Reference Only
Spec No. JENF243J-0007D-01
CHIP NOISE FILTER
P1/8
NFZ18SM□□□SN10D REFERENCE SPECIFICATION
1. Scope
This reference specification applies to Chip Noise Filter NFZ18SM_SN10 Series.
2. Part Numbering
(ex)
NF
Z
18
SM
Product ID Structure Dimension
(L×W)
121
Characteristics
S
N
Typical Impedance Performance
at 100MHz
1
Category
0
*B: Bulk packing also available
3. Rating
・Operating Temperature Range
・Storage Temperature Range
– 55°C to +125°C
– 55°C to +125°C
DC
Resistance(Ω)
Impedance at 100 MHz
MURATA
Part Number
(Ω)
NFZ18SM121SN10D
NFZ18SM251SN10D
NFZ18SM501SN10D
NFZ18SM701SN10D
120
250
500
700
(*1) As for the rated current,
Rated Current derated as right figure
depending on the operating temperature.
Rated Current
(mA)
Tolerance
Typ.
MAX.
85℃*1
125℃*1
±25%
0.11
0.15
0.20
0.23
0.14
0.19
0.25
0.29
1250
1100
950
800
1100
1000
850
800
R a te d C u rre n t ( A )
Customer
Part Number
Rated current
at 85°C
Rated current
at 125°C
0
85
125
Operating Temperature (°C)
4. Testing Conditions
《Unless otherwise specified》
《In case of doubt》
Temperature : Ordinary Temperature / 15°C to 35°C
Temperature : 20°C ± 2°C
: Ordinary Humidity
/ 25%(RH) to 85%(RH)
Humidity
: 60%(RH) to 70%(RH)
Humidity
Atmospheric Pressure : 86kPa to 106kPa
5. Appearance and Dimensions
1.6±0.15
0.8±0.15
■Unit Mass (Typical value)
0.005g
0.8±0.15
0.4±0.2
: Electrode
(in mm)
MURATA MFG.CO., LTD
D
Numbers special Packaging
of
speci- D:Taping
Circuit
fication *B: BULK
Spec No. JENF243J-0007D-01
Reference Only
P2/8
6. Electrical Performance
No.
6.1
Item
Impedance
Specification
Impedance shall meet item 3.
6.2
DC Resistance
DC Resistance shall meet item 3.
Test Method
Measuring Equipment:
KEYSIGHT 4991A or equivalent (50mV)
Measuring Frequency: 100MHz
Measuring Equipment: Digital multi meter
Digital multi meter
(TR6846 or equivalent)
a
terminal1
terminal2
SW
b
DC resistance shall be measured after putting chip
noise filter between the terminal 2 under the condition
of opening between a and b.
Every measurement the terminal 1 shall be shorted
between a and b when changing noise filter.
7. Mechanical Performance
No.
7.1
Item
Shear Test
Specification
Chip noise filter shall not be damaged
after tested as follows.
Test Method
Applied Direction
Coil
CHIP NOISE Chip
FILTER
F
Substrate
7.2
Bending Test
Force: 10N
Hold Duration: 5s±1s
Applied Direction: Parallel to PCB
Substrate: Glass-epoxy substrate
(100mm×40mm×1.0mm)
Solder: Reflow
Pressure jig
R230
F
Deflection
45
7.3
Vibration
7.4
Drop
45
Product
(in mm)
Speed of Applying Force: 0.5mm / s
Deflection: 2mm
Hold Duration: 30 s
Oscillation Frequency:
10Hz to 2000Hz to 10Hz for 20 min
Total amplitude 3.0 mm or Acceleration
amplitude 245m/s2 whichever is smaller.
Testing Time:
A period of 4h in each of 3 mutually
perpendicular directions.
It shall be dropped on concrete or steel
board.
Method : free fall
Height : 1m
Total of 10 cycles
MURATA MFG.CO., LTD
Spec No. JENF243J-0007D-01
Reference Only
No.
7.5
Item
Solderability
Specification
The wetting area of the electrode
shall be at least 90% covered with
new solder coating.
7.6
Resistance to
Soldering Heat
Appearance: No damage
Impedance Change: within ±30%
Test Method
Flux: Ethanol solution of rosin 25(wt)%
(Immersed for 5s to 10s)
Solder: Sn-3.0Ag-0.5Cu
Pre-Heating: 150°C±10°C / 60s to 90s
Solder Temperature: 240°C±5°C
Immersion Time: 3s±1s
Flux: Ethanol solution of rosin 25(wt)%
(Immersed for 5s to 10s)
Solder: Sn-3.0Ag-0.5Cu
Pre-Heating: 150°C±10°C / 60s to 90s
Solder Temperature: 270°C±5°C
Immersion Time: 10s±1s
Then measured after exposure in the room
condition for 24h±2h.
8. Environmental Performance
It shall be soldered on the substrate.
No.
Item
Specification
8.1 Heat Resistance
Appearance: No damage
Impedance Change: within ±30%
8.2
Cold Resistance
8.3
Humidity
8.4
Temperature
Cycle
P3/8
Test Method
Temperature: 125°C±2°C
Time: 1000h (+48h,-0h)
Then measured after exposure in the room
condition for 24h±2h.
Temperature: -55°C±2°C
Time: 1000h (+48h,-0h)
Then measured after exposure in the room
condition for 24h±2h.
Temperature: 40°C±2°C
Humidity: 90%(RH) to 95%(RH)
Time: 1000h (+48h,-0h)
Then measured after exposure in the room
condition for 24h±2h.
1 cycle:
1 step: -55°C±2°C / 30 min±3 min
2 step: Ordinary temp. / 10 min to 15 min
3 step: 125°C±2°C / 30 min to 3 min
4 step: Ordinary temp. / 10 min to15 min
Total of 100cycles
Then measured after exposure in the room
condition for 24h±2h.
MURATA MFG.CO., LTD
Reference Only
Spec No. JENF243J-0007D-01
P4/8
9. Specification of Packaging
9.1 Appearance and Dimensions of plastic tape (8mm-wide)
(in mm)
1.1 max
Dimension of the Cavity is measured at the bottom side.
9.2 Specification of Taping
(1) Packing quantity (standard quantity)
4,000 pcs / reel
(2) Packing Method
Products shall be packed in the cavity of base tape continuously and sealed by top tape
And bottom tape.
(3) Sprocket hole
The sprocket holes are to the right as the tape is pulled toward the user.
(4) Spliced point
The base tape and top tape has no spliced point.
(5) Missing components number
Missing components number within 0.1% of the number per reel or 1 pc., whichever is greater,
and are not continuous. The Specified quantity per reel is kept.
9.3 Pull Strength
Top tape
Bottom tape
5N min.
9.4 Peeling off force of cover tape
Speed of Peeling off
300mm / min
Plastic tape: 0.1N to 0.6N
(minimum value is typical)
Peeling off force
9.5 Dimensions of Leader-tape, Trailer and Reel
There shall be leader-tape (top tape) and trailer-tape (empty tape) as follows.
Leader
Trailer
2.0±0.5
160 min.
190 min.
210 min.
Empty tape
Cover
tape
Top
tape
Label
13.0±0.2
1
60± 0
21.0±0.8
9± 10
Direction of feed
13±1.4
(in mm)
0
180± 3
MURATA MFG.CO., LTD
Spec No. JENF243J-0007D-01
Reference Only
P5/8
9.6 Marking for reel
Customer part number, MURATA part number, Inspection number (1), RoHS marking (2),
Quantity etc ・・・
□□ OOOO
1)
(1)
(2)
(3)
(1) Factory Code
(2) Date
First digit
(3) Serial No.
: Year / Last digit of year
Second digit
: Month / Jan. to Sep. 1 to 9, Oct. to Dec. O, N, D
Third, Fourth digit : Day
2)
ROHS – Y (△)
(1) (2)
(1) RoHS regulation conformity parts.
(2) MURATA classification number
9.7 Marking for Outside package (corrugated paper box)
Customer name, Purchasing order number, Customer part number, MURATA part number,
RoHS marking (2), Quantity, etc ・・・
9.8 Specification of Outer Case
Label
H
D
W
Outer Case Dimensions
(mm)
W
D
H
186
186
93
Standard Reel Quantity
in Outer Case (Reel)
5
Above Outer Case size is typical. It depends on a quantity of an order
10. ! Caution
Limitation of Applications
Please contact us before using our products for the applications listed below which require especially
high reliability for the prevention of defects which might directly cause damage to the third party's life,
body or property.
(1) Aircraft equipment
(6) Transportation equipment (vehicles, trains, ships, etc.)
(2) Aerospace equipment
(7) Traffic signal equipment
(3) Undersea equipment
(8) Disaster prevention / crime prevention equipment
(4) Power plant control equipment (9) Data-processing equipment
(5) Medical equipment
(10) Applications of similar complexity and /or reliability
requirements to the applications listed in the above
11. Notice
This product is designed for solder mounting.
Please consult us in advance for applying other mounting method such as conductive adhesive.
11.1 Land pattern designing
チップコイル
Chip Noise Filter
Reted
Current
(A)
d
c
a
0~1.25 0.7
a
b
Solder
Resist
ソルダーレジスト
Pattern
パターン
MURATA MFG.CO., LTD
b
1.8to2.0
c
Land pad thickness
and dimension d
18μm
35μm
70μm
0.7
0.7
0.7
0.7
(in mm)
Spec No. JENF243J-0007D-01
Reference Only
P6/8
11.2 Flux, Solder
・Use rosin-based flux.
Don’t use highly acidic flux with halide content exceeding 0.2(wt) % (chlorine conversion value).
Don’t use water-soluble flux.
・Use Sn-3.0Ag-0.5Cu solder.
・Standard thickness of solder paste: 100μm to 200μm.
11.3 Reflow soldering conditions
・Pre-heating should be in such a way that the temperature difference between solder and product
surface is limited to 150°C max. Cooling into solvent after soldering also should be in such a way that
the temperature difference is limited to 100°C max.
Insufficient pre-heating may cause cracks on the product, resulting in the deterioration of products
quality.
・Standard soldering profile and the limit soldering profile is as follows.
The excessive limit soldering conditions may cause leaching of the electrode and/or resulting in the
deterioration of product quality.
Soldering Profile for Lead Free solder
Temp.
(℃)
260℃
245℃±3℃
230℃
220℃
Limit Profile
180
150
Standard Profile
30s~60s
60s max.
90s±30s
Pre-heating
Heating
Peak temperature
Cycle of reflow
Time. (s)
Standard Profile
Limit Profile
150°C~180°C, 90s±30s
above 220°C, 30s~60s
above 230°C, 60s max.
245°C±3°C
260°C, 10s
2 times
2 times
11.4 Reworking with soldering iron
The following conditions must be strictly followed when using a soldering iron.
Pre-heating
150°C, 1 min
Tip temperature
350°C max.
Soldering iron output
80W max.
Tip diameter
φ3mm max.
Soldering time
3(+1, -0)s
Time
2 times
Note :Do not directly touch the products with the tip of the soldering iron in order to prevent the crack
on the ferrite material due to the thermal shock.
11.5 Solder Volume
・Solder shall be used not to be exceeded the upper limits as shown below.
・Accordingly increasing the solder volume, the mechanical stress to Chip is also increased.
Exceeding solder volume may cause the failure of mechanical or electrical performance.
Upper Limit
t
Recommendable
MURATA MFG.CO., LTD
1/3T≦t≦T
T: thickness of electrode
Spec No. JENF243J-0007D-01
Reference Only
P7/8
11.6 Product’s location
The following shall be considered when designing and laying out P.C.B.'s.
(1) P.C.B. shall be designed so that products are not subject to the mechanical stress due to warping the board.
[Products direction]
a
b
〈 Poor example 〉
Products shall be located in the sideways
direction (Length: a‹b) to the mechanical
stress.
〈 Good example 〉
(2)Components location on P.C.B. separation.
It is effective to implement the following measures, to reduce stress in separating the board.
It is best to implement all of the following three measures; however, implement as many measures
as possible to reduce stress.
Contents of Measures
(1) Turn the mounting direction of the component parallel to the board separation surface.
(2) Add slits in the board separation part.
(3) Keep the mounting position of the component away from the board separation surface.
Perforation
Stress Level
A > D *1
A > B
A > C
C
B
D
A
Slit
*1 A > D is valid when stress is added vertically to the perforation as with Hand Separation.
If a Cutting Disc is used, stress will be diagonal to the PCB, therefore A > D is invalid.
(3) Mounting Components Near Screw Holes
When a component is mounted near a screw hole, it may be affected by the board deflection that occurs
during the tightening of the screw. Mount the component in a position as far away from the screw holes
as possible.
Screw Hole
Recommended
11.7 Cleaning Conditions
Products shall be cleaned on the following conditions.
(1) Cleaning temperature shall be limited to 60°C max. (40°C max for IPA.)
(2) Ultrasonic cleaning shall comply with the following conditions with avoiding the resonance
phenomenon at the mounted products and P.C.B.
Power : 20 W / l max.
Frequency : 28kHz to 40kHz
Time : 5 min max.
(3) Cleaner
1. Alcohol type cleaner
Isopropyl alcohol (IPA)
2. Aqueous agent
PINE ALPHA ST-100S
MURATA MFG.CO., LTD
Spec No. JENF243J-0007D-01
Reference Only
P8/8
(4) There shall be no residual flux and residual cleaner after cleaning. In the case of using aqueous agent,
products shall be dried completely after rinse with de-ionized water in order to remove the cleaner.
(5) Other cleaning
Please contact us.
11.8 Resin coating
The impedance value may change and/or it may affect on the product's performance due to high
cure-stress of resin to be used for coating/molding products. So please pay your careful attention when you
select resin.
In prior to use, please make the reliability evaluation with the product mounted in your application set.
11.9 Caution for use
There is possibility that the impedance value change due to magnetism. Don‘t use a magnet or a pair of
tweezers with magnetism when chip noise filters are handled. (The tip of the tweezers should be molded with
resin or pottery.)
11.10 Handling of a substrate
After mounting products on a substrate, do not apply any stress to the product caused by bending or
twisting to the substrate when cropping the substrate, inserting and removing a connector from the
substrate or tightening screw to the substrate.
Excessive mechanical stress may cause cracking in the product.
Bending
Twisting
11.11 Storage and Handing Requirements
(1) Storage period
Use the products within 6 months after delivered.
Solderability should be checked if this period is exceeded.
(2) Storage conditions
・Products should be stored in the warehouse on the following conditions.
Temperature : -10°C to 40°C
Humidity
: 15% to 85% relative humidity
No rapid change on temperature and humidity
Don't keep products in corrosive gases such as sulfur, chlorine gas or acid, or it may cause oxidization
of electrode, resulting in poor solderability.
・Products should be stored on the palette for the prevention of the influence from humidity, dust and so
on.
・Products should be stored in the warehouse without heat shock, vibration, direct sunlight and so on.
・Products should be stored under the airtight packaged condition.
(3) Handling Condition
Care should be taken when transporting or handling product to avoid excessive vibration or mechanical
shock.
12. ! Note
(1) Please make sure that your product has been evaluated in view of your specifications with our product being
mounted to your product.
(2) You are requested not to use our product deviating from the reference specifications.
(3) The contents of this reference specification are subject to change without advance notice.
Please approve our product specifications or transact the approval sheet for product specifications
before ordering.
MURATA MFG.CO., LTD