NFZ32BW3R3HN11L

Reference Only SpecNo.JENF243J-0003F-01 CHIP NOISE FILTER NFZ32BW□□□HN11L P1/8 REFERENCE SPECIFICATION 1. Scope This reference specification applies to NFZ32BW_HN11L Series, Chip Noise Filter. 2. Part Numbering (ex) NF Z 32 BW 1R0 H N 1 1 L Product ID Structure Dimension Features Impedance Performance Category Numbers Other Packaging (L×W) of Circuit L:Taping 3. Rating ・Operating Temperature Range. (Ambient temperature; Self-temperature rise is not included) (Product temperature; Self- temperature rise is included) -40 to +125°C ・Storage Temperature Range. Customer Part Number Impedance at 1MHz MURATA Part Number (Ω) Tolerance -40 to +105°C -40 to +125°C DC Resistance (Ω) Tolerance 1 Rated Current(mA) 2 Ambient temperature 85°C 3 Ambient temperature 105°C NFZ32BW3R3HN11L 3.3 0.024 2900 1490 NFZ32BW6R8HN11L 6.8 0.036 2500 1380 NFZ32BW8R4HN11L 8.4 0.048 2400 1360 NFZ32BW9R8HN11L 9.8 0.053 2100 1110 NFZ32BW120HN11L 12 0.064 1850 910 NFZ32BW190HN11L 19 1800 900 NFZ32BW210HN11L 21 1550 800 NFZ32BW310HN11L 31 0.155 1200 610 NFZ32BW520HN11L 52 0.220 1100 550 NFZ32BW650HN11L 65 0.295 900 450 NFZ32BW101HN11L 100 0.475 900 330 NFZ32BW151HN11L 150 0.685 700 270 ±30% 0.089 0.100 ±20% 1：As for the rated current, rated current derated as figure.1 depending on the operating temperature. 2：When applied rated current to the Products, temperature rise caused by self heating will be 40°C or less. 3：When applied rated current to the Products, temperature rise caused by self heating will be 20°C or less. Rated Current [mA] Fugure. 1 Rated  Current at 85℃ Rated  Current at 105℃ 85 105 Operating Temperature (Ambient temperature)[℃] 4. Testing Conditions 《Unless otherwise specified》 Temperature : Ordinary Temperature (15 to 35°C) Humidity : Ordinary Humidity (25 to 85 % (RH)) 《In case of doubt》 Temperature : 20 ± 2°C Humidity : 60 to 70 % (RH) Atmospheric Pressure : 86 to 106 kPa MURATA MFG.CO., LTD Reference Only SpecNo.JENF243J-0003F-01 P2/8 5. Appearance and Dimensions 2.7±0.2 1.55±0.15 2.5±0.2 Ａ Ａ 2.5±0.2 Ａ ：2.8 以 下 3.2±0.3 ※製品本体への表示はありません。 ※ No marking. (in mm)( 単 位 ■Unit Mass (Typical value) 0.044ｇ mm) 0.9±0.3 1.3±0.2 0.9±0.3 6. Electrical Performance No. 6.1 Item Impedance Specification Impedance shall meet item 3. 6.2 DC Resistance DC Resistance shall meet item 3. Test Method Measuring Equipment：KEYSIGHT 4192A or equivalent Measuring Frequency：1MHz Measuring Equipment：Digital multi meter 7. Mechanical Performance No. 7.1 Item Shear Test Specification Chip coil shall not be damaged. Test Method Substrate：Glass-epoxy substrate Chip Coil Force：10N Hold Duration：5±1s Ｆ Substrate 7.2 Bending Test Substrate：Glass-epoxy substrate (100×40×1.0mm) Speed of Applying Force：0.5mm / s Deflection：2mm Hold Duration：5s Pressure jig R230 F Deflection 45 7.3 Vibration Chip Noise Filter shall not be damaged. 45 Product (in mm) Oscillation Frequency：10 to 2000 to 10Hz for 20 min Total amplitude：1.5 mm or Acceleration amplitude 98 m/s2 whichever is smaller. Testing Time：A period of 2 hours in each of 3 mutually perpendicular directions. (Total 6 hours) MURATA MFG.CO., LTD SpecNo.JENF243J-0003F-01 Reference Only No. 7.4 Item Solderability Specification The wetting area of the electrode shall be at least 90% covered with new solder coating. 7.5 Resistance to Soldering Heat Appearance：No damage Impedance Change：within ±10% P3/8 Test Method Flux：Ethanol solution of rosin,25(wt)% (Immersed for 5s to 10s) Solder：Sn-3.0Ag-0.5Cu Pre-Heating：150±10°C / 60 to 90s Solder Temperature：240±5°C Immersion Time：3±1 s Flux：Ethanol solution of rosin,25(wt)% (Immersed for 5s to 10s) Solder：Sn-3.0Ag-0.5Cu Pre-Heating：150±10°C / 60 to 90s Solder Temperature：270±5°C Immersion Time：10±1 s Then measured after exposure in the room condition for 24±2 hours. 8. Environmental Performance (It shall be soldered on the substrate.) No. 8.1 Item Heat Resistance Specification Test Method 8.2 Cold Resistance Temperature：-40±2°C Time：1000h (+48h , -0h) Then measured after exposure in the room condition for 24±2 hours. 8.3 Humidity Temperature: 40±2°C Humidity: 90~95%(RH) Time：1000h (+48h , -0h) Then measured after exposure in the room condition for 24±2 hours. 8.4 Temperature Cycle 1 cycle： 1 step：-40±2°C / 30±3 min 2 step：Ordinary temp. / 10 to 15 min 3 step：+105±2°C / 30±3 min 4 step：Ordinary temp. / 10 to 15 min Total of 100 cycles Then measured after exposure in the room condition for 24±2 hours. Appearance：No damage Impedance Change：within ± 10% DC Resistance Change：within ± 10% Temperature：105±2°C Time：1000h (+48h , -0h) Then measured after exposure in the room condition for 24±2 hours. 9. Specification of Packaging 3.6±0.2 3.5±0.05 ※ Lead- in/out wire 4.0±0.1 2.9±0.2 ( 0.2) positions of the lead wire. Dimension of the Cavity is measured at the bottom side. 4.0±0.1 2.0±0.05 ※The packing directions of the chip coil in taping are unified with the in/out 8.0±0.2 +0.1  1.5 -0 1.75±0.1 9.1 Appearance and Dimensions of plastic tape 1.7±0.2 Direction of feed MURATA MFG.CO., LTD (in mm) Reference Only SpecNo.JENF243J-0003F-01 P4/8 9.2 Specification of Taping (1) Packing quantity (standard quantity) 2,000 pcs / reel (2) Packing Method Products shall be packed in the each embossed cavity of plastic tape and sealed by cover tape. (3) Sprocket hole The sprocket holes are to the right as the tape is pulled toward the user. (4) Spliced point Plastic tape and Cover tape has no spliced point. (5) Missing components number Missing components number within 0.025% of the number per reel or 1 pc., whichever is greater, and are not continuous. The specified quantity per reel is kept. 9.3 Pull Strength Embossed carrier tape 10N min. Cover tape 5N min. 9.4 Peeling off force of cover tape Speed of Peeling off Peeling off force 165 to 180 degree 300mm/min F Cover tape 0.2 to 0.7N (minimum value is typical) 9.5 Dimensions of Leader-tape, Trailer and Reel There shall be leader-tape (cover tape) and trailer-tape (empty tape) as follows. Plastic tape 9.6 Marking for reel Customer part number, MURATA part number, Inspection number(1), RoHS marking(2), Quantity etc ･･･ 1) □□ OOOO  (1) (2) (3) (1) Factory Code (2) Date First digit : Year / Last digit of year Second digit : Month / Jan. to Sep.  1 to 9, Oct. to Dec.  O, N, D Third, Fourth digit : Day (3) Serial No. 2) « Expression of RoHS marking » ROHS – Y (△) (1) (2) (1) RoHS regulation conformity (2) MURATA classification number 9.7 Marking for Outside package (corrugated paper box) Customer name, Purchasing order number, Customer part number, MURATA part number, RoHS marking (2) , Quantity, etc ･･･ MURATA MFG.CO., LTD Reference Only SpecNo.JENF243J-0003F-01 9.8. Specification of Outer Case Outer Case Dimensions (mm) W D H Standard Reel Quantity in Outer Case (Reel) 186 186 93 5 Label H P5/8  Above Outer Case size is typical. It depends on a quantity of an order. D W 10. Caution 10.1 Limitation of Applications Please contact us before using our products for the applications listed below which require especially high reliability for the prevention of defects which might directly cause damage to the third party's life, body or property. (1) Aircraft equipment (2) Aerospace equipment (3) Undersea equipment (4) Power plant control equipment (5) Medical equipment (6) Transportation equipment (vehicles, trains, ships, etc.) (7) Traffic signal equipment (8) Disaster prevention / crime prevention equipment (9) Data-processing equipment (10) Applications of similar complexity and /or reliability requirements to the applications listed in the above 10.2 Corrosive gas Please refrain from use since contact with environments with corrosive gases (sulfur gas [hydrogen sulfide, sulfur dioxide, etc.], chlorine, ammonia, etc.) or oils (cutting oil, silicone oil, etc.) that have come into contact with the previously stated corrosive gas environment will result in deterioration of product quality or an open from deterioration due to corrosion of product electrode, etc. We will not bear any responsibility for use under these environments. 11. Notice This product is designed for solder mounting. Please consult us in advance for applying other mounting method such as conductive adhesive. 11.1 Land pattern designing Recommended land pattern for flow and reflow soldering is as follows: It has been designed for Electric characteristics and solderability. Please follow the recommended patterns. Otherwise, their performance which includes electrical performance or solderability may be affected, or result to "position shift" in soldering process. (Reflow) Land (Flow) Chip Noise Filter Solder Resist 0.8 Chip Noise Filter Land 2.5 Solder Resist 2.2 4.8 (in mm) (Distance between the products for Flow) (in mm) MURATA MFG.CO., LTD 1.3 (in mm) Reference Only SpecNo.JENF243J-0003F-01 11.2 Flux, Solder P6/8 ・Use rosin-based flux. ・Don’t use highly acidic flux with halide content exceeding 0.2(wt)% (chlorine conversion value). ・Don’t use water-soluble flux. Flux ・Use Sn-3.0Ag-0.5Cu solder ・Standard thickness of solder paste : 100μm to 150μm Solder Other flux (except above) Please contact us for details, then use. 11.3 Flow soldering conditions / Reflow soldering conditions ・Pre-heating should be in such a way that the temperature difference between solder and product surface is limited to 100°C max. Cooling into solvent after soldering also should be in such a way that the temperature difference is limited to 100°C max. Insufficient pre-heating may cause cracks on the product, resulting in the deterioration of product quality. ・Standard soldering profile and the limit soldering profile is as follows. The excessive limit soldering conditions may cause leaching of the electrode and / or resulting in the deterioration of product quality. (1)Flow soldering profile Temp. (℃) 265℃±3℃ 250℃ Limit Profile 150 Heating Time Standard Profile Time. (s) 60s min. Standard Profile Pre-heating Heating Limit Profile 150°C、60s min. 250°C、4s～6s 265°C±3°C、5s 2 times 1 time Cycle of flow (2)Reflow soldering profile 260℃ Temp. (℃) 245℃±3℃ 220℃ 230℃ Limit Profile 180 150 Standard Profile 30s～60s 60s max 90s±30s Standard Profile Pre-heating 150～180°C 、90s±30s Heating above 220°C、30s～60s Time(s) Limit Profile above 230°C、60s max. Peak temperature 245±3°C 260°C,10s Cycle of reflow 2 times 2 times MURATA MFG.CO., LTD Reference Only SpecNo.JENF243J-0003F-01 11.4 Reworking with soldering iron. The following conditions must be strictly followed when using a soldering iron. Pre-heating 150°C,1 min Tip temperature 350°C max. Soldering iron output 80W max. Tip diameter φ3mm max. Soldering time 3(+1,-0)s Times 2 times P7/8 Note : Do not directly touch the products with the tip of the soldering iron in order to prevent the crack on the products due to the thermal shock. 11.5 Solder Volume ・Solder shall be used not to be exceeded the upper limits as shown below. ・Accordingly increasing the solder volume, the mechanical stress to Chip is also increased. Exceeding solder volume may cause the failure of mechanical or electrical performance. Uppre Limit Recommendable Ｔ t 1/3T≦t≦T (T: Lower flange thickness) 11.6 Product's location The following shall be considered when designing and laying out P.C.B.’s. (1) P.C.B. shall be designed so that products are not subject to the mechanical stress due to warping the board. ［Products direction］ a Products shall be located in the sideways direction (Length:a＜b) to the mechanical stress. b 〈 Poor example 〉 〈 Good example 〉 (2) Components location on P.C.B. separation. It is effective to implement the following measures, to reduce stress in separating the board. It is best to implement all of the following three measures; however, implement as many measures as possible to reduce stress. Contents of Measures Stress Level (1) Turn the mounting direction of the component parallel to the board separation surface. A > D 1 (2) Add slits in the board separation part. A > B (3) Keep the mounting position of the component away from the board separation surface. A > C Seam b A C B D Slit 1 A > D is valid when stress is added vertically to the perforation as with Hand Separation. If a Cutting Disc is used, stress will be diagonal to the PCB, therefore A > D is invalid. Length:a b a (3) Mounting Components Near Screw Holes When a component is mounted near a screw hole, it may be affected by the board deflection that occurs during the tightening of the screw. Mount the component in a position as far away from the screw holes as possible. MURATA MFG.CO., LTD Screw Hole Recommended SpecNo.JENF243J-0003F-01 Reference Only P8/8 11.7 Cleaning Conditions Products shall be cleaned on the following conditions. (1) Cleaning temperature shall be limited to 60°C max.(40°C max for IPA.) (2) Ultrasonic cleaning shall comply with the following conditions with avoiding the resonance phenomenon at the mounted products and P.C.B. Power : 20 W / l max. Frequency : 28kHz to 40kHz Time : 5 minutes max. (3) Cleaner 1. Alternative cleaner ・Isopropyl alcohol (IPA) 2. Aqueous agent ・PINE ALPHA ST-100S (4) There shall be no residual flux and residual cleaner after cleaning. In the case of using aqueous agent, products shall be dried completely after rinse with de-ionized water in order to remove the cleaner. (5) Other cleaning Please contact us. 11.8 Resin coating The Impedance value may change due to high cure-stress of resin to be used for coating/molding products. An open circuit issue may occur by mechanical stress caused by the resin, amount/cured shape of resin, or operating condition etc. Some resin contains some impurities or chloride possible to generate chlorine by hydrolysis under some operating condition may cause corrosion of wire of coil, leading to open circuit. So, please pay your careful attention when you select resin in case of coating/molding the products with the resin. Prior to use the coating resin, please make sure no reliability issue is observed by evaluating products mounted on your board. 11.9 Caution for use ・Sharp material such as a pair of tweezers or other material such as bristles of cleaning brush, shall not be touched to the winding portion to prevent the breaking of wire. ・Mechanical shock should not be applied to the products mounted on the board to prevent the breaking of the core 11.10 Handling of a substrate After mounting products on a substrate, do not apply any stress to the product caused by bending or twisting to the substrate when cropping the substrate, inserting and removing a connector from the substrate or tightening screw to the substrate. Excessive mechanical stress may cause cracking in the product. Bending Twisting 11.11 Storage and Handling Requirements (1) Storage period Use the products within 12 months after delivered. Solderability should be checked if this period is exceeded. (2) Storage conditions ・Products should be stored in the warehouse on the following conditions. Temperature : -10 ~ 40°C Humidity : 15 to 85% relative humidity No rapid change on temperature and humidity The electrode of the products is coated with solder. Don't keep products in corrosive gases such as sulfur,chlorine gas or acid, or it may cause oxidization of electrode, resulting in poor solderability. ・Products should not be stored on bulk packaging condition to prevent the chipping of the core and the breaking of winding wire caused by the collision between the products. ・Products should be stored on the palette for the prevention of the influence from humidity, dust and so on. ・Products should be stored in the warehouse without heat shock, vibration, direct sunlight and so on. (3) Handling Condition Care should be taken when transporting or handling product to avoid excessive vibration or mechanical shock. 12. 4. Note (1)Please make sure that your product has been evaluated in view of your specifications with our product being mounted to your product. (2)You are requested not to use our product deviating from the reference specifications. (3)The contents of this reference specification are subject to change without advance notice. Please approve our product specifications or transact the approval sheet for product specifications before ordering. MURATA MFG.CO., LTD