NFZ2MSD200SN10L

Reference Only Spec No.JETE243A-0045B-01 P 1/8 CHIP NOISE FILTER NFZ2MSD□□□SN10L REFERENCE SPECIFICATION 1. Scope This reference specification applies to NFZ2MSD□□□SN10L, Chip Noise Filter. 2.Part Numbering (ex) NF Z Product Structure ID 2M SD 100 Dimension Characteristics Typical Impedance (L×W) at 10MHz S N 1 Numbers Performance Category Of Circuit (T) 0 L Special Specification Packaging L: Φ180Taping 3.Rating Operating Temperature Range (Ambient temperature; Self-temperature rise is not included) (Product temperature; Self- temperature rise is included) Storage Temperature Range. Absolute maximum voltage Customer Part Number -40 to +85°C -40 to +125°C -40 to +85°C 20V DC Impedance at 10MHｚ Murata Part Number (Ω) Tolerance DC Resistance Max *1 Rated Current (mΩ) （A） NFZ2MSD100SN10L 10 20 5.2 NFZ2MSD150SN10L 15 23 4.4 NFZ2MSD200SN10L 20 28 3.9 NFZ2MSD300SN10L 30 33 3.7 NFZ2MSD600SN10L 60 54 2.7 NFZ2MSD900SN10L 90 95 2.0 NFZ2MSD131SN10L 130 144 1.5 ±30% *1: When applied Rated current to the Products, self temperature rise shall be limited to 40℃ max. 4. Testing Conditions (Standard atmospheric conditions) Temperature : Ordinary Temperature (15 to 35°C) Humidity : Ordinary Humidity (25 to 85 %(RH)) Temperature Humidity Atmospheric Pressure : 20 ± 2°C : 60 to 70 %(RH) : 86 to 106 kPa 5.Appearance and Dimensions ※no marking (in mm) ■Unit Mass (Typical value) MURATA MFG.CO., LTD 0.0188g Reference Only Spec No.JETE243A-0045B-01 P 2/8 6. Electrical Performance No. 6.1 No. Impedance 6.2 DC Resistance Item Meet item 3. Specification Measuring Equipment: KEYSIGHT 4287A or equivalent (0.5V) Measuring Frequency: 10MHz Measuring Equipment: Digital multi meter 7. Mechanical Perdormance No. 7.1 Item Shear Test Specification Chip Noise Filter shall not be damaged. Test Method It shall be soldered on the substrate. Applying Force(F) : 10N Hold Duration: 5s 7.2 Bending Test Chip Noise Filter shall not be damaged. Substrate: Glass-epoxy substrate (100×40×1.0mm) Speed of Applying Force: 0.5mm / s Deflection: 2mm Hold Duration: 20s 7.3 Vibration Chip Noise Filter shall not be damaged. 7.4 Solderability The wetting area of the electrode shall be at least 90% covered with new solder coating. 7.5 Resistance to Soldering Heat Appearance:No damage Impedance Change : within ±30% (in mm) It shall be soldered on the substrate. Oscillation Frequency : 10 to 2000 to 10Hz for 20 minutes Total amplitude : 1.5 mm or Acceleration amplitude 98m/s2 whichever is smaller. Testing Time: A period of 2 hours in each of 3 mutually perpendicular directions. (Total 6 hours) Flux:Ethanol solution of rosin,25(wt)% (Immersed for 5s to 10s) Solder : Sn-3.0Ag-0.5Cu Pre-Heating:150±10°C / 60 to 90s Solder Temperature:245±5°C Immersion Time:3 s Reflow soldering method Flux: Ethanol solution of rosin,25(wt)% Solder: Sn-3.0Ag-0.5Cu Pre-Heating: 150~180°C / 90±30s Solder Temperature: 230°C min / 30±10s Peak Temperature: 250+5/-0°C Reflow times: 2 times max Test board shall be 0.8 mm thick. Base material shall be glass epoxy resin. Then measured after exposure Standard atmospheric conditions for 1~2 hours. MURATA MFG.CO., LTD Reference Only Spec No.JETE243A-0045B-01 P 3/8 8.Environmental Performance (It shall be soldered on the substrate.) No. 8.1 Item Heat Resistance 8.2 Cold Resistance 8.3 Humidity 8.4 Temperature Cycle Specification Appearance:No damage Impedance Change : within ±30% Test Method Temperature: 125±2°C Time: 1000h (±12h) Then measured after exposure Standard atmospheric conditions for 1~2 hours. Temperature: -40±2°C Time: 1000h (±12h) Then measured after exposure Standard atmospheric conditions for 1~2 hours. Temperature: 40±2°C Humidity: 90~95%(RH) Time: 1000h (±12h) Then measured after exposure Standard atmospheric conditions for 1~2 hours. 1 cycle: 1 step: -40±2°C / 30±3 min 2 step: Ordinary temp. / 3min max. 3 step: +125±2°C / 30±3 min 4 step: Ordinary temp. / 3min max. Total of 100 cycles Then measured after exposure Standard atmospheric conditions for 1~2 hours. 9. Specification of Packaging 9.1 Appearance and Dimensions of plastic tape A B D0 D1 E F 1.85 2.25 φ1.5 φ1.0 1.75 3.5 ±0.1 ±0.1 ＋0.1 -0 ＋0.1 -0 ±0.1 ±0.05 P0 P1 P2 T1 T2 W 4.0 4.0 2.0 0.25 1.3 8.0 ±0.1 ±0.1 ±0.05 ±0.05 ±0.1 ±0.2 Unreeling direction (in mm) 9.2 Specification of Taping (1) Packing quantity (standard quantity) 3,000 pcs / reel (2) Packing Method Products shall be packed in the each embossed cavity of plastic tape and sealed by cover tape. (3) Sprocket hole The sprocket holes are to the right as the tape is pulled toward the user. (4) Spliced point Plastic tape and Cover tape has no spliced point. (5) Missing components number Missing components number within 0.1 % of the number per reel or 1 pc., whichever is greater, and are not continuous. The specified quantity per reel is kept. 9.3 Pull Strength Embossed carrier tape Cover tape 9.4 Peeling off force of cover tape Speed of Peeling off Peeling off force 9.8N min. 5N min. 300mm/min 165 to 180 degree F Cover tape 0.1 to 0.7N (minimum value is typical) Plastic tape MURATA MFG.CO., LTD Reference Only Spec No.JETE243A-0045B-01 P 4/8 9.5 Dimensions of Leader-tape, Trailer and Reel There shall be leader-tape(cover tape) and trailer-tape (empty tape) as follows. (in mm) 9.6 Marking for reel Customer part number, MURATA part number, Inspection number(∗1), RoHS marking(∗2), Quantity etc ･･･ ∗1) □□ OOOO ××× (1) (2) (3) (1) Factory Code (2) Date First digit : Year / Last digit of year Second digit : Month / Jan. to Sep. → 1 to 9, Oct. to Dec. → O, N, D Third, Fourth digit : Day (3) Serial No. ∗2) « Expression of RoHS marking » ROHS – Y (△) (1) (2) (1) RoHS regulation conformity (2) MURATA classification number 9.7 Marking for Outside package (corrugated paper box) Customer name, Purchasing order number, Customer part number, MURATA part number, RoHS marking (∗2) ,Quantity, etc ･･･ 9.8. Specification of Outer Case Outer Case Dimensions (mm) Label H W D H Standard Reel Quantity in Outer Case (Reel) 200 185 67 5 Above Outer Case size is typical. It depends on a quantity of an order. D W MURATA MFG.CO., LTD Reference Only Spec No.JETE243A-0045B-01 10. P 5/8 Caution 10.1 Limitation of Applications Please contact us before using our products for the applications listed below which require especially high reliability for the prevention of defects which might directly cause damage to the third party's life, body or property. (1) Aircraft equipment (6) Transportation equipment (vehicles, trains, ships, etc.) (7) Traffic signal equipment (2) Aerospace equipment (3) Undersea equipment (8) Disaster prevention / crime prevention equipment (4) Power plant control equipment (9) Data-processing equipment (5) Medical equipment (10) Applications of similar complexity and /or reliability requirements to the applications listed in the above 10.2 Corrosive gas Please refrain from use since contact with environments with corrosive gases (sulfur gas [hydrogen sulfide, sulfur dioxide, etc.], chlorine, ammonia, etc.) or oils (cutting oil, silicone oil, etc.) that have come into contact with the previously stated corrosive gas environment will result in deterioration of product quality or an open from deterioration due to corrosion of product electrode, etc. We will not bear any responsibility for use under these environments. 11. Notice This product is designed for solder mounting. Please consult us in advance for applying other mounting method such as conductive adhesive. This product employs a core with low insulation resistance, Pay strict attention when use it. a) Do not make any through holes and copper pattern under the coil except a copper pattern to the electrode. b) Design/mount any components not to contact this product. 11.1 Land pattern designing (Reflow Soldering) Recommended land pattern for reflow soldering is as follows: It has been designed for Electric characteristics and solderability. Please follow the recommended patterns. Otherwise, their performance which includes electrical performance or solderability may be affected, or result to "position shift" in soldering process. (in mm) 11.2 Flux, Solder Flux Solder ・Use rosin-based flux. ・Don’t use highly acidic flux with halide content exceeding 0.2(wt)% (chlorine conversion value). ・Don’t use water-soluble flux. ・Use Sn-3.0Ag-0.5Cu solder ・Standard thickness of solder paste : 100μm to 150μm Other flux (except （above) Please contact us for details, then use. MURATA MFG.CO., LTD Reference Only Spec No.JETE243A-0045B-01 P 6/8 11.3 soldering conditions (Reflow) ・Pre-heating should be in such a way that the temperature difference between solder and product surface is limited to 100°C max. Cooling into solvent after soldering also should be in such a way that the temperature difference is limited to 100°C max. Insufficient pre-heating may cause cracks on the product, resulting in the deterioration of product quality. ・Standard soldering profile profile is as follows. Standard Profile Pre-heating 150℃～180℃ 、90s±30s Heating Peak temperature Cycle of reflow above 230℃ 、20s～40s 250℃+5/-0℃ 2 times 11.4 Solder Volume ・Solder shall be used not to be exceeded the upper limits as shown below. ・Accordingly increasing the solder volume, the mechanical stress to Chip is also increased. Exceeding solder volume may cause the failure of mechanical or electrical performance. Upper Limit Recommendable t 1/3T≦t≦T T： thickness of electrode 11.5 Product's location The following shall be considered when designing and laying out P.C.B.’s. (1) P.C.B. shall be designed so that products are not subject to the mechanical stress due to warping the board. ［Products direction］ a Products shall be located in the sideways direction to the mechanical stress. b 〈 Poor example 〉 〈 Good example〉 MURATA MFG.CO., LTD Reference Only Spec No.JETE243A-0045B-01 P 7/8 (2) Components location on P.C.B. separation. It is effective to implement the following measures, to reduce stress in separating the board. It is best to implement all of the following three measures; however, implement as many measures as possible to reduce stress. Contents of Measures Stress Level (1) Turn the mounting direction of the component parallel to the board separation surface. A > D ∗1 (2) Add slits in the board separation part. A > B (3) Keep the mounting position of the component away from the board separation surface. A > C Perforation C B D A ∗1 A > D is valid when stress is added vertically to the perforation as with Hand Separation. If a Cutting Disc is used, stress will be diagonal to the PCB, therefore A > D is invalid. Slit (3) Mounting Components Near Screw Holes When a component is mounted near a screw hole, it may be affected by the board deflection that occurs during the tightening of the screw. Mount the component in a position as far away from the screw holes as possible. Screw Hole Recommended 11.6 Resin coating The Impedance value may change and/or it may affect on the product's performance due to high cure-stress of resin to be used for coating/molding products. So please pay your careful attention when you select resin. In prior to use, please make the reliability evaluation with the product mounted in your application set. 11.7 Temperature rating of the circuit board and components located around Temperature may rise up to max. 40 ℃ when applying the rated current to the Products. Be careful of the temperature rating of the circuit board and components located around. 11.8 Caution for use There is possibility that the Impedance value change due to magnetism. Don‘t use a magnet or a pair of tweezers with magnetism when chip coil are handled. (The tip of the tweezers should be molded with resin or pottery.) 11.9 Magnetic Saturation When the excessive current over rated current is applied, the Impedance value may change due to magnetism. 11.10 Handling of a substrate After mounting products on a substrate, do not apply any stress to the product caused by bending or twisting to the substrate when cropping the substrate, inserting and removing a connector from the substrate or tightening screw to the substrate. Excessive mechanical stress may cause cracking in the product. Bending Twisting MURATA MFG.CO., LTD Reference Only Spec No.JETE243A-0045B-01 P 8/8 11.11 Storage and Handing Requirements (1) Storage period Use the products within 6 months after delivered. Solderability should be checked if this period is exceeded. (2) Storage conditions ・Products should be stored in the warehouse on the following conditions. Temperature ： -10°C to 40°C Humidity ： 15% to 85% relative humidity No rapid change on temperature and humidity Don't keep products in corrosive gases such as sulfur, chlorine gas or acid, or it may cause oxidization of electrode, resulting in poor solderability. ・Products should be stored on the palette for the prevention of the influence from humidity, dust and so on. ・Products should be stored in the warehouse without heat shock, vibration, direct sunlight and so on. ・Products should be stored under the airtight packaged condition. (3) Handling Condition Care should be taken when transporting or handling product to avoid excessive vibration or mechanical shock. 11.12 Derating Max. current (DC, AC) as function of product temperature (derating curve) IOP : Loaded Current IR : Rated Current Product Temperature [℃] 12． Note (1)Please make sure that your product has been evaluated in view of your specifications with our product being mounted to your product. (2)You are requested not to use our product deviating from the reference specifications. (3)The contents of this reference specification are subject to change without advance notice. Please approve our product specifications or transact the approval sheet for product specifications before ordering. MURATA MFG.CO., LTD