity: Ordinary Humidity 25 %(RH) to 85 %(RH) Temperature: 20 °C ± 2 °C Humidity: 60 %(RH) to 70 %(RH) Atmospheric pressure: 86 kPa to 106kPa 5. Style and Dimensions ■ Equivalent Circuit 1.6±0.2 2.3±0.2 (1) 1 .8 ±0 .2 (3) 3.2±0.3 (1) (2) 1.6±0.2 (2) (1) Input (Output) Terminal (2) Ground Terminal (3) Output (Input) Terminal • No polarity. (3) : Electrode 0.7±0.3 0.7±0.3 (in mm) 0.65±0.2 MURATA MFG. CO., LTD. ■ Unit Mass(Typical value) 0.030g Spec. No. JENF243E-0009J-01 ■ Reference Only P2/ 10 Insertion Loss Characteristics (I.L.) (Typ.) (50Ωsystem) 6. Marking No Marking 7. Electrical Performance No. 7.1 Item Insulation Resistance(I.R.) Specification Meet item 3. 7.2 Withstanding Voltage No damage. 7.3 Insertion Loss Characteristics (I.L.) Meet item 3. Test Method DC rated voltage : 25 V (Between input (or output) terminal and ground terminal.) The charge time : 60 ± 5 seconds (Through the protect resistance of 1MΩ) DC rated voltage : 62.5 V (Between input (or output) terminal and ground terminal.) Testing Time : 1 to 5 seconds Limit the charging current: 10 mA max. Measured by the following circuit (Fig 1. Table 1) NETWORK ANALYZER R- INPUT(50Ω ) OUTPUT(50Ω ) ∗1 ∗1 T- INPUT(50Ω ) ∗1 ∗1 (1) (2) ∗ 1 Connect to terminals T1 T2 of network analyzer Fig.1 · Network Analyzer:MS620J(ANRITSU) or the equivalent Table 1 Cable, Connector and Measuring Condition Impedance of Cable : 50Ω Impedance of connector : 50Ω · I.L. shall be measured after connecting signal terminals T1, T2 to (1), (2) in Fig.1 respectively. MURATA MFG. CO., LTD. Line Impedance 50Ω Reference Only Spec. No. JENF243E-0009J-01 P3/ 10 8. Mechanical Performance No. Item 8.1 Appearance and Dimensions Bonding Strength 8.2 Specification Test Method Meet item 5. Visual Inspection and measured with Slide Calipers. Products shall be no failure after tested. It shall be soldered on the substrate. Applying Force(F) : 4.9 N Applying Time: 5 ± 1 s Products Pattern Products F 1.0 0.6 2.2 Substrate (in mm) 8.3 Solderability The electrodes shall be at least 90% covered with new solder coating. Flux : Ethanol solution of rosin,25 (wt)% Pre-heat : 150 ± 10 °C, 60 to 90 s Solder : Sn-3.0Ag-0.5Cu Solder Temperature : 240 ± 3 °C Immersion Time : 3 ± 1 s Immersion and emersion rates : 25 mm / s 8.4 Resistance to soldering heat Meet Table 2. Flux: Ethanol solution of rosin, 25(wt)% Pre-heat: 150 ± 10 °C, 60 to 90 s Solder: Sn-3.0Ag-0.5Cu Solder Temperature: 270 ± 5 °C Immersion Time: 10 ± 1 seconds Immersion and emersion rates : 25 mm / s Then measured after exposure in the room condition for 4 to 48 hours. Initial values : Then measured after heat treatment (150°C (+0°C,-10°C), 1 hour) and exposure in the room condition for 4 to 48 hours. It shall be soldered on the Glass-epoxy substrate. (100 × 40 × 1.6 (mm)) Table 2 Appearance Withstanding Voltage I.R. I.L. 8.5 Bending Strength No damage. No damage. Meet item 3. Products shall be no failure after tested. Pressure jig R340 F Deflection 45 8.6 Vibration Meet table 3. Table 3 Appearance Withstanding Voltage I.R. I.L. No damage No damage 100MΩ min. Meet item 3. 45 Product (in mm) Deflection : 2.0 mm (for NFW31SP106/206 : 1.0 mm) Keeping Time : 10 seconds Speed of Applying Force : 1.0 mm / s It shall be soldered on the substrate. Oscillation Frequency : 10 to 55 to 10Hz for 1 minute Double Amplitude : 1.5 mm Testing Time : A period of 2 hours in each of 3 Mutually perpendicular directions. (Total 6 hours) MURATA MFG. CO., LTD. Spec. No. JENF243E-0009J-01 Reference Only P4/ 10 9. Environmental Performance (It shall be soldered on the substrate.) No. 9.1 Item Temperature Cycle 9.2 Humidity 9.3 Heat Resistance 9.4 Cold Resistance 9.5 Humidity Load 9.6 Heat Life Specification Meet table 3. Test Method 1 Cycle: 1 step : - 40 °C (+ 0°C, - 3°C) / 30 minutes 2 step : Room Temperature / within 5 minutes 3 step : +85 °C (+ 3°C, - 0°C) / 30 minutes 4 step : Room Temperature / within 5 minutes Total of 10 cycles Then measured after exposure in the room condition for 4 to 48 hours. Initial values: Then measured after heat treatment (150°C (+0°C,-10°C), 1 hour) and exposure in the room condition for 4 to 48 hours. Temperature : 40 ± 2 °C Humidity : 90 to 95 %(RH) Time : 1000 h (+ 48h , - 0h) Then measured after exposure in the room condition for 4 to 48 hours. Temperature : 85 ± 2 °C Time : 1000 h (+ 48h , - 0h) Then measured after exposure in the room condition for 4 to 48 hours. Temperature : -55 ± 2 °C Time : 500 h (+ 24h , - 0h) Then measured after exposure in the room condition for 4 to 48 hours. Temperature : 40 ± 2 °C Humidity : 90 to 95 %(RH) Test Voltage : Rated Voltage Time : 500 h (+ 24h , - 0h) Then measured after exposure in the room condition for 4 to 48 hours. Temperature : 85 ± 3 °C Test Voltage : Rated Voltage × 200% Time : 1000 h (+ 48h , - 0h) Charge Current: 10mA max. Then measured after exposure in the room condition for 4 to 48 hours. 10. Specification of Packaging 10.1. Appearance and Dimensions (8mm-wide plastic tape) 4.0±0.1 4.0±0.1 2.0±0.05 0.2±0.1 8 .0 ±0 .2 3 .6 ±0 .2 1.9±0.2 3 .5 ±0 .0 5 1 .7 5 ±0 .1 +0.1 φ 1.5 -0 Direction of feed Dimension of the Cavity is measured at the bottom side. 2.0±0.1 (in mm) MURATA MFG. CO., LTD. Reference Only Spec. No. JENF243E-0009J-01 P5/ 10 10.2. Specification of Taping (1) Packing quantity (standard quantity) 2000 pcs. / reel (2) Packing Method Products shall be packaged in the each embossed cavity of plastic tape and sealed with cover tape. (3) Sprocket Hole The sprocket holes are to the right as the tape is pulled toward the user. (4) Spliced point The cover tape has no spliced point (5) Missing components number Missing components number within 0.1% of the number per reel or 1 pc., whichever is greater, and are not continuous. The specified quantity per reel is kept. 10.3. Pull Strength of Plastic Tape and Cover Tape Plastic Tape 5N min. Cover Tape 10N min. 165 to 180 degree F 10.4. Peeling off force of cover tape 0.2 to 0.7N(minimum value is typical.) ∗ Speed of peeling off : 300mm / minute Cover tape Plastic tape 10.5. Dimensions of Leader-tape , Trailer and Reel There shall be leader-tape (cover tape only and empty tape) and trailer-tape (empty tape) as follows. Leader Trailer 2.0±0.5 160 min. Label 190 min. 210 min. Empty tape Top tape φ 13.0±0.2 1 φ 60± 0 φ 21.0±0.8 9± 10 Direction of feed 13±1.4 0 φ 180± 3 (in: mm) 10.6. Marking for reel Customer part number , MURATA part number , Inspection number(∗1) , RoHS marking(∗2) , Quantity , etc ∗1) « Expression of Inspection No. » □□ OOOO ××× (1) (1) Factory Code (2) Date (2) (3) First digit : Year / Last digit of year Second digit : Month / Jan. to Sep. → 1 to 9, Oct. to Dec. → O, N, D Third, Fourth digit : Day (3) Serial No. ∗2) « Expression of RoHS marking » ROHS – Y (△) (1) (2) (1) RoHS regulation conformity parts. (2) MURATA classification number 10.7. Marking for Outside package (corrugated paper box) Customer name , Purchasing Order Number , Customer Part Number , MURATA part number , RoHS marking (∗2) , Quantity , etc MURATA MFG. CO., LTD. Reference Only Spec. No. JENF243E-0009J-01 P6/ 10 10.8. Specification of Outer Case Label H D W Outer Case Dimensions Standard Reel Quantity in Outer Case (mm) (Reel) W D H 186 186 93 5 ∗ Above Outer Case size is typical. It depends on a quantity of an order. 11. Standard Land Dimensions The chip EMI filter suppresses noise by conducting the high-frequency noise element to ground. Therefore, to get enough noise reduction, feed through holes which is connected to ground-plane should be arranged according to the figure to reinforce the ground-pattern. 2.6 3.0 Small diameter thru hole (φ 0.4) 1.0 (a) Standard land dimensions ・Side on which chips are mounted 0.6 1.2 2.2 4.2 Resist Copper foil pattern No pattern (in mm) 12. ! Caution Limitation of Applications Please contact us before using our products for the applications listed below which require especially high reliability for the prevention of defects which might directly cause damage to the third party's life, body or property. (1)Aircraft equipment (2)Aerospace equipment (3)Undersea equipment (4)Power plant control equipment (5)Medical equipment (6)Transportation equipment (automobiles, trains, ships, etc.) (7)Traffic signal equipment (8)Disaster prevention / crime prevention equipment (9)Data-processing equipment (10)Applications of similar complexity or with reliability requirements comparable to the applications listed in the above 13. Notice This product is designed for solder mounting. Please consult us in advance for applying other mounting method such as conductive adhesive. 13.1. Flux and Solder Flux Solder Use rosin-based flux, but not highly acidic flux (with chlorine content exceeding 0.2(wt) %). Do not use water-soluble flux. Use Sn-3.0Ag-0.5Cu solder 13.2. Note for Assembling < Thermal Shock > Pre-heating should be in such a way that the temperature difference between solder and products surface is limited to 100 °C max. Also cooling into solvent after soldering should be in such a way that the temperature difference is limited to 100 °C max. MURATA MFG. CO., LTD. Reference Only Spec. No. JENF243E-0009J-01 P7/ 10 13.3. Attention Regarding P.C.B. Bending The following shall be considered when designing P.C.B.'s and laying out products. (1) P.C.B. shall be designed so that products are not subject to the mechanical stress for board warpage. 〔Products direction〕 a Products shall be located in the sideways direction (Length: a < b) to the mechanical stress. b 〈 Poor example〉 〈 Good example 〉 (2) Components location on P.C.B. separation. It is effective to implement the following measures, to reduce stress in separating the board. It is best to implement all of the following three measures; however, implement as many measures as possible to reduce stress. Contents of Measures (1) Turn the mounting direction of the component parallel to the board separation surface. (2) Add slits in the board separation part. (3) Keep the mounting position of the component away from the board separation surface. Perforation Stress Level A > D *1 A > B A > C C B D A Slit *1 A > D is valid when stress is added vertically to the perforation as with Hand Separation. If a Cutting Disc is used, stress will be diagonal to the PCB, therefore A > D is invalid. (3) Mounting Components Near Screw Holes When a component is mounted near a screw hole, it may be affected by the board deflection that occurs during the tightening of the screw. Mount the component in a position as far away from the screw holes as possible. Screw Hole Recommended 13.4. Attention Regarding P.C.B. Design < The Arrangement of Products > •P.C.B. shall be designed so that products are far from the portion of perforation. •The portion of perforation shall be designed as narrow as possible, and shall be designed so as not to be applied the stress in the case of P.C.B. separation. P.C.B. •Products shall not be arranged on the line of a series of holes when there are big holes in P.C.B.. (Because the stress concentrate on the line of holes.) MURATA MFG. CO., LTD. ○ × Product Hole Reference Only Spec. No. JENF243E-0009J-01 < Products Placing > •Support pins shall be set under P.C.B. to prevent causing a warp to P.C.B. during placing the products on the other side of P.C.B. P8/ 10 Pick- up nozzle < P.C.B. Separation > •P.C.B. shall not be separated with hand. P.C.B. shall be separated with the fixture so as not to cause P.C.B. bending. P.C.B. Support pin 13.5. Standard Soldering Conditions On flow soldering (e.g. double wave soldering), use the product in consideration of the conditions of solder, and solder temperature and immersion time (melting time) because longer soldering time may cause the corrosion of the electrode. On dipping soldering, use the product in consideration of the conditions of solder, solder temperature, flux, and preheat and so on because de-wetting may be caused. Standard soldering profile and the limit soldering profile is as follows. The excessive soldering conditions may cause leaching of the electrode and/or resulting in the deterioration of product quality. < Flow Soldering Profile > Temp. (°C) 265°C±3°C 250°C Limit Profile 150 Heating Time Standard Profile Time.(s) 60s min. Standard Profile 150°C , 60s min. 250°C , 4s ~ 6s 2 times Pre-heating Heating Cycle of flow Limit Profile 265°C ± 3°C, 5s max. 1 time < Reflow Soldering Profile > Temp. (°C) 260°C 245°C±3°C 220°C 230°C Limit Profile 180 150 30s～60s Standard Profile 60s max. 90s±30s Pre-heating Heating Peak temperature Cycle of reflow Time.(s) Standard Profile Limit Profile 150°C ~ 180°C , 90s ± 30s above 220°C , 30s ~ 60s above 230°C , 60s max. 245°C ± 3°C 260°C , 10s 2 times 1 time MURATA MFG. CO., LTD. Spec. No. JENF243E-0009J-01 Reference Only P9/ 10 13.6. Printing of Adhesive (Flow Soldering) Adhesive amount shall be about 0.2 mg per chip to obtain enough adhesive strength. The adhesive position is as follows. Position of adhesive 2.6 0.6 13.7. Solder paste printing for reflow ・Standard thickness of solder paste should be 150 to 200 µm. ・Use the solder paste printing pattern of the right pattern. ・For the resist and copper foil pattern, use standard land dimensions. 1.0 Adhesive 0.6 2.2 4.2 (in mm) 13.8. Reworking with Soldering iron The following conditions shall be strictly followed when using a soldering iron. • Pre-heating : 150°C, 1 min • Soldering iron output : 30W max. • Tip temperature : 350°C max. • Tip diameter : φ3mm max. • Soldering time : 3(+1,-0) s • Times : 2times max. Note :Do not directly touch the products with the tip of the soldering iron in order to prevent the crack on the ceramic material due to the thermal shock. 13.9. Cleaning Conditions Products shall be cleaned on the following conditions. (1) Cleaning temperature shall be limited to 60 °C max. (40°C max. for IPA.) (2) Ultrasonic cleaning shall comply with the following conditions with avoiding the resonance phenomenon at the mounted products and P.C.B.. Power: 20W / l max. Frequency: 28kHz ~ 40kHz Time: 5 minutes max. (3) Cleaner 1. Cleaner · Isopropyl alcohol (IPA) 2. Aqueous agent · PINE ALPHA ST-100S (4) There shall be no residual flux and residual cleaner after cleaning. In the case of using aqueous agent, products shall be dried completely after rinse with de-ionized water in order to remove the cleaner. (5) Other cleaning Please contact us. 13.10. Operating Environment Do not use this product under the following environmental conditions, on deterioration of the performance, such as insulation resistance may result from the use. (1) in the corrodible atmosphere (acidic gases , alkaline gases, chlorine, sulfur gases, organic gases and etc.) (2) in the atmosphere where liquid such as organic solvent, may splash on the products. 13.11. Resin coating In case of coating/molding products the products with the resin, an open circuit issue may occur by mechanical stress caused by the resin, amount/cured shape of resin, or operating condition etc. Some resin contains some impurities or chloride possible to generate chlorine by hydrolysis under some operating condition may cause corrosion of wire of coil, leading to open circuit. So, please pay your careful attention when you select resin in case of coating/molding the products with the resin. Prior to use the coating resin, please make sure no reliability issue is observed by evaluating products mounted on your board. MURATA MFG. CO., LTD. Spec. No. JENF243E-0009J-01 Reference Only P10/ 10 13.12. Caution for use Sharp material such as a pair of tweezers or other material such as bristles of cleaning brush, shall not be touched to the winding portion to prevent the breaking of wire. Mechanical shock should not be applied to the products mounted on the board to prevent the breaking of the core. 13.13. Handling of a substrate After mounting products on a substrate, do not apply any stress to the product caused by bending or twisting to the substrate when cropping the substrate, inserting and removing a connector from the substrate or tightening screw to the substrate. Excessive mechanical stress may cause cracking in the product. Bending Twisting 13.14. Storage condition (1) Storage period Use the products within 12 months after delivered. Solderability should be checked if this period is exceeded. (2) Storage environment condition · Products should be stored in the warehouse on the following conditions. Temperature: -10 ~ +40°C Humidity: 15 ~ 85% relative humidity No rapid change on temperature and humidity · Don’t keep products in corrosive gases such as sulfur, chlorine gas or acid, or it may cause oxidization of electrode, resulting in poor solderability. · Products should be stored on the palette for the prevention of the influence from humidity, dust and so on. · Products should be stored in the warehouse without heat shock, vibration, direct sunlight and so on. · Products should be stored under the airtight packaged condition. (3) Delivery Care should be taken when transporting or handling product to avoid excessive vibration or mechanical shock. 14. ! Notes (1) Please make sure that your product has been evaluated in view of your specifications with our product being mounted to your product. (2) You are requested not to use our product deviating from the reference specifications. (3)The contents of this reference specification are subject to change without advance notice. Please approve our product specifications or transact the approval sheet for product specifications before ordering. MURATA MFG. CO., LTD.