NFZ2MSD102SZ10L

Spec No.JETE243A-9103C-01 Reference Only P 1/9 CHIP NOISE FILTER NFZ2MSD□□□SZ10L REFERENCE SPECIFICATION Murata Standard Specification【AEC-Q200】 1. Scope This reference specification applies to NFZ2MSD_SZ10L, Chip Noise Filter for Automotive Electronic based on AEC-Q200.（except for Power train and Safety） 2.Part Numbering (ex) NF Z 2M Product Structure ID SD 101 Dimension Characteristics Typical Impedance (L×W) at 100MHz S Z 1 Numbers Performance Category Of Circuit (T) 0 L Special Specification Packaging L: Φ180Taping 3.Rating Operating Temperature Range (Ambient temperature; Self-temperature rise is not included) (Product temperature; Self- temperature rise is included) Storage Temperature Range. Withstand voltage Customer Part Number Murata Part Number Impedance at 10MHｚ (Ω) -40 to +85°C -40 to +125°C -40 to +85°C 20V Impedance at 100MHｚ DC Resistance Max *1 Rated Current Typ (Ω) (mΩ) （A） Tolerance ESD Rank １A:0.5kV NFZ2MSD101SZ10L 9 100 18 5.2 １A NFZ2MSD181SZ10L 15 180 22 4.0 １A NFZ2MSD301SZ10L 21 300 26 3.8 １A NFZ2MSD501SZ10L 29 500 32 3.2 １A NFZ2MSD102SZ10L 46 1000 46 2.5 １A ±30% *1: When applied Rated current to the Products, self temperature rise shall be limited to 40℃ max. 4. Testing Conditions (Standard atmospheric conditions) Temperature : Ordinary Temperature (15 to 35°C) Humidity : Ordinary Humidity (25 to 85 %(RH)) Temperature Humidity Atmospheric Pressure : 20 ± 2°C : 60 to 70 %(RH) : 86 to 106 kPa 5.Appearance and Dimensions ※no marking (in mm) ■Unit Mass (Typical value) MURATA MFG.CO., LTD 0.0188g Reference Only Spec No.JETE243A-9103C-01 P 2/9 6. Electrical Performance No. 6.1 No. Impedance 6.2 DC Resistance Item Meet item 3. Specification Measuring Equipment: KEYSIGHT 4287A or equivalent (0.5V) Measuring Frequency: 10MHz Measuring Equipment: Digital multi meter 7. Q200 Requirement AEC-Q200 Rev.D issued June 1. 2010 AEC-Q200 Stress No. 3 High Temperature Exposure Test Method 1000hours at 125 deg C Set for 24hours at room temperature, then measured. Murata Specification / Deviation Meet Table A after testing. Table A Appearance Impedance Change (at 10MHz) No damage Within ±30% 4 Temperature Cycling 1000cycles -40 deg C to +125 deg C Set for 24hours at room temperature, then measured. 5 Destructive Physical Analysis Per EIA469 No electrical tests Not Applicable 7 Biased Humidity 1000hours at 85 deg C, 85%RH Meet Table A after testing. MURATA MFG.CO., LTD Reference Only Spec No.JETE243A-9103C-01 AEC-Q200 P 3/9 Murata Specification / Deviation Stress No. 8 Operational Life Test Method Apply 125 deg C 1000hours Set for 24hours at room temperature, then measured Meet Table A after testing. The operating temperature should be 85 deg C. 9 Visual inspection No abnormalities 10 Physical Dimension Meet ITEM 5 （Appearance and Dimensions） No defects 12 Resistance to Solvents Per MIL-STD-202 Method 215 Not Applicable 13 Mechanical Shock Per MIL-STD-202 Method 213 Condition C 100g's(0.98N)/6ms/Half sine Meet Table A after testing. 14 Vibration 5g's(0.049N) for 20 minutes, 12cycles each of 3 oritentations Test from 10-2000Hz. 15 Resistance to Soldering Heat Solder temperature 250+5/-5 deg C Immersion time 30±5s Pre-heating: above 183 deg C, 90 to120s 17 ESD Per AEC-Q200-002 Meet Table A after testing. 18 Solderability Per J-STD-002 Method b : Not Applicable 90% of the terminations is to be soldered. 19 Electrical Characterization Measured : Impedance No defects 20 Flammability Per UL-94 Not Applicable 21 Board Flex Epoxy-PCB(1.6mm) Deflection 2mm(min) 60s minimum holding time Meet Table A after testing. 22 Terminal Strength Per AEC-Q200-006 No defects 30 Electrical Transient Conduction Per ISO-7637-2 Not Applicable External Visual Meet Table A after testing. ESD Rank: Meet Item 3 (Rating) MURATA MFG.CO., LTD Spec No.JETE243A-9103C-01 Reference Only P 4/9 8. Specification of Packaging 8.1 Appearance and Dimensions of plastic tape A B D0 D1 E F 1.85 2.25 φ1.5 φ1.0 1.75 3.5 ±0.1 ±0.1 ＋0.1 -0 ＋0.1 -0 ±0.1 ±0.05 P0 P1 P2 T1 T2 W 4.0 4.0 2.0 0.25 1.3 8.0 ±0.1 ±0.1 ±0.05 ±0.05 ±0.1 ±0.2 Unreeling direction (in mm) 8.2 Specification of Taping (1) Packing quantity (standard quantity) 3,000 pcs / reel (2) Packing Method Products shall be packed in the each embossed cavity of plastic tape and sealed by cover tape. (3) Sprocket hole The sprocket holes are to the right as the tape is pulled toward the user. (4) Spliced point Plastic tape and Cover tape has no spliced point. (5) Missing components number Missing components number within 0.1 % of the number per reel or 1 pc., whichever is greater, and are not continuous. The specified quantity per reel is kept. 8.3 Pull Strength Embossed carrier tape Cover tape 8.4 Peeling off force of cover tape Speed of Peeling off Peeling off force 9.8N min. 5N min. 300mm/min 165 to 180 degree F Cover tape 0.1 to 0.7N (minimum value is typical) Plastic tape 8.5 Dimensions of Leader-tape, Trailer and Reel There shall be leader-tape(cover tape) and trailer-tape (empty tape) as follows. (in mm) MURATA MFG.CO., LTD Reference Only Spec No.JETE243A-9103C-01 P 5/9 8.6 Marking for reel Customer part number, MURATA part number, Inspection number(∗1), RoHS marking(∗2), Quantity etc ･･･ ∗1) □□ OOOO ××× (1) (2) (3) (1) Factory Code (2) Date First digit : Year / Last digit of year Second digit : Month / Jan. to Sep. → 1 to 9, Oct. to Dec. → O, N, D Third, Fourth digit : Day (3) Serial No. ∗2) « Expression of RoHS marking » ROHS – Y (△) (1) (2) (1) RoHS regulation conformity (2) MURATA classification number 8.7 Marking for Outside package (corrugated paper box) Customer name, Purchasing order number, Customer part number, MURATA part number, RoHS marking (∗2) ,Quantity, etc ･･･ 8.8. Specification of Outer Case Outer Case Dimensions (mm) Label H W D H Standard Reel Quantity in Outer Case (Reel) 200 185 67 5 Above Outer Case size is typical. It depends on a quantity of an order. D W 9. Caution 9.1 Limitation of Applications Please contact us before using our products for the applications listed below which require especially high reliability for the prevention of defects which might directly cause damage to the third party's life, body or property. (1) Aircraft equipment (6) Transportation equipment ( trains, ships, etc.) (7) Traffic signal equipment (2) Aerospace equipment (3) Undersea equipment (8) Disaster prevention / crime prevention equipment (4) Power plant control equipment (9) Data-processing equipment (5) Medical equipment (10) Applications of similar complexity and /or reliability requirements to the applications listed in the above 9.2 Caution(Rating) Do not exceed maximum rated current of the product. Thermal stress may be transmitted to the product and short/open circuit of the product or falling off the product may be occurred. 9.3 Fail-safe Be sure to provide an appropriate fail-safe function on your product to prevent a second damage that may be caused by the abnormal function or the failure of our product. 9.4 Corrosive gas Please refrain from use since contact with environments with corrosive gases (sulfur gas [hydrogen sulfide, sulfur dioxide, etc.], chlorine, ammonia, etc.) or oils (cutting oil, silicone oil, etc.) that have come into contact with the previously stated corrosive gas environment will result in deterioration of product quality or an open from deterioration due to corrosion of product electrode, etc. We will not bear any responsibility for use under these environments. 10. Notice This product is designed for solder mounting. Please consult us in advance for applying other mounting method such as conductive adhesive. This product employs a core with low insulation resistance, Pay strict attention when use it. a) Do not make any through holes and copper pattern under the coil except a copper pattern to the electrode. b) Design/mount any components not to contact this product. MURATA MFG.CO., LTD Spec No.JETE243A-9103C-01 Reference Only P 6/9 10.1 Land pattern designing (Reflow Soldering) Recommended land pattern for reflow soldering is as follows: It has been designed for Electric characteristics and solderability. Please follow the recommended patterns. Otherwise, their performance which includes electrical performance or solderability may be affected, or result to "position shift" in soldering process. (in mm) 10.2 Flux, Solder Flux Solder ・Use rosin-based flux. ・Don’t use highly acidic flux with halide content exceeding 0.2(wt)% (chlorine conversion value). ・Don’t use water-soluble flux. ・Use Sn-3.0Ag-0.5Cu solder ・Standard thickness of solder paste : 100μm to 150μm Other flux (except （above) Please contact us for details, then use. 10.3 soldering conditions (Reflow) ・Pre-heating should be in such a way that the temperature difference between solder and product surface is limited to 100°C max. Cooling into solvent after soldering also should be in such a way that the temperature difference is limited to 100°C max. Insufficient pre-heating may cause cracks on the product, resulting in the deterioration of product quality. ・Standard soldering profile profile is as follows. Standard Profile Pre-heating 150℃～180℃ 、90s±30s Heating Peak temperature Cycle of reflow above 230℃ 、20s～40s 250℃+5/-0℃ 2 times MURATA MFG.CO., LTD Reference Only Spec No.JETE243A-9103C-01 P 7/9 10.4 Solder Volume ・Solder shall be used not to be exceeded the upper limits as shown below. ・Accordingly increasing the solder volume, the mechanical stress to Chip is also increased. Exceeding solder volume may cause the failure of mechanical or electrical performance. Upper Limit Recommendable t 1/3T≦t≦T T： thickness of electrode 10.5 Product's location The following shall be considered when designing and laying out P.C.B.’s. (1) P.C.B. shall be designed so that products are not subject to the mechanical stress due to warping the board. ［Products direction］ a Products shall be located in the sideways direction to the mechanical stress. b 〈 Poor example 〉 〈 Good example〉 (2) Components location on P.C.B. separation. It is effective to implement the following measures, to reduce stress in separating the board. It is best to implement all of the following three measures; however, implement as many measures as possible to reduce stress. Contents of Measures Stress Level (1) Turn the mounting direction of the component parallel to the board separation surface. A > D ∗1 (2) Add slits in the board separation part. A > B (3) Keep the mounting position of the component away from the board separation surface. A > C Perforation C B D A ∗1 A > D is valid when stress is added vertically to the perforation as with Hand Separation. If a Cutting Disc is used, stress will be diagonal to the PCB, therefore A > D is invalid. Slit (3) Mounting Components Near Screw Holes When a component is mounted near a screw hole, it may be affected by the board deflection that occurs during the tightening of the screw. Mount the component in a position as far away from the screw holes as possible. Screw Hole Recommended 10.6 Resin coating The Impedance value may change and/or it may affect on the product's performance due to high cure-stress of resin to be used for coating/molding products. So please pay your careful attention when you select resin. In prior to use, please make the reliability evaluation with the product mounted in your application set. 10.7 Temperature rating of the circuit board and components located around Temperature may rise up to max. 40 ℃ when applying the rated current to the Products. Be careful of the temperature rating of the circuit board and components located around. 10.8 Caution for use There is possibility that the Impedance value change due to magnetism. Don‘t use a magnet or a pair of tweezers with magnetism when chip coil are handled. (The tip of the tweezers should be molded with resin or pottery.) MURATA MFG.CO., LTD Spec No.JETE243A-9103C-01 Reference Only P 8/9 10.9 Magnetic Saturation When the excessive current over rated current is applied, the Impedance value may change due to magnetism. 10.10 Handling of a substrate After mounting products on a substrate, do not apply any stress to the product caused by bending or twisting to the substrate when cropping the substrate, inserting and removing a connector from the substrate or tightening screw to the substrate. Excessive mechanical stress may cause cracking in the product. Bending Twisting 10.11 Storage and Handing Requirements (1) Storage period Use the products within 6 months after delivered. Solderability should be checked if this period is exceeded. (2) Storage conditions ・Products should be stored in the warehouse on the following conditions. Temperature ： -10°C to 40°C Humidity ： 15% to 85% relative humidity No rapid change on temperature and humidity Don't keep products in corrosive gases such as sulfur, chlorine gas or acid, or it may cause oxidization of electrode, resulting in poor solderability. ・Products should be stored on the palette for the prevention of the influence from humidity, dust and so on. ・Products should be stored in the warehouse without heat shock, vibration, direct sunlight and so on. ・Products should be stored under the airtight packaged condition. (3) Handling Condition Care should be taken when transporting or handling product to avoid excessive vibration or mechanical shock. 10.12 Derating Max. current (DC, AC) as function of product temperature (derating curve) IOP : Loaded Current IR : Rated Current Product Temperature [℃] MURATA MFG.CO., LTD Spec No.JETE243A-9103C-01 11． Reference Only P 9/9 Note (1)Please make sure that your product has been evaluated in view of your specifications with our product being mounted to your product. (2)You are requested not to use our product deviating from the reference specifications. (3)The contents of this reference specification are subject to change without advance notice. Please approve our product specifications or transact the approval sheet for product specifications before ordering. MURATA MFG.CO., LTD