NFZ03SG331SN10D

Reference Only Spec.No.JENF243J-0016B-01 CHIP NOISE FILTER P1/7 NFZ03SG□□□SN10□ REFERENCE SPECIFICATION 1.Scope This reference specification applies to Chip Ferrite Bead NFZ03SG Series. 2.Part Numbering (ex) NF Z Product ID 03 Structure Dimension (L×W) SG 331 Characteristics S N Typical Impedance Performance at 900MHz Category 1 Numbers of Circuit 0 D special Packaging speciD:Taping fication * B: BULK 0：ＨighImpedance 3.Rating Customer Part Number MURATA Part Number Impedance (Ω) (Under Standard Testing Condition) at 900MHz at 1.7GHz Typ. Min. Typ. DC Resistance (Ω) Typ. Rated Current (mA) Max. NFZ03SG331SN10D 330 200 400 0.46 0.55 NFZ03SG331SN10B NFZ03SG501SN10D 500 300 600 0.56 0.68 NFZ03SG501SN10B NFZ03SG671SN10D 670 400 800 0.69 0.85 NFZ03SG671SN10B NFZ03SG102SN10D 1000 600 900 1.00 1.20 NFZ03SG102SN10B NFZ03SG162SN10D 1600 960 1200 1.30 1.60 NFZ03SG162SN10B ■Operating Temperature : -55°C to +125°C ■Storage Temperature : -55°C to +125°C 305 275 250 210 180 4.Style and Dimensions 0.3±0.03 0.6±0.03 0.3±0.03 ■ Equivalent Circuit 0.15±0.05 ( Resistance element becomes dominant at high frequencies. ) : Electrode (in mm) ■ Unit Mass(Typical value) 0.300mg 5.Marking No marking. 6.Standard Testing Conditions < Unless otherwise specified > Temperature : Ordinary Temp. (15 °C to 35 °C ) Humidity : Ordinary Humidity (25%(RH) to 85%(RH)) < In case of doubt > Temperature : 20°C±2 °C Humidity : 60%(RH) to 70%(RH) Atmospheric pressure : 86kPa to 106kPa 7.Specifications 7-1.Electrical Performance No. Item 7-1-1 Impedance 7-1-2 DC Resistance Specification Meet item 3. Test Method Measuring Frequency : 900MHz, 1.7GHz±1MHz Measuring Equipment : KEYSIGHT 4991A or the equivalent Test Fixture : KEYSIGHT 16192A /16197Aor their equivalents Measuring Equipment : Digital multi meter *Except resistance of the Substrate and Wire MURATA MFG.CO.,LTD. Reference Only Spec.No.JENF243J-0016B-01 P2/7 7-2.Mechanical Performance No. Item 7-2-1 Bonding Strength Specification Products shall not be damaged after tested as test method. 7-2-2 Bending Strenght Test Method It shall be soldered on the substrate. Applying Force(F) : 2N Applying Time : 5s It shall be soldered on the Glass-epoxy substrate. Substrate : 100mm×40mm×0.8mm Deflection : 2.0mm Speed of Applying Force : 1.0mm/s Keeping Time : 20s Pressure jig R230 F Deflection Product 45 7-2-3 Vibration 7-2-4 Solderability Appearance: No damage The electrodes shall be at least 95% covered with new solder coating. (in mm) 45 It shall be soldered on the substrate. Oscillation Frequency : 10Hz to 2000Hz to 10Hz for 20min Total amplitude 3.0mm or Acceleration amplitude 196 m / s2 whichever is smaller. Testing Time:A period of 2h in each of 3 mutually perpendicular directions.(Total 6h) Flux : Ethanol solution of rosin,25(wt)% Pre-Heating : 150°C, 60s Solder : Sn-3.0Ag-0.5Cu Solder Temperature : 245°C±3°C Immersion Time : 3s 7-3.Environmental Performance It shall be soldered on the substrate. No. Item Specification 7-3-1 Heat Life Meet Table 1. Table 1 7-3-2 Cold Resistance 7-3-3 Humidity 7-3-4 Temperature Cycle Appearance Impedance Change (at 900MHz) No damage Within ±30% Test Method Temperature : 125°C±2°C Applying Current : Rated Current Time : 1000h(+48h,-0h) Then measured after exposure in the room condition for 4 to 48 h. Temperature : -55°C±2°C Time : 1000h(+48h,-0h) Then measured after exposure in the room condition for 4 to 48 h. Temperature : 40°C±2°C Humidity : 90%(RH) to 95%(RH) Time : 1000h(+48h,-0h) Then measured after exposure in the room condition for 4 to 48 h. 1 cycle : 1 step : -55 °C(+0 °C,-3 °C) /30min(+3min,-0min) 2 step : Ordinary temp. / 3 min max. 3 step : +125 °C(+3 °C,-0 °C) / 30min(+3min,-0min) 4 step : Ordinary temp. / 3 min max. Total of 100 cycles Then measured after exposure in the room condition for 4 to 48 h. MURATA MFG.CO.,LTD. Reference Only Spec.No.JENF243J-0016B-01 P3/7 +0.1 0.66(Typ.) 3.5±0.05 φ 1.5 - 0 0.36(Typ.) 8.0±0.3 2.0±0.05 2.0±0.05 4.0±0.1 1.75±0.1 8.Specification of Packaging 8-1.Appearance and Dimensions (8mm-wide paper tape) 0.55max. Direction of Feed (in mm) (1) Taping Products shall be packaged in the each embossed cavity of 8mm-wide, 2mm-pitch and plastic tape continuously and sealed by cover tape. (2) Sprocket hole : The sprocket holes are to the right as the tape is pulled toward the user. (3) Spliced point : The cover tape has no spliced point. (4) Missing components number Missing components number within 0.1% of the number per reel or 1 pc., whichever is greater, and are not continuous. The specified quantity per reel is kept. 8-2.Tape Strength (1)Pull Strength Cover tape 5N min (2)Peeling off force of Cover tape 0.1N to 0.5N (Minimum value is typical.) *Speed of Peeling off:300mm/min 165 to 180 degree 8-3.Taping Condition F Cover tape Plastic tape (1)Standard quantity per reel Quantity per 180mm reel : 15000 pcs. / reel (2)There shall be leader-tape(cover tape only and empty tape ) and trailer- tape(empty tape) as follows. (3)Marking for reel The following items shall be marked on a label and the label is stuck on the reel. (Customer part number, MURATA part number, Inspection number(∗1), RoHS marking(∗2), Quantity, etc) ∗1) « Expression of Inspection No. » □□ OOOO ××× (1) (1) Factory Code (2) Date (2) (3) First digit : Year / Last digit of year Second digit : Month / Jan. to Sep. → 1 to 9, Oct. to Dec. → O, N, D Third, Fourth digit : Day (3) Serial No. ∗2) « Expression of RoHS marking » ROHS – Y (△) (1) (2) (1) RoHS regulation conformity parts. (2) MURATA classification number (4)Outside package These reels shall be packed in the corrugated cardboard package and the following items shall be marked on a label and the label is stuck on the box. (Customer name, Purchasing order number, Customer part number, MURATA part number, RoHS marking (∗2), Quantity, etc) MURATA MFG.CO.,LTD. Reference Only Spec.No.JENF243J-0016B-01 P4/7 (5)Dimensions of reel and taping(leader-tape, trailer-tape) 2.0±0.5 Trailer 160 min. Leader Label 190 min. Empty tape 210 min. Cover tape φ 13.0±0.2 +1 φ 60 -0 φ 21.0±0.8 9.0 +1 -0 Direction of feed 13.0±1.4 +0 φ 180 -3 (in mm) 8-4. Specification of Outer Case Outer Case Dimensions Standard Reel Quantity (mm) in Outer Case (Reel) W D H 186 186 93 5 ∗ Above Outer Case size is typical. It depends on a quantity of an order. Label H D W 9. ！ Caution 9-1.Surge current Excessive surge current (pulse current or rush current) than specified rated current applied to the product may cause a critical failure, such as an open circuit, burnout caused by excessive temperature rise. Please contact us in advance in case of applying the surge current. 9-2.Limitation of Applications Please contact us before using our products for the applications listed below which require especially high reliability for the prevention of defects which might directly cause damage to the third party's life, body or property. (1) Aircraft equipment (2) Aerospace equipment (3) Undersea equipment (4) Power plant control equipment (5) Medical equipment (6) Disaster prevention / crime prevention equipment (7) Traffic signal equipment (8) Transportation equipment (vehicles, trains, ships, etc.) (9) Data-processing equipment (10) Applications of similar complexity and / or reliability requirements to the applications listed in the above. 10. Notice Products can only be soldered with reflow. This product is designed for solder mounting. Please consult us in advance for applying other mounting method such as conductive adhesive. 10-1.Land pattern designing • Standard land dimensions (Reflow soldering) Chip Ferrite Bead c Solder Resist a b c 0.25 0.80 0.30 Pattern ( in mm) a b 10-2.Soldering Conditions (1) Flux,Solder Flux Solder Use rosin-based flux, but not highly acidic flux (with chlorine content exceeding 0.2(wt)%. ) Do not use water-soluble flux. Use Sn-3.0Ag-0.5Cu solder Standard thickness of solder paste : 100 µm to 150 μm MURATA MFG.CO.,LTD. Reference Only Spec.No.JENF243J-0016B-01 P5/7 (2) Soldering conditions • Pre-heating should be in such a way that the temperature difference between solder and ferrite surface is limited to 150℃ max. Also cooling into solvent after soldering should be in such a way that the temperature difference is limited to 100℃ max. Insufficient pre-heating may cause cracks on the ferrite, resulting in the deterioration of product quality. • Standard soldering profile and the limit soldering profile is as follows. The excessive limit soldering conditions may cause leaching of the electrode and / or resulting in the deterioration of product quality. Temp. (℃) 260℃ 245℃±3℃ 220℃ 230℃ Limit Profile 180 150 Standard Profile 30s～60s 60s max. 90s±30s Pre-heating Heating Peak temperature Cycle of reflow Time. (s) Standard Profile 150～180°C 、90s±30s above 220°C、30s～60s 245±3°C 2 times Limit Profile above 230°C、60s max. 260°C,10s 2 times 10-3.Solder Volume Solder shall be used not to be exceed as shown below. Upper Limit Recommendable 1/3T≦t≦T (T:Chip thickness) t Accordingly increasing the solder volume, the mechanical stress to product is also increased. Exceeding solder volume may cause the failure of mechanical or electrical performance. 10-4.Attention regarding P.C.B. bending The following shall be considered when designing and laying out P.C.B.'s. (1) P.C.B. shall be designed so that products are not subject to the mechanical stress for board warpage. a Products shall be located in the sideways direction (Length:a D *1 A > B A > C Reference Only Spec.No.JENF243J-0016B-01 Perforation P6/7 C B D A Slit *1 A > D is valid when stress is added vertically to the perforation as with Hand Separation. If a Cutting Disc is used, stress will be diagonal to the PCB, therefore A > D is invalid. (3) Mounting Components Near Screw Holes When a component is mounted near a screw hole, it may be affected by the board deflection that occurs during the tightening of the screw. Mount the component in a position as far away from the screw holes as possible. Screw Hole Recommended 10-5.Mounting density Add special attention to radiating heat of products when mounting the inductor near the products with heating. The excessive heat by other products may cause deterioration at joint of this product with substrate. 10-6.Cleaning Conditions Products shall be cleaned on the following conditions. (1)Cleaning temperature shall be limited to 60°C max. (40°C max. for IPA.) (2)Ultrasonic cleaning shall comply with the following conditions, avoiding the resonance phenomenon at the mounted products and P.C.B. Power:20W/ max. Frequency:28kHz to 40kHz Time:5 min max. (3)Cleaner 1.Alternative cleaner · Isopropyl alcohol (IPA) 2.Aqueous agent · PINE ALPHA ST-100S (4)There shall be no residual flux and residual cleaner after cleaning. In the case of using aqueous agent, products shall be dried completely after rinse with de-ionized water in order to remove the cleaner. (5)Other cleaning Please contact us. 10-7. Operating Environment Do not use this product under the following environmental conditions, on deterioration of the Insulation Resistance of the Ferrite material and/or corrosion of Inner Electrode may result from the use. (1) in the corrodible atmosphere such as acidic gases, alkaline gases, chlorine, sulfur gases, organic gases and etc. (the sea breeze, Cl2, H2S, NH3, SO2, NO2,etc) (2) in the atmosphere where liquid such as organic solvent, may splash on the products. (3) in the atmosphere where the temperature / humidity changes rapidly and it is easy to dew. 10-8. Resin coating When products are coated with resin, please contact us in advance. 10-9. Handling of a substrate After mounting products on a substrate, do not apply any stress to the product caused by bending or twisting to the substrate when cropping the substrate, inserting and removing a connector from the substrate or tightening screw to the substrate. Excessive mechanical stress may cause cracking in the product. Bending Twisting MURATA MFG.CO.,LTD. Reference Only Spec.No.JENF243J-0016B-01 P7/7 10-10.Storage Conditions (1)Storage period Use the products within 6 months after delivered. Solderability should be checked if this period is exceeded. (2)Storage conditions • Products should be stored in the warehouse on the following conditions. Temperature : -10°C to 40°C Humidity : 15% to 85% relative humidity No rapid change on temperature and humidity • Don't keep products in corrosive gases such as sulfur, chlorine gas or acid, or it may cause oxidization of electrode, resulting in poor solderability. • Products should be stored on the palette for the prevention of the influence from humidity, dust and so on. • Products should be stored in the warehouse without heat shock, vibration, direct sunlight and so on. • Products should be stored under the airtight packaged condition. (3)Delivery Care should be taken when transporting or handling product to avoid excessive vibration or mechanical shock. 11. ! Note (1)Please make sure that your product has been evaluated in view of your specifications with our product being mounted to your product. (2)You are requested not to use our product deviating from the reference specifications. (3)The contents of this reference specification are subject to change without advance notice. Please approve our product specifications or transact the approval sheet for product specifications before ordering. MURATA MFG.CO.,LTD.